M-Series Fast Silicon Photomultiplier Sensors
DATASHEET
Fast Silicon Photomultiplier Sensors
SensL’s M-Series sensors feature a uniquely fast output signal
that can have a rise time of ~100 ps and a recovery time of <1 ns,
allowing for precision timing and fast count rates. The M-Series
sensors are available in four detector sizes (0.25 mm,1 mm, 3 mm
and 6 mm) and a number of package types, including a 4-side
tileable surface-mount (SMT) package that is compatible with
lead-free, reflow soldering processes.
The M-Series sensors are based on the silicon photomultiplier concept and form a range of high gain, singlephoton sensitive, visible-light sensors. They have performance characteristics similar to a conventional PMT,
while benefiting from the practical advantages of solid-state technology: low operating voltage, robustness,
compactness and insensitivity to light over-exposure. More information on the M-Series sensors and their
operation can be found in the M-Series User Manual.
PERFORMANCE PARAMETERS
Sensor
Size
Microcell Size
0.25mm
20m
1mm
10m, 20m, 35m, 50m
3mm
35m, 50m
6mm
35m, 50m
0.25mm
20m
1mm
10m, 20m, 35m, 50m
3mm
35m, 50m
6mm
35m, 50m
0.25mm
20m
1mm
10m, 20m, 35m, 50m
3mm
35m, 50m
6mm
35m, 50m
0.25mm
20m
1mm
10m, 20m, 35m, 50m
3mm
35m, 50m
6mm
35m, 50m
Parameter 1
Overvoltage
Min.
Typ.
Max.
Units
Breakdown Voltage (Vbr) 2
27.0
27.5
28.0
V
Overvoltage Range (Voltage
above Vbr)
1.0
5.0
V
Spectral Range
400
1000
nm
Peak Wavelength (lp)
500
nm
1
All measurements made at Vbr+2V and 21°C unless otherwise stated.
The breakdown voltage (Vbr) is defined as the reverse bias voltage at which a certain current flows in dark conditions: 10nA for 1mm sensors and 100nA
for 3mm and 6mm sensors.
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SensL © 2013
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M-Series Fast Silicon Photomultiplier Sensors
DATASHEET
Sensor
Size
0.25mm
1mm
Microcell Size
6mm
0.25mm
1mm
6mm
0.25mm
1mm
6mm
0.25mm
1mm
6mm
Max.
Units
%
9
%
20m
15
%
35m
20
%
23
%
35m
20
%
50m
23
%
35m
20
%
50m
23
%
20m
1.2x106
10m
3.0x105
20m
1.2x106
35m
PDE at λp
3
Gain (anode to cathode
readout)
Vbr + 2V
2.3x106
Vbr + 2V
4.0x106
35m
2.3x106
50m
4.0x106
35m
2.3x106
50m
4.0x106
20m
0.11
0.30
mA
10m
0.06
0.12
mA
20m
0.23
0.48
mA
35m
0.45
0.90
mA
0.70
1.4
mA
3.8
8.0
mA
Dark Current
Vbr + 2V
35m
50m
6.0
12.0
mA
35m
12.0
24.0
mA
50m
20.0
36.0
mA
20m
0.23
1.0
MHz
10m
1.2
1.2
MHz
1.2
2.5
MHz
MHz
20m
35m
50m
3mm
Typ.
15
50m
3mm
Min.
20m
50m
3mm
Overvoltage
10m
50m
3mm
Parameter
Dark Count Rate 4
Vbr + 2V
35m
50m
35m
50m
MHz
10
22
33
65
MHz
MHz
MHz
MHz
0.25mm
20m
0.1
ns
1mm
10m, 20m, 35m, 50m
0.3
ns
3mm
35m, 50m
0.8
ns
6mm
35m. 50m
1.0
ns
Rise Time - Fast Output 5
Vbr + 2V
3
Note this is true “sensor PDE” which does not contain afterpulsing or crosstalk.
Dark count rate is derived from dark current measurement as Ndcr=ISiPM/Gain/q (Hz).
5
Measured as 10% to 90% of the peak amplitude.
