PLCC
Plastic Leaded Chip Carrier
Daisy-Chained And Lead-Free Parts Available!
Dummy Components
Plastic Leaded Chip Carriers (PLCC) are four-sided “J” Leaded Plastic
body packages. Lead counts range from 20 to 84. PLCC packages can be
square or rectangle. Body sizes range from .35" to 1.15". PLCCs are JEDEC
standard compliant. The PLCC “J” Lead configuration requires less board
space versus equivalent gull leaded components.
PLCC Plastic Leaded Chip Carrier
Part Number
(In Tubes)
PLCC20T
PLCC28T
PLCC32T
PLCC44T
PLCC52T
PLCC68T
PLCC84T
Pin Count
Body Size
20
28
32
44
52
68
84
8.8mm
11.4mm
11.4 x 13mm
16.5mm
19.0mm
24.1mm
29.2mm
Quantity
Per Tube
48
38
30
27
24
18
15
Part Number
(Tape and Reel)
PLCC20TR
PLCC28TR
PLCC32TR
PLCC44TR
PLCC52TR
PLCC68TR
PLCC84TR
Notes








Tape Width
Tape Pitch
16mm
24mm
24mm
32mm
32mm
44mm
44mm
12mm
16mm
16mm
24mm
24mm
32mm
36mm
Quantity
13" Reel
1,000
750
750
450/500
450
230/250
250
Part Number System
Plastic Leaded Chip Carrier
All PLCCs have “J” leads.
Standard lead pitch is 1.27mm (50 mils).
PLCCs are to JEDEC standards.
Tube quantity may vary.
13" reels are standard.
Parts available on Tape and Reel.
Moisture sensitivity is JEDEC level 3.
Lead-free parts are available with 100% Matte Sn finish.
Packaging
Number of Pins
 Packaging: T=Tubes, TR=Tape and Reel.
 Add “Sn” to end of part number for Lead-Free.
Mold
Compound
Au Wire
J-Formed
Cu Leadframe
Die
For kits see pages 53, 55, 60, 62,
67, 70, 71, 79 and 82.
Die Attach Adhesive
Die Attach Pad
Z
G
A
H
PLCC20T
Y
X
Full Radius Optional
S J L
E
B
D C
P
W
Heel
L
T
Grid
Placement
Courtyard
C
PLCC Component Dimensions
Component
Identifier
PLCC-20
PLCC-28
PLCC-44
PLCC-52
PLCC-68
PLCC-84
L (mm)
Min
9.78
12.32
17.40
19.94
25.02
30.10
S (mm)
Max
10.03
12.57
17.65
20.19
25.27
30.35
Min
5.78
8.32
13.40
15.94
21.02
26.10
W (mm)
Max
6.53
9.07
14.15
16.69
21.77
26.85
Min
0.33
0.33
0.33
0.33
0.33
0.33
T (mm)
Max
0.53
0.53
0.53
0.53
0.53
0.53
Min
1.50
1.50
1.50
1.50
1.50
1.50
A (mm)
Max
2.00
2.00
2.00
2.00
2.00
2.00
Min
8.89
11.43
16.51
19.05
24.13
29.21
B (mm)
Max
9.04
11.58
16.66
19.20
24.33
29.41
Min
8.89
11.43
16.51
19.05
24.13
29.21
Max
9.04
11.58
16.66
19.20
24.33
29.41
J (mm)
Ref
7.87
10.41
15.49
18.03
23.11
28.19
H (mm)
Max
4.57
4.57
4.57
5.08
5.08
5.08
P (mm)
Basic
1.27
1.27
1.27
1.27
1.27
1.27
PLCC Land Patterns
Component
Identifier
Z (mm)
G (mm)
X (mm)
PLCC-20
PLCC-28
PLCC-44
PLCC-52
PLCC-68
PLCC-84
10.80
13.40
18.40
21.00
26.00
31.20
6.40
9.00
14.00
16.60
21.60
26.80
0.60
0.60
0.60
0.60
0.60
0.60
Y (mm)
Ref
2.20
2.20
2.20
2.20
2.20
2.20
C (mm)
Ref
8.60
11.20
16.20
18.80
23.80
29.00
D (mm)
Ref
5.08
7.62
12.70
15.24
20.32
25.40
E (mm)
Ref
1.27
1.27
1.27
1.27
1.27
1.27
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
Placement Grid
(No. of Elements)
24 x 24
30 x 30
40 x 40
44 x 44
54 x 54
66 x 66
29
SOIC/SOJ
Dummy Components
Small Outline Integrated Circuit
Small Outline Package (SOP/SOJ) body size was compressed and the
lead pitch tightened to obtain a smaller version SOP. This yields an IC
package that is a significant reduction in the size (compared to stan-
dard package). All IC assembly processes remain the same as with our
standard SOPs.
SOIC/SOJ Small Outline Integrated Circuit
Number
of Pins
8
14
16
16
20
24
28
28
32
Part Number
SO8GT-3.8mm*
SO14GT-3.8mm
SO16GT-3.8mm
SO16GT-7.6mm
SO20GT-7.6mm
SO24GT-7.6mm*
SO28GT-7.6mm
SO28JT-7.6mm
SO32JT-7.6mm
Lead
Style
Gull
Gull
Gull
Gull
Gull
Gull
Gull
J-Lead
J-Lead
Body
Width
3.8mm
3.8mm
3.8mm
7.6mm
7.6mm
7.6mm
7.6mm
7.6mm
7.6mm
Notes





