J-Series High PDE and Timing Resolution, TSV Package
DATASHEET
High PDE and Timing Resolution SiPM Sensors in a TSV Package
SensL’s J-Series low-light sensors feature an industry-leading low dark-count rate and
a high PDE (photon detection efficiency) that extends much further into the blue part of
the electromagnetic spectrum, using a high-volume, P-on-N silicon foundry process.
The J-Series sensors incorporate major improvements in the transit time spread which
results in a significant improvement in the timing performance of the sensor. J-Series
sensors are available in two sizes (3mm and 6mm) and use a TSV (Through Silicon
Via) process to create a CSP (Chip Scale Package) with minimal deadspace, that is
compatible with industry standard lead-free, reflow soldering processes.
The J-Series Silicon Photomultipliers (SiPM) form a range of high gain, single-photon
sensitive, UV to visible light sensors. They have high performance combined with
the practical advantages of solid-state technology: low operating voltage, excellent
temperature stability, robustness, compactness, output uniformity, and low cost. For
more information on the J-Series sensors please refer to the website, www.sensl.com.
PERFORMANCE PARAMETERS
Sensor
Size
Microcell Size
3mm
20mm, 35mm
6mm
35mm
3mm
20mm, 35mm
6mm
35mm
3mm
20mm, 35mm
6mm
35mm
3mm
20mm, 35mm
6mm
35mm
Parameter 1
Min.
Typical
Max.
Units
Breakdown Voltage (Vbr) 2
24.25
24.5
24.75
V
Recommended Overvoltage
Range (Voltage above Vbr)
1
6
V
Spectral Range 3
200
900
nm
Peak PDE Wavelength (lp)
20mm
3mm
35mm
6mm
Vbr + 2.5V
35mm
20mm
PDE 4
35mm
20mm
3mm
35mm
6mm
35mm
Vbr + 6.0V
Dark Count Rate 5
420
nm
31
%
38
%
42
%
51
%
Vbr + 2.5V
38
%
Vbr + 6.0V
51
%
45
75
kHz/mm2
45
75
kHz/mm2
80
157
kHz/mm2
80
157
kHz/mm2
Vbr + 2.5V
45
75
kHz/mm2
Vbr + 5.0V
80
157
kHz/mm2
Vbr + 2.5V
35mm
20mm
Overvoltage
Vbr + 5.0V
1
All measurements made at 5.0V overvoltage and 21°C unless otherwise stated.
The breakdown voltage (Vbr) is defined as the value of the voltage intercept of a straight line fit to a plot of √I vs V, where I is the current and V is the overvoltage.
3
The range where PDE >2.5% at Vbr + 5.0V.
4
PDE does not contain afterpulsing or crosstalk.
5
Dark count rate is derived from dark current data.
2
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J-Series High PDE and Timing Resolution, TSV Package
DATASHEET
PERFORMANCE PARAMETERS (CONTINUED)
Sensor
Size
Microcell Size
Parameter
20mm
3mm
35mm
6mm
Gain
(anode-cathode)
35mm
20mm
3mm
35mm
20mm
35mm
6mm
3mm
20mm, 35mm
35mm
3mm
6mm
3mm
6mm
3mm
6mm
3mm
6mm
Dark Current
35mm
6mm
20mm
35mm
20mm
35mm
3mm
Max.
Units
9.1x105
2.8x106
1.7x106
5.3x106
2.8x106
Vbr + 5.0V
5.3x106
Vbr + 2.5V
0.2
0.3
mA
Vbr + 5.0V
1.1
1.6
mA
Vbr + 2.5V
0.9
1.3
mA
Vbr + 5.0V
4.1
5.8
mA
Microcell recharge time
constant 7
Capacitance 8
(anode output)
Typical
Vbr + 2.5V
35mm
Vbr + 2.5V
100
ps
300
ps
12
ns
37
ns
48
ns
TBD
pF
1000
pF
35mm
4000
pF
20mm
TBD
pF
50
pF
35mm
200
pF
20mm
1.4
ns
1.4
ns
3.0
ns
5
%
7
%
10
%
35mm
35mm
Capacitance 8
(fast terminal)
Vbr + 2.5V
Fast output pulse width
(FWHM)
35mm
Vbr + 2.5V
35mm
20mm
35mm
6mm
Vbr + 5.0V
Rise time 6 anode-cathode output
20mm
3mm
Min.