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M-Series Fast Silicon Photomultiplier Sensors
DATASHEET
Sensor
Size
Microcell Size
0.25mm
20m
0.4
ns
1mm
10m, 20m, 35m, 50m
0.7
ns
3mm
35m, 50m
2
ns
6mm
35m, 50m
5
ns
0.25mm
20m
30
ns
10m
15
ns
20m
30
ns
130
ns
320
ns
35m
130
ns
50m
320
ns
35m
130
ns
50m
320
ns
20m
10
pF
10m
40
pF
20m
70
pF
1mm
6mm
0.25mm
1mm
6mm
0.25mm
1mm
3mm
6mm
Units
pF
870
pF
50m
990
pF
35m
3450
pF
50m
3850
pF
20m
1
pF
10m, 20m
3
pF
35m, 50m
2
pF
14
pF
50m
11
pF
35m
56
pF
50m
40
pF
20
mV/oC
Capacitance 7 (anode-cathode)
Vbr + 2V
35m
35m
10m, 20m, 35m, 50m
3mm
35m, 50m
6mm
35m, 50m
Capacitance 7 (fast terminal to
cathode)
Vbr + 2V
Temperature dependence of
Vbr 8
20m
17
%
10m
17
%
20m
17
%
35m
21
%
38
%
35m
21
%
50m
38
%
35m
21
%
50m
38
%
50m
6mm
Max.
pF
1mm
3mm
Vbr + 2V
Typ.
90
20m
1mm
Microcell recovery time 6
Min.
100
0.25mm
0.25mm
Vbr + 2V
35m
50m
3mm
Signal Pulse Width - Fast
Output (FWHM)
Overvoltage
35m
50m
3mm
Parameter
Crosstalk
Vbr + 2V
6
Time for microcell to recharge (90% to 10% of pulse peak amplitude).
Internal capacitance of the sensor. Typically add 2-3pF for sensor in package. Listed by unique microcell size for each part version.
8
Calculated as the change in Vbr extracted from pulsed laser gain measurements.
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M-Series Fast Silicon Photomultiplier Sensors
DATASHEET
GENERAL PARAMETERS
Active area
No. of microcells
Microcell fill factor
02500 Series
10000 series
30000 series
60000 series
02520
10010, 10020, 10035,
10050
30035, 30050
60035, 60050
0.25 x 0.25 mm2
1 x 1 mm2
3 x 3 mm2
6 x 6 mm2
02520: 100
10010: 2720
10020: 1144
10035: 504
10050: 282
30035: 4774
30050: 2668
60035: 18980
60050: 10374
02520: 48%
10010: 28%
10020: 48%
10035: 64%
10050: 72%
30035: 64%
30050: 72%
60035: 64%
60050: 72%
SMT Package Specifics
02500 Series
10000 series
30000 series
60000 series
02520
10010, 10020, 10035,
10050
30035, 30050
60035, 60050
4 x 4 mm2
7 x 7 mm2
Package dimensions
1.5 x 1.8 mm2
Recommended operating
temperature range
-40°C to +85°C
Recommended storage
temperature range
-40°C to +85°C
Storage and soldering
conditions
Lead-free, reflow soldering process compatible, max. body temperature of 250°C for 10 sec.
(MSL 3 for tape & reel quantities; MSL 4 for tape only qty.)
See the SMT Handling Tech Note for more details.
Encapsulant type
Thermoset clear epoxy
Encapsulant refractive Index
1.54 @ 589nm
X18 Package Specifics
02500 Series
10000 series
30000 series
60000 series
02520
10010, 10020, 10035,
10050
30035, 30050
60035, 60050
Recommended operating
temperature range
-40°C to +85°C
Recommended storage
temperature range
-40°C to +95°C
Soldering conditions
Soldering iron, maximum of 260°C for no more
than 10s.
See the Soldering Tech Note for more details.
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M-Series Fast Silicon Photomultiplier Sensors
DATASHEET
X13 Package Specifics
02500 Series
10000 series
30000 series
60000 series
02520
10010, 10020, 10035,
10050
30035, 30050
60035, 60050
Recommended operating
temperature range
0°C to +40°C
Recommended storage
temperature range
-20°C to +50°C
Soldering conditions
Soldering iron, max. of 260°C for 5s, 2mm from ceramic base.
