WJA1510
+5V Active-Bias InGaP HBT Gain Block
Product Features
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Cascadable gain block
50 – 1000 MHz
14 dB Gain
+20 dBm P1dB
+47 dBm OIP3
+61 dBm OIP2
Operates from +5V @ 95mA
Robust 1000V ESD, Class 1C
RoHS-compliant SOT-89 package
Applications
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IF Amplifier
VHF/UHF Transmission
Wireless Infrastructure
General Purpose
CATV / FTTH
The WJA1510 is cascadable gain block that offers high
linearity in a low-cost surface-mount package. At 200
MHz, the WJA1510 typically provides 14 dB gain, +47
dBm OIP3, and +20 dBm P1dB. The device is housed in a
RoHS-compliant SOT-89 industry-standard SMT package
using a NiPdAu plating to eliminate the possibility of tin
whiskering.
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3 (2)
Output IP2
Noise Figure
Device Voltage
Device Current
GND
4
The WJA1510 consists of Darlington pair amplifiers using
a high reliability InGaP/GaAs HBT process technology.
The MMIC amplifier is internally matched to 50Ω and only
requires DC-blocking capacitors and a bias inductor for
operation. An internal active bias is designed to enable
stable performance over temperature. A dropping bias
resistor is not required allowing the device to be biased
directly from +5V supply voltage.
1
2
3
RF IN
GND
RF OUT
Function
Input
Output/Bias
Ground
Pin No.
1
3
2, 4
The amplifier is targeted for high performance IF applications
in existing and next generation wireless technologies. The
WJA1510 is ideal for general purpose applications such as LO
buffering, IF amplifier and pre-driver stages within the 50 to
1000 MHz frequency range.
Specifications (1)
Parameter
Functional Diagram
Product Description
Typical Performance (3)
Units
Min
MHz
MHz
dB
dB
dB
dBm
dBm
dBm
dB
V
mA
50
12.8
+40
82
Typ
200
14.4
11
16
+19.8
+47.0
+61.2
5.4
5
95
Max
Parameter Units
1000
Frequency
S21
S11
S22
Output P1dB
Output IP3 (2)
Output IP2
Noise Figure
15.8
MHz
dB
dB
dB
dBm
dBm
dBm
dB
Typical
70
170
240
500
900
15.0
14.3
14.2
14.1
13.8
-10
-11
-12
-13
-16
-20
-17
-16
-17
-15
+19.6 +19.7 +19.8 +19.8 19.6
+41.6 +48.0 +52.5 +40.8 +36.1
60.1
61.4
61.2
64.1
64.2
5.2
5.3
5.4
5.6
6
3. Listed typical performance parameters measured on evaluation board
102
1. Test conditions: 25 ºC, Supply Voltage = +5 V, 50 Ω System. S-parameters and 3OIP measured at
device pins. All other specifications measured on evaluation board.
2. 3OIP measured with two tones at an output power of 8 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Parameter
Storage Temperature
Supply Voltage
Input Power
θjc (junction to paddle)
Maximum Junction Temperature
Rating
-55 to +150 °C
+6.5 V
+24 dBm
78 °C / W
150 °C
Operation of this device above any of these parameters may cause permanent damage.
Ordering Information
Part No.
WJA1510
WJA1510-PCB
Description
+5V Active Bias InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 Package)
50 – 1000 MHz Fully Assembled Eval. Board
Standard Tape / Reel size = 1000 pieces on a 7″ reel
Specifications and information are subject to change without notice
Triquint Semiconductor Inc. • Phone 1-800-WJ1-4401 • FAX: 408-577-6633 • e-mail: info-sales@tqs.com • Web site: www.TriQuint.com
