ALSO PUBLISHED ONLINE:
MARCH2016
www.highfrequencyelectronics.com
A Simulation-Based
Design Flow for
Broadband GaN Power
Amplifier Design
IN THIS ISSUE:
The Mystery Behind
MSL 1, 2, 3
Product Features:
LadyBug Technologies
Linear Technology
Micro Lambda
Wireless
Keysight Technologies
Exodus Advanced
Communications
D-COAX
Pasternack
AWT Global
Rohde & Schwarz
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506 rev F
ALSO PUBLISHED ONLINE AT: www.highfrequencyelectronics.com
Vol. 15 No. 3
22
34
16
Feature Article
Feature Article
Featured Products
A Simulation-Based
Design Flow for
Broadband GaN Power
Amplifier Design
By Ivan Boshnakov, Malcolm Edwards, Larry Dunleavy, Isabella Delgado
The Mystery Behind
MSL 1, 2, 3
By Kelvin Kiew
Appropriate packing
and handling methods,
including dry-bake before
packing, are explored.
A simulation-based
methodology for
broadband power amplifier
design.
Featuring Coilcraft,
National Instruments,
P1dB, Link Microtek,
Norden Millimeter, and
more.
40
60
6
Product Highlights &
Features
Book Review
Guest Editorial
Tom Perkins reviews
Dynamic Power Supply
Transmitters.
Joel Johnson on the
benefits of attending
WAMICON 2016.
LadyBug Technologies,
Master Bond, Linear
Technology, VidaRF,
Micro Lambda Wireless,
and many more.
4
MARCH2016
6 Editorial
12 In the News
16 Featured Products
8 Meetings & Events
40 Product Highlights
64 Advertiser Index
High Frequency Electronics
Guest Editorial
Vol. 15 No. 3 March 2016
Publisher
Scott Spencer
scott@highfrequencyelectronics.com
Tel: 603-472-8261
Associate Publisher/Managing Editor
Tim Burkhard
tim@highfrequencyelectronics.com
Tel: 707-544-9977
Senior Technical Editor
Tom Perkins
tom@highfrequencyelectronics.com
Tel: 603-472-8261
Vice President, Sales
Gary Rhodes
grhodes@highfrequencyelectronics.com
Tel: 631-274-9530
Editorial Advisors:
Ali Abedi, Ph.D.
Candice Brittain
Paul Carr, Ph.D.
Alen Fezjuli
Roland Gilbert, Ph.D.
Sherry Hess
Thomas Lambalot
John Morelli
Karen Panetta, Ph.D.
Jeffrey Pawlan, Ph.D.
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Copyright © 2016, Summit Technical Media, LLC
6
High Frequency Electronics
WAMICON: A Great
Opportunity for Learning
and Networking
Joel Johnson
Harris Corp.
As General Chair, I invite you to participate in the 2016
IEEE MTT-S WAMICON, Wireless and Microwave
Technology Conference, to be held in Clearwater, Florida,
April 11 to 13,, 2016. WAMICON 2016 is the 17th consecutive Wireless and Microwave Conference to be held in
Florida.
WAMICON started life as an outgrowth of industry/academic exchange between the University of South Florida
(USF) Electrical Engineering Department’s Center for
Wireless and Microwave Information Systems (WAMI Center) and a number of
both local and national companies involved in microwave and wireless engineering. The first “conference” was held in February 1999. From that modest
beginning, with its approximately 50 attendees, we have blossomed to approximately 200 attendees over the ensuing years. We are now an IEEE MTT-S
sponsored annual international conference in various locations in Florida, with
generous support from academia and industry.
Industry, Government, Academia
WAMICON brings together a great mix of industry, governmental and academic attendees and authors as well as an expanding exhibitor presence. One
of the aspects that adds to the charm of the event is the strong participation of
students and early career engineers as organizers and presenters. One of the
highlights has always been a lively, well-attended, evening (student presenter
dominated) poster session reception preceding a banquet dinner to close the
first day of our two-and-half day event.
As has also become a tradition at WAMICON, three author awards will be
presented for the best student poster, best student paper and best professional
presentation. One other special award presented is the Rudolf E. Henning
Distinguished Mentoring award, given each year since 2009 to a person exemplifying selfless dedication to encouraging students and/or mentoring young
engineers in the areas of RF/Microwave and/or Wireless Engineering. We have
a full schedule of events for the participants, from two speakers for our plenary
session, to our two tutorials, to our multiple sessions.
ABSSA
In the first plenary session, Tom Driscoll, Founder and CTO of Echodyne,
will present newly developed architecture for Airborne Sense and Avoid
(ABSSA) imaging radar systems, which utilizes metamaterials to eliminate the
need for phase-shifters. This architecture, the Metamaterials Electronically
Scanning Array (MESA), offers many
of the capabilities of a phased-array,
but at a fraction of the Cost, Size,
Weight, and Power (C-SWaP). The
proposed MESA-ABSAA system is
compact and lightweight enough to
mount on Group-2 Unmanned Aircraft
Systems, yet capable enough to meet
the requirements of much larger and
faster platforms.
5G, IoT
In the second plenary session,
Richard D. Gitlin, Distinguished
University Professor, University of
South Florida, will present opportunities, challenges, and technologies confronting 5G and the Internet of
Tomorrow. The upcoming fifth generation (5G) of mobile communication
systems will impact our lives more
than any other wireless technology by
enabling a seamlessly connected society in the 2020 timeframe. This presentation will preview the expected
disruptive market opportunities, new
applications, and the technologies
needed to facilitate the holistic integration of cellular, Wi-Fi, the Internet
of Things (IoT), and other wireless
systems into a heterogeneous Internet
of Tomorrow, with extraordinary capabilities that brings together people,
data, and “things”, and a myriad of
new applications.
Two excellent and on-target tutorials will sure to be of interest to
microwave design engineers.
The first tutorial will reveal the
ubiquitous presence of nonlinearity in
all RF and microwave circuits and the
recent efforts made to understand,
model, predict, and measure its
diverse manifestations. After a theoretical overview of nonlinearity in
wireless circuits, we will introduce
some recent advances in nonlinear
microwave circuit analysis tools and
illustrate different types of models
that are currently being used to represent and predict device, circuit, and
system performance. Finally, we will
focus the talk on the key metrics that
are used to characterize nonlinear
behavior, as well as newly developed
lab instruments and their ability to
assess device performance
The second tutorial will cover different techniques and technologies for
the design and development of microwave and millimeter wave integrated
circuits. Key technologies including
microstrip, suspended stripline,
dielectric integrated guides, substrate
integrated guides, PolyStrata, LTCC,
CMOS, and micromachining will be
discussed.
On behalf of the WAMICON 2016
Steering Committee, I would like to
extend to all of you a warm invitation
to participate in this year’s Wireless
and Microwave Conference at the
beautiful Marriott Suites, Clearwater,
Florida.
Powerful Multipath/Link
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Multipath Rayleigh & Rician Fading
Unmanned Arial Vehicle (UAV) testing
Sophisticated Satellite link emulation
Mobile Comm’s on the move testing
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- Internet routing in space
- Modernization Enterprise Terminal
Software showing mobile link setup
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www.dbmcorp.com
Get info at www.HFeLink.com
Meetings and Events
Conferences & Meetings
2016 IEEE MTT-S International Wireless Symposium
(IWS)
14 - 16 March 2016
Shanghai, China
Full Paper Submission Deadline: 16 Oct 2015
Final Submission Deadline: 16 Jan 2016
2016 IEEE MTT-S Wireless and Microwave Technology
Conference (WAMICOM 2016)
11 – 13 April 2016
Clearwater Beach, FL
wamicon.org
2016 IEEE MTT-S International Conference on Microwaves for Intelligent Mobility (ICMIM)
19 - 20 May 2016
San Diego, CA
Abstract Submission Deadline: 18 Dec 2015
Full Paper Submission Deadline: 26 Feb 2016
Final submission Deadline: 26 Feb 2016
2016 IEEE/MTT-S International Microwave Symposium - MTT 2016
22 - 27 May 2016
San Francisco, CA
2016 IEEE MTT-S Radio Frequency Circuits
Symposium (RFIC 2016)
22-24 May 2016
San Francisco, California, USA
http://rfic-ieee.org/
87th ARFTG Microwave Measurement Symposium
Topic
27 May 2016
San Francisco, California, USA
http://www.arftg.org/
EDI CON 2016
20 – 22 September 2016
Boston, Mass.
ediconusa.com
IEEE MTT-S Latin America Microwave Conference
(LAMC)
12 – 14 December 2016
Puerto Vallarta, Mexico
lamc-ieee.org
Company-Sponsored
Training & Tools
Analog Devices
Training, tutorials and seminars.
http://www.analog.com/en/training-tutorials-seminars/resources/index.html
NI AWR
On-site and online training, and open training courses on
design software.
http://www.awrcorp.com/news/trainings
National Instruments
LabVIEW Core 1
Online
http://sine.ni.com/tacs/app/fp/p/ap/ov/pg/1/
LabVIEW Core 2
Online
http://sine.ni.com/tacs/app/fp/p/ap/ov/pg/1/
Object-Oriented Design and Programming in LabVIEW
Online
http://sine.ni.com/tacs/app/fp/p/ap/ov/pg/1/
Free, online LabVIEW training for students and teachers.
http://sine.ni.com/nievents/app/results/p/country/
us/type/webcasts/
HFE’s April Issue
Test & Measurement
Integrated Assemblies
Cable Assemblies
CONTACT YOUR SALES REP TODAY!
8
High Frequency Electronics
Tunable Low Noise Oscillator Solutions
600 MHz to 40 GHz!
MLTO-Series. Permanent magnet
designs available covering the 2 to 16 GHz
frequency range. Units provide +8 dBm
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TO-8 packages are provided with three
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MLMB/MLMY-Series. Electromagnetic
PCB mount and Mini designs are available
covering 700 MHz to 12 GHz frequency
range. Phase noise of -130 dBc/Hz is
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MLOS-Series. Units cover 600 MHz
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Millimeter wave units are available in
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18 to 26.5 GHz, 18 to 40 GHz and 26.5
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MLSMO-Series. Permanent magnet
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MLPB/MLMY-Series. Permanent
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noise versions providing phase noise
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Commercial and extended temperature
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Magnet based PCB mount and Mini
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See our complete line of low noise frequency synthesizers
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Market Reports
Global Electronic Warfare Support
Market Growing to $8.6 billion
RF-based Electronic Warfare Support (EWS) systems
such as RWRs (Radar Warning Receivers), DF/COMINT
(Direction Finding and Communications Intelligence) and
ESM/ELINT (Electronic Support Measures and Electronic
Signals Intelligence) will dominate the market for EWS
system
spending,
Spending on EWS
accounting for 73% of the
systems installed on
total market in 2024.
airborne platforms will
The Strategy Analytics
account for 36%
Advanced
Defense
through 2024.
Systems (ADS) service
series of Electronic
Warfare Support (EWS) forecasts, outline global defense
expenditure trends segmented on a regional basis before
breaking out the expected spend on EWS incorporating
systems, hardware, support and related services across
the land, air and naval domains.
• Spending on EWS systems installed on airborne platforms will account for 36% through 2024.
Developing and maintaining land-based EWS capabilities will represent the second largest end market.
• EWS systems include both RF (radio frequency)
-based and EO-IR (electro-optical and infra-red) and
laser-based TWRs (Threat Warning Receivers) which will
account for the third largest market, followed by DF/
COMINT systems with spending on ESM/ELINT systems
accounting for the largest market. Collectively, these
sectors will account for account for 93% of total spending
on EWS through 2024.
.
• The total number of EWS system shipments is
forecast to grow at a CAGR of 3.6% through 2024 to reach
9,319 units.
Strategy Analytics Global Electronic Warfare Support
(EWS) Market and Technology Forecast: 2014 - 2024 outlines analysis looking at the total EWS sector providing
segmentation detail related to form factors, platforms,
frequency, power and associated enabling technology
trends and component demand. The associated Land
Electronic Warfare Support (EWS) Market and Technology
Forecast: 2014 - 2024, Airborne Electronic Warfare
Support (EWS) Market and Technology Forecast: 2014 2024 and Shipborne Electronic Warfare Support (EWS)
Market and Technology Forecast: 2014 - 2024 data models
provider a deeper dive into system shipments segmented
across the different domains.
