91/477/DA
For IEC use only
2004-08-20
`
INTERNATIONAL ELECTROTECHNICAL COMMISSION
TECHNICAL COMMITTEE N° 91:
ELECTRONICS ASSEMBLY TECHNOLOGY
Draft agenda for the TC 91 meeting to be held in San Jose, CA,
on 1st October 2004
-----------1.
Opening of the meeting
2.
Approval of the agenda
3.
Confirmation of the minutes of the last TC91 meeting
4.
Report of coordinated meetings held after the last TC91 meeting
4.1
ACET (Area 1 and Area 5)/Plenary meetings
4.2
Report from SMB on purpose of ACET
4.3
Confirmation of project management and organization of the work within TC91
5.
Report by Convenors on discussions and activities at each WG
91/477/DA
91/441/RM
SMB/2839/R
SMB/2862/INF
SMB/2867/DL
5.1 WG1:
- Report of the WG1 activity in general
- Confirmation and approval of maintenance schedule
- Report of the status of the following documents :
IEC 61760-1 Ed. 2.0 Surface mounting technology - Part 1: Standard method for
the specification of surface mounting components (SMDs)
91/454/CDV
IEC 61760-2 Ed.2.0 Surface mounting technology - Part 2: Transportation and storage
conditions of surface mounting devices (SMD) - Application guide
91/461/CD
91/xxx/CC*
PNW 91-467 Ed.1.0 : Electronic modules - Generic standard
91/467/NP
5.2 WG 2:
- Report of the WG2 activity in general
- Confirmation and approval of maintenance schedule
- Report of the status of the following documents :
IEC 61192-5 Ed. 1.0 :
Workmanship requirements for soldered electronic assemblies Part 5: Rework, modification and repair of soldered electronic assemblies
91/326/CD
91/413A/CC
2
IEC 61190-1-6 Ed. 1.0 :
Attachment materials for electronic assembly - Part 1-6: Requirements for
Electronic grade lead free solder alloys and fluxed and non-fluxed lead free solid solder
for electronic soldering applications
IEC 61190-1-7 Ed. 1.0
Attachment materials for electronic assembly - Part 1-7: Requirements for
Lead free solder pastes for high quality interconnections in electronic assembly
91/477/DA
91/378/NP
91/422A/RVN
91/379/NP
91/423A/RVN
Note: These two documents will be withdrawn by including their contents in
IEC 61190-1-2 and IEC 61190-1-3, respectively, which are subject to maintenance.
5.3 WG3 :
- Report of the WG3 activity in general
- Confirmation and approval of maintenance schedule
- U.S. proposal on test method numbering
- Report of the status of the following documents :
IEC 60068-2-21 Amendment 1 Environmental testing - Part 2-21:
Tests U: Robustness of terminations and integral mounting devices
IEC 60068-2-54 Environmental testing - Part 2-54: Tests. Test Ta:
Solderability testing of electronic components by the wetting balance method
IEC 60068-2-69 Amendment 1 to 60068-2-69 Ed.1: Environmental testing –
Part 2 : Tests - Test Te : Solderability of electronic components for surface
mount technology by the wetting balance method
91/440/CD
91/475/CC
91/446/CDV
91/xxx/RVC*
91/404/CD
91/474/CC
IEC 61189-5 Ed.1.0 Test methods for electrical materials, interconnection
structures and assemblies - Part 5: Test methods for printed board assemblies
91/435/CDV
91/xxx/RVC*
IEC 61189-6 Ed.1.0 Test methods for electrical materials, interconnection
structures and assemblies - Part 6: Test methods for materials used in electronic
assemblies
91/436/CDV
91/xxx/RVC*
PNW 91-443 Ed.1.0 (IEC60068-2-XX) Future IEC 60068-2-XX: Environmental
testing - Part XX: Tests - Test Tx- Whisker test methods for electronic and
electric components terminals
91/443/NP
91/xxx/RVN*
PNW 91-455 Ed.1.0 (IEC62137-1-1) Future IEC 62137-1-1: Surface mount
technology - Endurance test methods for lead-free solder joints. Part 1-1: Test x –
Methods of peel strength test for evaluating durability of lead-free solder joints
between terminals of gull wing type surface mount components and land-patterns of
printed wiring board
PNW 91-456 Ed.1.0 (IEC62137-1-2) Future IEC 62137-1-2: Surface mount
technology - Endurance test methods for lead-free solder joint- Part 1-2: Test x –
Method of shear type strength test for evaluating durability of lead-free solder joints