See the Soldering Tech Note for more details.
Encapsulant material
Epoxy
X05 Package Specifics
02500 Series
10000 series
30000 series
60000 series
02520
10010, 10020, 10035,
10050
30035, 30050
60035, 60050
Recommended operating
temperature range
-40°C to +85°C
Recommended storage
temperature range
-40°C to +95°C
Soldering iron, maximum
of 260°C for no more than
10s. See the Soldering
Tech Note for more details.
Soldering conditions
X39 Package Specifics
02500 Series
10000 series
30000 series
60000 series
02520
10010, 10020, 10035,
10050
30035, 30050
60035, 60050
Recommended operating
temperature range
-40°C to +85°C
Recommended storage
temperature range
-40°C to +95°C
Soldering iron, maximum of 260°C for no more than 10s.
See the Soldering Tech Note for more details.
Soldering conditions
Maximum current levels for each sensor size and package type
02500 Series
10000 series
30000 series
60000 series
02520
10010, 10020, 10035,
10050
30035, 30050
60035, 60050
SMT
2 mA
2 mA
15 mA
20 mA
X18
4 mA
4 mA
-
-
X13
-
1.5 mA
3 mA
5 mA
X05
-
-
20 mA
-
X39
-
-
50 mA
-
Package
type
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M-Series Fast Silicon Photomultiplier Sensors
DATASHEET
M-Series PERFORMANCE
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M-Series Fast Silicon Photomultiplier Sensors
DATASHEET
FAST OUTPUT SIGNALS
The oscilloscope graphs below show examples of measured waveforms from the fast and standard output of a 3mm sensor mounted
on a SensL SMA product board; the MicroFM-SMA-30035. The measurements were obtained using a 2.5GHz bandwidth oscilloscope
and a 50MHz, 50ps red (650nm) laser. No amplifier was used, and the output of the SMA product boards was directly connected to the
oscilloscope using a 1m long, 50Ω coaxial cable.
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M-Series Fast Silicon Photomultiplier Sensors
DATASHEET
M-SERIES EVALUATION BOARD OPTIONS
SMA BIASING BOARD (MicroFM-SMA-XXXXX)
The MicroFM-SMA is a simple board designed to allow evaluation of the
MicroFM SMT range of SiPM sensors. The board has SMA connectors for
connecting the bias voltage, standard output from the cathode and the fast
output signal. The biasing and output line is laid out in such a way as to
preserve the fast timing characteristics of the sensor.
The MicroFM-SMA is recommended for users who require a plug-andplay set-up to quickly evaluate M-Series SMT sensors with optimum timing
performance. The board also allows the standard output from the cathode
to be observed at the same time as the fast output. The outputs can be
connected directly to the oscilloscope or measurement device. The table
below lists the SMA board connections.
Output
Function
Vbias
negative bias input (anode)
Fout
fast output
Sout
standard output (cathode)
PIN ADAPTER (MicroFM-SMTPA-XXXXX)
The SMT Pin Adapter board (SMTPA) is a small PCB board that houses the SMT sensor and has
through-hole pins to allow its use with standard sockets or probe clips. This product is useful for
those needing a quick way to evaluate the SMT package without the requirement for specialist
surface-mount soldering. While this is a ‘quick fix’ suitable for many evaluations, it should be
noted that the timing performance from this board will not be optimized and if the best possible
timing performance is required, the MicroFM-SMA-XXXXX is recommended. The table below lists
the pin connections for the SMTPA board, for either a positive or negative bias set-up.
Pin
No.
Connection
1
Function
Positive bias
Negative bias
cathode
positive bias input
standard output
(if unused connect to zero V)
2
fast
fast output
(if unused can be left open)
fast output
(if unused can be left open)
3
anode
standard output
(if unused connect to zero V)
negative bias input
4
gnd
PCB gnd
PCB gnd
5
n/c
do not connect
do not connect
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M-Series Fast Silicon Photomultiplier Sensors
DATASHEET
M-Series CIRCUIT SCHEMATICS
SensL SiPM component symbol.
Simplified circuit schematic of the SensL SiPM showing only a 12
microcell example.
