TWL6032 Evaluation Module (EVM) User’s
Guide
User's Guide
Literature Number: SWCU105
October 2012
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Agreement.
According to our best knowledge of the state and end-use of this
product or technology, and in compliance with the export control
regulations of dual-use goods in force in the origin and exporting
countries, this technology is classified as follows:
US ECCN: EAR99
EU ECCN: EAR99
And may require export or re-export license for shipping it in compliance
with the applicable regulations of certain countries.
Contents
1
........................................................................................................................ 5
............................................................................................................... 5
1.2
Applications .............................................................................................................. 6
1.3
Features .................................................................................................................. 6
TWL6032 EVM Resources Summary ...................................................................................... 7
Schematic .......................................................................................................................... 8
Connector and Test Point Descriptions ................................................................................ 11
4.1
Connector Descriptions ............................................................................................... 11
4.2
Test Point Descriptions ................................................................................................ 13
Test Setup ........................................................................................................................ 14
EQUIPMENT SETUP ........................................................................................................... 14
6.1
Input Supply ............................................................................................................ 14
6.2
Basic Jumper Setting .................................................................................................. 14
6.3
Load ..................................................................................................................... 15
6.4
Meter .................................................................................................................... 15
6.5
Recommended Wire Gauge .......................................................................................... 15
6.6
Install GUI ............................................................................................................... 15
Test Procedure .................................................................................................................. 19
7.1
EVM Wakeup ........................................................................................................... 19
7.2
Set Input Voltage ....................................................................................................... 19
7.3
Enable DUT ............................................................................................................. 19
7.4
Power Consumption Test ............................................................................................. 20
7.5
32-kHz Clock Test ..................................................................................................... 20
7.6
Load Test ............................................................................................................... 20
7.7
Test Complete .......................................................................................................... 20
7.8
Final Jumper Connections ............................................................................................ 20
7.9
Load Test ............................................................................................................... 20
EQUIPMENT SHUTDOWN ................................................................................................... 20
EVM Assembly Drawings and Layout ................................................................................... 21
List of Materials ................................................................................................................. 26
Revision History ................................................................................................................ 30
Introduction
1.1
2
3
4
5
6
7
8
9
10
11
Description
SWCU105 – October 2012
Table of Contents
Copyright © 2012, Texas Instruments Incorporated
3
www.ti.com
List of Figures
1
TWL6032 EVM Schematic – TWL6032 Connections ..................................................................
8
2
TWL6032 EVM Schematic – Power Connections ......................................................................
9
3
TWL6032 EVM Schematic – MSP430 Connetions ...................................................................
10
4
GUI Snapshot – Register
................................................................................................
GUI Snapshot – DUT Control ...........................................................................................
GUI Snapshot – BCI ......................................................................................................
TWL6032 EVM Component Placement With Silkscreen Labels ....................................................
TWL6032 EVM Internal Layer (L1) ......................................................................................
TWL6032 EVM Internal Layer (L2) ......................................................................................
TWL6032 EVM Internal Layer (L3) ......................................................................................
TWL6032 EVM Internal Layer (L4) ......................................................................................
TWL6032 EVM Internal Layer (L5) ......................................................................................
TWL6032 EVM Internal Layer (L6) ......................................................................................
TWL6032 EVM Internal Layer (L7) ......................................................................................
TWL6032 EVM Internal Layer (L8) ......................................................................................
16
5
6
7
8
9
10
11
12
13
14
15
17
18
21
22
22
23
23
24
24
25
25
List of Tables
1
Boot Configuration.........................................................................................................
11
2
VBAT Minimum and Maximum Levels ..................................................................................
11
3
VSYS Minimum and Maximum Levels ..................................................................................
11
4
SMPS Loads
..............................................................................................................
11
5
LDO Loads .................................................................................................................
12
6
GPADC Channels .........................................................................................................
12
7
Test Point Descriptions ...................................................................................................
13
8
VBAT Minimum and Maximum Levels ..................................................................................
14
9
Input Jumper Settings .....................................................................................................
14
10
Input Jumper Settings .....................................................................................................
14
11
Electronic Load Connections
............................................................................................
Electronic Load Connections ............................................................................................
Expected Voltages ........................................................................................................
SMPS Register Values ...................................................................................................
SMPS Jumper Measurements ...........................................................................................
15
12
13
14
15
4
List of Figures
15
19
20
20
SWCU105 – October 2012
Copyright © 2012, Texas Instruments Incorporated
User's Guide
SWCU105 – October 2012
TWL6032 Evaluation Module (EVM) User’s Guide
1
Introduction
1.1
Description
1.1.1
Device Description
The TWL6032 device is an integrated power-management integrated circuit (PMIC) for applications
powered by a rechargeable battery. The device provides five configurable step-down converters with up to
5-A current capability for memory, processor core, I/O, auxiliary, preregulation for low drop-out voltage
regulators (LDOs), and so forth. The TWL6032 device also contains nine LDOs for external use that can
be supplied from a battery or a preregulated supply. The power-up and power-down controller is
configurable and can support any power-up and power-down sequence (programmed in OTP memory).
The real-time clock (RTC) provides three 32-kHz clock outputs, seconds, minutes, hours, day, month, and
year information, as well as alarm wakeup and timer. The TWL6032 device supports 32-kHz clock
generation based on a crystal oscillator.
The TWL6032 device integrates a switched-mode system supply regulator from a universal serial bus
(USB) connector. The TWL6032 includes power paths from the USB and battery with supplemental mode
for immediate startup, even with an empty battery. The battery switch uses an external low-Ωic PMOS
transistor allowing minimal serial resistance during fast charging and when operating from a battery. The
TWL6032 device can also be used without the external PMOS transistor; the battery is then always tied to
the system supply and the switched-mode regulator is used for battery charging.
Project collateral and source code discussed in this application report can be downloaded from the
following URL: http://www.ti.com/lit/zip/swcc013.
1.1.2
EVM Kit Description
The TWL6032 evaluation module (EVM) is a stand-alone module that demonstrates the functions of the
integrated PMIC. The EVM uses a USB cable and an MSP430™ device (mounted on the EVM) to control
the standard inter-integrated circuit (I2C™) interfaces in the TWL6032 device. It includes Windows®compatible software to interface with the device. The software is a simple graphical user interface (GUI)
that simplifies registers access for the IC.
1.1.3
EPROM Power-Up Sequence Description
This user's guide is common for all TWL6032x parts. The only difference in these parts is the EPROM
sequence for power up. Each part has a unique EPROM sequence to satisfy the attached application
processor. For details of the EPROM sequence, see the corresponding user's guide in the Application
Notes section on the TWL6032x product page.
SmartReflex is a trademark of Texas Instruments.
Windows is a registered trademark of Microsoft Corporation.
I2C is a trademark of Philips Semiconductor Corp.
MSP430 is a trademark of Texas Instruements.
SD is a registered trademark of Toshiba Corporation.
All other trademarks are the property of their respective owners.
