Pericom Semiconductor Corp. • 3545 North First St. • San Jose, CA 95134 • USA
PRODUCT/PROCESS CHANGE NOTICE (PCN)
PCN Number: 10-04
Means of Distinguishing Changed Devices:
Date Issued: September 10, 2010
Product Mark
Product(s) Affected: PI7C8150x (see affected part number list)
Back Mark
Manufacturing Location Affected: Product assembled at ASE Malaysia
Date Code ASEM Assembly ID Letter Code
Date Effective: December 10, 2010
is “B” *
Other
*”B”– Next to last letter of the date code in
barcode label and in package marking
Contact: Brian Conway, Director of Quality Systems
Attachment:
Phone: (408) 435-0800, Ext. 314
Samples: Available when requested from
Fax: (408) 321-0324
Yes;
No
Pericom Sales
e-Mail: bconway@pericom.com
PSC Form - FR-0320 (04/01/02)
Page 1 of 3
Description and Purpose of Change:
Die Technology
Pericom has successfully completed qualification of Copper
Bond Wire and plans to ship selected products assembled by
ASE Malaysia in 256 pin Ball Grid Array packages (256 PBGA,
pkg. code ND-256). Pericom’s qualification of copper bond wire
in addition to gold bond wire provide the following advantages:
Wafer Fabrication
•
Increased Pericom assembly capability and capacity
•
Better electrical conductivity- higher current handling
capability
•
Better thermal conductance
•
Better mechanical properties – Higher EL (breaking load)
and EL (elongation), minimize wire swaying
•
Slower Intermetallic (IMC) growth
Assembly Process
Equipment
Material
Testing
Manufacturing Site
Data Sheet
Other
ASE has extensive experience in copper bond wire assembly; in
development from 2005 and hundreds of millions of production
units shipped since 2008. There is no change to the PBGA
package moisture performance; this package still meets MSL 3
as per JESD22-A113.
Products built with copper bond wire will have no change to
product functionality, performance, quality or reliability. No
changes to the product data sheet are required.
The following part numbers may be assembled by Pericom using
copper bond wire, but the decision on when and what part
numbers will be made on an ongoing basis by Pericom’s
planning department. This flexibility increases Pericom’s
manufacturing responsiveness and allows Pericom to better
meet customer demand and delivery requirements.
Part Number
PI7C8150AND
PI7C8150AND-33
PI7C8150ANDE
PI7C8150ANDE-33
PI7C8150BND
PI7C8150BNDE
PI7C8150BNDI
PI7C8150BNDI-33
PI7C8150BNDIE
PI7C8150BNDIE-33
PI7C8150DND
PI7C8150DNDE
PI7C8150ND
PI7C8150ND-33
Product Family
2-Port PCI-to-PCI Bridge
2-Port PCI-to-PCI Bridge
2-Port PCI-to-PCI Bridge
2-Port PCI-to-PCI Bridge
Asynchronous 2-Port PCI Bridge
Asynchronous 2-Port PCI Bridge
Asynchronous 2-Port PCI Bridge
Asynchronous 2-Port PCI Bridge
Asynchronous 2-Port PCI Bridge
Asynchronous 2-Port PCI Bridge
2-Port PCI Bridge
2-Port PCI Bridge
2-Port PCI Bridge
2-Port PCI Bridge
Reliability/Qualification Summary: ND-256, Copper Bond Wire package qualification report is attached for reference
PSC Form - FR-0320 (04/01/02)
Page 2 of 3
Customer Acknowledgement of Receipt:
Customer:
Name:
Title:
Date:
eMail:
Phone:
Fax:
Approval for shipments prior to effective date
Customer Comments (Optional):
PSC Form - FR-0320 (04/01/02)
Page 3 of 3
PACKAGE QUALIFICATION
APPROVAL REPORT
Built In Reliability
Code / Lead Count:
ND256-CuWire
Package Name:
PBGA
Qual by extension:
none
Assembly Site:
ASE (B) - MALAYSIA
MSL Level:
MSL3
A list of applicable Device part numbers, at the time of Qual, is included in Section 7.0
Approvals:
Brian D.