between terminals of surface mount components and land-patterns of printed
wiring board
91/455/NP
91/xxx/RVN*
91/456/NP
91/xxx/RVN*
5.4 WG4 :
- Report of the WG4 activity in general
- Confirmation and approval of maintenance schedule
- Report of the status of the following documents:
IEC 61192-6 Ed.1.0 Product performance requirements - Part 6: Guide to the
rework of unassembled boards
91/245/NP
91/324/RVN
IEC 61249-2-1 Ed.1.0 Materials for printed boards and other interconnecting
structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic
cellulose paper reinforced laminated sheets, economic grade, copper-clad
91/316/CDV
91/369/RVC
3
IEC 61249-2-2 Ed.1.0 Materials for printed boards and other interconnecting
structures – Part 2-2: Reinforced base materials, clad and unclad - Phenolic
cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
91/477/DA
91/317/CDV
91/370/RVC
IEC 61249-2-22 Ed.1.0 Materials for printed boards and other interconnecting
structures - Part 2-22: Reinforced base materials clad and unclad - Modified
non-halogenated epoxide woven E-glass laminated sheets of defined flammability
(vertical burning test), copper-clad
91/396/CDV
91/453/RVC
IEC 61249-2-23 Ed.1.0 Materials for printed boards and other interconnecting
structures - Part 2-23: Reinforced based materials, clad and unclad –
Non-halogenated phenolic cellulose paper reinforced laminated sheets,
economic grade, copper-clad
91/418/CDV
91/462/RVC
IEC 61249-2-26 Ed.1.0 Materials for printed boards and other interconnecting
structures - Part 2-26: Reinforced based materials, clad and unclad –
Non-halogenated epoxide, nonwoven/woven E-glass reinforced laminated sheets
of defined flammability (vertical burning test), copper-clad
91/419/CDV
91/457/RVC
IEC 61249-4-1 Ed.1.0 Materials for interconnecting structures - Part 4-1: Sectional
specification set for prepreg materials, unclad (for the manufacture of multilayer
boards) – Epoxide woven E-glass prepreg of defined flammability
91/406/NP
91/450/RVN
IEC 61249-4-2 Ed.1.0 Materials for printed boards and other interconnecting
structures - Part 4-2: Sectional specification set for prepreg materials, unclad
(for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass
prepreg of defined flammability (vertical burning test)
91/394/CDV
91/xxx/RVC*
IEC 61249-4-5 Materials for printed boards and other interconnecting structures –
Part 4-5: Sectional specification set for prepreg materials, unclad (for the manufacture
of multilayer boards) - Polyimide, modified or unmodified, woven E-glass prepreg of
defined flammability (vertical burning test)
91/395/CDV
91/xxx/RVC*
IEC 61249-4-11 Ed. 1.0 Materials for printed boards and other interconnecting
structures – Part 4-11: Sectional specification set for prepreg materials, unclad
(for the manufacture of multilayer boards) - Non-halogenated epoxide woven
E-glass prepreg of defined flammability (vertical burning test)
91/420/CDV
91/452/RVC
IEC 61249-4-12 Ed.1.0 Materials for printed boards and other interconnecting
structures - Part 4-12: Sectional specification set for prepreg materials, unclad
(for the manufacture of multilayer boards) - Non-halogenated multifunctional
epoxide woven E-glass prepreg of defined flammability (vertical burning test)
91/421/CDV
91/xxx/RVC*
IEC 61249-6-3 Ed.1.0 Materials for printed boards and other interconnection
structures - Part 6-3: Reinforcements - Woven fiberglass fabrics
IEC 62326-3 Ed.1.0 Printed Boards - Part 3: Safety certification of rigid printed
circuit boards for electronic assemblies (performance for capability approval)
91/393/CD
91/438/CC
91/445/CDV
PNW 91-405 : IEC 61249-1-1: Materials for printed boards and other interconnection
structures - Part 1-1: Safety certification of base materials for rigid printed circuit boards
91/405/NP
IEC61249-1 : Materials for interconnecting structures - Part 1: Generic specification
52/807/NP
5.5 WG5 :
- Report of the WG5 activity in general
- Confirmation and approval of maintenance schedule
- Report of the status of the following documents:
IEC 60194 Ed.5.0 Printed Board Design, Manufacture and Assembly - Terms and