“A renewed emphasis on developing and maintaining
conventional EWS capabilities to enable operations in a
congested and contested spectrum environment will drive
spending and also underpin demand for new systems and
upgrading existing capabilities,” notes Asif Anwar,
10 High Frequency Electronics
Director at Strategy Analytics. “In the area of RF-based
EWS, this will be underpinned by an emphasis on direct
and fast digital synthesis of the RF signals across the full
breadth of the frequency spectrum driving demand for
wideband solid state RF component technologies coupled
with higher performing wider bandwidth digital receivers. The associated market for semiconductor components
will approach $232 million in 2024.”
—Strategy Analytics
strategyanalytics.com
802.11ac Wi-Fi Shipments to Gain
Momentum
Wi-Fi access points based on 802.11ac steadily gained
momentum over the past year, rising to represent 39% of
total Wi-Fi access points shipped in 2015. According to
ABI Research, adoption will continue to accelerate in
2016 as more 802.11ac Wave 2 products enter the market,
along with the introduction of tri-band access points.
“Wave 2 access points are based on a richer set of technologies in the 802.11ac specification,” says Sam Rosen,
Managing Director and Vice President at ABI Research.
“This includes MU-MIMO, which supports better efficiency for high density wireless environments. We forecast Wave 2 access points to spearhead 802.11ac shipments, with those shipments representing nearly 65% of
total Wi-Fi access points in 2016.”
In addition to the emergence of Wave 2 product
this year, tri-band access points are likely to hit the
market in the first half of 2016. Tri-band Wi-Fi
products use 802.11n, 802.11ac, and 802.11ad in the
2.4 GHz, 5 GHz, and 60 GHz bands, respectively, and
are backward compatible to the older protocols
within each band.
“If all goes according to plan, TP-Link’s Talon AD
product line will kick-start the market for tri-band access
points with WiGig (802.11 ad),” concludes Rosen. “The
access points, however, are likely to take an additional
one to two years’ time before they gain significant market
share in the overall Wi-Fi CPE market.”
Moving beyond the scope of this year’s market data to
take a look at the overall market, ABI Research predicts Wi-Fi access point shipments to surpass 204
million units in consumer applications and 19.3
million units in enterprise in 2020, with the majority of those shipments supporting 802.11ac.
These findings are part of ABI Research’s Set-Top Box
and Home Gateway and Wi-Fi Services, which include
research reports, market data, insights and competitive
assessments.
—ABI Research
abiresearch.com
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Ideal for use in Bias Tees, Coilcraft conical inductors offer
flat bandwidth and high impedance to 40 GHz
Coilcraft BCL/BCR Series conical inductors
operate across a frequency range of 10 MHz
to 40 GHz, letting you replace a series
of narrow band inductors with one part.
Both series provide excellent return loss
and insertion loss. Their unique conical
shape optimizes the effects of capacitance,
maintaining high impedance across your
frequency spectrum.
Choose from a rugged, surface mount
package or our flying lead configuration.
And for applications below 6 GHz,
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Learn more and order your
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coilcraft.com/conicals.
®
WWW.COILCRAFT.COM
In the News
open window and able to fly at speeds up to 20 meters per
second (45 miles per hour)—while avoiding objects within
complex indoor spaces independent of communication
with outside operators or sensors and without reliance
on GPS.
A FLA quadcopter self-navigates around boxes during initial flight data
collection using only onboard sensors/software. DARPA’s FLA program
aims to develop and test algorithms that could reduce the amount of processing power, communications, and human intervention needed for
unmanned aerial vehicles (UAVs) to accomplish low-level tasks, such as
navigation around obstacles in a cluttered environment.
They may not have zoomed flawlessly around obstacles
like the Millennium Falcon did as it careened through
the hull of a crashed Star Destroyer in Star Wars VII. But
the sensor-loaded quadcopters that recently got tested
in a cluttered hangar in Massachusetts did manage to
edge their way around obstacles and achieve their target
speeds of 20 meters per second. Moreover, the quadcopters were unmanned … and real. Thus was the initial
phase of data collection for DARPA's Fast Lightweight
Autonomy (FLA) program recently deemed an encouraging success.
DARPA’s FLA program aims to develop and test algorithms that could reduce the amount of processing power,
communications, and human intervention needed for
unmanned aerial vehicles (UAVs) to accomplish low-level
tasks, such as navigation around obstacles in a cluttered
environment. If successful, FLA would reduce operator
workload and stress and allow humans to focus on higherlevel supervision of multiple formations of manned and
unmanned platforms as part of a single system.
FLA technologies could be especially useful to
address a pressing surveillance shortfall: Military
teams patrolling dangerous overseas urban environments and rescue teams responding to disasters
such as earthquakes or floods currently can use
remotely piloted unmanned aerial vehicles (UAVs)
to provide a bird’s-eye view of the situation, but to
know what’s going on inside an unstable building
or a threatening indoor space often requires physical entry, which can put troops or civilian response
teams in danger. The FLA program is developing a
new class of algorithms aimed at enabling small UAVs
to quickly navigate a labyrinth of rooms, stairways and
corridors or other obstacle-filled environments without a
remote pilot. The program seeks to develop and demonstrate autonomous UAVs small enough to fit through an
12
High Frequency Electronics
DARPA researchers recently completed the first flight
data collection from the common quadcopter UAV platform that three research teams are using for the program.
The flight test data validated that the platform—which
uses a commercial DJI Flamewheel 450 airframe, E600
motors with 12" propellers, and 3DR Pixhawk autopilot—
is capable of achieving the required flight speed of 20
meters per second while carrying high-definition onboard
cameras and other sensors, such as LIDAR, sonar and
inertial measurement units. During the testing, researchers also demonstrated initial autonomous capabilities,
such as “seeing” obstacles and flying around them at slow
speed unaided by a human controller.
“We’re excited that we were able to validate the airspeed
goal during this first-flight data collection,” said Mark
Micire, DARPA program manager. “The fact that some
teams also demonstrated basic autonomous flight ahead
of schedule was an added bonus. The challenge for the
teams now is to advance the algorithms and onboard
computational efficiency to extend the UAVs’ perception
range and compensate for the vehicles’ mass to make
extremely tight turns and abrupt maneuvers at high
speeds.”
The three performer teams are Draper, teamed with
the Massachusetts Institute of Technology; University
of Pennsylvania; and Scientific Systems Company, Inc.
(SSCI), teamed with AeroVironment.
The test flight and data collection took place at Otis
Air National Guard Base, Cape Cod, Massachusetts, in
a former aircraft hangar that was transformed into a
warehouse setting with simulated walls, boxes and other
obstacles to test flight agility and speed. The test run also
resulted in several crashes. “But the only way to achieve
hard goals is to push physical systems and software to
the limit,” Micire said. “I expect there will be more flight
failures and smashed quadcopters along the way.”
With each successive program milestone flight test, the
warehouse venue will be made more complicated by
adding obstacles and clutter to create a more challenging and realistic environment for the UAVs to navigate
autonomously.
“Very lightweight UAVs exist today that are agile
and can fly faster than 20 meters per second, but
they can’t carry the sensors and computation
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In the News
to fly autonomously in cluttered
environments,” Micire said. “And
large UAVs exist that can fly high
and fast with heavy computing
payloads and sensors on board.
What makes the FLA program
so challenging is finding the
sweetspot of a small size, weight
and power air vehicle with limited onboard computing power to
perform a complex mission completely autonomously.”
The FLA program’s initial focus is on
UAVs, but advances made through the
program could potentially be applied
to ground, marine and underwater
systems, which could be especially
useful in GPS-degraded or denied
environments.
* * *
Richardson RFPD announced that
it has achieved AS9120A certification.
The AS certification series rewards
aerospace and defense industry suppliers for achieving the highest levels of quality standards, meeting
regulatory compliance requirements
and mitigating customer risk. The
AS9120A certification applies specifically to electronic component distributors who serve the aerospace
industry.
The aerospace and defense industry
is Richardson RFPD’s leading vertical market. Built upon long-time
supplier relationships and supported
by a highly technical field team, the
company supports military communications applications such as radar,
electronic warfare, communications,
jammers, avionics and SATCOM.
Get info at www.HFeLink.com
14 High Frequency Electronics
“We see growth opportunity in
military markets, both in the
Americas and in the EMEA
region,” said Rafael R. Salmi,
Ph.D, president of Richardson
RFPD. “Our AS9120A certification
is an important accomplishment, as
it represents our commitment to our
customers who serve the aerospace
and defense marketplace.”
* * *
Engineers working in communications, consumer electronics and
aerospace & defense are faced with
increasingly complex design and measurement challenges, as well as rapidly changing technology. A strong
foundation in basic measurement and
simulation techniques is essential for
success.
Keysight is hosting a series of
one-day RF Back to Basics seminars designed to provide engineering
graduates, experienced R&D engineers and technicians with an understanding of basic RF measurement,
design and simulation techniques.
Seminar topics will include network
analysis; modular PXI instruments,
measurement and test programs; signal generation and analysis, and fundamentals of RF simulation.
When:
Wednesday, March 9
Thursday, March 17
Tuesday, May 3
Thursday, May 5
Where:
March 9: Westford, Mass.
Westford Regency Inn & Conference
Center, 219 Littleton Road
March 17: Santa Clara, Calif.
Agilent Technologies - Building 5,
5301 Stevens Creek Blvd
May 3: Kanata, Ontario
Holiday Inn & Suites, 101 Kanata
Avenue
May 5: Mississauga, Ontario
Four Points by
Argentia Road
Sheraton, 2501
For more information visit: keysight.
com/find/events.
Radio tower image courtesy
of Tom Rauch, W8JI
Features:
Advantages:
Applications:
• Capacitance Range:
0.1 to 5100 pF
• Proprietary NPO Dielectric for
Superior High Voltage Handling
• High Tesla
• Case Sizes
Case A (0.055'' x 0.055'')
Case B (0.110'' x0.110'')
Case R (0.070'' x 0.090'')
Case C (0.250'' x 0.250'')
Case E (0.380'' x 0.380'')
• Advanced Engineered Silver
Electrode System for Lowest ESR
• HF/RF PowerAmplifiers
and Transmitters
• Rugged Ceramic Design for
Reliable Trouble-Free Operation
• Antenna Tuning
• Improved Image Quality in MRI
Scanners
• Industrial Lasers
• NPO Low Loss Rugged Dielectric
• Voltage Ratings up to 7200 WVDC
• RoHS Compliant, Pb Free
American
MRI Imaging Coils
• Plasma Chambers
• Superior Thermal Management
in High RF Power Applications
• Proprietary Dielectric Material
Technical
THE ENGINEERS’ CHOICE ®
Ceramics
www.atcera mics.co m
Featured Products
VNA
Keysight Technologies introduced
a series of hardware and software
options for the M9485A high-performance PXIe® multiport vector
network analyzer (VNA). The options further enhance the modular
nature of the M9485A VNA by adding a range of new capabilities in
support of applications such as base
transceiver station (BTS) component test and active multiport module test.
login.aspx. This new release builds
upon the features introduced in V12
and offers improvements to Analyst
3D finite element method electromagnetic simulator and layout and
to NI AWR Design Environment
modeling, scripting and stability
analysis.
National Instruments
awrcorp.com
Keysight Technologies
keysight.com
Web Tool
Coilcraft’s Common Mode Choke
Finder web tool allows users to
search and compare hundreds of
common mode filter options in just
seconds. Search results are presented in a clear table sorted by the
highest impedance or attenuation,
depending on user input. The tool
includes the ability to search across
a range of frequencies, showing the
minimum common mode impedance/attenuation across that entire
range.
Coilcraft
coilcraft.com
Software Portfolio
NI AWR Design Environment™
V12.02, inclusive of Microwave Office, Visual System Simulator™
(VSS), Analog Office, AXIEM, and
Analyst™, has been released and
is now available to download at
https://awrcorp.com/download/
16 High Frequency Electronics
Test Cables
P1dB released a series of test cables
that are phase stable under continuous flexure. These new test cables
are built using P1dB’s new 195TM
coaxial cable, which has been designed and tested to be phase stable
under 50,000 flexure cycles. The
P1dB test cables are also constructed using specialized stainless steel
connectors that are designed for
high retention and stability under
more than 5,000 mating cycles.