Conway
Digitally signed by Brian D. Conway
DN: cn=Brian D. Conway,
o=Pericom Semiconductor,
ou=Quality,
email=bconway@pericom.com,
c=US
Date: 2010.09.10 15:16:10 -07'00'
Brian D. Conway
Director - Quality Systems
Pericom
Prepared by;
Date:
July-2010
P. Finer
Sr. Quality Engineer
The Contents of this document are to be treated as strictly confidential and proprietary in nature and are not to be
reproduced, used, or disclosed outside of the receiving company except as authorized by Pericom.
Contents
Section
Item
Page
1
Abstract
3
2
Purpose
3
3
Scope and Contents
3
4
Reference Documents
3
5
ESD Precautions
3
6
Justification for Qualification by Similarity or Extension
3
7
Product Informaton / List of Devices
4
10
Qualilfication Plan & Test Matrix
5
11
Package Qualification conformance test data:
6-11
12
Conclusion
12
13
Reflow Profile
12
14
Appendices
PN Information & BOM Summary
13
Package Outline Drawing(s)
14
The Contents of this document are to be treated as strictly confidential and proprietary in nature and are not to be
reproduced, used, or disclosed outside of the receiving company except as authorized by Pericom.
1.0 Abstract
The information contained herein represents proof of Reliability and Performance of the ND (PBGA) Cu Wire
Package Series (Qual PN: PI7C8150BNDE) in accordance with the Qualification Plan and test methods referenced
in Section 7.0, after exposure to a variety of environments and mechanical events that occur during installation and
operational lifetime of the product. Upon conclusion of the testing the product continued to operate within
specification limits, demonstrating its capability of reliable operation throughout its lifetime.
2.0 Purpose
The purpose of this report is to present Qualification Test results of the ND (PBGA) Cu Wire Package Series. The
Pericom product data presented in this report qualifies the products manufactured in this package configuration,
using the same bill of materials and assembled by the identified subcontractor location.
3.0 Scope and Contents
The report describes the qualification test program, procedures utilized, criteria enforced (at the time of product
validation), and specific result data obtained during the testing of three lots of semiconductors. The three lots
consist of an equal number of units from different date codes, from the same production line and SubContractor to
ensure manufacturing repeatability.
4.0 Reference Documents
JESD22
Test Methods and Procedures
MIL-STD-883
Test Methods and Procedures Microcircuits
J-STD-020
Moisture / Reflow Sentivitiy for Non-Hermetic Devices
5.0 ESD Precautions
Integrated Circuits are considered Electro-Static Discharge Sensitive and were handled and stored throughout the
testing in a manner to prevent ESDS damage to the devices.
6.0 Justification for Qualification by Similarity or Extension
Pericom employs a commonly used industry method to generically qualify product. It is based on the premise that if
one product of specific wafer fab/package assembly process/materials is already qualified, then a second product
that has similar design, manufacturing process, and materials can be qualified by extending the data used to qualify
the first product to the second product without generating additional data. This methodology allows the ability to
benchmark suppliers to ensure continuous process improvements and minimize cost and time required for new
product availability. The basis of this “qualification by similarity or extension” is the following rules:
For Package Assembly Process and Materials:
i) The package assembly process technology and location are the same or similar
ii) The die paddle to package aspect ratio and/or complexity is the same or smaller.
iii) The package dimensions width and thickness dimensions are the same or similar
iv) The leadframe/substrate design and lead/ball pitch are the same or similar
v) The package assembly materials are the same or similar
Where a product of interest is not sampled during this period, it is valid to use the reliability data of the
particular process technology or package type family to which the part belongs. All parts within the same
family are designed to the same rules, and manufacturing is controlled by SPC. Within a product family,
a device can only be fabricated on one process technology/ option, and only assembled on one package
type process.
