Texas Instruments
300mm Analog Success
Karen Erz
SEMICON West 2016
TI Information – Selective Disclosure
TI revenue by segment
2015 TI Revenue
$13.0B
Embedded Processing
($2.79B)
• Processors
• Microcontrollers
• Connectivity
•
•
•
•
•
Other ($1.9B)
DLP® products
Custom ASIC products
Calculators
Royalties
Legacy wireless products
TI Information – Selective Disclosure
•
•
•
•
Analog ($8.3B)
High Volume Analog & Logic
Power Management
High Performance Analog
Silicon Valley Analog
Worldwide manufacturing sites
Greenock
GFAB
150mm,
200mm
Freising
FFAB
So. Portland
MFAB
200mm
Texas
Dallas
DFAB
150mm,
200mm
DMOS5
200mm
SFAB
150mm
DHC
MEMS
200mm
200mm
Chengdu
CFAB
Miho
200mm
200mm
CDAT
Taipei
TITL
Aguascalientes
TMX
Kuala Lumpur
TIM
DMOS6
Melaka
TIEM
300mm
DBUMP
RFAB
300mm
TI Information – Selective Disclosure
Aizu
LEGEND
Wafer Fabs
Assembly / Test
Bump
Baguio City
TIPI
Pampanga
Clark
Bump
RFAB is the only fab
in the world that is
dedicated to
advanced analog
technology on
300mm wafers
Why 300mm Analog?
Because the right set of
300mm used tools were
available at the right
time = Opportunity
TI Information – Selective Disclosure
4
Expanding our footprint with 300mm Analog
RFAB
DMOS6
• Launched in 2009
• Launched in 2001
• 220K square feet of clean room space
• 190K square feet of clean room space
• 300mm Analog
• 300mm; supported wireless products
• Currently using 50% of capacity; room to grow
• Currently using 25% for Embedded Processing
• Next-gen Analog processes begin prototyping in 2016
• Qualified first 300mm Analog product in Nov. 2015
• Will support $5B of analog revenue
• Will support $3B in Analog revenue
• Together, these two fabs will support $8 billion of annual Analog revenue on 300mm wafers
• Majority of future Analog growth will occur on 300mm capacity
TI Information – Selective Disclosure
Strategic investments in wafer fab capacity
Acquired National
Semi adding 2 fabs
totaling $2.5B of
capacity
Acquired Qimonda
Dresden 300mm tools
launching RFAB
Phase 2
Acquired Qimonda
300mm equipment
enabling the
opening of RFAB
Acquired 2 wafer fabs
and equipment in Aizu,
Japan – 200/300mm
(Spansion)
Acquired Powerchip
300mm tools
Acquired 200mm
wafer fab and
equipment in Chengdu,
China
2009
2010
Announced plans to
expand 300mm
Analog wafer
manufacturing in
DMOS6
2011
2012
Qualified first
300mm Analog
device in
DMOS6
2013
RFAB qualifies its first
device, production begins
Opened RFAB, the
world’s first 300mm
analog factory
TI Information – Selective Disclosure
Announced transfer of
production from HFAB and
HIJI to more advanced TI fabs
2014
2015
2016
Announced plans to
transfer of
production from
GFAB to more
advanced TI fabs
RFAB Status, Visual Progress
10/13/09
0 Tools
TI Information – Selective Disclosure
12/15/09
100 tools
9/12
436 tools
First silicon processed 1/15/10
Today ~640 Tools installed, ~215 Tools in inventory
Building a stronger manufacturing advantage
• Unique manufacturing strategy ensures continuity of supply, supports growth
 Leverage 300mm capacity to support Analog growth
 Opportunistically acquire used manufacturing assets
• Low depreciation, better return on investment
 Wafer fab capacity purchased ahead of demand
• Reduced time to contribution
• Analog technology development delivers differentiated, proprietary processes
TI Information – Selective Disclosure
Building a stronger manufacturing advantage
DMOS6 startup (300mm)
DMOS4 200mm conversion
RFAB startup (300mm)
TI Information – Selective Disclosure
Note: TI Capex Goal = 4% of Revenue
Why does this model work for TI?
• Executive manufacturing management leadership
 Used tools should always be first option
• RFAB – 92% used tools
 Quick decisions / quick purchases
 Willingness to take risks
• Team effort – everyone bought into the vision of highest return on assets
 Engineering, Procurement, Logistics, Finance, Planning….
• 130nm is RFAB’s leading edge technology
 No need for latest and greatest
TI Information – Selective Disclosure
Challenges / Risks
• Engineers need to “make it work”
 No 300mm equivalent to copy 200mm Analog toolset
 Every tool won’t match (“need to have” vs. “nice to have”)
 No warranties
• Costs beyond tool purchase
 Reconfiguration
 Replacement of missing/broken parts
• OEM Involvement often required
 Installation/upgrades
• End of Life Tools
TI Information – Selective Disclosure
Change requires taking a leap of faith
 Trust in our leadership
 The entire TI team is making it work
TI Information – Selective Disclosure
Thank you!
TI Information – Selective Disclosure