P1dB
p1db.com
Coupler
ZHDC-10-63-NS+ is a 50Ω, 10 dB
coupling, 50 to 6000 MHz directional coupler. Features: wideband, 50
to 6000 MHz; high directivity, 33 dB
typ.; flat coupling, ±0.3 dB typ.; good
VSWR, 1.20:1 typ. Applications: defense; test and measurement.
Mini-Circuits
minicircuits.com
Low Noise Amplifier
Model SBL-5037533050-1515-S1 is
a low noise amplifier with a minimum small signal gain of 30 dB and
a nominal noise figure of 5 dB in the
frequency range of 50 to 75 GHz. DC
power requirement is +8 VDC/300
mA. Input and output port configurations are both WR-15 Waveguides
with UG-385/U Flanges. The mechanical configuration is a right angle structure. Other configurations,
such as waveguide inline structure
and coaxial (1 mm) inline structure,
are available.
SAGE Millimeter
sagemillimeter.com
Horn Antenna
A series of lightweight microwave
gain horn antennas has been designed for military airborne applications. Featuring thin-walled
aluminium construction, they are
half the weight of standard aluminium gain horns and only a fifth the
weight of traditional brass alternatives. They provide a mid-band gain
of 20dB and are available with rectangular waveguide inputs ranging
in size from WR650 to WR28, covering microwave frequencies from 1.2
to 40.0 GHz.
Link Microtek
linkmicrotek.com
In-line Amplifier
Norden Millimeter introduced a
new waveguide package with inline waveguide transitions. This 33
- 50 GHz WR-22 amplifier has 35dB
typical gain, +/-2.5dB gain flatness,
Featured Products
fast intrinsic diode with low reverse recovery (Qrr).
Richardson RFPD
richardsonrfpd.com
1.5:1 VSWR, +10dBm P1dB, and
noise figure <6dB. The unit typically draws 220mA from 12v.
Norden Millimeter
nordengroup.com
High Frequency Probe
D-COAX introduced high performance TDR – VNA differential/
single-ended probe assemblies
through 40GHz. Testing for small
discontinuities on non-planar
PCBs is now possible on a 40GHz
VNA or very fast TDR because of
the durable and repeatable probe
design. Twinax and coaxial cable
can be probed directly. Probing in
the horizontal or vertical position
allows use on a probe station or
with specific test fixturing.
Cable Creator
Pasternack released an improved
version of its online tool called The
Cable Creator™. It allows the user
to not only design and customize
special cable configurations online in a few clicks, but also purchase their designs without the
need to wait for a quote from the
company’s sales team. Cable Creator enables engineers and buyers
to quickly create customized RF
cable assemblies that meet their
specs from any combination of
compatible connectors and cables
offered by the company.
Pasternack
pasternack.com
D-COAX
d-coax.com
Get info at www.HFeLink.com
18 High Frequency Electronics
MOSFETs
Richardson RFPD announced
availability and design support
for the expanded portfolio of 900V
MOSFETs from Wolfspeed. The
C3M0120090J,
C3M0120090D,
C3M0280090J and C3M0280090D
feature Wolfspeed’s new C3M SiC
MOSFET technology. They offer
high blocking voltage with low
On-resistance, high-speed switching with low capacitances, and
Terminations
MECA’s Low PIM Terminations
are now available in 4.3/10.0 connectors. Operating down to 380
MHz. (-160 to -165dBc Typical in
CELL & PCS Bands). Featuring
thermally stabilized low PIM distortion performance (low thermal
noise); In addition to having an
overall Low PIM performance all
while handling full rated power
to +85°C. All terminations cover
0.380 - 2.700 GHz frequency bands
in in 10, 30, 50, & 100 watt models.
Made in the USA and 36-month
warranty.
MECA Electronics
e-meca.com
The Right RF Parts.
Right Away.
We’re RF On Demand, with over one million RF and microwave components
in stock and ready to ship. You can count on us to stock the RF parts you
need and reliably ship them when you need them. Add Fairview Microwave
to your team and consider it done.
fairviewmicrowave.com
1.800.715.4396
Featured Products
Isolators
VidaRF is offering drop in surface
and flange mount Isolators and Circulators covering from 3.6 GHz to
23 GHz. It also offers wide range of
narrow and broad band coaxial and
waveguide Isolators and Circulators. VidaRF serves the Microwave
and RF industry with high performance Isolators, Circulators, Power
Dividers, Couplers, RF Connectors,
Adapters, Cable Assemblies, Attenuators, and Terminations.
VidaRF
vidarf.com
Bias Tee
ZX85-40W-63+ is a coaxial bias tee
providing high power handling and
low insertion loss for applications
over a very wide frequency range
from 700 to 6000 MHz. It provides
33 dB typical DC-RF isolation and
handles up to 1A DC current at the
input. This model features rugged
unibody construction with SMA
connectors, providing excellent durability, small case size (0.74 x 0.75
x 0.46”), saving space in crowded
system layouts.
Mini-Circuits
minicircuits.com
Crossguide Coupler
Model SWX-753114320-10-3B is a
W-band split block crossguide coupler that covers the full W-band frequency range of 75 to 110 GHz. This
three port design incorporates a termination load at the fourth port to
offer a compact size and low inser-
Get info at www.HFeLink.com
20 High Frequency Electronics
tion loss. Smaller form factor and
lower insertion loss make it better suited for certain applications
than multi-hole directional couplers
while providing good directivity. It
offers 0.7 dB insertion loss with 20
dB typical directivity. All ports feature WR-15 waveguides with UG387/U-M flanges.
SAGE Millimeter
sagemillimeter.com
HFE’s April Issue
Test & Measurement
Integrated Assemblies
Cable Assemblies
NOW! Revolutionary
ABSORPTIVE/REFLECTIONLESS
FILTERS
DC to 21 GHz!
Reflectionless
Filter
Conventional
Eliminates standing waves out-of-band
Stops Signal Reflections Dead in Their Tracks!
Mini-Circuits is proud to bring the industry a revolutionary breakthrough in
the longstanding problem of signal reflections when embedding filters in RF
systems. Whereas conventional filters are fully reflective in the stopband,
our new X-series reflectionless filters are matched to 50Ω in the passband,
stopband and transition band, eliminating intermods, ripples and other
problems caused by reflections in the signal chain. They’re perfect for pairing
with non-linear devices such as mixers and multipliers, significantly reducing
unwanted signals generated due to non-linearity and increasing system
dynamic range by eliminating matching attenuators2. They’ll
change the way you think about using filters in your design!
Jump on the bandwagon, and place your order online
today for delivery as soon as tomorrow. Need a custom
design? Call us to talk to our engine e rs about a
reflectionless filter for your system requirements.
X-Series
Small quantity samples available, $9.95 ea. (qty. 20)
See application note AN-75-007 on our website
See application note AN-75-008 on our website
4
Defined to 3 dB cutoff point
1
2
3
6
$ 95
1
ea.(qty.1000)
✓ High pass, low pass
and band pass models
✓ Patented design
eliminates in-band spurs
✓ Absorbs stopband signal power
rather than reflecting it
✓Good impedance match
in passband stopband and transition
✓Intrinsically Cascadable3
✓Passbands from DC – to 21GHz4
✓Stopbands up to 35 GHz
Tiny 3x3mm QFN
Protected by U.S. Patent No. 8,392,495 and
Chinese Patent No. ZL201080014266.l.
Patent applications 14/724976 (U.S.) and PCT /USlS/33118
(PCT) pending.
Mini-Circuits
®
www.minicircuits.com
P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
550 Rev Orig
Power Amp Design
A Simulation-Based Design
Flow for Broadband GaN Power
Amplifier Design
By Ivan Boshnakov, Malcolm Edwards, Larry Dunleavy, Isabella Delgado
The purpose of this note is to demonstrate a simulation-based methodology for broadband power amplifier design using load-line, load-pull, and
real-frequency synthesis techniques. The design shown in this application
note is a Class F amplifier and was created using the Qorvo 30W GaN
HEMT T2G6003028-FL transistor. Goals for this design were: a minimum
output power of 25W, bandwidth of 1.8 - 2.2GHz, and maximum power
added efficiency (PAE). The design procedure was performed using the Modelithics GaN HEMT
non-linear model for the Qorvo transistor mentioned above; Modelithics Microwave Global
Models for the passive components in the matching network design; and the Amplifier Design
Wizard (ADW) from AMPSA (all tools available within suitably configured NI AWR’s Microwave
Office).
A simulation-based
methodology for
broadband power
amplifier design.
Design Overview
For this design methodology it is crucial to have access to the intrinsic device channel voltage and current. Such capabilities are available in the advanced non-linear Modelithics GaN
models. The design begins with measurements of the voltage and current at the drain-source
intrinsic current generator within Microwave Office. The near optimum load-line, impedances
of the fundamental frequency, and harmonic impedances for a single frequency are located for
the required mode of operation. The impedance regions are then extracted using load-pull
simulations. Using ADW, the “real-frequency” synthesis of the matching networks can be quickly realized simultaneously for the fundamental and harmonic impedances across a wide bandwidth. These fully laid-out matching networks can then be exported to MWO for the remainder
of the design optimization, non-linear analysis, and electromagnetic (EM) simulation.
Design Process
To begin the design process, a schematic to bias and stabilize the transistor must first be
drawn. Once the conditions required for stability and biasing are established, the initial loadline analysis and harmonic impedance tuning can be performed (Figure 1).
Initial Load-Line and Harmonic Impedance Tuning
First, a line is drawn on top of the IV curves to approximate the near optimum load-line for
the fundamental frequency (the maximum swing of the RF voltage and current before hard
clipping occurs). Then the dynamic load-line, defined using meters located within the model to
monitor the intrinsic drain voltage and current and superimposed on the IV curves by the
IVDLL measurement, is tuned to be a straight line and parallel to the drawn line. The tuning
at a chosen frequency is performed by tuning the magnitude and phase of the output tuner
impedances. At this stage, the harmonic balance simulation is limited to just a single harmonic—the fundamental frequency. Additionally, the harmonic impedances of the output tuner and
22 High Frequency Electronics
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ZVM-273HP+
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Frequency
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35
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ZHL-10W-2G+
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• Protected under U.S. Patent 7,348,854
* Price Includes Heatsink
Mini-Circuits
®
www.minicircuits.com
P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
416 rev AG
PRODUCTS
TO SOLUTIONS
Power Amp Design
RF Products
PORT1
P=1
Z=50 Ohm
Pwr=20 dBm
HBTUNER2
ID=TU2
Mag1=0.94
Ang1=161 Deg
Mag2=0
Ang2=0 Deg
Mag3=0
Ang3=0 Deg
Fo=2 GHz
Zo=50 Ohm
2
3:Bias
2
1
Gate
RES
ID=R1
R=200 Ohm
M
IND
ID=L1
L=22 nH
internal sequential biasing
IVCURVE
ID=IV1
VSWEEP_start=0 V
VSWEEP_stop=56 V
VSWEEP_step=0.5 V
VSTEP_start=-3.5 V
VSTEP_stop=0 V
VSTEP_step=0.1 V
Swp
PORT
P=2
Z=50 Ohm
DCVS
ID=V1
V=28 V
3
Source
RES
ID=R2
R=50 Ohm
DCVS
ID=V2
V=-3.03 V
• High Power, Single DC power supply/
32 to 36 GHz Power Amplifier
• AHP-34043530-01
• Gain: 30 dB (Min)
• Gain Flatness: +/-2.0 dB (Max)
• P-1D dB: 34 dBm (Typ), 33 dBm (Min)
Drain
1
CAP
ID=C2
C=8.2 pF
3:Bias
Ducommun has more than 45 years
of experience with the design,
testing and manufacturing of
standard and custom millimeter
wave amplifiers.
HBTUNER2
ID=TU3
Mag1=0.75
Ang1=-175 Deg
Mag2=1
Ang2=-160.3 Deg
Mag3=1
Ang3=-172.2 Deg
SUBCKT
Fo=2 GHz
ID=S1
Zo=50 Ohm
NET="HMT_TQT_T2G6003028_FL_001"
Temperature=25 DegC
1
2
self_heat_factor=1
CAP
ID=C1
C=10000 pF
SUBCKT
ID=S1
NET="HMT_TQT_T2G6003028_FL_001"
Temperature=25 DegC
self_heat_factor=1
1
Drain
2
Gate
Step
M
3
Source
Figure 1 • Top – Schematic to bias and stabilize transistor. Bottom – IV
curve simulation schematic.