SWCU105 – October 2012
TWL6032 Evaluation Module (EVM) User’s Guide
Copyright © 2012, Texas Instruments Incorporated
5
Introduction
1.2
www.ti.com
Applications
The TWL6032 device is ideal for the following applications:
• Mobile phones and smart phones
• Tablets
• Gaming handsets
• Portable media players
• Portable navigation systems
• Handheld devices
1.3
Features
The TWL6032 device has the following features:
• Five highly efficient buck converters
– One 3 MHz, 0.6 to 2.1 V @ 5.0 A, DVS-capable
– One 6 MHz, 0.6 to 2.1 V @ 2.5 A, DVS-capable
– Three 6 MHz, 0.6 to 2.1 V @ 1.1 A, one being DVS-capable
• 11 general-purpose LDOs
– Six 1.0 to 3.3 V @ 0.2 A with battery or preregulated supply:
One can be used as vibrator driver.
– One 1.0 to 3.3 V @ 50 mA with battery or preregulated supply
– One low-noise 1.0 to 3.3 V @ 50 mA with battery or preregulated supply
– One 3.3 V @ 100 mA USB LDO
– Two LDOs for TWL6032 internal use
• USB OTG module:
– ID detection, accessory charger adapter (ACA) support
– Accessory detection protocol (ADP) support
• Backup battery charger
• 12-bit sigma-delta analog-to-digital converter (ADC) with 19 input channels:
– Seven external input channels
• 13-bit Coulomb counter with four programmable integration periods
• Low power consumption:
– 8 µA in BACKUP state
– 20 µA in WAIT-ON state
– 110 µA in SLEEP state, with two DC-DC converters active
• Real-time clock (RTC) with timer and alarm wake-up:
– Three buffered 32-kHz outputs
• SIM and SD®/MMC card detections
• Two digital pulse-width modulation (PWM) outputs
• Thermal monitoring:
– High-temperature warning
– Thermal shutdown
• Control:
– Configurable power-up and power-down sequences (OTP memory)
– Configurable sequences between SLEEP and ACTIVE states (OTP memory)
– Three digital output signals that can be included in the startup sequence to control external devices
– Two inter-integrated circuit I2C interfaces
6
TWL6032 Evaluation Module (EVM) User’s Guide
Copyright © 2012, Texas Instruments Incorporated
SWCU105 – October 2012
TWL6032 EVM Resources Summary
www.ti.com
•
•
•
2
– All resources configurable by I2C
System voltage regulator and battery charger with power path from USB:
– Input current limit to comply with USB standard
– 3-MHz switched-mode regulator with integrated power FET for up to 2.0-A current
– Dedicated control loop for battery current and voltage
– External low-Ωic FET for power path and battery charging
– Boost mode operation for USB on-the-go (OTG)
– Supplement mode to deliver current from battery during power path operation
– Charger for single-cell Li-Ion and Li-polymer battery packs
– Safety timer and reset control
– Thermal protection
– Input and output overvoltage protection
– Charging indicator LED driver
– Compliant with:
• USB 2.0
• OTG and EH 2.0
• USB battery charging 1.2
• YD/T 1591-2006
• Japanese battery charging guidelines (JEITA)
Battery voltage range from 2.5 to 5.5 V
Package 5.21 mm × 5.36 mm 155-pin WCSP
TWL6032 EVM Resources Summary
•
•
•
•
•
•
•
•
•
•
LDOs
REGEN1
REGEN2
SYSEN
SMPS regulators
Main bandgap
Comparators
Thermal shutdown
System reset
Clocks (PWM1 and PWM2)
For detailed electrical characteristics of the switched-mode power supplies (SMPSs) and LDO supplies,
see the TWL6032 product data sheet.
SWCU105 – October 2012
TWL6032 Evaluation Module (EVM) User’s Guide
Copyright © 2012, Texas Instruments Incorporated
7
Schematic
3
www.ti.com
Schematic
Figure 1 shows the TWL6032 EVM schematic.
C13
SMPS1
C33 22uF
C38 22uF
1 uH
AGND
AGND_SMPS1
VSYS
SMPS2_S
C37
4.7uF
I2C_SCL_B
I2C_SDA_B
TP20
TP6
TP17
SMPS1_SW
SMPS1_SW
SMPS1_SW
SMPS1_SW
N3
M3
L3
K3
SMPS1_GND
SMPS1_GND
SMPS1_GND
SMPS1_GND
TP9
VSYS
VBG F10
REFGND C8
REFGND G8
IREF E10
OSC32KCAP C10
OSC32KIN A9
C32
2.2uF
AGND_XTAL
+
C31
0.08 F
R15
AGND
C23
4.7uF
VBACKUP G6
AGND
0ohm
VBUS
AGND_CHRG
VSYS_BB C11
VBUS B1
VBUS C1
VBUS D1
C28
1.2uF
R16
100K
1
TP10
1 Q2
CHRG_PROT_GATE G1
GATE_PROT
CHRG_PMID A2
CHRG_PMID B2
CHRG_PMID C2
1
AGND
C16 4.7uF
TP7
AGND
AGND_CHRG
C19 100nF
CHRG_BOOT E2
M13 SMPS2_IN
L13 SMPS2_IN
SMPS2
JP9
1
AGND
OSC32KOUT B9