Page 1 of 4
October 2008
WJA1510
+5V Active-Bias InGaP HBT Gain Block
Typical Evaluation Board RF Performance
Supply Bias = +5V, Icc = 95 mA
1. Test conditions: T = 25 ºC, Supply Voltage = +5 V, Icc = 95 mA typical, 50 Ω System.
2. 3OIP measured with two tones at an output power of 8 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Return Loss
Gain vs. Frequency
Noise Figure vs. Frequency
T=25°C
10
0
20
9
-5
18
8
16
-15
14
7
NF (dB)
S11, S22 (dB)
Gain (dB)
-10
6
5
-20
4
12
-40C
+25C
-25
+85C
S22
500
1000
Frequency (MHz)
1500
200
400
600
Frequency (MHz)
Gain vs. Pout
OIP3 vs. Frequency
Freq = 200 MHz
Pout =8 dBm/tone
55
18
50
OIP3 (dBm)
20
16
14
12
800
0
1000
12
14
16
Pout (dBm)
18
35
800
1000
40
35
30
-40C
200
+25C
+85C
400
600
Frequency (MHz)
800
25
4.5
1000
4.6
4.7
4.8
4.9
Vcc (V)
5
5.1
5.2
P1dB vs. Vcc
P1dB vs. Frequency
OIP2 vs. Frequency
22
22
75
600
OIP3 vs. Vcc
40
0
Pout = 4 dBm/tone
400
50
45
20
200
Frequency (MHz)
25
10
+85C
45
30
10
+25C
2
0
2000
OIP3 (dBm)
0
-40C
3
-30
10
Gain (dB)
S11
20
70
65
60
55
P1dB (dBm)
P1dB (dBm)
OIP2 (dBm)
21
20
18
16
14
19
12
50
-40C
45
+25C
+85C
10
4.7
18
0
200
400
600
Frequency (MHz)
800
1000
0
200
400
600
Frequency (MHz)
800
1000
4.8
4.9
5
5.1
5.2
Vcc (V)
Icc vs. Vcc
Icc vs. Temperature
Vcc = +5V
160
100
140
95
Icc (mA)
Icc (mA)
120
90
85
100
80
60
80
75
-50
40
-25
0
25
Temperature (°C)
50
75
100
20
4.0
-40C
4.5
+25C
5.0
Vcc (V)
+85C
5.5
6.0
Specifications and information are subject to change without notice
Triquint Semiconductor Inc. • Phone 1-800-WJ1-4401 • FAX: 408-577-6633 • e-mail: info-sales@tqs.com • Web site: www.TriQuint.com
Page 2 of 4
October 2008
WJA1510
+5V Active-Bias InGaP HBT Gain Block
Vcc=+5.00V
Icc = 95 mA
Application Circuit
R4
0Ω
C3
Bypass
Capacitor
L1
RF Choke
RF IN
RF OUT
WJA1510
C1
Blocking
Capacitor
R1
0Ω
R2
0Ω
C2
Blocking
Capacitor
Recommended Component Values (1)
Ref. Name Value / Type
L1
470 nH ferrite core wire wound inductor (2)
C1, C2
1000 pF NPO chip capacitor
C3
0.018 μF chip capacitor
R1, R2, R4 0 Ω(3)
C4, C5, C6, Do Not Place (3)
R3, R5, R6,
R7, R8
1.
2.
3.
Size
0805
0603
0603
0603
The listed values are contained on the evaluation board to achieve optimal broadband performance
For lower cost and performance (100 – 1000 MHz) option use 470 nH air core wire wound inductor.
Place holders for the 0Ω resistors and “Do Not Place” references are not needed for final design.
Typical Device Data
S-Parameters (Vdevice = +5V, ICC = 95 mA, T = 25 °C, calibrated to device leads)
Freq (MHz)
10
50
100
150
200
250
300
350
400
450
500
550
600
650
700
750
800
850
900
950
1000
1050
1100
1150
1200
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
-12.77
-11.98
-11.87
-11.93
-11.87
-11.90
-11.89
-11.89
-11.94
-11.98
-11.99
-12.07
-12.12
-12.27
-12.31
-12.47
-12.57
-12.76
-13.04
-13.23
-13.42
-13.61
-13.77
-14.14
-14.41
-64.38
-145.22
-163.57
-170.62
-174.76
-177.65
-179.69
179.27
177.23
177.47
175.53
173.93
173.55
173.05
172.54
171.88
170.01
169.51
168.70
167.72
165.38
163.73
163.33
162.01
160.56
18.95
15.46
14.75
14.56
14.46
14.44
14.42
14.45
14.43
14.44
14.41
14.41
14.37
14.38
14.34
14.33
14.29
14.32
14.25
14.33
14.32
14.25
14.23
14.25
14.21
166.61
163.24
166.21
165.57
163.82
162.12
159.72
156.83
154.00
151.77
148.73
146.00
143.20
140.60
137.35
135.52
132.20
128.96
126.41
123.61
120.57
117.69
114.82
111.79
108.31
-22.12
-19.23
-19.02
-18.93
-18.91
-18.87
-18.91
-18.93
-18.89
-18.89
-18.83
-18.94
-18.95
-18.89
-18.91
-18.84
-18.88
-18.88
-18.82
-18.89
-18.92
-18.82
-18.85
-18.84
-18.92
17.45
6.80
2.10
-0.28
-2.15
-3.79
-5.44
-6.35
-7.81
-9.08
-10.20
-12.28
-13.22
-14.33
-15.26
-17.12
-18.53
-19.15
-20.48
-22.20
-23.12
-24.34
-26.17
-27.43
-28.23
-9.47
-14.81
-16.15
-16.59
-16.66
-16.80
-16.91
-16.99
-17.12
-17.09
-17.27
-17.28
-17.44
-17.44
-17.30
-17.44
-17.48
-17.28
-16.99
-16.70
-16.51
-16.14
-15.89
-15.46
-15.17
-43.08
-120.56
-145.12
-154.63
-160.13
-162.79
-163.90
-164.35
-165.69
-164.34
-166.02
-165.90
-166.63
-165.69
-163.67
-163.09
-162.89
-160.27
-158.37
-156.62
-155.86
-153.31
-151.81
-150.31
-148.90
Device S-parameters are available for download from the website at: http://www.triquint.com
Specifications and information are subject to change without notice
Triquint Semiconductor Inc. • Phone 1-800-WJ1-4401 • FAX: 408-577-6633 • e-mail: info-sales@tqs.com • Web site: www.TriQuint.com
Page 3 of 4
October 2008
WJA1510
+5V Active-Bias InGaP HBT Gain Block
Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded
(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The WJA1510 will be marked with an “A1510”
designator with an alphanumeric lot code
marked below the part designator.
A1510
XXXX-X
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating:
Value:
Test:
Standard:
Class 1C
Passes ≥ 1000V min.
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ESD Rating:
Value:
Test:
Standard:
Class IV
Passes ≥ 1000V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260 °C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated thru
diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
Triquint Semiconductor Inc. • Phone 1-800-WJ1-4401 • FAX: 408-577-6633 • e-mail: info-sales@tqs.com • Web site: www.TriQuint.com
Page 4 of 4
October 2008