32 to 36 GHz Power Amplifier
• ALN-33144030-01
• Gain: 30 dB (Min)
• Gain Flatness: +/-1.0 dB acoss the
For additional information,
contact our sales team at
+1 (310) 513-7256
rfsales@ducommun.com
Get info at www.HFeLink.com
24 High Frequency Electronics
CONTACT US
band
• Noise Figure : 4.0 dB (typ)
all the impedances of the input tuner are set to 50Ω. The final results of the
tuning can be seen in Figure 2.
Once the impedance of the fundamental frequency is known, the second
and the third harmonic impedances presented to the intrinsic drain can be
tuned according to the desired mode of operation. In the case of this application
note, Class-F operation is desired, meaning that the second harmonic impedance is tuned to a short circuit and the third harmonic impedance is tuned to
an open circuit (Figure 3).
The fundamental impedance of the input tuner is then made to be a conjugate match to the S11 of the transistor and stability / bias network. This will
provide the best match and therefore, maximum gain. The harmonic impedances of the input tuner are set to 50Ω.
Now that all of the impedances have been tuned, a final harmonic balance
simulation (using three harmonics) is performed to confirm the design is in the
desired mode of operation. Figure 4 and Figure 5 show the classic shapes of a
Class-F mode design.
Planar Monolithics Industries, Inc.
CW-Immune Successive Detection Log
Video Amplifier (SDLVA), 100 MHz - 18 GHz
Amplifiers
Attenuators - Variable
DLVA & ERDLVA &
SDLVA’s
DTO’s & Frequency
Synthesizers
Filters
Form, Fit & Function
Products
IFM’s & Frequency
Discriminators
Integrated MIC/MMIC
Modules
I/Q Vector Modulators
Limiters & Detectors
Log Amplifiers
Pulse & Bi-Phase
Modulators
Phase Shifters
Rack & Chassis Mount
Products
Receiver Front Ends &
Transceivers
Single Sideband
Modulators
SMT & QFN Products
Solid-State Switches
PMI Model SDLVA-100M18G-CW-70-MAH SDLVA features a SPST on the RF
output that allows for the RF to be blanked when the input signal is below the
externally adjustable threshold. A 3.3 V TTL-compatible output is also
provided for time-gating or sampling to assist in
digital system integration.
• Ideal for EW, ELINT and IFM receivers, DF radar,
ECM, broadband test & measurment and
missile guidance applications.
• SMA Connectors & Gold Finish.
• Military or Stringent Screening is available.
• Small Quantity Requirements accepted.
• Specialized Testing & Custom
designs welcome!
SPECIFICATIONS
Frequency Range:
Frequency Flatness:
TSS:
Limited Output Power:
100 MHz to 18.0 GHz
±2.0 dB max. - measured ±1.0 dB
-68 dBm min., -70 dBm typ. - measured -68 dBm
8.0 dBm ± 3.0 dBm max., - measured +8 ± 2.5 dBm
(Input Power > -65 dBm)
VSWR:
2.0:1 max. - measured 1.97:1
Linear Output Gain:
43 dB ± 3.0 dB max. - measured 43 to 45.7 dB
Linear Output Psat:
3 dBm ± 3.0 dBm max. - measured 0.9 to 4.0 dBm
V0 (Video Comparator Signal Amplitude): 3.3 V typ. - measured 2.25 V
Video Comparator Delay:
50 ns typ. - measured 45 ns
Video Comparator Threshold Level:
Adjustable with Analog Voltage, -60 dBm ± 3.0 dB max.
V1 (Log Video Signal Amplitude):
1 Volt max. - measured 0.807 Volt
Log Slope:
10 mV/dB into 50 W Load ±1 mV max. measured 10 mV/dB
Log Range:
-65 to +5 dBm min.
Log Linearity:
±1.75 dB (-40 ºC to +85 ºC) - measured 0.92 dB
Pulse Range:
100 ns to 250 µs
Rise Time:
35 ns max. - measured 20 ns
Settling Time to ±1 dB:
50 ns typ. - measured 41 ns
Recovery Time:
350 ns max. - measured 220 ns
SDLVA-100M18G-CW-70-MAH
TSS to -45 dBm (1 dB degradation) - measured 0.7 dB
Pulse Considered "CW":
1 ms typ. - measured 0.7 ms
Rejection Time:
1 ms typ. - measured 0.5 ms
Droop:
1 dB max. - measured 0 dB
SPST Isolation:
70 dB typ. - measured >70 dB
Switching Speed:
20 ns typ. - measured 20 ns
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sales@pmi-rf.com • www.pmi-rf.com
ISO9001-2008 REGISTERED
Power Amp Design
In Figure 7, the contours at the fundamental frequency for both maximum power
IV DLL
and efficiency have been superimposed in
8000
order to define a region of compromise for
mutually acceptable power and efficiency.
6000
In this case, an output power 1dB below the
maximum and an efficiency 5% below the
4000
maximum has been chosen. In the plot
shown, a circle defining this region is
placed by using an equation to define the
2000
acceptable area of the fundamental frequency impedance for the synthesis of the
0
relatively broadband output network.
Next, load-pull simulations for second
-2000
and third harmonic frequencies are per0
20
40
56
formed at the two impedances that providVoltage (V)
ed the maximum power and maximum
efficiency in the load-pull simulation of the
Figure 2 • IV curves with dynamic load-line superimposed.
fundamental frequency. The results for
both load-pull simulations at the second
Intrinsic impedances
and third harmonic can be seen in Figure 8. For the simuSwp Max
lation at the second harmonic frequency, the optimum
6GHz
maximum efficiency in both cases is the same and the
contours are essentially the same. A line is drawn to
0
bound the area with acceptable performance. In this case,
3.
the acceptable region is below the line. For the simulation
4. 0
4 GHz
5 .0
at the third harmonic frequency, the optimum maximum
Mag 0.9964
6 GHz
Ang 180 Deg
Mag 0.9153
efficiency is again the same in both cases. However, the
Ang -1.388 Deg 10.0
contours differ somewhat. Fortunately, the effect of varying the third harmonic impedance is small and an acceptable region is easily defined above the drawn line.
The described impedance extraction process is per2 GHz
formed
for a few frequencies across the desired band2
.
Mag
0.7273
0
Ang 179.7 Deg
width. In the case of this application note, simulations for
1.8GHz, 2GHz, and 2.2GHz were sufficient. It is impor.4
-0
tant to note that this is a streamlined method of extracting the fundamental and harmonic impedances relies on
access to the voltage and current across the intrinsic
Swp Min
2GHz
generator. Access to the intrinsic device nodes allows for
Figure 3 • Smith chart view of the fundamental and a near optimum tuning of the fundamental load-line
(impedance) and fixing the harmonics impedances for a
harmonic impedances of the output tuner.
particular mode of operation at the outset of the design
flow. If the transistor model was a black box or the intrinLoad-Pull Impedance Extraction
With the previously defined input and output imped- sic access was not used, the load-pull impedance extracances, load-pull simulations are performed to produce tions would need to be performed for far more iterations.
contours first for maximum power (Pmax) and then for First, load-pull for the fundamental frequency has to be
maximum drain efficiency (DCRF). The same schematic done with the harmonics set to 50Ω. Then, the load-pull
is used for the load-pull simulations as for the initial tun- has to be performed for harmonic loads and then with the
ing except for the addition of an XDB control element newly found harmonic impedances. For the highest per(Figure 6). This provides contours which are not only at a formance, load-pull for the fundamental is again repeatconstant power, efficiency, etc., but also at a constant gain ed. More iteration is needed for the harmonics, and at
that point one might want to stop the iterations. The
compression.
issue with this approach, other than the number of iterations required, is the uncertainty that optimum loads
IVCurve() (mA)
IV.AP_DC
IVDLL(S1\V_METER.VM1,S1\I_METER.I_drain_int)[*] (mA)
Load_lines.AP_HB
27.95 V
49.32 V
2.
0
0. 6
0.8
1.0
6.706 V
0.
4
10.0
4.0
5.0
3.0
2.0
1.0
0.8
0.6
0.4
0.2
0
0. 2
-10.0
0
-2
.0
.0
-1.0
-0.8
-3
6
- 4.
- 0.
- 5 .0
26 High Frequency Electronics
were actually defined, and nothing will
be known of mode of operation.
IVCurve() (mA)
IV.AP_DC
IVDLL(S1\V_METER.VM1,S1\I_METER.I_drain_int)[*] (mA)
Load_lines.AP_HB
IV DLL
8000
Matching Network Synthesis
Once all impedances have been
determined, ADW will be used to syn6000
thesize the broadband matching networks. The required fundamental and
4000
harmonics impedance areas across the
desired bandwidth are defined in the
2000
corresponding facilities of ADW are
shown in Figure 9. The fundamental
impedance areas for each frequency are
0
circles on the Smith chart. The harmonic impedance areas are sections of
-2000
the Smith chart.
0
20
40
56
Based on the impedances input into
Voltage (V)
ADW, an initial hybrid microstrip/
lumped component output matching
Figure 4 • Final dynamic load-line after harmonic impedance
network was synthesized (left image in
tuning.
Figure 10). The initial design is then
exported into ADW’s analysis facility for
Vtime(S1\V_METER.VM1,1)[*] (L, V)
Itime(S1\I_METER.I_drain_int,1)[*] (R, mA)
the addition of all decoupling components,
Load_lines.AP_HB
Load_lines.AP_HB
optimization and layout manipulation. The
Wave forms
final output matching network design can
8000
60
be seen on the right in Figure 10. The same
process is performed for the input matching
50
6333
network and both designs are exported to
40
4667
MWO to finalize the design.
6.706 V
27.95 V
49.32 V
30
3000
Finalizing the Design
Once the matching networks are in
20
1333
MWO, Modelithics models are substituted
for the surface mount lumped element mod10
-333.3
els used in ADW. Final linear, harmonic
balance, EM, and DC simulations are then
0
-2000
performed to fine-tune the design. The
0
0.2
0.4
0.6
0.8
1
described design process typically elimiTime (ns)
nates the need for optimization. The final
layout and design performance can be seen Figure 5 • Intrinsic voltage and current waveforms after harin Figure 11 and Figure 12, respectively. monic impedance tuning.
Figure 13 shows the simulated intrinsic
figures, excellent measurement to simulation agreement
device channel voltage and current waveforms at 1.8GHz, 2GHz and 2.2GHz. It can be seen that was achieved without any on-the-bench tuning.
Although there is a small difference in simulated verthe mode of operation of the final design is very close to
sus
measured output power, this is to be expected as in
Class-F across the required bandwidth. It could be
reality
there would be slightly more losses in each eleclaimed that the described method of design achieves an
ment,
the
transistor would heat up, and the models of the
extended continuous Class-F mode of operation [1].
transistor and any other component could not be perfect.
However, the difference in PAE is somewhat more subMeasurement Results
The Class-F power amplifier design presented in the stantial. In an attempt to resolve this discrepancy, a predesign flow above was built and tested. An image of the liminary yield analysis was performed on capacitor part
assembled amplifier can be seen in Figure 14. The mea- values in the output matching network (Figure 18). All
sured results presented in Figure 15 - Figure 18 are pre- capacitors were assigned a 5% tolerance. It is perceived
sented without any tuning. As evidenced by the following
27
Power Amp Design
PORT1
P=1
Z=50 Ohm
Pwr=0 dBm
HBTUNER2
ID=TU2
Mag1=0.95
Ang1=159 Deg
Mag2=0
Ang2=0 Deg
Mag3=0
Ang3=0 Deg
Fo=2 GHz
Zo=50 Ohm
HBTUNER2
ID=TU3
Mag1=0.75
Ang1=-175 Deg
Mag2=1
Ang2=-160.3 Deg
Mag3=1
Ang3=-172.2 Deg
SUBCKT
Fo=2 GHz
ID=S1
Zo=50 Ohm
NET="HMT_TQT_T2G6003028_FL_001"
Temperature=25 DegC
1
2
self_heat_factor=1
1
CAP
ID=C2
C=8.2 pF
Gate
RES
ID=R1
R=200 Ohm
3:Bias
XDB
ID=PO1
IN=PORT_P1
OUT=PORT_P2
XDB=4 dB
GAIN_TYPE=Linear
FUNC_IN=P("f1")
FUNC_OUT=P("f1")
ERR=0.01
RESET=No
3:Bias
2
1
2
Drain
M
RES
ID=R2
R=50 Ohm
DCVS
ID=V2
V=-3.03 V
IND
ID=L1
L=22 nH
3
Source
PORT
P=2
Z=50 Ohm
DCVS
ID=V1
V=28 V
CAP
ID=C1
C=10000 pF
Figure 6. Load-pull simulation schematic. Notice that the schematic is identical to that of Figure 1, however the input and output impedances have been updated and the XDB component has been added.
