Ensuring the Quality and Reliability of Electronics Devices
Prasert Kenpankho, Peerawut Suwanjan, and Surapong Siripongdee
Department of Engineering Education, Faculty of Industrial Education
King Mongkut’s Institute of Technology Ladkrabang
Chalongkrung Road, Bangkok 10520, Thailand
E-mail: kkpraser@kmitl.ac.th, kspeeraw@kmitl.ac.th, and kssurapo@kmitl.ac.th
Abstract. This paper is to show the quality of electronics devices, the research purposes the
performance inspections of each manufacturing process. This research is shown a broad range of
efficient process controls and inspections of the manufacturing process to assure that all electronics
products achieve the quality and reliability levels established at the design stage. The results of these
tests are evaluated using statistical methods, and feedback is provided to the manufacturing process.
Taking extensive measures to reduce static electricity
on people, equipment and in the environment throughout the
manufacturing process [2].
Using
moisture-protective
packing
for
our
semiconductor devices according to moisture sensitivity
classification, because resins are highly subject to moisture
damage during the mounting process of surface-mounted
packages. Labeling provides information about the moisture
sensitivity classification of each product.
The quality of our products begins when we select the
raw materials and components. The raw material control
follows the three steps below:
1. The engineering group performs the basic
examination of the products for their
physical and chemical characteristics.
2. QA groups perform reliability evaluation.
3. QA groups audit the suppliers' factories
and certify those having good quality. We
also hold regular quality standardization
meetings with suppliers.
This system maintains complete records of the entire
manufacturing process in order to identify production
problems rapidly, improve quality and manage nonconformance in the field.
1. Introduction
The maintenance of the manufacturing equipment is another
important aspect of maintaining product quality. At factory,
each piece of production equipment is regularly inspected
according to stringent control standards.
Each plant's equipment maintenance group regularly
calibrates all instruments used for measurements and
inspections. Control ledgers record the results of the
calibrations. Each piece of production equipment bears a label
showing the deadline for the next calibration.
Only experienced specialists calibrate the measuring
instruments. The standard equipment used for the calibration
is calibrated with a trace ability system based on standards.
The manufacturing environment greatly affects the
quality and reliability of semiconductors. To maintain
consistent product quality, we strictly suggest to control
temperature, humidity, dust levels and water purity at every
phase of manufacturing [1].
We impose rigorous standards on each item and
regularly monitor every aspect of the environment. We also
impose control standards for product storage.
The structure of semiconductors makes them very
sensitive to static electricity. At factory, design in integrated
circuits to be as resistant to static electricity is as possible.
Fig. 1 The standard marking on ICs
Proceedings of the International Conference on Computer and Industrial Management, ICIM, October 29-30, 2005, Bangkok, Thailand
17.1
Fig. 2 In-Process Troubleshooting
We maintain controlled specifications that define the
procedures for process changes and notifications to
customers. The proposed process changes should follow the
internal Process Change Notification (PCN) specifications,
and be reviewed by a committee formed of members from the
quality assurance department, the department where the
change originated and any other related departments. Changes
are classified by the specific categories, and a major change
should be reviewed and approved by the manager of QA
division before the implementation of the change. We always
notify customers in advance of changes affecting form,
appearance, function, quality or reliability [3].
This system enables us to focus on problem areas. The
system refers to the lot number assigned to each group that
has been manufactured at the same time. The manufacturing
date code is marked on the products as shown in the Fig. 1.
2. In-Process Troubleshooting
Whenever a problem that might interfere with the
manufacturing process arises, we immediately investigate the
cause, select and implement countermeasures, and take steps
to suppress the problem. The QA group confirms the
effectiveness of countermeasures.
Fig. 3 Failure analysis and corrective action procedure
Special Issue of the International Journal of the Computer, the Internet and Management, Vol. 13 No.SP2, October, 2005
17.2
3.1. Presentation of Information Related to Defective
Products
For analysis of defective products, the more information there
is about the defects, the more accurate failure analysis is
possible. For this reason, we elicit as much detailed
information from the customer as possible when receiving the
claim.
3. Failure Analysis
We carefully analyze the returned products that factories
receive from customers, take suitable measures to prevent
recurrence and provide analytical feedback to the concerned
groups. Because this feedback can directly improve reliability,
it is company’s policy to give customer claims full attention
and to do everything possible to resolve problems.
Customer claims are first directed to the
Sales/Customer Support Departments. Information is then
passed on to the Reliability & QA Departments for electronic
and physical analysis to determine the cause of the failure.