The Contents of this document are to be treated as strictly confidential and proprietary in nature and are not to be
reproduced, used, or disclosed outside of the receiving company except as authorized by Pericom.
7.0 Product Information / List of Devices (at the time of Qualification)
Part Number
PI7C8150AND
PI7C8150AND-33
PI7C8150ANDE
PI7C8150ANDE-33
PI7C8150BND
PI7C8150BNDE
PI7C8150BNDI
PI7C8150BNDI-33
PI7C8150BNDIE
PI7C8150BNDIE-33
PI7C8150DND
PI7C8150DNDE
PI7C8150ND
PI7C8150ND-33
Product Family
Pkg Code Lead Count
2-Port PCI-to-PCI Bridge
2-Port PCI-to-PCI Bridge
2-Port PCI-to-PCI Bridge
2-Port PCI-to-PCI Bridge
Asynchronous 2-Port PCI Bridge
Asynchronous 2-Port PCI Bridge
Asynchronous 2-Port PCI Bridge
Asynchronous 2-Port PCI Bridge
Asynchronous 2-Port PCI Bridge
Asynchronous 2-Port PCI Bridge
2-Port PCI Bridge
2-Port PCI Bridge
2-Port PCI Bridge
2-Port PCI Bridge
ND
ND
ND
ND
ND
ND
ND
ND
ND
ND
ND
ND
ND
ND
256
256
256
256
256
256
256
256
256
256
256
256
256
256
8.0 Abbreviations and Test Methods
PERICOM RELIABILITY TEST
DESCRIPTION (ALT. NAME)
Latch-Up Sensitivity
Human Body Model (HBM) ESDS Test
TEST TYPE
PERICOM
TEST CODE
EIA & JEDEC
STANDARDS
(note 1)
DIE=PSC
LU
JESD78
-
XX
ESD – HBM
JESD22-A114
E
XX
REV
PKG=SUB
Machine Model (MM) ESDS Test
ESD – MM
JESD22-115
A
XX
Charged Device Model (CDM) ESDS Test
ESD – CDM
JESD22-C101
C
XX
Dynamic High Temperature Operating Life
DHTOL
JESD22-A108
C
XX
External Visual Inspection
EVI
JESD22-B101
A
XX
Physical Dimensions
PD
JESD22-B100
B
XX
Preconditioning
PRE
JESD22-A113
E
XX
CSAM
J-STD-020
D.1
XX
RTX
MIL-STD-883, M2012
--
XX
UHAST
JESD22-A110
B
XX
PCT
JESD22-A102
C
Temperature Cycle Test
TMCL
JESD22-A104, Cond C
C
XX
High Temperature Storage Life Test
HTSL
JESD22-A103
C
XX
Solderability Test (Pb-free & Backward SnPb)
SDT
JESD22-B102
E
as
required
XX
LI
JES22-B105
C
XX
Scanning Acoustic Microscopy
Real Time X-Ray
Unbiased Highly Accelerated Stress Testing
Unbiased Autoclave
- Accelerated Moisture Resistance
Lead Integrity (leaded parts only)
note 1: REV - shall indicate the current revision at the time of qualification plan.
The Contents of this document are to be treated as strictly confidential and proprietary in nature and are not to be
reproduced, used, or disclosed outside of the receiving company except as authorized by Pericom.
as
required
XX
Stress / Test:
QUALIFICATION PLAN & TEST RESULTS
ND256-CuWire - ASE (B)
PI7C8150BNDE MSL3
No Package related failures permitted during Qual Test
Any failed part shall be subjected to Failure analysis and Corrective Action.
Pkg Type - Assembly:
Qual Part Number:
Test Condition:
Test
Req'd
Test
#
QUAL TEST
Pericom QA-1800
Reference:
JEDEC / MIL STD Condition / Criteria
Quantit Quantity:
# of Lots:
Sample Size:
QUALIFICATION JUDGEMENT:
Qty
per Lot
Total
Qty.