Pmax and DCRF
2.
0
0. 6
0. 8
1. 0
Swp Max
101
71.15
Mag 0.4676
Ang 154 Deg
DCRF_PORT_2 = 71.15
0
3.
4. 0
5. 0
0.
4
0. 2
10. 0
4. 0
5. 0
3. 0
2. 0
1. 0
0. 8
0. 6
0. 4
0
0. 2
10. 0
- 10. 0
2
0
0
-3
.0
- 1. 0
- 0. 8
6
.0
-2
.4
-0
- 0.
- 4.
45.5
Mag 0.6893
Ang -162.4 Deg
Pcomp_PORT_2_1_M_DB = 45.5
- 5.
- 0.
28 High Frequency Electronics
Swp Min
1
from the yield analysis that some initial tuning could
reduce, if not eliminate the discrepancy in PAE.
Conclusions
A streamlined practical design method for a broadband high-efficiency RF power amplifier was presented.
Using Modelithics transistor models with access to the
reference planes at the intrinsic generator allows for a
new approach and shortened process of extracting the
fundamental and harmonic impedances to obtain the
desired performance. The new approach is to pre-tune the
fundamental and harmonics impedances presented to the
intrinsic current generator before performing load-pull
simulations.
The efficiency and creativity of the design process is
also substantially improved by using the Amplifier
Design Wizard which is the only commercially available
Figure 7 • The load-pull contours of the fundamental frequency for maximum power (blue) and drain
efficiency (magenta) have been plotted in the same
Smith chart. The green circle defines the region of
mutually acceptable power and efficiency.
DCRF_PORT_2
DCRF_PORT_2 Max
DCRF_PORT_2
LPCM(73,46.92,2.5,1,1,50,0)
2nd_Fund_maxEff
DCRF_PORT_2 Max
LPCM(73,64,1,1,1,50,0)
3rd_Fund_maxEff
Swp Max
73
0.8
0
0. 6
2.
0
0
3.
67
Mag 0.5067
Ang -4.821 Deg 4.0
DCRF_PORT_2 = 67
5 .0
62.75
Mag 0.4479
Ang -66.35 Deg
DCRF_PORT_2 = 62.75
-10.0
- 4.
0
-0
.4
.0
-2
6
-1.0
- 0.
Swp Min
40.78
-0.8
-1.0
-0.8
- 0.
6
-2
.0
.0
-3
4
- 5 .0
0.
73
r 1.72307 Ohm
x -9.58084 Ohm
DCRF_PORT_2 = 73
- 0. 2
73
Mag 0.9297
Ang -172.1 Deg
DCRF_PORT_2 = 73
.0
65.5
r 380.844 Ohm
x -613.513 Ohm
DCRF_PORT_2 = 65.5
0
65.78
- 0. 2
r 1.71447 Ohm
x -9.95503 Ohm
DCRF_PORT_2 = 65.78
10.0
4.0
5.0
2.0
1.0
0.8
0.6
0.4
0.2
0
10.0
4.0
5.0
3.0
2.0
1.0
0.8
0.6
0.4
0.2
10.0
-10.0
0. 2
0
66
Mag 0.9471
Ang -175.3 Deg
DCRF_PORT_2 = 66
0. 2
10.0
3.0
4
60.78
r 199.221 Ohm5.0
x 429.387 Ohm
DCRF_PORT_2 = 60.78
-3
0.
4. 0
- 4.
0.8
2.
4
0
0.
3.
- 5 .0
0. 6
1.0
3rd_DCRF_at_Pmax_and_DCRFmax_imp
Swp Max
73
1.0
2nd_DCRF_at_Pmax_and_DCRFmax_imp
Swp Min
61.75
Figure 8 • Top Left – Plot of load-pull contours for the
second harmonic frequency at the fundamental impedances for maximum power and drain efficiency. The
acceptable region is below the drawn line. Top Right
– Plot of load-pull contours for the third harmonic
frequency at the fundamental impedances for maximum power and drain efficiency. The acceptable
region is above the drawn line.
Figure 9 • Left - Examples of the termination definition
facilities in ADW. Right – Smith chart view of desired
termination impedances (red, grey, pink, and blue) versus achieved impedances (green).
29
Power Amp Design
Figure 10 • Left – Initial hybrid microstrip / lumped element output matching network created in ADW.
Right – Final output matching network after decoupling elements, optimization and layout manipulation
is complete.
DB(|Pcomp(PORT_2,1)|) (dBm)
Real_amplifier.AP_HB
DB(|LSSnm(PORT_2,PORT_1,1,1)|)
Real_amplifier.AP_HB
60
40
DB(|LSSnm(PORT_1,PORT_1,1,1)|)
Real_amplifier.AP_HB
2.1997 GHz
67.5
2.0138 GHz
46.2 dBm
1.8008 GHz
45.9 dBm
2.0925 GHz
19 dB
20
1.75
2.2003 GHz
45.9 dBm
1.8
1.85
1.9
1.95
2
2.05
Frequency (GHz)
30 High Frequency Electronics
2.1
2.15
2.2
“real-frequency” and “real-world” matching
network synthesis tool. It also provides
many levels of automation to drastically
reduce the amount of time required to create and manipulate the schematics and
layouts.
References
[1]Vincenzo Carrubba, Alan. L.
Clarke, Muhammad Akmal, Jonathan Lees,
Johannes Benedikt, Paul J. Tasker and
Steve C. Cripps, “On the Extension of the
2.0991 GHz
12.8 dB
0
-20
Figure 11 • Final layout for the Class-F
amplifier design.
DB(|S(2,1)|)
Real_amplifier.AP
Pout, DCRF, Gain
1.8019 GHz
66.4
80
DCRF(PORT_2)
Real_amplifier.AP_HB
2.25
Figure 12 • Final simulated performance for the Class-F amplifier design.
Vtime(S1\V_METER.VM1,1)[1] (L, V)
Real_amplifier.AP_HB
Vtime(S1\V_METER.VM1,1)[2] (L, V)
Real_amplifier.AP_HB
Itime(S1\I_METER.I_drain_int,1)[1] (R, mA)
Real_amplifier.AP_HB
p2: Freq = 2 GHz p1: Freq = 2 GHz
p2: Freq = 1.8 GHz p1: Freq = 1.8 GHz
Wave forms at intrinsic generator
80
p2
Itime(S1\I_METER.I_drain_int,1)[2] (R, mA)
Real_amplifier.AP_HB
6000
Wave forms at intrinsic generator
60
5000
p1
60
4400
40
2800
20
1200
0
-400
40
3500
20
-20
0
0.4
Time (ns)
0.8
1.111
-2000
p1
2000
p2
0
-20
500
0
Figure 13 • Simulated intrinsic device channel
voltage and current wave forms at 1.8GHz (top
left), 2GHz (top right), and 2.2GHz (bottom right).
0.2
0.4
Time (ns)
Vtime(S1\V_METER.VM1,1)[3] (L, V)
Real_amplifier.AP_HB
0.6
0.8
1
-1000
Itime(S1\I_METER.I_drain_int,1)[3] (R, mA)
Real_amplifier.AP_HB
p2: Freq = 2.2 GHzp1: Freq = 2.2 GHz
Wave forms at intrinsic generator
80
8000
p2
60
40
6000
4000
20
2000
p1
0
-20
0
0
0.2
0.4
Time (ns)
0.6
0.8
-2000
0.909
Figure 15 • Simulated versus measured output
power (red), PAE (blue), and S21 (green). Lines
show simulated performance, symbols show measured data.
Continuous Class-F Mode Power Amplifier”, IEEE Trans.
Microw. Theory Tech., vol. 59, no. 5, pp. 1294-1303, May
2011.
About the Authors
Ivan Boshnakov is with ETL Systems Ltd. Malcolm
Edwards works at NI AWR. Larry Dunleavy and Isabella
Figure 14 • Assembled Class-F amplifier design.
31
Power Amp Design
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Figure 16 • Simulated versus measured small signal S-Parameters.
Waveguide Bandpass
Filters
Waveguide
Detectors
Waveguide Power
Amplifiers
Waveguide
Sections
Figure 17. Simulated versus measured output power (left) and PAE
(right).
Waveguide Standard
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Figure 18. Results of a preliminary yield analysis showing the
effect of part value tolerances on PAE. Performed with 5% tolerance on all capacitors in the output matching network.
Delgado are with Modelithics Inc. Thanks to Adam Furman and Scott
Skidmore of Modelithics for assistance with assembly and testing of the
power amplifier example used in this note.
Contact Information
For information on accessing the Modelithics-Qorvo GaN Model Library
or the Modelithics COMPLETE Library please contact Modelithics at
sales@modelithics.com or via the web at modelithics.com.
Get info at www.HFeLink.com
32 High Frequency Electronics
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Moisture Sensitivity
The Mystery Behind
MSL 1, 2, 3
By Kelvin Kiew
What is Moisture Sensitivity Level (MSL)?
Semiconductor non-hermetic packages have the tendency to absorb
moisture. During the surface-mount solder reflow process, moisture
Moisture Sensitivity
trapped in the package will vaporize when heat is applied. The expansion
Level (MSL) is a
of this trapped moisture creates internal stress, which can cause damage
classification outlined
to the non-hermetic package. The damage can take the form of internal
in the industry
separation between the plastic and die or metal frame, wire bond damage,
standard procedure
die damage or internal cracks.
IPC/JEDEC J-STD-020.
Unfortunately, the damage is often not visible on the package surface
and may require X-ray or Scanning Acoustic Microscopy equipment to conduct a proper analysis. In the event the damage goes undetected, it may result in serious and
long-term reliability problems. In extreme cases, cracks may extend to the package surface,
causing the package to bulge and crack externally, literally popping open. This phenomenon is
known as “the popcorn effect” in the industry.
Moisture Sensitivity Level (MSL) is a classification outlined in the industry standard procedure IPC/JEDEC J-STD-020 to address the moisture absorption problem of non-hermetic
packages. MSL defines moisture absorption into 6 different levels through standard test methods and criteria. The MSL 1 classified non-hermetic package is the least sensitive to moisture
and MSL 6 is the most sensitive.
Knowing the Moisture Sensitivity Level (MSL), moisture absorption of non-hermetic packages can be contained through various packing and handling methods defined in the industry
standard procedure, IPC/JEDEC J-STD-033. By implementing the right method in packing and
Table 1 • The packing requirements for MSL classifications. Note: ** Caution Label is
required if classified at other then 220ºC~225ºC reflow temperature. *** Mandatory Drybake before surface-mount solder reflow process.
34 High Frequency Electronics
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minicircuits.com and place your order today for delivery as soon as tomorrow!
i See
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specified over 0.5 to 7 GHz.
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• High Gain, 21 dB
• Excellent Gain Flatness,±0.7 dB ii
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541 revC
Moisture Sensitivity
Table 2 • Reference Criteria and Condition for Dry-Bake Process.
handling, damage during the surface-mount solder reflow
process can be prevented.
This article will provide insight into the appropriate
packing and handling methods, including dry-bake before
packing, floor life control, and dry-bake for expired floor
life non-hermetic packages.
Packing Method
The product packing of non-hermetic packages is
critical except for those rated MSL 1. Every MSL class
has its own specific packing requirements, according to
IPC/JEDEC J-STD-033. This is to prevent moisture
absorption of the non-hermetic package. The packing
36 High Frequency Electronics
requirements include some combination of the following,
depending on MSL class:
• Dry-bake before packing
• Moisture barrier bag (MBB) with humidity indicator card (HIC)
• Desiccant
• Moisture-sensitivity identification (MSID) label
• Caution label containing information such as MSL,
floor life after unsealing the bag, temperature &
humidity range, and reflow peak temperature.