1
CLK32KG K8
CLK32KAUDIO C9 1
CLK32KAO K9 1
CTLI2C_SCL J3
CTLI2C_SDA J4
DVSI2C_SCL J11
DVSI2C_SDA H11
TESTV A13 1
VPROG D6
TESTEN E3
NRESPWRON J5
K5
K7
J1
H3
SYSEN
INT
REGEN2
REGEN1
MSECURE K4
NRESWARM H4
PREQ1 H7
PREQ2 K6
PREQ3 H6
PWRON J2
N2
M2
L2
K2
1
2
100nF
H1 SMPS1_FDBK
L3
510K
C20
1
SMPS1_S
M1 SMPS1_IN
L1 SMPS1_IN
K1 SMPS1_IN
RPWRON H2
BOOT0 E4
BOOT1 D3
BOOT2 F6
VSYS
C12 12pF
C14 2.2uF
R10
TP8
AGND BOOT2
BOOT1
BOOT0
K13 SMPS2_FDBK
N12 SMPS2_SW
M12 SMPS2_SW
L12 SMPS2_SW
1 uH
N11 SMPS2_GND
M11 SMPS2_GND
U1-A
VSYS
N10 SMPS3_IN
M10 SMPS3_IN
SMPS3
C9
NM
L6 1 uH
CHRG_CSOUT D5
M8 SMPS3_GND
M9 SMPS3_GND
SMPS4_S
C35
4.7uF
CHRG_PGND C5
CHRG_PGND B5
CHRG_PGND A5
J12 SMPS4_IN
J13 SMPS4_IN
SMPS4
CHRG_VSYS C12
G11 SMPS4_FDBK
L2 1 uH
AGND
AGND_SMPS4
VSYS
AGND
GGAUGE_RESP D9
N5 SMPS5_SW
L5 1 uH
R1
M5 SMPS5_GND
M6 SMPS5_GND
GGAUGE_RESN D10
R2
1
TP4
C5 2.2uF
L4 SMPS5_FDBK
C42
10uF
2
2 Q1
CHRG_VREF D2
TP2
VSYS
AGND_CHRG
CHRG_VBAT B13
N4 SMPS5_IN
M4 SMPS5_IN
SMPS5_S
10uF
CHRG_GATE_CTRL C13
G12 SMPS4_GND
G13 SMPS4_GND
SMPS5
C39
4.7uF
C17
AGND AGND_CHRG
C2 4.7nF
H12 SMPS4_SW
H13 SMPS4_SW
C36 10uF
0ohm
C18
100nF
AGND
VSYS
AGND
AGND_SMPS3
2
R11
N9 SMPS3_SW
10uF
AGND_CHRG
CHRG_CSIN D4
L11 SMPS3_FDBK
C43
L1
1 uH
AGND
TWL6032, A2B4
SMPS3_S
C40
4.7uF
B4
C4
C3
B3
A3
1
AGND
AGND_SMPS2
CHRG_SW
CHRG_SW
CHRG_SW
CHRG_SW
CHRG_SW
1
L4
C41 10uF
1
C34
4.7uF
I2C_SCL_A
I2C_SDA_A
R7 0ohm
S1
R5
0ohm AGND
NRESPWRON
1
SYSEN
INT
REGEN2
REGEN1
2
Y1
32.768 KHz
PREQ3
PREQ2
PREQ1
MSECURE
NRESWARM
JP10
12pF
PACK+
TP1
PACK-
20mohm
AGND_CHRG
2
AGND
AGND
AGND
AGND_SMPS5
VSYS
AGND
VBUS_DET F7
BATREMOVAL J10
CHRG_EXTCHRG_STATZF3
CHRG_EXTCHRG_ENZF4
CHRG_DET_N A4
L5 VDD
B7 VDD
E11 VDD
G2 VDD
VBUS_DET
BATREMOVAL
CHRG_EXTCHRG_STATZ
CHRG_EXTCHRG_ENZ
CHRG_DET_N
C44 2.2uF
VIO
VIO
H10 VIO
C51 100nF
2
1 Not Installed
2 See BOM for part usage
Figure 1. TWL6032 EVM Schematic – TWL6032 Connections
8
TWL6032 Evaluation Module (EVM) User’s Guide
SWCU105 – October 2012
Copyright © 2012, Texas Instruments Incorporated
Schematic
www.ti.com
JP4
J12
1
2
1
1
2
3
4
5
6
7
8
9
10
11
12
2
R23 0ohm
SDA_MSP430
R19 0ohm
SCL_MSP430
3
AGND
_SMPS1_S
1
2
3
4
5
6
7
8
9
10
11
12
AGND
AGND
J6
SMPS2S
SMPS2F
SMPS3S
SMPS3F
SMPS4S
SMPS4F
SMPS5S
SMPS5F
1
2
3
4
VIO F
VIO S
SMPS4
SMPS5
VSYS
CHRG_LED_IN A6
LDO3_IN
LDO4_IN
R20
0ohm
0ohm
LDO5_IN
LDO6_IN
R6
0ohm
0ohm
LDO7_IN
C30
2.2uF
C7 2.2uF
C3 2.2uF
GPADC_VREF B11
LDO4
GPADC_IN0
GPADC_IN1
GPADC_IN2
GPADC_IN3
GPADC_IN4
GPADC_IN5
GPADC_IN6
F12 LDO5_IN
LDO5
LDO7
VBUS
LDOLN_IN
LDOLN_OUTE13
LDOLN
LDOUSB_OUT
A7
LDOUSB
J4
1
2
3
K12
1 K11 PWM1
PWM2
1
4
ID
GND_DIG_VRTC G3
GND_DIG_VIO L7
GND_ANA E1
GND_ANA L9
GND_ANA C7
GND_ANA H8
PBKG N1
PBKG A1
PBKG N13
PBKG G4
5
U2
1 DM
VBUS 6
2 DP
NC 5
3 USB-ID
AGND
BOOT
JP6
1
2
3
4
5
6
7
8
9
10
11
12
S
LDO7_OUT
F
LDO7_OUT
LDOLN_OUTS
LDOLN_OUTF
S
LDOUSB_OUT
F
LDOUSB_OUT
VRTC_OUT
BOOT0
1
2
3
JP7
1
2
3
BOOT1
J3
1
2
3
4
5
6
7
8
9
10
11
12
BATREMOVAL
VBUS_DET
CHRG_EXTCHRG_STATZ
CHRG_EXTCHRG_ENZ
VAC
LDOUSB_OUT
CHRG_DET_N
AGND
AGND
GPADC
J2
NC 4
7
2
2 See BOM for part usage
CHARGER
AGND
USB_MICRO_AB
B8 LDO7_IN
LDOLN_IN E12
AGND
JP8
1
2
3
4
5
6
7
8
9
10
11
12
GPADC_START
ADIN0
ADIN1
R12
GPADC_VREF
AGND
2
1
BOOT2
R9
44.2K
0ohm
GPADC_IN2
GPADC_IN6
GPADC_IN3
GPADC_IN5
GPADC_IN4
2
3
AGND
JP5
2
AGND
AGND
GPADC_VREF
AGND
ADIN0
ADIN1
GPADC_IN2
GPADC_IN3
GPADC_IN4
GPADC_IN5
GPADC_IN6
1 Not Installed
J1
LDO1_IN
LDO7_IN
LDO2_IN
LDOLN_IN
LDO3_IN
LDO4_IN
LDO5_IN
LDO6_IN
C15 100nF
D11
D8
A12
B12
A11
G10
F11
J11
1
2
3
4
5
6
7
8
9
10
11
12
TP21
GPADC_START
LDO6
LDO7_OUT A8
TP18
TP14
1
AGND
TP12
C24 2.2uF
C47 2.2uF
C26 2.2uF
C22 2.2uF
C27
2.2uF
C48 2.2uF
C10 2.2uF
C6
2.2uF
C29 2.2uF
C11
2.2uF
C46 2.2uF
C8 2.2uF
AGND_XTAL
AGND_CHRG
C21
2.2uF
AGND
AGND_SMPS4
AGND_SMPS3
AGND_SMPS1
AGND_SMPS2
AGND_SMPS5
GND
SIM J9
GPADC_START L10
D12 LDO6_IN
LDO6_OUTD13
R14
TWL6032, A1B4
LDO3
L8 LDO4_IN
LDO4_OUT N8
R13
U1-B
M7 LDO3_IN
1
10
11
0ohm
ID
MMC K10
6
7
0ohm
R27
LDO2
TP3
L6 LDO2_IN
1
R26
VSYS
ID G7
F1 LDO1
LDO3_OUT N7
C45
2.2uF
C50
2.2uF
J5
PACK-
D1
F2 LDO1_IN
LDO5_OUTF13
AGND
C1
47uF
PACK+
0ohm
GND
LDO2_IN
R4
1
1
0ohm
LDO2_OUT N6
C49