Control Lot-1
Ac / Re Ac / Re
Lot-2
Ac / Re
3Cu+1Au
260
PASS
Lot-3
Judgement
Ac / Re
A
Select 300 Electrically Good Units
(3 Qual Lots, 260 per lot)
Serialize samples as needed to track the testing
260
1040
Yes
B
FULL ATE TEST
Test Temp: 90°C
260
1040
Yes
C
EVI
JESD22-B101
Marking, Construction, Foreign materials,
Bridging, Burrs, Cracks, Separation, etc.
Include 1 photo of top / bottom - per lot
5
20
5/0
5/0
5/0
5/0
PASS
Yes
D
PD
JESD22-B100
Measurements outside limits and package
warpage >2 mils/length not permitted.
5
20
5/0
5/0
5/0
5/0
PASS
Yes
E
RTX
MIL-STD-883
Method 2012
If any anomaly found inspection top down,
verify by tilting units. Leadframe tip to tip and
bond wire to wire and frame proximity < 1mil.
2
8
2/0
2/0
2/0
2/0
PASS
Yes
F1
CSAM (PRE)
per Note 1
MIL-STD-883
Method 2012
No more than 10% Delamination allowed
If delamination = submit FA report with root
cause and corrective action (3 cycles)
22
88
5/0
5/0
5/0
5/0
PASS
Yes
G
PRE
JESD22-A113
J-STD-020
JEDEC Table 1:
MSL 1 [ ] MSL 2 [ ]
90
360
100 / 0 100 / 0 100 / 0 100 / 0
PASS
Yes
H
REFLOW
JESD22-A113
J-STD-020
Reflow Profiles: J-STD-020, Profile: Figure 5-1
Table 4.2. Peak Temperature 260°C-265°C max
Time above 255°C = 30 sec (3 Reflows)
90
360
100 / 0 100 / 0 100 / 0 100 / 0
PASS
Yes
F2
CSAM (POST)
per Note 1
MIL-STD-883
Method 2012
Less than 10% Delamination allowed
If delamination = submit FA report with root
cause and corrective action
22
88
Yes
J1
PUHAST
JESD22-A118
130±2C, 85±5% RH, 96Hrs,
33.3 psia (230kPa)
45
180
Yes
J2
FULL ATE TEST
after UHAST
Test Temp: 90°C
45
180
Yes
K1
PTMCL
-65C to +150C, 10 minute dwell, 500 Cycles
Measure after 100 & after 500 cycles
45
180
Yes
K2
FULL ATE TEST
after 100 cycles
Test Temp: 90°C
45
Yes
K3
FULL ATE TEST
after 500 cycles
Test Temp: 90°C
No
L1
HTSL
no Precon
No
L2
MSL 3 [ X ]
PASS
100 / 0 100 / 0 100 / 0 100 / 0
PASS
5/0
5/0
5/0
5/0
PASS
45 / 0
45 / 0
45 / 0
45 / 0
PASS
180
45 / 0
45 / 0
45 / 0
45 / 0
PASS
45
180
45 / 0
45 / 0
45 / 0
45 / 0
PASS
+150C, 1000 hours, no Bias
Measure after 168 hrs, 500 hrs, & 1000 hrs.
45
180
FULL ATE TEST
after HTSL
Test Temp: 90°C
45
180
45 / 0
45 / 0
45 / 0
45 / 0
PASS
+125C, 1000 hours, 3.6V
Measure after 168 hrs, 500 hrs, & 1000 hrs.
Datalog SN 01-30 units at each measurement
68
272
Test Temp: 90°C
68
272
2/0
2/0
2/0
2/0
PASS
JESD22-A104
JESD22-A103
by
PSC
M1
DHTOL
no Precon
by
PSC
M2
FULL ATE TEST
after DHTOL
No
P
SDR
after UHAST
J-STD-002 (SMD)*
JESD22–B102 (TH)
4 units = Pb- Free criteria
4 units = Backward Compatible SnPb
3
12
No
Q
LI (leaded parts only)
JESD22-B105
Lead Splay >5° at 10X or greater
Lead Bend - 90° bends, minimum of 2 bends
Lead Pull -
5
20
Yes
R
DPA
Decap for Bond Strength and IMC > HAST
Decap for Bond Strength and IMC > HTS.