Dry-Bake Before Packing
The Dry-Bake process is required to dry off the
absorbed moisture in the non-hermetic package before
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cable assemblies.
Call us today and let our experience work for you!
Phone: (888) 591-4455 or (772) 286-4455 Fax:(772) 286-4496
E-Mail: admin@microwavecomponentsinc.com
Web Site: www.microwavecomponentsinc.com
AS9120
ISO 9001:2000
CERTIFIED
Moisture Sensitivity
Table 3 • Floor Life and Condition for MSL Classifications.
packing. It has to be performed according to the criteria
and conditions in reference to MSL classification and
body thickness of the non-hermetic package. Table 2
below shows the dry-bake criteria and conditions.
Floor Life Control
Based on the MSL classification, the floor life of the
non-hermetic package is determined and controlled. The
floor life of the package begins after unsealing of the bag.
Table 3 below shows the floor life and condition for each
MSL class. The floor life control ends after the surfacemount solder reflow process is completed.
Dry-Bake to Extend Floor Life
In the event that the non-hermetic package is exposed
to atmosphere beyond the controlled floor life, dry-bake is
required to extend floor life before future surface-mount
solder reflow process. Dry-bake to extend floor life has to
be performed according to the criteria and conditions in
reference to the MSL classification and body thickness of
the non-hermetic package. Table 4 below shows the drybake criteria and conditions to extend floor life.
38 High Frequency Electronics
Mini-Circuits Products
Mini-Circuits understands the importance and significance of Moisture Sensitivity Level (MSL) requirements, and we fully expect our products to be reliable. In
addition to providing state-of-the-art, high-performance
products, we want our customers to enjoy ease of use and
to incur the lowest possible costs in using our products.
We know that customers will have to implement tedious
and costly procedures to use non-MSL 1 rated products.
Accordingly, our design and manufacturing processes are
carefully determined from concept to realization, each bill
of material is carefully selected, and a variety of designs
and testing methods are conducted to ensuring we meet,
maintain and exceed MSL 1 classification.
As a result, all Mini-Circuits semiconductor products
are MSL 1 classified. This technical excellence brings
about many advantages and benefits to customers who
select Mini-Circuits as their preferred components supplier.
About the Author
Kelvin Kiew is President and CEO, Mini-Circuits
Technologies Malaysia Sdn Bhd.
Table 4 • Reference Criteria and Conditions for Dry-Bake Process to Extend Floor Life.
39
Product Feature
Wide Frequency Range Power Sensor
for Lab Use, EMC Test, SATCOM,
Defense Applications
“
It can be
interfaced using
its USB HID,
USBTMC or can
be directly
controlled
through its I2C or
SPI, serial
microcontroller
interfaces.
40 High Frequency Electronics
LadyBug Technologies announced its fully self-contained 9 kHz to
40 GHz Wideband RF and microwave power sensor. The highly accurate power sensor is suitable for laboratory use, EMC testing,
SATCOM, and defense applications.
The sensor can be interfaced using its USB HID, USBTMC or can
be directly controlled through its I2C or SPI, serial microcontroller
interfaces. These options make it ideal for automated test equipment.
All interfaces use standard SCPI commands. The sensor’s USBTMC
interface makes it a drop in replacement for similar competitive sensors. The sensor includes a full featured windows application.
With 80dB of dynamic range, the sensor is extremely flexible.
The sensor is capable of making accurate measurements down to
-60 dBm without zeroing before use. This low level sensitivity, broad
frequency range, and flexible connectivity make the sensor is ideal for
a wide variety of applications.
LadyBug Technologies
ladybug-tech.com
rie! s!
e
S
NewTINY
Ultra-Wideband
MMIC SPLITTER/COMBINERS
+
2C GHz
P
E 2.5
1
to
8
.
1
+
2K Hz
P
E 0G
o2
t
5
1+ z
K
H
2
EP .5 G
26
o
2t
Single Unit Coverage as Wide as
2 to 26.5 GHz
5
$ 56
Models from
ea.(qty.1000)
THE WIDEST BANDWIDTH IN THE INDUSTRY IN A SINGLE MODEL!
Our new EP-series ultra-wideband MMIC splitter/combiners are perfect for wideband systems like defense and instrumentation that require full coverage in a single
component. These models deliver consistent performance across the whole
range, so you can reduce component counts on your bill of materials by using one
part instead of many! They utilize GaAs IPD technology to achieve industry-leading
performance, high power handling capability and efficient heat dissipation in a tiny
4x4mm device size, giving you a new level of capability and the flexibility to use
them almost anywhere on your PCB! They’re available off the shelf, so place your
order on minicircuits.com today, and have them in hand as soon as tomorrow!
•
•
•
•
•
•
Series coverage from 1.8 to 26.5 GHz
Power handling up to 2.5W
Insertion loss, 1.1 dB typ.
Isolation, 20 dB typ.
Low phase and amplitude unbalance
DC passing up to 1.2A
Tiny size, 4 x 4 x1mm
Mini-Circuits
®
www.minicircuits.com
P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
549 Rev Orig
Product Highlights
Epoxy Adhesive
Master Bond Supreme 18TC is a single component
epoxy adhesive that contains a blend of special thermally
conductive fillers. This smooth paste system can be
applied in bond lines as thin as 10-15 microns. It offers an
exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W
NM-023_IMA7.25x4.75-HFE-proof121415.pdf
1
12/14/15
4:58
and a thermal
conductivity of 22-25 BTU•in/ft2•hr•°F
[3.17-3.61 W/(m·K)]. It also passes NASA low outgassing
tests and can be used in applications in the aerospace,
electronics, optical, specialty OEM and cryogenic industries.
Master
Bond
PM
masterbond.com
L-3 NARDA-MITEQ...NEXT-GENERATION
INTEGRATED MICROWAVE ASSEMBLIES
Your Proven Source for IMAs With
Open VPX Technology
L-3 Narda-MITEQ offers more than 60 years
of innovative component-level expertise in
microwave and RF technology, delivering both
performance and packaging solutions not
considered possible in the past. We are your
proven source for complex-level IMA modular
designs with open VPX technology for antenna
interface modules, converters, wideband
amplifiers, receivers, synthesizers, switched
filter banks and more. Providing everything
from design to production, we are ready to
meet your most challenging requirements.
When your next project demands a highly
specialized IMA, count on L-3 Narda-MITEQ –
your best resource for advanced VPX solutions.
Learn more about all we have to offer by
visiting us at nardamiteq.com or call us at
(631) 231-1700.
Complex-Level
IMA Modular
Design
42 High Frequency Electronics
OPEN VPX
TECHNOLOGY
Get info at www.HFeLink.com
Narda-MITEQ
L-3com.com
Product Highlights
Edge Launch Connectors
• 1.85mm, 2.4mm, 2.92mm, 3.5mm, & SMA Series readily available for
0.062” thick PCB’s.
• Electrical: 50 Ohm, Low VSWR, Low Insertion Loss, Mode Free through
65 GHz.
• Materials: Beryllium Copper Gold plated Components.
• Dielectrics are PCTFE (PolyChloroTriFluoroEthylene) (SMA Fluorocarbon
(PTFE)).
• Available for immediate delivery – Same day shipping for all stock items.
SGMC Microwave
sgmcmicrowave.com
Coupler
ZGBDC20-33HPD+ is a high-power, wideband bi-directional coupler providing 20 dB coupling with good coupling flatness across the 300 to 3000 MHz
frequency range. It is capable of handling up to 250W RF input power and passing up to 3.0A DC current from input to output. 20 dB typical directivity allows
accurate sampling of signal through the coupled port, and low mainline loss
(0.15 dB typical) provides excellent transmission of signal power from input to
output.
Mini-Circuits
minicircuits.com
Get info at www.HFeLink.com
43
Product Feature
“
The on-chip
sequencer allows
the LTC2335-18 to
be programmed
to cycle through
a sequence of
channels and
ranges without
further user
intervention.
44 High Frequency Electronics
”
ADC Ideal for Test &
Measurement,
Instrumentation
The LTC2335-18 is an 18-bit, 8-channel 1Msps multiplexed input successive approximation register (SAR) ADC with independently configurable input ranges. Each SoftSpan™ input can be software configured on
a conversion-by-conversion basis to accept ±10.24V, 0V to 10.24V, ±5.12V
or 0V to 5.12V true bipolar input signals.
The on-chip sequencer allows the LTC2335-18 to be programmed to
cycle through a sequence of channels and ranges without further user
intervention. The differential analog inputs operate over a -16.5V to 34V
input common mode range, allowing the ADC to directly digitize a variety
of signals to simplify signal-chain design. It is ideal for test and measurement, power line monitoring and instrumentation applications.
Linear Technology
linear.com
Product Highlights
Connectors
VidaRF is offering a new line of precision coaxial connectors for semi-rigid
and flexible cables. Interfaces include
Type N, Type N Right Angle, SMA and
TNC connectors that provide excellent
VSWR from DC-18 GHz. S/Steel passivated construction. VidaRF serves the
Microwave and RF industry with high
performance Isolators, Circulators,
Power
Dividers,
Couplers,
RF
Connectors, Adapters, Cable Assemblies,
Attenuators, and Terminations.
VidaRF
vidarf.com
2-Way Splitter
Model WMPD02-8-12-S/N from
Werbel Microwave LLC is a 2-way
splitter that covers the 8 – 12 GHz
band. It is available in a housing
measuring 1.8 x 1.5 x 0.8 in. and is
available with either N or SMA
female connectors. VSWR is specified
1.4:1 or better at all ports. Insertion
loss is typically 0.5 dB max, and isolation is 18 dB min. Phase balance is
specified +/- 4 degrees. The unit is
designed for 10W in splitter operation. Made in USA.
Werbel Microwave LLC
werbelmicrowave.com
MM-Wave Tutorial
A new tutorial, Millimeter Wave
Active Component Characterization
for 5G, explores the tools required
for performance verification of millimeter wave active devices. It
addresses the challenges with making a single connection measurement for multiple measurements of
transceiver modules for 5G.
Innovation in Millimeter Wave Solutions
www.omlinc.com
(408) 779-2698
Get info at www.HFeLink.com
Keysight Technologies
45
keysight.com
Product Feature
Miniature TO-8 YIG-Tuned Oscillator
Covers 10 to 20 GHz for Test
Instruments, Wideband Receivers,
and More
“
Micro Lambda offers
the deepest standard
product line of YIG
oscillators,
synthesizers, filters,
multipliers, and
benchtop intruments.
46 High Frequency Electronics
”
Micro Lambda Wireless announced the production release of TO-8
YIG-Tuned oscillators covering the frequency range from 10 to 20 GHz.
This new model is only .7” tall and is perfect for the next generation products that use plug-in technology.
The standard model operates over the 0 to +65 C temperature range,
but Military versions covering -40 to +85C are available on special order.
Applications include Test Instruments, Wide Band Receivers, Telecom,
Satcom, and a variety of Military applications.
Availability: 4 - 6 weeks from receipt of order.
Micro Lambda offers the deepest standard product line of YIG oscillators, synthesizers, filters, multipliers, and benchtop intruments. It also
thought ahead and designed complementary drivers for nearly every
product in its portfolio, so you can employ them right out of the box. Every
product is supported by a team of engineers that are always ready to help
with your application engineering and product integration challenges.
Micro Lambda Wireless
microlambdawireless.com
Product Highlights
Band-Pass Filter
Model SWF-61312340-15-B1 is a V band waveguide
bandpass filter to pass the frequency range of 55 to 67
GHz and reject the frequency DC to 51 GHz and 71 to 90
GHz. Nominal insertion loss is 2.0 dB and typical rejection is 50 dB. The waveguide interface is WR-15 waveguides with UG-385/U flanges. Since both low end and
high end cut off frequencies can be selected through the
design, various custom designed models are available.
Diplexer
CDPL-1710A+ is a 50W high performance diplexer
with the channel-1 at 1176 MHz and channel-2 at 1590
MHz. Good return loss combined with high out of channel
rejection makes it an ideal component in differential GPS.
Mini-Circuits
minicircuits.com
SAGE Millimeter
sagemillimeter.com
Express Cable Delivery
Dynawave is shortening the wait
for standard and custom length coaxial cable assemblies through its
Dynawave Express accelerated delivery program.