2.2uF
1
2
3
4
2
CHRG_LED_TEST B6
A10 VANA
LDO1_IN
0ohm
LDO1_OUT
R25
C25
2.2uF
S
LDO1_OUT
F
LDO1_OUT
S
LDO2_OUT
F
LDO2_OUT
S
LDO3_OUT
F
LDO3_OUT
S
LDO4_OUT
F
LDO4_OUT
S
LDO5_OUT
F
LDO5_OUT
S
LDO6_OUT
F
LDO6_OUT
1
AGND
VAC C6
D7 VRTC
B10 VANA_IN
VANA_OUT
TP5
1
2
3
4
5
6
7
8
9
10
11
12
2
VAC
C4
100nF
R17
J10
1
JP2
AGND
F8 VRTC_IN
LDO
PREQ1
NRESPWRON
PREQ2
REGEN1
PREQ3
REGEN2
MSECURE
INT
NRESWARM
SYSEN
1
2
3
4
VRTC_OUT
AGND
JP3
AGND
J13
AGND
VBUS
R21 0ohm
VSYS
AGND
R24 0ohm
I2C_SCL_B
AGND
I2C_SCL_A
I2C_SDA_B
SMPS1S
TP13
I2C_SDA_A
SMPS1F
2
4
2
BATTERY
J7
1
ADIN0
JP12
1
R18 2.2K
TP11
1
JP1
IN Config / OUT
J9
VIO
R22 2.2K
TP16
TP19
1
TP15
1
1
SMPS
ADIN1
CONNECTORS
SCL/SDA
R8
121K
R3
47K
AGND
AGND
AGND
Figure 2. TWL6032 EVM Schematic – Power Connections
SWCU105 – October 2012
TWL6032 Evaluation Module (EVM) User’s Guide
Copyright © 2012, Texas Instruments Incorporated
9
Schematic
www.ti.com
TRANSCEIVER USB TO I2C OPTION 1
3V3 VOLTAGE
AGND
JP11
VR1
C53
4.7uF
NC/FB 4
+5V
AGND
AGND
6
1
2
4
AGND
5
VR3
1.5K
C58
1nF
AGND
Shifters
J8
3
Y2
24 MHz
R28
120K
2
C59 100pF
3 EN
C57 22pF
2 GND
C54
100nF
1
C56 22pF
OUT 5
1 IN
C60 100pF
+3V3
+3V3
+5V
AGND
AGND
+3V3
1 P6.4/CB4/A4
VIO
IO_9
VSSU 61
PU.0/DP 62
R29
PU.1/DM 64
V18 67
VUSB 66
VBUS 65
AVSS2 68
P5.2/XT2IN 69
P5.3/XT2OUT 70
PJ.0/TDO 72
TEST/SBWTCK 71
PJ.1/TDI/TCLK 73
PJ.3/TCK 75
P7.6/TB0.4 59
3 P6.6/CB6/A6
P7.5/TB0.3 58
4 P6.7/CB7/A7
P7.4/TB0.2 57
5 P7.0/CB8/A12
P5.7/TB0.1 56
7 P7.2/CB10/A14
AGND
IO_11
C62
100nF
C63
100nF
C64
100nF
P4.5/PM_UCA1RXD 52
11 AVCC1
DVCC2 50
12 P5.4/XIN
DVSS2 49
13 P5.5/XOUT
AGND
IO_11
5 1A2
1B2 12
PREQ2
IO_12
6 2A1
2B1 11
PREQ3
IO_9
7 2A2
2B2 10
MSECURE
8 GND
GND 9
AGND
VR4
R35
1.5K
R36
1.5K
100nF
15 P8.0
P4.1/PM_UCB1SIMO46
16 P8.1
P4.0/PM_UCB1STE/PM_U45
17 P8.2
P3.7/TB0OUTH/SVMOUT44
18 DVCC1
P3.6/TB0.6 43
19 DVSS1
P3.5/TB0.5 42
20 VCORE
P3.4/UCA0RXD/UCA0SOM41
IO_7
IO_7
1V8
AGND
1 VCCA
VCCB 16
2 1DIR
~1OE 15
3 2DIR
~2OE 14
1V8
AGND
4 1A1
1B1 13
INT
5 1A2
1B2 12
NRESPWRON
6 2A1
2B1 11
7 2A2
2B2 10
8 GND
GND 9
Q7
AGND
SDA_MSP430
SCL_MSP430
40 P3,3/UCA0TXD/UCA0SIM
38 P3.1/UCB0SOMI/UCB0SC
39 P3.2/UCB0CLK/UCA0STE
37 P3.0/UCB0SIMO/UCB0SD
36 P2.7/UCB0/STEUCA0CLK
34 P2.5/TA2.2
35 P2.6/RTCCLK/DMAE0
31 P2.2/TA2CLK/SMCLK
32 P2.3/TA2.0
33 P2.4/TA2.1
30 P2.1/TA1.2
27 P1.6/TA1CLK/CBOUT
28 P1.7/TA1.0
29 P2.0/TA1.1
26 P1.5/TA0.4
25 P1.4/TA0.3
23 P1.2/TA0.1
IO_12
24 P1.3/TA0.2
21 P1.0/TA0CLK/ACLK
AGND
22 P1.1/TA0.0
C65
470nF
+3V3
AGND
IO_3
P4.2/PM_UCB1SOMI47
Q6
+3V3
PREQ1
AGND
P4.3/PM_UCB1CLK 48
14 AVSS1
Q5-B
C61
P4.4/PM_UCA1TXD 51
10 P5.1/VREF-/VEREF-
D6
R30
1.5K
AGND
1B1 13
P4.6/PM_NONE 53
9 P5.0/VREF+/VEREF+
IO_10
1V8
P4.7/PM_NONE 54
U4
MSP430F552XIPN
8 P7.3/CB11/A15
+3V3
~2OE 14
P5.6/TB0.0 55
6 P7.1/CB9/A13
AGND
~1OE 15
3 2DIR
4 1A1
P7.7/TB0CLK/MCLK 60
2 P6.5/CB5/A5
VCCB 16
2 1DIR
IO_10
AGND
NC/FB 4
AGND
+3V3
3 EN
C55
4.7uF
PJ.2/TMS 74
OUT 5
2 GND
P6.0/CB0/A0 77
1 IN
C52
100nF
NMI/SBWTDIO/RST 76
P6.3/CB3/A3 80
1V8
P6.2/CB2/A2 79
VR2
+5V
P6.1/CB1/A1 78
AGND
PUR 63
1V8 VOLTAGE
1 VCCA
IO_3
LEDs
+5V
+5V
R34
1.5K
D5
R33
1.5K
D4
Q4-B
VRTC_OUT
NRESPWRON
AGND
+5V
D3
D2
+3V3
AGND
5
INT
Q4-A
R31
1.5K
1V8
Q3-A
VCC
R32
1.5K
2A
GND
+5V
U3
Q3-B
Y
4
3
AGND
AGND
Figure 3. TWL6032 EVM Schematic – MSP430 Connetions
10
TWL6032 Evaluation Module (EVM) User’s Guide
SWCU105 – October 2012
Copyright © 2012, Texas Instruments Incorporated
Connector and Test Point Descriptions
www.ti.com
4
Connector and Test Point Descriptions
4.1
Connector Descriptions
4.1.1
Boot Pins
JP6, JP7, and JP8 are used to select the boot pin configuration for proper booting of the device. Table 1
shows the possible boot options.
Table 1. Boot Configuration
4.1.2
State
Boot0
Boot1
Boot2
1
JP6(1-2)
JP7(1-2)
JP8(1-2)
0
JP6(3-2)
JP7(3-2)
JP8(3-2)
Backup Battery
JP9 is used for the backup battery connection. The user can use the onboard 0.8-F, 3.3-V capacitor by
shorting JP9-1 and JP9-2.
4.1.3
VBAT and VSYS
Pack+/– (JP2) is the main source input to the PMIC. See Table 2 for the minimum and maximum levels
that can be applied to this pin. Use JP12 for ground; the power supply V+ is JP2 (1) and V– to JP2 (2).