Quantity
Per Tube
100
50
48
46
38
31
25
26
25
Tape
Width
12mm
16mm
16mm
16mm
24mm
16mm
24mm
24mm
24mm
Tape
Pitch
8mm
8mm
8mm
12mm
12mm
12mm
12mm
12mm
12mm
Quantity
13" Reel
2,500
2,500
2,500
1,000
1,000
1,000
1,000
1,000
750
Part Number System
Small Outline
Integrated Circuit
* = Available as an ExposedPadTM SOIC package by Amkor.
ExposedPadTM can increase heat dissipation by as much as
110% over standard packages.
Standard lead pitch is 1.27mm.
Tube quantity may vary.
Parts available on Tape and Reel.
Lead-free parts are available with 100% Matte Sn finish.
Number of Pins
Lead Style
Body Width
Packaging
 Lead Style: G=Gull Wing, J=J-Leaded.
 Packaging: T=Tubes, TR=Tape and Reel.
 Add “Sn” to end of part number for Lead-Free.
For kits see pages 53, 55, 60, 62, 67,
68, 69, 70, 71, 73 and 79.
B
Die Attach
Cu Leadframe Adhesive
SO14GT–3.8mm
D
Grid
Placement
Courtyard
Mold
Compound Au Wire
A
Die
S
L
C
G
Die Attach Pad
Exposed Pad
P
H
W
E
Y
X
SOIC Component Dimensions
Component
Identifier
JEDEC
Number
SO8
SO14
SO16
SO16-7.6mm
SO20-7.6mm
SO28-7.6mm
MS-012 AA
MS-012 AB
MS-012 AC
MS-013 AA
MS-013 AC
MO-119 AB
L (mm)
Min
Max
5.80
6.30
5.80
6.30
5.80
6.30
10.00
10.65
10.00
10.65
10.29
10.64
S (mm)
Min
Max
3.26
4.55
3.26
4.55
3.26
4.55
7.46
8.85
7.46
8.85
8.21
9.01
W (mm)
Min
Max
0.33
0.51
0.33
0.51
0.33
0.51
0.33
0.51
0.33
0.51
0.36
0.51
Min
0.40
0.40
0.40
0.40
0.40
0.53
T (mm)
Max
1.27
1.27
1.27
1.27
1.27
1.04
A (mm)
Min
Max
3.80
4.00
3.80
4.00
3.80
4.00
7.40
7.60
7.40
7.60
7.40
7.60
B (mm)
Min
Max
4.80
5.00
8.55
8.75
9.80
10.00
10.10
10.50
12.60
13.00
18.08
18.39
H (mm)
Min
Max
1.35
1.75
1.35
1.75
1.35
1.75
2.35
2.65
2.35
2.65
2.34
2.64
P (mm)
Basic
1.27
1.27
1.27
1.27
1.27
1.27
SOIC Land Pattern Dimensions
30
Component
Identifier
Z (mm)
G (mm)
X (mm)
SO8
SO14
SO16
SO16-7.6mm
SO20-7.6mm
SO28-7.6mm
7.40
7.40
7.40
11.40
11.40
11.40
3.00
3.00
3.00
7.00
7.00
7.00
0.60
0.60
0.60
0.60
0.60
0.60
Y (mm)
Ref
2.20
2.20
2.20
2.20
2.20
2.20
C (mm)
Ref
5.20
5.20
5.20
9.20
9.20
9.20
D (mm)
Ref
3.81
7.62
8.89
8.89
11.43
16.51
E (mm)
Ref
1.27
1.27
1.27
1.27
1.27
1.27
Placement Grid
(No. of Grid Elements)
12 x 16
20 x 16
22 x 16
22 x 22
28 x 24
38 x 24
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
Z
TSOP
Thin Small Outline Package
Dummy Components
Thin Small Outline Packages (TSOP) are thin body size components;
thickness is 1.0mm. TSOP packages have four sides and are rectangular.
Type I TSOPs have the leads protruding from the width portion of the
package. Type II TSOPs have the leads protruding from the length portion of the package. Lead counts range from 28 to 54. Package body size
ranges from 8x11.8mm to 12x20mm.
TSOP Thin Small Outline Package – Type I
Number
of Pins
28
28
32
32
40
40
48
Part Number
TI-TSOP28-8.1x11.8mm-.55mm
TI-TSOP28-8x20mm-.5mm
TI-TSOP32-8x11.8mm-.5mm
TI-TSOP32-8x18.4mm-.5mm
TI-TSOP40-10x14mm-.5mm
TI-TSOP40-10x18.4mm-.5mm
TI-TSOP48-12x18.4mm-.5mm
Body Size
8.1 x 11.8mm
8 x 20mm
8 x 11.8mm
8 x 18.4mm
10 x 14mm
10 x 18.4mm
12 x 18.4mm
Lead
Pitch
.55mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
Quantity
Per Tray
234
156
234
156
160
120
96
Tape
Width
24mm
32mm
24mm
32mm
32mm
32mm
32mm
Tape
Pitch
12mm
12/16mm
12mm
12/16mm
12/16mm
16mm
16mm
Quantity
13" Reel
1,000
1,000
1,000
1,000
1,000
1,000
1,000
Tape
Pitch
16mm
16mm
16mm
16mm
16mm
Quantity
13" Reel
1,000
1,000
1,000
1,000
1,000
TSOP Thin Small Outline Package – Type II
Part Number
TII-TSOP40/44-10.16x18.42mm-.8mm
TII-TSOP44-10.16x18.42mm-.8mm
TII-TSOP44/50-10.16x20.95mm-.8mm
TII-TSOP50-10.16x20.95mm-.8mm
TII-TSOP54-10.16x22.22mm-.8mm
Number
of Pins
40/44
44
44/50
50
54
Body Size
10.16 x 18.42mm
10.16 x 18.42mm
10.16 x 20.95mm
10.16 x 20.95mm
10.16 x 22.22mm
Notes