Dynawave Express is available
for standard length DynaTest™
cable assemblies (24”,36”,48”) and
custom length, low loss DynaFlex®
cable assemblies. Quotes are provided for both product series within 24
hours of request. DynaTest™ assemblies are shipped within 24 hours
and custom length DynaFlex®
assemblies within 2 weeks.
DynaTest™ assemblies offer outstanding value in a production test
cable with broadband frequency to
26 GHz and a highly flexible, phase
stable design. The design utilizes
several high reliability features such
as molded strain relief taper sleeves,
hex/knurl coupling nuts and an abrasion-resistant outer jacket sleeve.
Dynawave
dynawave.com
Automated Scalable RF Platform
Spider™ | Extensible Platform
Building blocks that make test-bed
setups for Wi-Fi, LTE unlicensed, and
coexistence child’s play.
© 2016 Azimuth. All rights reserved.
Get info at www.HFeLink.com
47
Product Feature
New Signal Analyzer’s Multi-Touch
User Interface Streamlines
Measurement Setup
Keysight announced new X-Series signal analyzers
that provide significantly enhanced capabilities for developers creating next-generation devices. Most notable is a
multi-touch user interface (UI) that streamlines measurement setup and creates a solid foundation for new solutions.
Performance improvements and feature enhancements address emerging needs in aerospace, defense and
wireless communications.
The UI enables optimization of measurement parameters in no more than two touches. Support for gesturedriven controls, such as pinching, dragging and swiping,
makes analysis more immediate and intuitive. With consistent operation across the UXA, PXA, MXA, EXA and
CXA, learning one means knowing them all.
To help developers create next-generation devices, the
flagship UXA now offers frequency coverage to 44 or 50
48 High Frequency Electronics
GHz and integrated 1 GHz analysis bandwidth, an industry first.
The PXA now offers benchmark phase noise performance of -136 dBc/Hz at 1 GHz, 10 kHz offset, and realtime bandwidth of 510 MHz with spurious-free dynamic
range greater than 75 dBc over the full span.
To characterize signal interactions in dense radar
environments, the UXA and PXA support real-time data
streaming at up to 255 MHz bandwidth with 16-bit resolution at 300 MSa/s.
When coupled with a data recorder from solutionpartner X-COM Systems, the analyzers support real-time
acquisition with up to 15 TB (> 3 hrs) of capture memory.
Keysight Technologies
keysight.com
Product Highlights
PRODUCTS
TO SOLUTIONS
RF Products
Attenuators
Featuring our line of 50 watt low PIM Attenuators with 4.3/10.0 DIN connectors. With PIM spec of -160 dBc typ, while handling full rated power to
+85°C with no power deration over temperature. Covering 0.698 - 2.700 GHz
frequency bands and weatherproof IP67 rated. Products are verified for RF
performance and PIM tested to the industry standard consisting of 2 x 20 W
tones at 25 degrees C in both Cell & PCS Bands.
MECA Electronics
e-meca.com
Ducommun has more than 45 years
of experience with the design,
testing and manufacturing of
coaxial switches and
integrated systems
Coaxial Switch
• 400 MHz to 8 GHz
• 10 WCW
• Operating temp
- 30˚C to +71˚C
• Low Insertion Loss
• High Isolation
• For Use In All Thermal Vacuum
Chambers
Manually Controlled
• DC to 22 GHz
• Available in SPDT,
DPDT, and up to
SP8T
• 200 WCW
• Great for lab testing
Ultra Broadband
• SPDT to SP8T
• Insertion in Loss
Fairview Microwave
fairviewmicrowave.com
For additional information,
contact our sales team at
+1 (310) 513-7256
rfsales@ducommun.com
CONTACT US
Test Probes
Fairview Microwave’s new family of semi-rigid test probes operate up to 6
GHz. They are constructed of high quality semi-rigid coax and SMA Female
connectors. They come in multiple cable diameters to help when attaching the
unterminated end of the probe to a circuit board trace. There are two versions:
straight-cut probe ends for those that would like to customize the dimensions
of the center conductor and dielectric dimensions; as well as pre-stripped probe
ends that are ready for immediate use.
i. Reflective: 20dB min
ii. Absorptive: 40dB min
• Complete solid state
solution
• 0.05 GHz to 67 GHz
Get info at www.HFeLink.com
49
Product Feature
Broadband
Amplifier Family
for Wireless
Communications,
Automotive
Applications
Rohde & Schwarz expands its R&S BBA150
broadband amplifier family with the D series to
cover the frequency range from 690 MHz to 3.2 GHz
and power levels up to 800 W. With the new addition, the company’s amplifier portfolio can also be
used for tests in the automotive and wireless communications sectors. These compact, lightweight
amplifiers feature state-of-the-art design. The models in the new series are available in the power
classes 30 W, 60 W, 110 W, 200 W, 400 W and 800 W.
The R&S BBA150 amplifier family’s D series is
characterized by high power density and appeals
especially to the automotive and wireless communications industry. A desktop model of only four height
units delivers up to 200 W. In total, an output power
of up to 800 W in the frequency range from 690 MHz
to 3.2 GHz is possible.
Both frequency bands, from 1.2 GHz to 1.4 GHz
and 2.7 GHz to 3.2 GHz, as are necessary for automotive radar pulse tests with high field strength,
are integrated in only one amplifier. With a frequency range starting at 690 MHz, the amplifiers
meet the requirements of the LTE, GSM700, UMTS
and WLAN mobile communications standards. The
high power levels are required for compliance tests
in EMC labs.
Users in the field of research and development
can use the amplifiers for robustness and precompliance tests. In production, the amplifiers are available for device und product validation tests.
Rohde & Schwarz
rohde-schwarz.com
50 High Frequency Electronics
Product Highlights
Analog Filters
The D68 series of analog filters from Frequency
Devices have Total Harmonic Distortion levels as low as
-100 dB with near theoretical frequency responses and
low noise. The D68 filters are available in low pass and
high pass versions with Butterworth, Bessel, Elliptic, and
Constant Delay transfer functions. Filters with 4, 6, and,
8 poles with corner frequencies from 1 Hz to 100 kHz can
be ordered. They are very small at 1.8” by 0.8” by 0.3” tall.
Frequency Devices
freqdev.com
Switches
Skyworks offers a family of high isolation (47 dB)
multi-throw switches for 0.7–3.0 GHz Rx switching.
The SKY13522-644LF, SKY13523-639LF and
SKY13524-639LF are designed for switching singleended Rx SAW filters in cellular handsets. Consuming
less than 10 µA of current, they are ideal for low
power switching in smartphone, data card, IoT, infrastructure and test and measurement applications
and may be used for switching filter banks in infrastructure Rx chains. The small footprint devices are
supplied in quad-flat no-lead (QFN) packages: 14-pin
1.6 x 1.6 x 0.45 mm (-639LF) and 8-pin 1.1 x 1.1 x
0.45 mm (-644LF).
Skyworks
skyworksinc.com
Get info at www.HFeLink.com
51
Product Highlights
Mixer/Phase Detector
Model SFQ-15-F1 is a V Band Quadrature Mixer or
Phase Detector covering the frequency range of 58 to 62
GHz. Since the IF port is DC coupled, the mixer can be
used as a phase detector. In addition, it can readily be
configured into an image rejection mixer or single side-
40 MHz to 2.5 GHz RF Amplifier
Model SPG-2G-002 operates between 40 MHz and 2.5
GHz. The power gain with 50 Ohms I/O impedances is 39
dB (typ.) at 200 MHz, 27 dB at 20 MHz and 22 dB at 2.5
GHz. Operating power supply is between 3.3V to 5.5V.
P1dB is typically is 3.6 dBm at 2.7 GHz, 4.6 dBm at 1.9
GHz and 4.8 dBm at 900 MHz. Reverse isolation is better
than -31.0 dB at 900 MHz. Power supply current varies
52 High Frequency Electronics
band modulator by adding an IF quadrature coupler.
Typical conversion loss is 11 dB with +16 dBm LO driving
power and the LO to RF port isolation is around 30 dB.
SAGE Millimeter
sagemillimeter.com
between 34 to 60 ma. Typical applications include RFPA
predrivers, low power high gain antenna driver, LNA follow-on high gain amplifier, general RF amplification,
general RX/TX amplification. Please visit http://www.signalpro.biz/2rfamps.htm.
Signal Processing Group
signalpro.biz
Product Showcase
SILVER COATED NICKEL FILLED EPOXY
EP79FL Adhesive
Advanced
Switch
Technology
754 Fortune Cr, Kingston, ON
K7P 2T3, Canada.
613 384 3939
info@astswitch.com
Our line of Waveguide, Coaxial and Dual Switches are the most
reliable in the industry, but don’t just take our word for it. Join
the hundreds of satisfied customers who use our switches every
day.
• Electrically conductive
• Tough and flexible
• Thermal cycling resistant
www.masterbond.com
When only the best will do
30
Years
www.highfrequencyelectronics.com
Product Feature
500 – 2500 MHz, 200W SSPA Ideal for
EW, ATE Applications
“
In-house resources
include RF circuit
designs up to 47 GHz,
prototype verification,
system level
mechanical &
electrical design,
digital circuit design,
and control software
development.
54 High Frequency Electronics
”
Exodus Advanced Communications introduces AMP1096, a new
500 - 2500MHz, 200W GAN SSPA Module. Features instantaneous
bandwidth from 500 - 2500MHz with 200W Minimum Saturated
Power output, 3.0dB Peak to Peak flatness and 24A max consumption.
It is suitable for any application that requires high power and wide
band coverage such as EW and ATE.
Exodus Advanced Communications is a multinational RF communication equipment and engineering service company serving both
commercial and government entities and their affiliates worldwide.
Headquartered in Las Vegas, Nevada, the company utilizes its
global network of both In-house and Outside resources to effectively
serve customer requirements.
In-house resources include RF circuit designs up to 47 GHz, prototype verification, system level mechanical & electrical design, digital
circuit design, and control software development.
Outside resources includes custom made RF components, manufacturing services for both small and large volume production. Our
engineering service group provides full design support starting from
the conceptual phase to prototype verifications.
We deliver document packages on all approved prototypes and also
provide manufacturing services per customer’s requirements.
Exodus Advanced Communications
exoduscomm.com
Product Highlights
In Stock
 
     
   
 
    
MM-Wave Products
MECA announced a family of 5G ready millimeter-wave Power Dividers,
Couplers, Isolators, Attenuators and Terminations covering C to V bands. Ideal
for Satcom, 5G and backhaul upgrade applications. Ranging from 2 & 4 way
Power Dividers, 10 & 20 dB Couplers, Attenuators, Terminations, Isolators,
Bias T’s and DC blocks covering up to 40 GHz with 2.92mm connectors. Made
in USA; 36-month warranty.
MECA Electronics
e-meca.com
0201 0402
0603
• Case Sizes: EIA
• Low ESR/ESL
• TC = NPO
• Modeling Data Available
0805
    
• Case Sizes: 0505, 1111
• Q > 10,000
• Low ESR/ESL
• TC = NPO / P90
• Modeling Data Available
Available in Non-Magnetic Terminations

  
• High Power
Capacitors
• Up to 25kV
• High Current
• TC = NPO
• Custom
Assemblies
• Case Sizes:
2225
3838
6040
7676
Available in Non-Magnetic Terminations
MPAC
Richardson RFPD announced availability and full design support capabilities for a new monolithic phase and amplitude controller (MPAC) from
Peregrine Semiconductor. The PE46120 covers a frequency range of 1.8 GHz to
2.2 GHz and integrates a 90-degree hybrid splitter, digital phase shifters and a
digital step attenuator (DSA), along with a low voltage CMOS serial interface.
The new MPAC is designed for precise phase and amplitude control of two
independent RF paths, making it ideally suited for Doherty power amplifiers.
It optimizes system performance while reducing manufacturing costs of transmitters that use symmetric or asymmetric Doherty PA designs to efficiently
process signals with large peak-to-average ratios.
Richardson RFPD
richardsonrfpd.com
      
   

• Unmatched customer service
• Online store
• Design kits in stock
• Inventory programs
Call us today
631-425-0938
sales@passiveplus.com
www.PassivePlus.com
Get info at www.HFeLink.com
55
Product Feature
Reconfigurable Mini Probe Station
Features Small Footprint, Light Weight
“
The probe station
has small
footprint (X = 22
in, Y = 9 in, Z = 8
inch) and can
be used at the
desk or a lab.