Table 2. VBAT Minimum and Maximum Levels
VBAT
Minimum (V)
Typical (V)
Maximum (V)
2.7
3.6
5.5
VSYS (JP1) is the main input source to the device. Table 3 lists the minimum and maximum levels that
can be applied to these pins.
Table 3. VSYS Minimum and Maximum Levels
VSYS
Minimum (V)
Typical (V)
Maximum (V)
2.7
3.6
5.5
VBUS (JP4) plug insertion is one of the power up events for the device; VBUS is set to 5 V. It is not
mandatory to plug in VBUS for power up of the PMIC.
4.1.4
SMPS
There are five SMPSs on the TWL6032 device. SMSPs can be loaded by connecting the load on
connectors JP13 and J3. Special consideration must be given to force and sense while loading on SMPS1
(JP13).
Table 4 lists the maximum loads of the SMPSs.
Table 4. SMPS Loads
Connector
Label
JP9(1-4)
SMPS1
Maximum Load
5A
J12(6-1)
SMPS2
2.2 A
J12(8-1)
SMSP3
1.1 A
J12(10-1)
SMSP4
1.1 A
J12(12-1)
SMSP5
1.1 A
SWCU105 – October 2012
TWL6032 Evaluation Module (EVM) User’s Guide
Copyright © 2012, Texas Instruments Incorporated
11
Connector and Test Point Descriptions
4.1.5
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LDO
There are eleven LDOs on the TWL6032 device. Two LDOs are for internal use and nine LDOs are
available to supply external power.
Table 5 lists the maximum loads of the LDOs.
Table 5. LDO Loads
4.1.6
Connector
Label
Maximum Load
J11-2
LDO1
50 mA
J11-4
LDO2
200 mA
J11-6
LDO3
200 mA
J11-8
LDO4
200 mA
J11-10
LDO5
200 mA
J11-12
LDO6
250 mA
J1-2
LDO7
200 mA
J1-4
LDOLN
50 mA
J1-6
LDOUSB
100 mA
GPADC
The TWL6032 device has seven general-purpose ADC channels which are externally available and used
for various purposes; for example, battery temperature measurement, battery voltage measurement, and
so forth. See the TWL6032 data manual for a detailed description about the each channel.
Table 6. GPADC Channels
Connector
Label
Function
J3-1
GPADC_VREF
Reference voltage for GPADC
J3-2
GPADC_START
Start the conversion on ADC
J3-3
ADIN0
Battery detection
J3-5
ADIN1
Battery temperature measurement
J3-7
GPADC2
General purpose
J3-8
GPADC6
General purpose
J3-9
GPADC3
General purpose
J3-10
GPADC5
General purpose
J3-11
GPADC4
General purpose
JP5(1-2) must be connected to simulate the temperature measurements.
4.1.7
I2C Communication
The TWL6032 device has two slave I2C interfaces. One is a general-purpose interface to control the
internal configuration registers. The second is dedicated to SmartReflex™ applications such as dynamic
voltage frequency scaling (DVFS) or adaptive voltage scaling (AVS). J-1 is used to control the
communication between the GUI and the MSP430, which in turn control the PMIC.
12
TWL6032 Evaluation Module (EVM) User’s Guide
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SWCU105 – October 2012
Connector and Test Point Descriptions
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4.2
Test Point Descriptions
Table 7 lists the test point functions.
Table 7. Test Point Descriptions
Connector
Label
Function
J9-2
SMSP1-OUT
Sense for SMPS1
J12-5
SMPS 2-OUT
Sense for SMPS2
J12-7
SMPS3-OUT
Sense for SMPS3
J12-7
SMPS4-OUT
Sense for SMPS4
J12-11
SMPS5-OUT
Sense for SMPS5
J6-2
VIO-OUT
Sense for VIO
J11-1
LDO1-OUT
Sense for LDO1
J11-3
LDO2-OUT
Sense for LDO2
J11-5
LDO3-OUT
Sense for LDO3
J11-7
LDO4-OUT
Sense for LDO4
J11-9
LDO5-OUT
Sense for LDO5
J11-11
LDO6-OUT
Sense for LDO6
J1-1
LDO7-OUT
Sense for LDO7
J1-3
LDOLN-OUT
Sense for LDOLN
J1-4
LDOUSB-OUT
Sense for LDOUSB
J5-1
LDO1-IN
Input for LDO1
J5-2
LDO7-IN
Input for LDO7
J5-3
LDO2-IN
Input for LDO2
J5-4
LDOLN-IN
Input for LDOLN
J5-5
LDO3-IN
Input for LDO3
J5-6
LDO4-IN
Input for LDO4
J5-7
LDO5-IN
Input for LDO5
J5-8
LDO6-IN
Input for LDO6
J2-1
BATREMOVAL
Battery removal indication
J2-2
VBUSDET
VBUS detection
J2-3
CHRG_EXTCHRG_STATZ
External charging status
J2-4
CHRG_EXTZCHRG_ENZ
External charging enable
J2-5
VAC
VAC detection
J2-7
LDOUSB-OUT
Sense for LDOUSB
J2-8 and J2-10
CHRG_DET_N
USB charger detection
J10 and J13 are extra ground connectors used for any purpose.
SWCU105 – October 2012
TWL6032 Evaluation Module (EVM) User’s Guide
Copyright © 2012, Texas Instruments Incorporated
13
Test Setup
5
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Test Setup
The following equipment is needed to complete this test procedure.
• Power Supplies
A power supply capable of supplying up to 3.8 V @ 10 A and a USB cable
• Loads
Three electronic load circuits capable of drawing 5 A
• Meters
One DC voltmeter
• Oscilloscope
One oscilloscope with 1 probe
6
EQUIPMENT SETUP
6.1
Input Supply
Pack+/– (JP2) is the main source input to the PMIC. See Table 8 for minimum and maximum levels that
can be applied to this pin; use JP12 for ground.
Table 8. VBAT Minimum and Maximum Levels
PACK
Minimum (V)
Typical (V)
Maximum (V)
2.7
3.8
5.5
1. Connect the power supply V+ to JP2 (1) and V– to JP2 (2).
2. Connect the USB cable to J8 and the other end to the PC.
3. Connect power supply GND to JP12.
6.2
Basic Jumper Setting
Ensure that the following jumper settings are done so the setup functions as expected.
Table 9 and Table 10 list the input jumper settings.
Table 9. Input Jumper Settings
Jumper ID
Device Input Pin
Use
JP6(2-3)
BOOT0
Boot mode selector
JP7(2-3)
BOOT1
Boot mode selector
JP8(2-3)
BOOT2
Boot mode selector
JP79-2)
VBACKUP
JP5(1-2)
GPADC1
Backup battery to the device
General-purpose ADC for temperature
monitoring
Table 10. Input Jumper Settings
14
Jumper ID
Label
J6(1-3)
SMPS4
J2(9-10)
CHRG_DET_N
J3(3-4)
ADIN0
J3(5-6)
ADCIN1
TWL6032 Evaluation Module (EVM) User’s Guide
Copyright © 2012, Texas Instruments Incorporated
Use
VIO follow SMPS4
CHRG_DET_N connected LDO USB to
pull it high
ADCIN connected to ground
ADIN connected to resistor for
temperature simulations
SWCU105 – October 2012
EQUIPMENT SETUP
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6.3
Load
The load test for DC-DC is performed on one SMPS at a time is:
1. 1. Set the load in 4-W mode.