Lead
Pitch
.8mm
.8mm
.8mm
.8mm
.8mm
Quantity
Per Tray
135
135
135
117
108
Tape
Width
32mm
32mm
32mm
32mm
44mm
Part Number System
Standard packaging is in JEDEC trays or tape and reel
(quantities may vary).
Body dimensions are measured by body length and width.
Type I means that pins extend from the narrow end (the width) of
the body.
Type II means that pins extend from the wide end (the length) of
the body.
Parts available on Tape and Reel upon special request.
Lead-free parts are available with 100% Matte Sn or SnBi.
Type I or Type II
TI–TSOP28–8.1x11.8mm–.5mm
Thin Small
Outline Package
Number
of Pins
Lead
Pitch
Body Size
 Add “T” to end of part number for Tray.
 Add “TR” to end of part number for Tape and Reel.
 Add specific finish to end of part number for Lead-Free, i.e Sn or SnBi.
TYPE I
TYPE II
For recommended kits see
pages 58, 67 and 71.
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
31
SSOP
Dummy Components
Small Shrink Outline Package
The Small Shrink Outline Package (SSOP) body size is compressed and
the lead pitch is tightened to obtain a small version of the standard SOIC
packages. Lead counts range from 8 to 64. Body sizes are 209 and 300
mils. The SSOP package is JEDEC and EIAJ compliant. The package leads
are solder plated.
SSOP Small Shrink Outline Package
Part Number
SSOP14T-5.3mm
SSOP16T-5.3mm
SSOP20T-5.3mm
SSOP24T-5.3mm
SSOP28T-5.3mm
SSOP48T-7.6mm
SSOP56T-7.6mm
Number
of Pins
14
16
20
24
28
48
56
Body Width
Pitch
5.3mm
5.3mm
5.3mm
5.3mm
5.3mm
7.6mm
7.6mm
.65mm
.65mm
.65mm
.65mm
.65mm
1.27mm
1.27mm
Notes