”
56 High Frequency Electronics
D-COAX, Inc. has introduced a reconfigurable probe station (Model
W4.0 x L6.5). This mini probe station is meant for the busy design
engineer or technician. It’s used to test a chip or small circuit board for
the project that cannot wait for the local lab probe station availability.
The probe station has small footprint (X = 22 in, Y = 9 in, Z = 8 inch)
and can be used at the desk or a lab. It’s easy to transport weighing
only 9 pounds.
The probe station is fully manual with the following features: 4.0
inch x 6.5 inch test plate with vacuum holes; wide probe holder plates
on each positioner with multiple holes for probe mounting; both positioners can slide back and forth in the X and Y directions and can be
moved toward the DUT at the angle; the height positioning is accomplished via digital micrometers; and each positioner can be locked
independently.
Magnetic plates attach to the normal probe mounting holes to allow
additional magnetic XYZ positioners with fine adjustment; probe arms
are adjustable in the X, Y, Z, and theta.
This probe station is compatible with all standard wafer probes and
many DC needle set-ups. See the video at our website. All D-COAX
products are made in the USA.
D-COAX
d-coax.com
Product Feature
VCOs: Over 60 Different Models in
Surface-Mount and Coaxial Packaged
Versions
Pasternack added an all new product line of voltage controlled oscillators covering select bands from
10 MHz to 11 GHz in a variety of package options.
This line of voltage controlled oscillators is most
commonly deployed in applications such as phase
locked loops, frequency synthesizers, electronic jamming equipment and function generators.
Pasternack’s new voltage controlled oscillators,
commonly referred to as VCOs, are a type of oscillator
where the frequency of the output signal can be varied by adjusting the amplitude of the input tuning
voltage. The performance characteristics play a critical role in overall system performance. Unlike oscillators with a single fixed frequency, VCOs have a range
of frequencies making them desirable with designers.
A comprehensive and growing portfolio of VCOs
includes over 60 different models in true surface
mount and coaxial packaged versions available from
stock. Some models have added features which
include integrated buffer amplifiers and input modulation ports. Tuning voltages can range from 0 to 20
volts, output power ranges from 0 to +12.5 dBm, and
all models have an operational temperature range
covering -40°C to +85°C. These VCOs also boast
exceptional phase noise performance as low as -125
dBc/Hz at 10 KHz offset. All designs are highly reliable and are designed to meet a series of MILSTD-202 environmental test conditions, which
include shock, vibration, and temperature cycle.
Pasternack
pasternack.com
amcomusa.com
301-353-8400
The RF Power House
Wideband Power
Amplifiers (And More!)
Power Device
(GaAs FET, GaAs PHEMT,
GaN/SiC)
MMIC PA
PA Module
Bias T
T/R Switch
Attenuator
Phase Shifter
401 Professional Drive | Suite 140 | Gaithersburg, MD 20879
Get info at www.HFeLink.com
57
Product Feature
Low PIM Switch Matrices Handle
Power Levels Up to 100W
“
Now it is no
longer required
to connect
different PIM
sources multiple
times to tested
devices. Our new
LPSU low PIM
Switch units can
be integrated
seamlessly in
R&D and
production
processes.
”
58 High Frequency Electronics
AWT Global has launched a new line of low PIM switch matrices: the
LPSU Series.
While there are many low-power, low PIM switches on the market,
this new low PIM switch unit LPSU can handle high RF power with levels of up to 100W. LPSU switch matrices are designed for testing situations that require multiple PIM sources, and test multi-port components
and antennas. Even combinations of high power multi-band PIM and
S-Parameters testing are now possible.
“Now it is no longer required to connect different PIM sources multiple times to tested devices. Our new LPSU low PIM Switch units can be
integrated seamlessly in R&D and production processes,” said Wolfgang
Damm, General Manager of AWT Global. “Significantly improved production flow and time savings of more than 70% result in much higher production throughput,” he added.
The new switch matrices combine 5 by 6 low PIM, high power ports
(LPSU 5x6) or 1 by 4 low PIM, high power ports (LPSU 1x4). With a
residual PIM level of less than -163dBc (@ 2x20W), and a frequency range
of 700 – 2700 MHz, LPSU switching matrices can be used for a very wide
variety of telecommunication applications. Insertion loss is 1.2 dB, Return
Loss 13 dB and Isolation 50dB. Power of up to 100W CW can be applied
continuously without degradation of the switches. LPSUs are controlled
view SCPI commands, this either via Ethernet cable connection or wirelessly. LPSUs are housed in 19” Rack mount bodies with a height of 4U.
They are available for immediate sale.
AWT Global
awt-global.com
Product Feature
Vector Signal Generator Enables
Simulation of Complex MIMO
Scenarios
Rohde & Schwarz has enhanced its R&S SMW200A
high-end vector signal generator to include an option that
permits developers of base stations and mobile devices to
simulate a large number of complex MIMO scenarios
such as 4x8, 8x4 or 2x4x4 with realtime fading. The result
is a compact solution that will appeal
to cost-conscious users.
Equipped with the new R&S
SMW-K75
option, the
R&S
SMW200A high-end vector signal
generator from Rohde & Schwarz
can generate complex scenarios of
up to 4x8 or 8x4 MIMO as well as
two MIMO systems with up to 4x4
MIMO.
Multiple input multiple output
transmission is used for a number
of digital communications standards, including LTE, LTEAdvanced and WLAN (802.11n,
802.11ac). The technology will likely also play a key role for 5G. The
solution is therefore targeted at
users working on research and development of base stations and wireless devices for the mobile communications
market.
Rohde & Schwarz
rohde-schwarz.com
Get info at www.HFeLink.com
59
Product Highlights
4 x 4 Hybrid Coupler
REC has developed a compact 4 x 4 Hybrid Coupler to
assist in the deployment of multi-band DAS systems. It
operates between 698 – 2700 MHz and has the ability to
combine four distinctive inputs. The input power is 150W
with low IMD measurement of -153 dBc @ 2 tone, 43 dBm.
Renaissance Electronics & Communications, LLC and its
wholly owned subsidiary HXI LLC provide RF, Microwave
and Millimeter Wave solutions for Military and
Commercial Applications. With products ranging from
high reliability components to integrated transceivers,
our team will exceed your requirements and expectations.
Renaissance Electronics
rec-usa.com
Book Review
Dynamic Power Supply
Transmitters
Earl McCune
© Cambridge University Press 2015
ISBN 978-1-107-05917-7 (Hardback)
This publication claims to be “The first physically based
and coherent book to bring together a complete overview of
such circuit techniques.” The techniques referred to are
envelope tracking, polar modulation and hybrid designs.
The book first explores how to use dynamic power supplies
(DPS) to optimize high peak-to-average power (PAPR). It
explains common principles of DPS, linearity of power
amplifiers, envelope tracking principles, polar transmitter
principles, many idiosyncrasies of all sorts of circuits and
their loads, appropriate transistor technologies and all
aspects of testing and measurement.
It provides a good background leading up to a thorough
explanation of circuit techniques essential to power amplifier efficiency in complex modern RF transmitters. The
choice of a book title may seem, at first, a bit misleading.
Transmitters employing dynamic power supplies, their
theory, and design - both RF and power added supply,
might describe the contents better. There is so much good,
60 High Frequency Electronics
detailed information contained herein, that with
thorough comprehension,
one could well become an
expert in this technique.
This would require even an
experienced
amplifier
designer to spend considerable time in the book and
perhaps also on the bench.
At a recent NIDays
event in Boston, Haydn
Nelson, Senior Product
Marketing Manager, RF
and Wireless, National
Instruments, conducted a
session on Modern RF
Power Amplifier Test Requirements. At the end of his talk
he spoke very favorably of this book, and mentioned that it
was introduced at the IEEE MTT Symposium in Phoenix.
This added to my appreciation of Dr. McCune’s prowess. If
you contemplate or are already dealing with wireless
mobile communications technology, I would strongly recommend Dynamic Power Supply Transmitters.
—Tom Perkins
Senior Technical Editor
The 2016 IEEE MTT-S
International Microwave Symposium
Discover New Technologies. Gain Fresh Insights.
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• The world’s largest Microwave/RF component, test & measurement, software and
semiconductor exhibition featuring over 600 companies
Attend IMS2016 and see what’s new, improve your technical knowledge and network with
colleagues, customers and vendors face-to-face in one efficient trip. No other event in the
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Turbocharge your productivity and boost your career at IMS2016!
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22-27 MAY 2016 • IMS.MTT.ORG
MOSCONE CENTER, SAN FRANCISCO, CA
61
POWER
SPLITTERS
COMBINERS
from
2 kHz to 26.5 GHz
94
as low as
¢
ea.( qty.1000 )
W!
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The industry’s largest selection includes THOUSANDS
of models from 2 kHz to 26.5 GHz, with up to 300 W power
handling, in coaxial,flat-pack, surface mount and rack mount
housings for 50 and 75Ω systems.
From 2-way through 48-way designs, with 0°, 90°, or 180°
phase configurations, Mini-Circuits’ power splitter/combiners offer a vast
selection of features and capabilities to meet your needs from high power
and low insertion loss to ultra-tiny LTCC units and much more.
Need to find the right models fast? Visit minicircuits.com and use Yoni2®!
It’s our patented search engine that searches actual test data for the models
that meet your specific requirements! You’ll find test data, S-parameters,
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448 rev Q
Advertiser Index
CompanyPage
Advanced Switch Technology............................................................... 53
American Technical Ceramics.............................................................. 15
AMCOM................................................................................................. 57
API Technologies INMET....................................................................... 1
Azimuth................................................................................................. 47
Cernex.................................................................................................... 18
Coilcraft................................................................................................. 11
Communication Concepts..................................................................... 59
C.W. Swift & Associates........................................................................C2
dBm.......................................................................................................... 7
Ducommun............................................................................................ 24
Ducommun............................................................................................ 49
Fairview Microwave.............................................................................. 19
Herotek.................................................................................................. 14
IMS 2016............................................................................................... 61
JFW Industries....................................................................................... 5
L-3 Narda-MITEQ................................................................................ 42
Master Bond.......................................................................................... 53
MECA Electronics................................................................................. 51
Micro Lambda Wireless.......................................................................... 9
Microwave Components........................................................................ 37
Mini-Circuits....................................................................................... 2, 3
Mini-Circuits......................................................................................... 21
Mini-Circuits......................................................................................... 23
Mini-Circuits......................................................................................... 35
Mini-Circuits......................................................................................... 41
Mini-Circuits................................................................................... 62, 63
National Instruments........................................................................... 17
OML....................................................................................................... 45
Passive Plus........................................................................................... 55
Pasternack............................................................................................. 32
Pasternack............................................................................................. 33
Planar Monolithics Industries............................................................. 25
Pulsar Microwave................................................................................. 20
RF Bay................................................................................................... 53
Richardson RFPD.................................................................................C4
SAGE Millimeter.................................................................................. 13
Satellink................................................................................................ 53
Sector Microwave.................................................................................. 53
SGMC Microwave.................................................................................C3
Special Hermetic Products................................................................... 53
Temwell................................................................................................. 43
Wenteq Microwave................................................................................ 53
The ad index is provided as an additional service by the publisher,
who assumes no responsibility for errors or omissions.
n Find Our Advertisers’ Web Sites using HFeLink™
1. G
o to our company information Web site:
www.HFeLink.com, or
2. F
rom www.highfrequencyelectronics.com, click on the HFeLink
reminder on the home page
3. C
ompanies in our current issue are listed, or you can choose one of
our recent issues
4. F
ind the company you want ... and just click!
5. Or ... view our Online Edition and simply click on any ad!
PUBLISHER
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High Frequency Electronics (USPS 024-316) is published monthly by Summit Technical Media, LLC, 3 Hawk Dr., Bedford, NH 03110.
Vol. 15 No. 3 March 2016. Periodicals Postage Paid at Manchester, NH and at additional mailing offices.
POSTMASTER: Send address corrections to High Frequency Electronics, PO Box 10621, Bedford, NH 03110-0621.
Subscriptions are free to qualified technical and management personnel involved in the design, manufacture and distribution of electronic equipment and
systems at high frequencies. Copyright © 2016 Summit Technical Media, LLC
64 High Frequency Electronics
QUALITY, PERFORMANCE AND RELIABILITY
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Get info at www.HFeLink.com