2. Connect the electronic load to the DC-DC outputs at J12 for SMPS2 through SMPS5, as shown in
Table 11.
Table 11. Electronic Load Connections
SMPS
F+
F–
S+
S–
SMPS2
J12(6)
J12(4)
J12(5)
J12(3)
SMPS3
J12(8)
J12(4)
J12(7)
J12(3)
SMPS4
J12(10)
J12(4)
J12(9)
J12(3)
SMPS5
J12(12)
J12(4)
J12(11)
J12(3)
3. Connect the electronic load to the DCDC outputs at J13 for SMPS1.
Table 12. Electronic Load Connections
SMPS
F+
F–
S+
S–
SMPS1
J9(1)
J9(3)
J9(2)
J9(4)
4. Special attention must be taken of the force and the sense connections marked on the J9. SMPS 1
can load up to 5 A.
6.4
Meter
A voltmeter is used to measure input and output voltages.
6.5
Recommended Wire Gauge
To reduce voltage drop and improve the accuracy of loads and measurements, use a minimum
connection wire of 22 AWG.
6.6
Install GUI
The GUI accompanying this device is simple and runs on a Windows PC. Ensure that your machine
supports Microsoft .NET Framework 3.5.
6.6.1
Installation Instructions
To install the GUI perform the following steps:
1. Unzip the installable file, SWCC013.zip.
2. Create a new folder or unzip it into any appropriate windows folder. By default, the GUI is installed in
C:\Program Files\Texas Instruments\TWL6032EVM.
3. Open the GUI by clicking the Setup.exe icon in the folder created in Step 2. The GUI can also be
opened by clicking:
Start → All Programs → Texas Instruments → TWL6032
Two files are generated: MSP Firmware upgrade utility and TWL6032 EVM
6.6.2
GUI Files
The GUI software consists of the following files:
• .dll
• .exe
• .xml
The .xml file is the main file that contains all the device registers. The registers in this file are categorized
in blocks according to the functions. The .xml file also specifies the slave I2C address for the device.
SWCU105 – October 2012
TWL6032 Evaluation Module (EVM) User’s Guide
Copyright © 2012, Texas Instruments Incorporated
15
EQUIPMENT SETUP
6.6.3
www.ti.com
GUI Description
The GUI windows are divided into the following sections:
6.6.3.1
Register
Following are the blocks seen on the GUI on the left side pane under Register.
1. POWER
2. AUX
3. SMART_REFLEX
4. TEST
5. TRIM
6. DEBUG
7. BQ_24156_USER
Figure 4 shows a sample snapshot of the Registers panel in the GUI.
Each block can be selected independently so that it appears on the main GUI window. Each register
instance appears in a separate block.
The user can write to the registers through the I2C bus. Each bit in the 8-bit register can be written
independently or the complete register can be written using 8-bit hexadecimal value in the Value field.
Individual bits can be toggled by selecting the drop-down menu or by double-clicking the field.
SWCU105-002
Figure 4. GUI Snapshot – Register
16
TWL6032 Evaluation Module (EVM) User’s Guide
Copyright © 2012, Texas Instruments Incorporated
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EQUIPMENT SETUP
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6.6.3.2
DUT Control
The DUT control panel is used to control the static on a few pins on the device; for example, PREQ1,
PREQ2, PREQ3, and so forth.
Figure 5 shows a sample snapshot of the DUT_Control panel in the GUI.
SWCU105-003
Figure 5. GUI Snapshot – DUT Control
SWCU105 – October 2012
TWL6032 Evaluation Module (EVM) User’s Guide
Copyright © 2012, Texas Instruments Incorporated
17
EQUIPMENT SETUP
6.6.3.3
www.ti.com
BCI
The BCI panel is used to control the battery charging interface automatically. The BCI panel has a
different dropdown to change the charging voltage, charging current, VBUS current, and termination
current. There is a provision to read the status, faults, and interrupts from this control panel.
Figure 6 shows a sample snapshot of the BCI panel in the GUI.
SWCU105-004
Figure 6. GUI Snapshot – BCI
18
TWL6032 Evaluation Module (EVM) User’s Guide
Copyright © 2012, Texas Instruments Incorporated
SWCU105 – October 2012
Test Procedure
www.ti.com
7
Test Procedure
7.1
EVM Wakeup
For the first time, the MSP430 firmware must be flashed as follows:
1. Set jumper configuration as described in Table 1 and Table 2.
2. Plug the USB cable into the PC to flash the MSP430 on the board.
3. Load the MSP flash tool on the PC.
4. Click on MSP430 firmware upgrade utility.
5. Click the Next button.
6. Plug the USB cable into the connector on the board.
(a) Press the browse button then select USB2ANY and hit open
(b) The Upgrade button should be highlighted
7. Press the Upgrade button.
8. Wait for the MSP430 to be flashed.
9. Close the tool, then disconnect and reconnect the USB cable. The LED should blink three times then
stay on.
10. If a voltage source is used instead of a battery, the source must be able to sink some current.
7.2
Set Input Voltage
With the input supply off or disconnected from the unit under test, adjust the input voltage to 3.8 V. For the
supply connections, see Section 6.1, Input Supply. Ensure that the input power supply current limit is set
at 2 A.
CAUTION
Do not exceed an input voltage of 5.5 V at any time during the testing of the
UUT.
7.3
Enable DUT
With the power supply connected to the input pins, turn on the power supply.
To power up the UUT, press the POWERON pin for 1 second. Check the following power outputs on the
EVM to check if the UUT powered on properly.
Table 13. Expected Voltages
Power Domain
TP
Expected Voltage Range (V)
REGEN1
J7-6
3.77 V to 3.83 V
REGEN2
J7-8
3.77 V to 3.83 V
SMPS4
J12-9
1.75 V to 1.83 V
SYSEN
J7-12
1.77 V to 1.83 V
SMSP3
J12-7
1.220 V to 1.230 V
LDO6
J11-11
1.77 V to 1.83 V
SMPS2
J12-5
0.955 V to 0.969 V
SMPS1
J9-2
0.955 V to 0.969 V
SMPS5
J12-11
0.955 V to 0.969 V
LDOLN
J1-3
1.77 V to 1.83 V
LDO2
J11-3
2.75 V to 2.85 V
NRESPWRON
J7-4
1.77 V to 1.83 V
SWCU105 – October 2012
TWL6032 Evaluation Module (EVM) User’s Guide
Copyright © 2012, Texas Instruments Incorporated
19
EQUIPMENT SHUTDOWN
7.4
www.ti.com
Power Consumption Test
When the device is powered on, the supply should show the power consumption in the range of 750 µA to
1.2 mA.
7.5
32-kHz Clock Test
Probe TP20 to check the clock. This should measure a 32-kHz clock.
7.6
Load Test
Turn on the electronic loads (see Section 6.3, Load). When the DC-DCs (VDD1, VDD2, and VIO) are
loaded, they should regulate at the same voltage as shown in Table 13.
7.7
Test Complete
Turn off the power supply and remove all connections from the UUT.
7.8
Final Jumper Connections
Leave the jumper connections as done above for the test setup.
7.9
7.9.1
Load Test
GUI Test
Connecting the GUI to the EVM:
If the board is powered on, turn it off. Turn on the EVM supply and power on the board and open the GUI.