Vbr + 2.5V
35mm
20mm
Overvoltage
Crosstalk
Vbr + 2.5V
35mm
20mm, 35mm
20mm, 35mm
6mm
35mm
3mm
20mm, 35mm
6mm
35mm
Vbr + 5.0V
Afterpulsing
22
%
7
%
Vbr + 5.0V
22
%
Vbr + 2.5V
0.1
%
Vbr + 5.0V
1.0
%
Vbr + 2.5V
0.1
%
Vbr + 5.0V
1.0
%
<21.5
mV/oC
Temperature dependence of
Vbr 9
6
Measured as time to go from 10% to 90% of the peak amplitude and measured over a 1W series output resistor.
RC charging time constant of the microcell (t)
8
Capacitance values are for the complete TSV package.
9
Calculated as the change in Vbr extracted from pulsed laser gain measurements.
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J-Series High PDE and Timing Resolution, TSV Package
DATASHEET
GENERAL PARAMETERS
3mm
6mm
30020, 30035
Active area
60035
3.07 x 3.07 mm
6.07 x 6.07 mm2
No. of microcells
30020: 14,850
30035: 5,676
60035: 22,292
Microcell fill factor
30020: 62%
30035: 75%
60035: 75%
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TSV Package Specifics
Package dimensions
3mm
6mm
30020, 30035
60035
3.16 x 3.16 mm2
6.13 x 6.13 mm2
Recommended operating temperature range
-40oC - +85oC
Soldering conditions
Reflow solder
Cover material
Glass
Cover refractive Index
Moisture sensitivity level
Maximum Current
1.53 @ 436nm
Tape & reel
MSL3 *
Cut tape
MSL4 *
10mA
15mA
6mm TSV-packaged J-Series sensor
* Please refer to the TSV Handling and Soldering guide for more information on MSL for different delivery options.
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J-Series High PDE and Timing Resolution, TSV Package
DATASHEET
PERFORMANCE PLOTS
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J-Series High PDE and Timing Resolution, TSV Package
DATASHEET
EVALUATION BOARD OPTIONS
SMA BIASING BOARD (MicroFJ-SMA-XXXXX)
The MicroFJ-SMA is a printed circuit board (PCB) that can facilitate
the evaluation of the J-Series sensors. The board has three female
SMA connectors for connecting the bias voltage, the standard output
from the anode and the fast output signal. The output signals can
be connected directly to a 50W-terminated oscilloscope for viewing.
The biasing and output signal tracks are laid out in such a way as to
preserve the fast timing characteristics of the sensor.
The MicroFJ-SMA is recommended for users who require a plugand-play set-up to quickly evaluate J-Series TSV sensors with
optimum timing performance. The board also allows the standard
output from the anode to be observed at the same time as the fast
output. The outputs can be connected directly to the oscilloscope or
measurement device, but external preamplification may be required
to boost the signal. The table below lists the SMA board connections.
The SMA board electrical schematics are available to download in
the TSV Board Reference Design document.
MicroFJ-SMA-XXXXX
Output
Function
Vbias
positive bias input (cathode)
Fout
fast output
Sout
standard output (anode)
PIN ADAPTER (MicroFJ-SMTPA-XXXXX)
The TSV Pin Adapter board (SMTPA) is a small PCB board that houses the TSV sensor and has through-hole pins to allow its use with
standard sockets or probe clips. This product is useful for those needing a quick way to evaluate the TSV package without the need for
specialist surface-mount soldering. While this is a ‘quick fix’ suitable for many evaluations, it should be noted that the timing performance
from this board will not be optimized and if the best possible timing performance is required, the MicroFJ-SMA-XXXXX is recommended.
The SMTPA circuit schematic is shown below. Please consult the J-Series User Manual for further information on biasing. The SMTPA board
electrical schematics are available to download in the TSV Board Reference Design document.
SMTPA circuit schematic
MicroFJ-SMTPA-XXXXX
Top view of the SMTPA board showing
the pin numbering
SensL © 2015
Pin No.
Connection
1
anode
2
fast output
3
cathode
4
ground
5
no connect
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J-Series High PDE and Timing Resolution, TSV Package
DATASHEET
CIRCUIT SCHEMATICS
An SIPM is formed of a large number (hundreds or thousands) of microcells. Each microcell (Figure 1) is an avalanche photodiode with its
own quench resistor and a capactively coupled fast output. These microcells are arranged in a close-packed array with all of the like terminals
(e.g. all of the anodes) summed together (Figure 2). The array of microcells can thus be considered as a single photodiode sensor with three
terminals: anode, cathode and fast output, as shown in Figure 3.
Figure 1, Circuit schematic of the SensL SiPM
microcell, showing details of the Fast Output.
Figure 2, Simplified circuit schematic of the SensL SiPM showing
only a 12 microcell example. Typically, SiPM sensors have hundreds
or thousands of microcells.
Figure 3, SensL SiPM component symbol.