TILING OF THE SMT PACKAGE
SensL has developed a market-leading, custom SMT package for the M-Series sensors. It is a compact, leadless, chip-scale package
that is compatible with lead-free, reflow soldering processes. A clear encapsulant is used for optimal coupling to scintillators or fibre optic
elements.
6mm SMT tiling.
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M-Series Fast Silicon Photomultiplier Sensors
DATASHEET
The dead-space between the sensor chip and the edge of the package has been minimized resulting in a package that can be tiled on
4 sides. This allows multiple devices to be configured into unique layouts for a wide range of custom applications. Two-dimensional tiling
examples are illustrated for the 1mm, 3mm and 6mm SMT package. The distance between active areas is typically 1.2mm when tiled, but
actual alignment and placement tolerances will depend on the accuracy of the user’s assembly process. A Technical Note is available that
gives advice on creating arrays of the SMT sensors.
3mm SMT tiling.
1mm SMT tiling.
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M-Series Fast Silicon Photomultiplier Sensors
DATASHEET
SCHEMATICS (All Dimensions in mm)
MicroFM-600XX-SMT-A1
5
Pin Assignments
Pin #
M-Series
1
Cathode (N)
2
Fast Output
3
Anode (P)
4, 5
No Connect*
The complete MicroFM-600XX-SMT-A1 CAD file is available to download: SND0005-RevE.
MicroFM-300XX-SMT-A1
2
Pin Assignments
Pin #
M-Series
1
Cathode (N)
2
Fast Output
3
Anode (P)
4
No Connect*
The complete MicroFM-300XX-SMT-A1 CAD file is available to download: SND0002-RevC.
* The ‘No Connect’ pins are electrically isolated and should be soldered to a ground (or bias) plane to help with heat dissipation.
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M-Series Fast Silicon Photomultiplier Sensors
DATASHEET
MicroFM-100XX-SMT-B1 *
BOTTOM VIEW
TOP VIEW
Pin Assignments
SIDE VIEW
Pin #
M-Series
1
Cathode (N)
2
Active Area
Series
Dimension X
(mm)
Fast Output
02500
0.25
3
Anode (P)
10000
1.00
4
No Connect **
The complete MicroFM-100XX-SMT-B1 CAD file is available to download: SND0008-RevF.
* Please consult the PCN concerning MicroFM-100XX parts.
** The ‘No Connect’ pins are electrically isolated and should be soldered to a ground (or bias) plane to help with heat dissipation.
MicroSM-300XX-X05
1
2
Pin Assignments
Pin #
M-Series
1
Cathode (N)
2
Anode (P)
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M-Series Fast Silicon Photomultiplier Sensors
DATASHEET
MicroSM-300XX-X13
Pin Assignments
Pin #
M-Series
1
Cathode (N)
2
Anode (P)
MicroSM-600XX-X13
Pin Assignments
SensL © 2013
Pin #
M-Series
1
Cathode (N)
2
Anode (P)
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M-Series Fast Silicon Photomultiplier Sensors
DATASHEET
MicroFM-100XX-18
Pin Assignments
Pin #
1
Fast output
2
Anode (P)
3
No connect
4
Cathode (N)
MicroSM-XXXXX-X39
1
2
6
3
4
5
Pin Assignments
Pin #
M-Series
1
TEC (-)
2
TEC (+)
3
Thermistor
4
Thermistor
5
Anode (P)
6
Cathode (N)
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M-Series Fast Silicon Photomultiplier Sensors
DATASHEET
MicroFM-SMTPA-XXXXX
MicroFM-SMA-XXXXX
* Schematics shown for 3mm versions. If the schematics for the other sizes are required then please contact support@sensl.com
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M-Series Fast Silicon Photomultiplier Sensors
DATASHEET
ORDERING INFORMATION
Product Code
Microcell size
(Total number)
Sensor active area
Package type
02500 Series
MicroFM-02520-X18
MicroFM-02520-SMT
MicroFM-SMA-02520
TO-18
20µm
(100 microcells)
4-side tileable, surface mount package (SMT)
0.25mm x 0.25mm
MicroFM-SMTPA-02520
SMT detector mounted onto a PCB with SMA connectors for
bias and output.