The GUI can be controlled from a PC or laptop. The cable is connected between the PC or laptop USB
slot and connector J8 on the TWL6032 EVM.
Once the GUI is connected to the EVM, the device registers can be written. In the Registers section of the
GUI, scroll down to the SMPSx_CFG_FORCE register. Write the values listed in Table 14 to the registers.
Table 14. SMPS Register Values
Register Name
Hex Values To Be Written
Value
SMPS2_CFG_FORCE
0x33
1.35 V
SMPS1_CFG_FORCE
0x3C
1.8 V
SMPS5_CFG_FORCE
0x01
0.7 V
Measure the SMPS outputs at the jumpers listed in Table 15.
Table 15. SMPS Jumper Measurements
8
Register Name
Jumper
Value (V) (No Load Needed)
SMPS2_CFG_FORCE
J12-5
1.3 V to 1.4 V
SMPS1_CFG_FORCE
J2-9
1.75 V to 1.85 V
SMPS5_CFG_FORCE
J12-11
0.65 V to 0.75 V
EQUIPMENT SHUTDOWN
No special shutdown procedures are required.
20
TWL6032 Evaluation Module (EVM) User’s Guide
Copyright © 2012, Texas Instruments Incorporated
SWCU105 – October 2012
EVM Assembly Drawings and Layout
www.ti.com
9
EVM Assembly Drawings and Layout
Figure 7 through Figure 15 show the design of the TWL6032 EVM printed circuit board.
Figure 7. TWL6032 EVM Component Placement With Silkscreen Labels
SWCU105 – October 2012
TWL6032 Evaluation Module (EVM) User’s Guide
Copyright © 2012, Texas Instruments Incorporated
21
EVM Assembly Drawings and Layout
www.ti.com
Figure 8. TWL6032 EVM Internal Layer (L1)
Figure 9. TWL6032 EVM Internal Layer (L2)
22
TWL6032 Evaluation Module (EVM) User’s Guide
Copyright © 2012, Texas Instruments Incorporated
SWCU105 – October 2012
EVM Assembly Drawings and Layout
www.ti.com
Figure 10. TWL6032 EVM Internal Layer (L3)
Figure 11. TWL6032 EVM Internal Layer (L4)
SWCU105 – October 2012
TWL6032 Evaluation Module (EVM) User’s Guide
Copyright © 2012, Texas Instruments Incorporated
23
EVM Assembly Drawings and Layout
www.ti.com
Figure 12. TWL6032 EVM Internal Layer (L5)
Figure 13. TWL6032 EVM Internal Layer (L6)
24
TWL6032 Evaluation Module (EVM) User’s Guide
Copyright © 2012, Texas Instruments Incorporated
SWCU105 – October 2012
EVM Assembly Drawings and Layout
www.ti.com
Figure 14. TWL6032 EVM Internal Layer (L7)
Figure 15. TWL6032 EVM Internal Layer (L8)
SWCU105 – October 2012
TWL6032 Evaluation Module (EVM) User’s Guide
Copyright © 2012, Texas Instruments Incorporated
25
List of Materials
10
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List of Materials
TWL6032 EVM Bill of Materials lists the EVM components as configured according to the schematic shown in Figure 1.
TWL6032 EVM Bill of Materials
Count
Reference
Designator
Value
Description
Size
Part Number
Manufacturer
1
C1
47uF
CAP, CER, 10V, X5R, 20%
1210
GRM32ER61A476ME20
MURATA
2
C12, C13
12pF
CAP,CER,50V,COG,2%
0402
GRM1555C1H120GA01D
MURATA
2
C16, C23
4.7uF
CAP, CER, 16V, X5R, 20%
0603
STD
STD
5
C17, C36, C41, C42,
C43
10uF
CAP,CER,6.3V,X5R,20%
0603
C1608X5R0J106M
MURATA
1
C2
4.7nF
CAP, CER, 50V, X7R, 10%
0402
GRM155R71H472KA01D
MURATA
1
C28
1.0uF
CAP, CER, 16V, X7R, 10%
0603
C1608X7R1C105K
TDK
24
C3, C5, C6, C7, C8,
C10, C11, C14, C21,
C22, C24, C25, C26,
C27, C29, C30, C32,
C44, C45, C46, C47,
C48, C49, C50
2.2uF
CAP,CER,6.3V,X5R,20%
0402
GRM155R60J225ME15D
MURATA
1
C31
0.08 F
CAP, DOUBLE LAYER ELEC, 3.3V
4.8 mm Dia.
XH414HGII06E
SII Micro
2
C33, C38
22uF
CAP, CER, 6.3V,X5R, 20%
0805
GRM21BR60J226ME39
MURATA
1
C34
4.7uF
CAP, CER, 6.3V, X5R, 10%
0603
GRM188R60J475KE19D
MURATA
4
C35, C37, C39, C40
4.7uF
CAP, CER, 6.3V, X5R, 20%
0402
GRM155R60J475ME87
MURATA
6
C4, C15, C18, C19,
C20, C51
100nF
CAP,CER,6.3V,X5R,10%
0402
GRM155R60J104KA01D
MURATA
5
C52, C54, C62, C63,
C64
100nF
CAP, CER, 50V, X7R, 10%
0603
C0603C104K5RAC
KEMET
2
C53, C55
4.7uF
CAP, CER, 16V, X5R, 10%
0805
C0805C475K4PAC
KEMET
2
C56, C57
22pF
CAP, CER, 50V, NP0, 5%
0603
C0603C220J5GACTU
KEMET
1
C58
1nF
CAP,CER,50V,X7R,10%
0402
GRM155R71H102KA01D
MURATA
2
C59, C60
100pF
CAP,CER,50V,NP0,5%
0402
GRM1555C1H101JD01D
MURATA
1
C61
100nF
CAP,CER, 50V , X7R , 10%
0402
C1005X7R1H104K
KEMET
1
C65
470nF
CAP, CER, X5R, 6.3V, 10%
0402
04026D474KAT2A
ARROW
0
C9
2.2uF
CAP,CER,6.3V,X5R,20%
0402
GRM155R60J225ME15D
MURATA
5
D1, D2, D3, D4, D5
HSMR-CL25
Diode. LED Blue, 5V, 10mA
0603
HSMR-CL25
Avago
1
D6
Yellow_LYT67KK2M1-26-Z
Diode. LED Hyper-Bright Low Current,
yellow, 12V, 20mA
PLCC-2
LYT67K-K2M1-26-Z
Osram
7
J1, J2, J3, J5, J7,
J11, J12
PEC06DAAN
Header, Male 2x6 pin, 100mil spacing
0.100 inch x
2X6
PEC06DAAN
Sullins
1
J4
ZX62-AB-5PA
Connector, USB Micro B, 5-pins, SMT
6x8 mm
ZX62-AB-5PA
Hirose
26
TWL6032 Evaluation Module (EVM) User’s Guide
SWCU105 – October 2012
Copyright © 2012, Texas Instruments Incorporated
List of Materials
www.ti.com
TWL6032 EVM Bill of Materials (continued)
Count
Reference
Designator
Value
Description
Size
Part Number