2
6
JESD22-A108
Note 1: CSAM Images to include
Leadframe devices:
Data Requirements:
BGA devices
Top Die
Top Die
Top Leadframe
Top Leadframe
1. Solder Plating Composition
2. Plating Thickness Data
3. X-Ray Images - Top View
4. CSAM Images as per Note 1
5. Lot Traveler - showing assembly steps & matls used
6. Test Traveler -
Qualification Report
Package Type : PBGA
ND256-CuWire
xx
xx
xx
xx
xx
na
Stress / Test: EXTERNAL VISUAL
Pkg Type - Assembler:
Qual Part Number:
Test Condition:
Reference:
ND256-CuWire - ASE (B)
PI7C8150BNDE MSL3
10x Magnification or greater
Quantity:
# of Lots:
Sample Size:
3Cu+1Au
5
PASS
Result:
Results Summary:
External Visual Inspection Report
Cu Lot #1
Part #
1
2
3
4
5
A
B
C
D
E
F
G
H
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
ND256-CuWire
A
B
C
D
E
F
G
H
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
ND256-CuWire
A
B
C
D
E
F
G
H
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Part #
1
2
3
4
5
ND256
I
008PRADB01 (B1008BT)
Pass
Pass
Pass
Pass
Pass
Au Control Lot
I
008PRACB01 (B1008BT)
Pass
Pass
Pass
Pass
Pass
Cu Lot #3
Part #
1
2
3
4
5
008PRABB01 (B1008BT)
Pass
Pass
Pass
Pass
Pass
Cu Lot #2
Part #
1
2
3
4
5
ND256-CuWire
I
008PRAAB01 (B1008BT)
A
B
C
D
E
F
G
H
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
I
Failure Code & Desc
A
Marking
B
Non-conformance
C
Foreign/displaced material
D
Construction defects
E
- Leads
F
- Plated Pads
G
- Solder Balls
H
Package I
Special requirement
Failure Criteria:
Illegible marking, or marking content or placement not in accordance with the applicable specification.
Evidence of any nonconformance with the detail drawing / procurement document, or absence of any required feature
Leads or terminals that are not free of foreign material or other adherent deposits.
Protrusions, metallization not intended by design between solder pads etc
Broken, twisted, burrs, misalignment ,metallization (including solder lead finish) etc
Bridging, Burrs, etc.
Bridging, Solder Ball size and/or Shape, etc.
Evidence of cracks, delamination, separation, or voiding on package.