Quantity
Per Tube
100
80
62
66
47
30
26
Tape Width
Tape Pitch
16mm
16mm
16mm
16mm
16/24mm
32mm
32mm
12mm
12mm
12mm
12mm
12mm
12/16mm
12/16mm
Quantity
13" Reel
1,000
1,000
1,000
1,000
1,000
1,000
500
Part Number System
Tube quantity may vary.
Parts available on Tape and Reel upon special request.
209 and 300 mil body widths.
JEDEC and EIAJ package outline standard compliance.
High-conductivity copper leadframes.
Eutectic solder plating is 85/15 Sn/Pb.
Moisture sensitivity is JEDEC level 3.
Lead-free available with 100% Matte Sn alloy.
Small Shrink
Outline Package
SSOP20T–5.3mm
Number of Pins
Body Width
Packaging
 Add “T” for Tubes or “TR” for Tape and Reel to end of part number.
 Add “ePad” to beginning of part number when ordering
ExposedPad™ package.
 Add “Sn” to end of part number for Lead-Free.
Mold
Compound
Au Wire
Cu Leadframe
Pb
Looking for Lead-Free?
This symbol indicates that
lead-free parts are available!
For kits see pages 60, 71, 79 and 82.
Die
Die Attach Adhesive
Cu Leadframe
Die Attach
Adhesive
Die Attach Pad
DiMold
Compound Au Wire
Die
Practical Components is the exclusive distributor of
Amkor Technology Mechanical Components.
Exposed Pad
Exposed Pad
Note: Drawings not to scale.
32
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
TSSOP
Thin Shrink Small Outline Package
Dummy Components
The Thin Shrink Small Outline Package (TSSOP) offers smaller body sizes,
smaller lead pitches and package thickness (0.9mm thick) than standard
SOIC packages. Body widths are 3.0mm, 4.4mm and 6.1mm. Lead counts
range from 8 to 80. This package conforms to JEDEC package outlines.
Parts are also available as an ExposedPad™ package.
TSSOP Thin Shrink Small Outline Package
Part Number
A-TSSOP8T-3.0mm
A-TSSOP8T-4.4mm
A-TSSOP10T-3.0mm
A-TSSOP14T-4.4mm
A-TSSOP16T-4.4mm
A-TSSOP20T-4.4mm
A-TSSOP24T-4.4mm
A-TSSOP28T-4.4mm
A-TSSOP28T-6.1mm
A-TSSOP32T-6.1mm
A-TSSOP38T-4.4mm
A-TSSOP38T-6.1mm
A-TSSOP44T-4.4mm
A-TSSOP48T-4.4mm
A-TSSOP48T-6.1mm
A-TSSOP56T-4.4mm
A-TSSOP56T-6.1mm
A-TSSOP64T-6.1mm
A-TSSOP80T-6.1mm
Number
of Pins
8
8
10
14
16
20
24
28
28
32
38
38
44
48
48
56
56
64
80
Body
Width
3.0mm
4.4mm
3.0mm
4.4mm
4.4mm
4.4mm
4.4mm
4.4mm
6.1mm
6.1mm
4.4mm
6.1mm
4.4mm
4.4mm
6.1mm
4.4mm
6.1mm
6.1mm
6.1mm
.65mm
.65mm
.5mm
.65mm
.65mm
.65mm
.65mm
.65mm
.65mm
.65mm
.5mm
.65mm
.5mm
.4mm
.5mm
.4mm
.5mm
.5mm
.4mm
Notes









Tape
Width
12mm
12/16mm
12mm
12/16mm
12/16mm
16mm
16mm
16mm
24mm
24mm
16mm
24mm
24mm
16mm
24mm
24mm
24mm
N/A
N/A
Pitch
Tape
Pitch
8mm
8mm
8mm
8mm
8mm
8/12mm
8/12mm
8/12mm
12mm
12mm
8/12mm
12mm
12mm
8mm
12mm
12mm
12mm
N/A
N/A
Quantity
Per Tube
98
100
98
96
96
74
62
50
50
44
50
39
42
50
39
42
35
28
28
Quantity
Per Reel
2,500
1,000/2,500
2,500
1,000/2,500
1,000/2,500
1,000/2,500
1,000/2,500
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
N/A
N/A
Part Number System
0.9mm body thickness for 4.4 and 6.1mm body widths.
0.85mm body thickness for 3.0mm body width.
JEDEC package outline is standard.
High conductivity copper leadframes.
Very low-stress mold compound.
Tube quantity may vary.
Parts available on Tape and Reel upon special request..
All pin counts listed are available as an ExposedPad™package.
Lead-free available with 100% Matte Sn alloy.
 Add “T” for Tubes or “TR” for Tape and Reel to end of part number.
 Add “ePad” to beginning of part number when ordering
ExposedPad™ package.
 Add “Sn” to end of part number for Lead-Free.
ExposedPad™ TSSOP Package
Cu Leadframe
Mold
Compound
Au Wire
Mold
Compound
Die
Cu Leadframe
Exposed Pad
Die
Die Attach Adhesive
ExposedPad™ Notes

Die Attach Pad
Body
Width
Packaging
Number
of Pins
ExposedPad™
Thin Shrink Small
Outline Package
TSSOP Package
Au Wire
A-ePadTSSOP8T-3.0mm
Amkor
Die Attach Adhesive



Solder plated exposed metal die pad.
Highly conductive copper leadframe.
Up to 60% improvement in Theta JA (compared to standard TSSOP).
Overall height is 1.1mm.
For recommended kit see page 55.
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
33