Manufacturer
3
J6, J10, J13
PEC02DAAN
Header, 2x2-pin, 100mil spacing
0.20 x 0.20
inch
PEC02DAAN
Sullins
1
J8
067068-9000
Connector, USB Upstream (Type B)
0.47 x 0.67
inch
067068-9000
Molex
1
J9
ED555/4DS
Connector, Male 4 Pole3.5 mm, 6A, 150V
6.5x14 mm
ED555/4DS
On Shore Tech
4
JP1, JP2, JP3, JP4
MKDS3/2
Header, Side Entry 2-pin, 5mm spacing,
0.441 x 0.200 MKDS3/2
inch
Phoenix Contact
1
JP12
S1731-46R
Jumper, Power SMT
2.3x12.3 mm
S1731-46R
Harwin
4
JP5, JP9, JP10,
JP11
PEC02SAAN
Header, Male 2-pin, 100mil spacing,
0.100 inch x
2
PEC02SAAN
Sullins
3
JP6, JP7, JP8
PEC03SAAN
Header, Male 3-pin, 100mil spacing,
0.100 inch x
3
PEC03SAAN
Sullins
2
L1, L4
1 uH
Inductor, Chip Coils, LQM32PN1R0
1210
LQM32PN1R0
muRata
3
L2, L5, L6
1 uH
Inductor, Chip Coils, LQM2MPN1R0NG0L
806
QM2MPN1R0NG0L
muRata
1
L3
1 uH
Inductor, Power, XFL4020-102MEB
0.157 x 0.157 XFL4020-102MEB
inch
Coilcraft
1
Q1
CSD25201W15
MOSFET, PChan, -20V, 4A, 50 mOhm
CSP
1.5x1.5mm
CSD25201W15
Texas Instruments
0
Q2
CSD25201W15
MOSFET, PChan, -20V, 4A, 50 mOhm
CSP
1.5x1.5mm
CSD25201W15
Texas Instruments
3
Q3, Q4, Q5
Si1912EDH
MOSFET, Dual Nch, 20V, 1.28A, 280 mOhm SOT-363
Si1912EDH-T1-E3
Vishay
2
Q6, Q7
BSS138
MOSFET, Nch, 50V, 0.22A, 3.5 Ohm
SOT23
BSS138
Fairchild
1
R1
20mohm
RES, 0.5W, 1%
1206
LRC-LRF1206LF-01-R020-F
IRCTT
1
R10
510K
RES, 0.0625W, 1%
0402
STD
STD
2
R11, R15
0ohm
RESISTOR,SMT,5%,1/4W
1206
ERJ-8GEY0R00V
PANASONIC
0
R16
100K
RES, 0.0625W, 1%
0402
0402WGF1003TCE
Multicomp
2
R18, R22
2.2K
RES, 0.0625W, 1%
0402
STD
STD
0
R2
0ohm_0.5W Not
Mount
Resistor, 0.5 watt
1206
1
R28
120K
RES,0.0625W, 1%
0402
STD
STD
8
R29, R30, R31, R32,
R33, R34, R35, R36
1.5K
RESISTOR,SMT,0.1%,1/16W
0402
PCF0402-R-1K5-B-T1
Multicomp
1
R3
47K
THERMISTOR, NTC, 1%
0402
ERTJ0EP473F
PANASONIC
16
R4, R5, R6, R7, R12, 0ohm
R13, R14, R17, R19,
R20, R21, R23, R24,
R25, R26, R27
Resistor, Chip, 1/16W
0402
CRG0402ZR
TYCO
SWCU105 – October 2012
TWL6032 Evaluation Module (EVM) User’s Guide
Copyright © 2012, Texas Instruments Incorporated
27
List of Materials
www.ti.com
TWL6032 EVM Bill of Materials (continued)
Count
Reference
Designator
Value
Description
Size
Part Number
Manufacturer
1
R8
121K
RESISTOR,1%,1/16W
0402
ERJ-2RKF1213X
Multicomp
1
R9
44.2K
RESISTOR,1%,1/16W
0402
ERJ-2RKF4422X
Multicomp
1
S1
KSR221GLFS
Switch, SMT Subminiature Tact , 50v, 50mA 3.8x7.15 mm
Max.
KSR221GLFS
ITT
21
TP1, TP2, TP3, TP4,
TP5, TP6, TP7, TP8,
TP9, TP10, TP11,
TP12, TP13, TP14,
TP15, TP16, TP17,
TP18, TP19, TP20,
TP21
PEC01SAAN
Through Hole, O.040 Dia
PEC01SAAN
Sullins
1
U1
TWL6032YFF
IC, Power Management With Power Path
and Battery Charge
uBGA
TWL6032A2B4YFF
Texas Instruments
1
U2
RCLAMP1654P
IC, Low Capacitance TVS Array
QFN
RCLAMP1654P
Semtech
1
U3
SN74AUC1G04DCK
IC, Single Inverter
DCK-5
SN74AUC1G04DCK
TI
1
U4
MSP430F5529IPN
IC, Mixed Signal Microcontroller
TQFP-80
MSP430F5529IPN
Texas Instruments
1
VR1
TPS76333DBV
IC, Micro-Power 150 mA LDO Regulator
SOT23-5
TPS76333DBV
TI
1
VR2
TPS76318DBV
IC, Micro-Power 150 mA LDO Regulator
SOT23-5
TPS76318DBV
TI
2
VR3, VR4
SN74AVC4T245PW
IC, 4-BIT DUAL-SUPPLY BUS
TRANSCEIVER
TSSOP
SN74AVC4T245PW
TI
1
Y1
32.768 KHz
Crystal, SMT Ceramic , 12.5pF, +/-20ppm
1.8x4.9 mm
CM519-32.768KDZF-UT
Citizen
1
Y2
24 MHz
Crystal, SMT Ceramic , 18pF, +/- 30ppm
3.7x12.7 mm
24.000MHZ 49USMX/30/50/40/18PF
EuroQuartz
Keystone Ref 2203 (
L= 12.7 mm)
Diameter = 6.4mm
4-40 Threaded Standoffs - .250 [6.4] O.D
Brass Zinc Plate
2203
Keystone
6
WASHER FLAT #4 .120X.250" NYLON
3348
Keystone
6
Screw 4-40 thread, .250
NY PMS 440 0025 PH
Richco plastic
1
PCB
PWR122
ANY
6
2
--
Shunt, 100-mil, Black
0.100
929950-00
3M
1
--
Label (See note 5)
1.25 x 0.25
inch
THT-13-457-10
Brady
28
TWL6032 Evaluation Module (EVM) User’s Guide
SWCU105 – October 2012
Copyright © 2012, Texas Instruments Incorporated
List of Materials
www.ti.com
NOTE:
•
•
•
•
These assemblies are ESD sensitive. ESD precautions must be observed.
These assemblies must be clean and free from flux and all contaminants. Use of contaminated flux is not acceptable.
These assemblies must comply with workmanship standards IPC-A-610 Class 2. Reference designators marked with an asterisk (**)
cannot be substituted. All other
components can be substituted with equivalent manufacturer's components.
SWCU105 – October 2012
TWL6032 Evaluation Module (EVM) User’s Guide
Copyright © 2012, Texas Instruments Incorporated
29
Revision History
11
www.ti.com
Revision History
Note: Numbering may vary from previous versions.
(1)
30
Version
Literature Number
Date
*
SWCU105
October 2012
Notes
See
(1)
SWCU105 - initial release.
TWL6032 Evaluation Module (EVM) User’s Guide
Copyright © 2012, Texas Instruments Incorporated
SWCU105 – October 2012
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