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1/4
Semiconductor Business Group
Industrial Devices Company
Panasonic Corporation
Design Guide for PCB Layout [Low-side Step-down Chopper Circuit for Standby Power Supply]
[Chopper Circuit Example]
LINE
Separate the pattern
into front and back
stages of Cout.
[Layout Example]
CIN
Vout
ZD
Input
+
Cout
+
+
Dout
+
Dout
Output
CIN
DIN
Rb
DIN
DR
Lout
NTRL
S S
PC
RETURN
D
DR
Separate the pattern
into front and back
stages of CIN.
Cout
Lout
ZD
S S
D
IPD
IPD
D :DRAIN
S :SOURCE
BP:BYPASS
FB:FB
BP S S FB
CBP
PC
Rb
BP S S FB
CBP
PC
[Attentions for PCB Layout]
No.
Attentions
Object
1
Design the patterns of the loop in which switching current flows when IPD is ON (red dotted line), and the loop in which
switching current flows when IPD is OFF (blue dotted line), as short and wide as possible to reduce impedance.
These loops are called as "power loop" hereafter.
Noise reduction
2
Separate the pattern of the front stage of CIN from the power loop.
Noise reduction
3
Allocate the AC line connected to the input filter away from the power loop.
Noise reduction
Surge withstand
4
Do not connect components for control (CBP, PC) to the power loop.
(When using MIP384, the capacitor between FB and S pins is included.)
Stability for control
5
Separate the Source pattern of the power loop from the Source pattern of the control circuit block.
Stability for control
6
Allocate control circuit pins and connected patterns away from the power loop.
Stability for control
7
Allocate the ceramic capacitor between BP and S pins as close to each pin as possible.
(When using MIP384, the capacitor between FB and S is included.)
Stability for control
Surge withstand
8
Do not connect ZD for output voltage detection to the power loop.
Stability for control
9
Separate the power loop from the output voltage line (stable), the back stage of Cout.
Stability for Output line
10
Allocate the Input block away from the Output block. (Allocate as the Input block, the power loop, the Output block are in line.)
Noise reduction
11
Take measures to prevent the noise generated at relays or lamps in AC line from affecting IPD.
Surge withstand
Design Guide for PCB Layout [Low-side Step-down Chopper Circuit for Standby Power Supply]
No. 注意点
2/4
Semiconductor Business Group
Industrial Devices Company
Panasonic Corporation
説明
Design the pattern of the power loop as short and wide as
possible.
Because high-frequency large current, which may cause noise, flows in the power loop, design the pattern as
short as possible to minimize the area inside the loop.
2
Separate the pattern of the front stage of CIN from the
power loop.
To prevent the noise generated at the power loop from propagating to the front stage of CIN, separate the
pattern into front and back stages of CIN. To flow all current flowing in the power loop into the input capacitor
and prevent the heat generated at IPD from propagating to the input capacitor, narrow the patterns of the
positive/negative junction of the input capacitor. It is also intended to prevent the surge current generated at
AC line from propagating to IPD by passing the input capacitor.
3
Allocate the AC line connected to the input filter away from
the power loop.
It is intended to prevent the noise generated at the power loop from propagating to the AC line connected to
the input filter directly and optimize the effect of X-capacitor and line filter, etc. It is also intended to prevent
the surge current generated at AC line from propagating to IPD.
4
Do not connect components for control (CBP, PC) to the
power loop.
(When using MIP384, the capacitor between FB and S pins
is included.)
Because large voltage fluctuation or high-frequency current is generated at the power loop, do not connect
components for control to the power loop for stable operation.
5
Separate Source pattern of the power loop from Source
pattern for IPD control circuit block.
Because the Source of the power loop is unstable, allocate the Source pattern of the power loop in the circuit,
which is different from the IPD control circuit, and each Source pattern are connected to each Source pin of
IPD. Do not connect components for control to the power loop.
6
Allocate control circuit pins (BP, FB) and connected
patterns away from the power loop.
(Be careful to the FB pin particularly.)
The power loop may be noise source due to the large voltage fluctuation or high-frequency current flowing.
Allocate control pins away from the power loop to avoid the effect of noise. In particular, as the FB pin is the
most important and sensitive to noise of control pins, design the pattern connected to FB pin not to be
affected by the noise.
7
Allocate the ceramic capacitor between BP and S pins as
close to each pin as possible.
Allocate the ceramic capacitor between BP and S pins as close to each pin as possible and do not connect it
to the power loop. This capacitor may affect not only stable operation but also surge withstand capability.
8
Do not connect ZD for output voltage detection to the power
loop.
Because large voltage fluctuation or high-frequency current is generated at the power loop, connect the
circuit for feedback or output voltage detection to the pattern of back stage of Cout.
9
Separate the power loop from the pattern of the back stage
of Cout.
To prevent the noise generated at the power loop from propagating to the back stage of Cout, separate the
pattern into the front and back stages of Cout. To flow all current flowing in the power loop into the output
capacitor, narrow the patterns of the positive/negative junction of the output capacitor.
10
Allocate the Input block away from the Output block.
(Allocate as the Input block, the power loop block, and the
Output block in line.)
Allocate the Input block away from the Output block to prevent the noise generated at AC line or the power
loop from propagating to the Output block.
11
Take measures to prevent the noise generated at relays or
lamps in AC line from affecting the IPD.
Take measures to prevent the noise generated at relays or lamps in AC line from propagating to IPD.
(e.g., Allocate IPD peripheral circuits away from the noise source or the channel of noise propagation, or
connect capacitors to the noise source, etc.)
1
Check List of PCB Layout [Low-side Step-down Chopper Circuit for Standby Power Supply]
No.
3/4
Semiconductor Business Group
Industrial Devices Company
Panasonic Corporation
Check Items
1
The pattern of the power loop is as short and wide as possible.
2
The pattern of the front stage of the input capacitor CIN is separated from the power loop.
3
AC line connected to the input filter is allocated away from the power loop.
4
Components for control (the capacitor between BP and S pins, Opto-isolators) are not connected to the power loop.
5
The Source pattern of the power loop is separated from the Source pattern of the control circuit.
6
Control circuit pins and connected patterns are allocated away from the power loop.
7
The ceramic capacitors between BP and S pins and FB and S pins are allocated close to each pin.
8
Components for output voltage detection (ZD, shunt regulators) are not connected to the power loop, but to the pattern of
the back stage of Cout.
9
The power loop is separated from the Output voltage line (stable), the back stage of Cout.
10
The Input block is allocated away from the Output block. (The Input block, the power loop block, and Output block are
allocated in line.)
11
PCB layout is designed to prevent the noise generated at relays or lamps in AC line from affecting IPD.
Check
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)
If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2)
The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3)
The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4)
The products and product specifications described in this book are subject to change without notice for modification and/or
improvement.
At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5)
When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6)
Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7)
This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
20100202
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