Cu Lot #1 ND256-CuWire
008PRABB01 (B1008BT)
Cu Lot #2 ND256-CuWire
008PRACB01 (B1008BT)
PHOTO
Cu Lot #3 ND256-CuWire
008PRADB01 (B1008BT)
PHOTO
Qualification Report Package Type : PBGA ND256-CuWire
PHOTO
Au Control Lot ND256
008PRAAB01 (B1008BT)
PHOTO
Stress / Test: PHYSICAL DIMENSIONS
Pkg Type - Assembler:
Qual Part Number:
Test Condition:
Reference:
ND256-CuWire - ASE (B)
PI7C8150BNDE MSL3
Quantity:
JESD22 - B100B
# of Lots:
Sample Size:
Result:
3Cu+1Au
5
PASS
Results Summary:
Max
Min
X
17.200
16.800
Y
17.200
16.800
Z
1.760
1.360
Mechanical Inspection Report
Cu Lot #1
Part #
1
2
3
4
5
X
16.990
16.988
16.992
16.998
16.996
Y
16.998
16.990
17.005
16.992
16.998
Part #
1
2
3
4
5
X
16.992
16.990
16.986
16.990
17.000
Y
16.986
16.984
17.000
16.984
16.992
Part #
1
2
3
4
5
X
17.004
16.996
16.996
16.980
16.996
Y
16.998
16.998
16.994
17.002
16.992
Part #
1
2
3
4
5
X
17.010
16.986
17.000
17.000
16.998
Y
17.000
17.010
16.986
16.998
16.986
ND256-CuWire
008PRABB01 (B1008BT)
ND256-CuWire
008PRACB01 (B1008BT)
ND256-CuWire
008PRADB01 (B1008BT)
Z
1.390
1.400
1.390
1.390
1.400
Cu Lot #2
Z
1.400
1.390
1.400
1.400
1.410
Cu Lot #3
Z
1.410
1.410
1.400
1.400
1.390
Au Control Lot
ND256
008PRAAB01 (B1008BT)
Z
1.400
1.400
1.410
1.390
1.400
X
Y
Z
Qualification Report Package Type : PBGA ND256-CuWire
Stress / Test: REAL TIME X-RAY (RTX)
Pkg Type - Assembler:
Qual Part Number:
Test Condition:
Results Summary:
Reference:
ND256-CuWire - ASE (B)
PI7C8150BNDE MSL3
If any anomoly found inspecting top down, verify
by tilting units.
Quantity:
MIL-STD-883, Method 2012
# of Lots:
Sample Size:
Result:
PASS
Leadframe tip to tip and bond wire to wire and frame proximity shall be < 1 mil.
Cu Lot #1
ND256-CuWire
008PRABB01 (B1008BT)
from Bottom
Cu Lot #2
ND256-CuWire
008PRACB01 (B1008BT)
from Bottom
Cu Lot #3
ND256-CuWire
008PRADB01 (B1008BT)
from Bottom
Au Control Lot
ND256
008PRAAB01 (B1008BT)
Qualification Report Package Type : PBGA ND256-CuWire
from Top Side
3Cu+1Au
5
Stress / Test: PRECONDITION, ELECT TEST / CSAM
Pkg Type - Assembler:
Qual Part Number:
Test Condition:
ND256-CuWire - ASE (B)
PI7C8150BNDE MSL3
Die / Leadframe delamination <10% by A-Scan
Reflow profile per Figure 5-1
Results Summary:
Cu Lot #1
ND256-CuWire
008PRABB01 (B1008BT)
Cu Lot #2
ND256-CuWire
008PRACB01 (B1008BT)
Cu Lot #3
ND256-CuWire
008PRADB01 (B1008BT)
Au Control Lot
ND256
008PRAAB01 (B1008BT)
Qualification Report Package Type : PBGA ND256-CuWire
Reference:
Quantity:
J-STD-020D.1; JESD22-A113E
# of Lots:
Sample Size:
Result:
PASS
3Cu+1Au
5
Stress / Test: DECAP after 96 hrs HAST Testing
Pkg Type - Assembler:
Qual Part Number:
Test Condition:
ND256-CuWire - ASE (B)
PI7C8150BNDE MSL3
Decap and Inspect Intermetallic Growth (IMC)
Perform Bond Pull and Bond shear
Results Summary:
Cu Lot #1
ND256-CuWire
008PRABB01 (B1008BT)
Cu Lot #2
ND256-CuWire
008PRACB01 (B1008BT)
Cu Lot #3
ND256-CuWire
008PRADB01 (B1008BT)
Au Control Lot
ND256
008PRAAB01 (B1008BT)
Qualification Report Package Type : PBGA ND256-CuWire
Reference:
Quantity:
J-STD-020D.1; JESD22-A113E
# of Lots:
Sample Size:
Result:
PASS
3Cu+1Au
5
Stress / Test: DECAP after 1000 hrs High Temp Storage
Pkg Type - Assembler:
Qual Part Number:
Test Condition:
ND256-CuWire - ASE (B)
PI7C8150BNDE MSL3
Decap and Inspect Intermetallic Growth (IMC)
Perform Bond Pull and Bond shear
Results Summary:
Cu Lot #1
ND256-CuWire
008PRABB01 (B1008BT)
Cu Lot #2
ND256-CuWire
008PRACB01 (B1008BT)
Cu Lot #3
ND256-CuWire
008PRADB01 (B1008BT)
Au Control Lot
ND256
008PRAAB01 (B1008BT)
Qualification Report Package Type : PBGA ND256-CuWire
Reference:
Quantity:
J-STD-020D.1; JESD22-A113E
# of Lots:
Sample Size:
Result:
PASS
3Cu+1Au
5
10.0 Conclusion
The successful results of this qualification test activity have demonstrated that Pericom's ND (PBGA) Cu
Wire Package Series will continue reliable operation throughout exposure to various mechanical,
environmental and operating life stress conditions that are common to both industrial and commercial
service situations.