TILING OF THE TSV PACKAGE
For the J-Series, SensL has developed a market-leading, high-performance package using a TSV process. It is a chip-scale package that is
compatible with lead-free, reflow soldering processes. The glass cover is ideal for coupling to scintillators or fibre optic elements.
The dead-space between the sensor active area and the edge of the package has been minimized, resulting in a package that can be tiled
on 4 sides with high fill-factor. This allows multiple sensors to be configured into unique layouts for a wide range of custom applications. The
distance between sensor packages can be as little as 200um when tiled, but actual alignment and placement tolerances will depend on the
accuracy of the user’s assembly process. A Technical Note is available that gives advice on creating arrays of the TSV sensors.
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J-Series High PDE and Timing Resolution, TSV Package
DATASHEET
PACKAGE DRAWINGS (All Dimensions in mm)
MicroFJ-300XX-TSV-A1
TOP VIEW
BOTTOM VIEW
Pin Assignments
Pin #
SIDE VIEW
MicroFJ-300XX-TSV
B1
Anode
B3
Fast Output
A1, C3
Cathode
All others
No Connect *
* The ‘No Connect’ pins are electrically isolated and should be soldered to a ground (or bias) plane to help with heat dissipation.
The complete MicroFJ-300XX-TSV-A1 CAD and solder footprint file is available to download here.
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J-Series High PDE and Timing Resolution, TSV Package
DATASHEET
PACKAGE DRAWINGS (All Dimensions in mm)
MicroFJ-60035-TSV-A1
TOP VIEW
BOTTOM VIEW
Pin Assignments
Pin #
MicroFJ-60035-TSV
C1, D1
Anode
A1, F6
Cathode
C6, D6
Fast Output
All others
No Connect
SIDE VIEW
* The ‘No Connect’ pins are electrically isolated and should be soldered to a ground (or bias) plane to help with heat dissipation.
The complete MicroFJ-60035-TSV CAD and solder footprint file is available to download here.
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J-Series High PDE and Timing Resolution, TSV Package
DATASHEET
MicroFJ-SMA-60035 Board
TOP VIEW
BOTTOM VIEW
SIDE VIEW
The complete CAD for the SMA boards can be downloaded from the website: 3mm version and 6mm version.
MicroFJ-SMTPA-60035 Board
TOP VIEW
SIDE VIEW
BOTTOM VIEW
The complete CAD for the SMTPA boards can be downloaded from the website: 3mm version and 6mm version.
SensL © 2015
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J-Series High PDE and Timing Resolution, TSV Package
DATASHEET
ORDERING INFORMATION
Product Code
Microcell size
(number of
microcells)
Sensor active area
Delivery options b
Description
3mm sensors
MicroFJ-30020-TSV a
MicroFJ-SMA-30020 a
20µm
(14,850)
MicroFJ-SMTPA-30020 a
3.07mm x 3.07mm
MicroFJ-30035-TSV
MicroFJ-SMA-30035
35µm
(5,676)
MicroFJ-SMTPA-30035
4-side tileable, chip scale package with
through-silicon vias (TSV)
WP d, TA, TR c
TSV sensor mounted onto a PCB with three
SMA connectors for bias, standard output and
fast output.
PK
TSV sensor mounted onto a pin adapter board
PK
4-side tileable, chip scale package with
through-silicon vias (TSV)
WP d, TA, TR c
TSV sensor mounted onto a PCB with three
SMA connectors for bias, standard output and
fast output.
PK
TSV sensor mounted onto a pin adapter board
PK
4-side tileable, chip scale package with
through-silicon vias (TSV)
GP, TA, TR c
TSV sensor mounted onto a PCB with three
SMA connectors for bias, standard output and
fast output.
PK
TSV sensor mounted onto a pin adapter board
PK
6mm sensors
MicroFJ-60035-TSV
MicroFJ-SMA-60035
MicroFJ-SMTPA-60035
35µm
(22,292)
6.07mm x 6.07mm
a
Check with SensL sales for availability.
The two-letter delivery option code should be appended to the order number, e.g.) to receive a MicroFJ-60035-TSV in a Gel Pack, use
MicroFJ-60035-TSV-GP. The codes are as follows:
PK = ESD Package
GP = Gel Pack
WP = Waffle Pack d
TA
= Tape
TR = Tape and Reel c
b
c
The TR (Tape and Reel) delivery option has a minimum order quantity (MOQ) of 3000, and is available in multiples thereof.
d
WP and GP options only available for small quantity orders, please discuss with SensL sales.
www.sensl.com
sales@sensl.com
+353 21 240 7110 (International)
+1 650 641 3278 (North America)
All specifications are subject to change without notice
Rev. 2.2, Preliminary, May 2016
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