SMT detector mounted onto a pin adapter board.
10000 Series
MicroFM-10010-X18
TO-18
MicroFM-SMA-10010-X18
X18 detector mounted onto a PCB with SMA connectors for bias
and output.
MicroFM-10010-SMT
10µm
(2720 microcells)
4-side tileable, surface mount package (SMT)
MicroFM-SMA-10010
SMT detector mounted onto a PCB with SMA connectors for
bias and output.
MicroFM-SMTPA-10010
SMT detector mounted onto a pin adapter board.
MicroFM-10020-X18
TO-18
MicroFM-10020-SMT
20µm
(1144 microcells)
4-side tileable, surface mount package (SMT)
SMT detector mounted onto a PCB with SMA connectors for
bias and output.
MicroFM-SMA-10020
MicroFM-10035-X18
TO-18
1mm x 1mm
MicroFM-SMA-10035-X18
MicroFM-10035-SMT
MicroFM-SMA-10035
35µm
(504 microcells)
X18 detector mounted onto a PCB with SMA connectors for bias
and output.
4-side tileable, surface mount package (SMT)
SMT detector mounted onto a PCB with SMA connectors for
bias and output.
MicroFM-SMTPA-10035
SMT detector mounted onto a pin adapter board.
MicroSM-10035-X39 *
TO-39 can package, Peltier TEC and thermistor
MicroFM-10050-X18
TO-18
MicroFM-10050-SMT
50µm
(282 microcells)
4-side tileable, surface mount package (SMT)
MicroFM-SMA-10050
SMT detector mounted onto a PCB with SMA connectors for
bias and output.
MicroFM-SMTPA-10050
SMT detector mounted onto a pin adapter board.
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M-Series Fast Silicon Photomultiplier Sensors
DATASHEET
30000 Series
MicroFM-30035-SMT
4-side tileable, surface mount package (SMT)
MicroFM-SMA-30035
SMT detector mounted onto a PCB with SMA connectors for
bias and output.
MicroFM-SMTPA-30035
MicroSM-30035-X39 *
SMT detector mounted onto a pin adapter board.
35µm
(4774 microcells)
TO-39 can package, Peltier TEC and thermistor
MicroSM-30035-X05 *
TO-5 can
3mm x 3mm
MicroSM-30035-X13 *
MicroFM-30050-SMT
MicroFM-SMA-30050
MicroFM-SMTPA-30050
2-pin Ceramic Package, Epoxy Fill
4-side tileable, surface mount package (SMT)
SMT detector mounted onto a PCB with SMA connectors for
bias and output.
50µm
(2656 microcells)
SMT detector mounted onto a pin adapter board.
MicroSM-30050-X13 *
2-pin Ceramic Package, Epoxy Fill
60000 Series
MicroFM-60035-SMT
MicroFM-SMA-60035
MicroFM-SMTPA-60035
4-side tileable, surface mount package (SMT)
MicroFM-60050-SMT
MicroFM-SMTPA-60050
SMT detector mounted onto a pin adapter board.
6mm x 6mm
MicroSM-60035-X13 *
MicroFM-SMA-60050
SMT detector mounted onto a PCB with SMA connectors for
bias and output.
35µm
(18980 microcells)
2-pin Ceramic Package, Epoxy Fill
4-side tileable, surface mount package (SMT)
50µm
(10374 microcells)
SMT detector mounted onto a PCB with SMA connectors for
bias and output.
SMT detector mounted onto a pin adapter board.
Options
Micro-EVB-1mm **
SiPM Transimpedance Preamplifier and Power Supply Module for use with 1mm MicroSM devices
Micro-EVB-3mm **
SiPM Transimpedance Preamplifier and Power Supply Module for use with 3mm and 6mm MicroSM devices
* NOTE: The ‘SM’ products have only 2 (signal) pins (anode and cathode) and therefore do not feature the fast output signal.
** For more details on the Micro-EVB products, please see the Micro-EVB Product Brief.
www.sensl.com
sales@sensl.com
+353 21 240 7110 (International)
+1 650 641 3278 (North America)
All specifications are subject to change without notice
Rev. 2.1, March 2016
SensL © 2013
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