The ND (PBGA) Cu Wire Package meets the requirements for MSL-3 according to JESD22-A113.
The maximum temperature of the ND (PBGA) Cu Wire Package Series is 260°C maximum.
11.0 Reflow Profile
insert diagram of reflow profile.
12.0 Appendices
12.1
PN Information & BOM Summary
12.2
Package Outline Drawing(s)
The Contents of this document are to be treated as strictly confidential and proprietary in nature and are not to be
reproduced, used, or disclosed outside of the receiving company except as authorized by Pericom.
Qual Plan :
QPB09012C
PKG Code :
ND256-CuWire
Qualify by extention :
none
Package Type :
PBGA
Qualification Lots Background Informaton
Cu Lot #1
Cu Lot #2
Cu Lot #3
Au Control Lot
ND256-CuWire
ND256-CuWire
ND256-CuWire
ND256
ASE (B)
ASE (B)
ASE (B)
ASE (B)
MALAYSIA
MALAYSIA
MALAYSIA
MALAYSIA
PI7C8150BNDE
PI7C8150BNDE
PI7C8150BNDE
PI7C8150BNDE
MSL3
MSL3
MSL3
MSL3
008PRABB01 (B1008BT)
008PRACB01 (B1008BT)
008PRADB01 (B1008BT)
008PRAAB01 (B1008BT)
Package Type
PBGA
PBGA
PBGA
PBGA
Qual Plan No.
QPB09012C
QPB09012C
QPB09012C
QPB09012C
0.35um, 1P4M, 3.3V
Salicide (T3)
0.35um, 1P4M, 3.3V
Salicide (T3)
0.35um, 1P4M, 3.3V
Salicide (T3)
0.35um, 1P4M, 3.3V
Salicide (T3)
Pkg Code / Lead count
Assembly House
Assembly Location
Pericom PN
MSL Level
Assembly Lot (DateCode)
Fab Process Information
Bill of Materials Information
BY EXTENSION
ND256-CuWire QUAL
1
Leadframe Material
2
Lead Finish
3
Die Attach Material
4
Bond Wire Size & Material
5
Mold Compound
6
Package Size
7
Package Drawing
none
substrate - BT Core
0.50mm Sn-Cu-Ag Balls
Ablebond 2100A
Copper 0.8mil
Pd Coated Cu Wire
KE-G1250 LKDS
17.0mm x 17.0mm
PD-2016
The Contents of this document are to be treated as strictly confidential and proprietary in nature and are not to be
reproduced, used, or disclosed outside of the receiving company except as authorized by Pericom.
DOCUMENT CONTROL NO.
PD - 2016
REVISION: B
DATE: 05/24/05
1
Notes:
1. Controlling dimensions in millimeters
2. Ref: JEDEC MS-034B/AAF-1
Pericom Semiconductor Corporation
3545 N. 1st Street, San Jose, CA 95134
1-800-435-2335 • www.pericom.com
DESCRIPTION: 256-Pin, Ball Grid Array Package, PBGA
PACKAGE CODE: ND