Related divisions take appropriate measures based on the
results of analysis. Furthermore, in order to fully correct the
problem, similar measures are taken at all manufacturing
facilities.
3.2. Returning Defective Goods
Customers are requested to send defective products in the
original defective state, preventing exterior defect condition
change, so that proper analysis may be performed.
3.3. Failure Analysis & Corrective Action Procedure
The failure analysis and corrective action procedure is shown
by Table 1.
Table 1. The failure analysis and corrective action procedure
Item
Visual survey
Equipment
– Stereoscopic microscope
– Lead inspection equipment
– Large-leak/small-leak (gross-leak
detector/ fine-leak detector)
Use in Analysis
– Visual inspection (lead deformation and damage, ID
marking, package voids, etc.)
– Lead deformation
– Package damage and airtightness
Electrical
characteristic
s
measurements
– LSI tester
– Failure simulation
– Curve tracer
– Oscilloscope
– Thermo-stream
– DC, AC, FNC, and Analog characteristics survey (final test
level, detailed survey)
– Failure-location estimation
– DC check for pin leak, breakdown-voltage, etc.
– Waveform survey of analysis samples
– Temperature-margin survey
Interior
survey before
opening
package
– Microfocus X-ray TV system
– SAT (scanning acoustic tomograph)
– PIND
– Wire bonding inspection, internal lead inspection, etc.
– Intra-package void and delamination survey
– Survey of internal foreign material
Package
decapsulation
– Package opener (nitric acid and sulfuric
acid)
– Mechanical opener
– Polishing equipment
– De-cap resin-type package
– De-cap ceramic-type package
– Surface analysis
Internal
operation
analysis
(locating
failure sites)
– Optical microscope
– EMS (near-infrared type)
– SEM
– EB tester (waveform, difference images)
– Liquid crystal method
– Laser microscope (OBIC/OBIRCH)
– Manual probe
– Surface inspection
– Locating infra-chip leak sites such as oxide-film leaks,
junction leaks, etc.
– Surface inspection
– Locating malfunctioning sites (logic-type abnormalities)
– Locating hot-spot sites
– Locating abnormal electric-field sites like diffusion
abnormalities (for TEG and the like, locating conductor breaks
and high-resistance sites)
– Locating malfunctioning sites
Internal
analysis
(structural
analysis)
– RIE
– FIB
– EDX
– TEM
– Etching of inter-layer isolation film
– Cross section inspection (contact sections, etc.), metal grain
inspection
– Foreign material analysis
– Fine-structure inspection (defects, etc.) and analysis
Proceedings of the International Conference on Computer and Industrial Management, ICIM, October 29-30, 2005, Bangkok, Thailand
17.3
4. Conclusions
In business, the customer always comes first. That is why we
put such efforts to ensure high quality and stable product
supply.
For every defect discovered, an in-depth analysis is
conducted to determine the cause of the problem and to
incorporate preventive measures into the development
process. Customers are informed of all aspects of the
situation. Because the results of these analyses can provide
information vital to improving reliability, it is our policy to
give claims full attention and to do everything possible to
resolve problems.
Database services and responses to audits demonstrate
company commitment to an ongoing dialogue with customers.
We believe that customer audits and visits to the
manufacturing facilities play an important role in building
trust in business relationship. Customers are welcome to visit
facilities. Through extensive customer communications, we
purpose the determination customer needs and incorporate
these needs into company products to ensure customer
satisfaction.
References
[1]
Research Center for Quantum Communication
Engineering Holon Academic Institute of Technology
52 Golomb Street, Holon 58102, Israel Available
http://www.magniel.com/qcc/ (last accessed July 2005)
[2] International Trade Centre, 2000, Export Development in
the Digital Economy, Geneva: International Trade
Centre. Available
http://www.intracen.org/execforum/ef2000/publication
2000.htm (last accessed July 2005)
[3] UNCTAD, 2002, ‘Electronic Commerce Strategies for
Development: The Basic Elements on an Enabling
Environment for E-Commerce’, Background Paper
TD/B/Com.3/EM.15/2,
Geneva,
UNCTAD,
Commission on Enterprise, Business Facilitation, and
Development.
Available
http://r0.unctad.org/ecommerce/event_docs/geneva_stra
tegies_issues.pdf (last accessed August 2005)
Special Issue of the International Journal of the Computer, the Internet and Management, Vol. 13 No.SP2, October, 2005
17.4