Definitions
91/448/CDV
4
91/477/DA
5.6 WG10 :
- Report of the WG10 activity in general
- Confirmation and approval of maintenance schedule
- Report of the status of the following documents
IEC 61189-2 Amd.2 Ed.1.0 Amendment 2 to IEC 61189-2: Test methods for
electrical materials, interconnection structures and assemblies - Part 2: Test methods
for materials for interconnection structures
IEC 61189-3 Amd.2 Ed.1.0 Amendment 2 to IEC 61189-3: Test methods for
electrical materials, interconnection structures and assemblies - Part 3: Test methods for
interconnection structures
91/442/CDV
91/xxx/RVC*
91/314/CD
91/391/CC
5.7 WG12 :
- Report of the WG12 activity in general
- Confirmation and approval of maintenance schedule
- Report of the status of the following documents
IEC 61188-5-3 Printed boards and printed board assemblies - Design and use –
Part 5-3: Sectional design and use requirements - Attachment (land/joint)
considerations - Components with Gull-wing leads on two sides
91/463/CDV
IEC 61188-5-4 Printed boards and printed board assemblies - Design and use –
Part 5-4: Sectional design and use requirements - Attachment (land/joint)
consideration - Components with J leads on two sides
91/464/CDV
IEC 61188-5-5 Printed boards and printed board assemblies - Design and use –
Part 5-5: Sectional design and use requirements - Attachment (land/joint)
considerations - Components with Gull-wing leads on four sides
91/465/CDV
IEC 61188-5-8 Ed.1.0 Printed board and printed board assemblies - Design and use –
Part 5-8 : Sectional Requirement - Attachment (land/joint) considerations - Area array
components (BGA, FBGA, CGA, LGA)
91/466/CDV
PNW 91-407 Ed.1.0 IEC 61188-5-7 Design and use of printed boards and printed
board assemblies - Part 5-7: Sectional requirements attachment (land/joint)
considerations - components with post mounting leads on two sides (dips)
PNW 91-449 Ed.1.0 Electronic Component Zero Orientation for CAD Library
Construction
91/407/NP
91/449/NP
5.8 JWG11 :
- Report of the WG11 activity in general
- Confirmation and approval of maintenance schedule
- Report of the status of the following documents:
5.9 Projects and PASs
- Report of the status of the following documents
PNW 91-432 Ed.1.0 IEC xxx-xx: Test methods for lead-free solders - Part 1:
Measurement of melting temperature ranges
91/432/NP
PNW 91-433 Ed.1.0 IEC xxx-xx: Test methods for lead-free solder - Part 2:
Testing of mechanical characteristics
91/433/NP
PNW 91-469 Ed.1.0 Specification for Flexible Optical Board using Glass Fibre
and its test methods
91/469/NP
PNW 91-470 Ed.1.0 Specification for rigid optical board using planar waveguide
and its test methods
91/470/NP
PNW 91-471 Ed.1.0 Specification for optical board connector type SF using glass fibre
91/471/NP
5
IEC 61193-2 Quality Assessment Systems: Part 2: Guide to the selection and
use of sampling plans for end-product and in-process auditing
91/477/DA
91/307/NP
6. Discussion and approval of TC91 existing programme of work and SPS
6.1 Update and approval of the programme of work
6.2 Confirmation of the maintenance cycles for the standards listed in the SPS
7. Liaison state with IEC/ISO TCs/SCs and other organizations
8. Review of the TC 91 shopping list and published documents
9. Report from TC 91 to the SMB
10. Any other business
11. Date and place of the next meeting
12. Close of the meeting
----*
These documents will be circulated later
Delegates are requested to bring copies of all documents referenced, as copies will not be furnished at the
meeting.
Please note that an electronic version of this Draft Agenda in which hyperlinks have been established will be
available on the IEC Web Site approximately three weeks prior to the meeting.
Instructions on how to download the files are included in “Bits and Bytes”, Volume 7, January 1999. All past
issues of this publications can be accessed via the IEC Web Site ”Technical Work, TISS Support Services,
IT documentation” on the main web page: (http://www.iec.ch/support/bbyte/bb_entry-e.htm).