PCB Manufacture Capabilities
PCB Manufacture Capabilities
Item
1
2
3
4
5
6
7
8
Arlon material model
Rogers material model
Rogers PP model
Taconic material model
Taconic pp model
High Tg material model
Halogen free material（High Tg）
Halogen free material(nomal Tg)
9
Impedance control board
10 PCB THICKNESS
11 FR-4 PREPREGS
12 Copper foil
13 Core with different copper foil on both side
14
15
16
17
18
19
Out layer with different copper foil on both side
Finished copper(18um based copper)
Finished copper(35um based copper)
Finished copper(70um based copper)
solder mask color
Legend color
20 Surface finishing
selective surface finishing
21
22 Peelable solder mask
Unit
Description or parameter
AD350,AR1000,25FR,33N,Diclad527
Ro4350,Ro4350B,Ro4003,Ro4003C,Ro3003,RT5880
Ro4403(0.10mm),Ro4450B(0.10mm),
RF-35,TLX-8,TLC-32
TP-32（0.10mm）
ShengYi Tg=170 (S1141 S1170)
Shengyi: S1165，PP:S0165
Others material Shengyi: S1155,PP:S0155
should inquiry FR-4,Halogen free FR-4,High TG FR-4,RO4000,25FR
firstly
series
0.13-7.0(if the boards THK≤0.5mm, the panel size must
mm
be ≤18in)
ShengYi 7628 2116 1080 3313 106
um
12、18、35、70
18/35,35/70(18/70 or other mold should inquiry Fastprint
firstly）
18/35(35/70、18/70 or other mold should inquiry Fastprint
firstly)
um
≥35(normal is 52um，namely 1.5OZ)
um
≥55
um
≥90
Green, Yellow,Black, Blue,Red, White, Matte Green
White, Black, Yellow
HAL、HAL lead free, Flash Gold, Immersion gold,
immersion sliver, immersion Tin, OSP, Hard Gold.
ENIG+OSP，ENIG+GOLD Finger，Flash
gold+HASL，Flash gold+gold finger，Immersion
sliver+gold finger, immersion Tin+gold finger
mm
0.2-0.5
page 1，Total: 8 pages
PCB Manufacture Capabilities
PCB Manufacture Capabilities
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
countersink size and angle
min core thickness
Max drilling
Mix laminating
Board layer
Max board size for 2-layers
Max board size for 4-layers
Max board size ( ≥6-layers)
Min board size
Max panel size for RF
material(rogers、arlon、tyconi cseries )
Tolerance for outline routing
Min Internal angle radius
Tolerance of depth control slot or the blind
slot(NPTH）
mechanical blind&burried vias with times
laminating
Gold THK(Immersion Gold)
Nick THK(Immersion Gold)
Sliver THK(Immersion sliver)
Min Tin THK(HAL Lead free)
Tin THK(Immersion Tin)
Gold THK(hard gold plating)
Gold THK(gold finger/connecter)
Nick THK(gold finger/connecter)
Gold THK(Flash gold)
Nick THK(Flash gold)
Min copper THK in the hole
Min THK for isolation layer
min pad for BGA
mm
mm
Layer account
inch
inch
inch
mm
Angle:82，90，120，Φ≤10mm
0.05
6.3
Rogers/Taconic/Arlon mixing with FR-4
2-40
23*35( Length above 30inch, need to evaluate)
22.5*33.5( Length above 30inch, need to evaluate)
22.5*26.5( Length above 22.5inch, need to evaluate)
10*10
inch
16*18
mil
mm
±4 (Complex routing and slot, need to evaluate)
0.4
mm
±0.10
Laminating less than 3times
um
0.025-0.10
um
3/5
um
0.1-0.3
um
0.4 (large bare copper area for HAL)
um
>0.8
um
0.15-3
um
0.25-1.3 (Min thickness point )
um
3/5
um
0.025-0.10
um
3/5
um
Average 25um, Min thickness point above 20um
mm
0.075(only for half OZ base copper)
mil
10 (For flash gold pcb can be 7mil)
page 2，Total: 8 pages
PCB Manufacture Capabilities
PCB Manufacture Capabilities
50 Min pad
51 Min soldermask THK
Min width for the legend which soldermask
52 layer
mil
um
12(min 0.10mm only for laser drilling )
10
mil
53 Min soldermask bridge
Min width of soldermask cover line (single
54 side)
mil
8
4(for Green soldermask),5(for another soldermask color)(if
base copper≤1OZ,can be 5mil)(if base copper is 2-4OZ,
can be 6mil)
55 Min soldermask clearance (single side)
mil
2.5(pcb partial should be 2mil)
2mil (10% area of flash gold pcb can be 1.5mil, 10% area
of another surface treatment should be 1mil)
56
57
58
59
MAX Via damision for soldermask via plugging
Soldermask thickness cover Via
Tolerance for the press hole without soldering
Max finished copper
min distance for innerlayer between the
60 edge(without exposed copper)
61 Min distance for the isolation tape innerlayer
mm
um
mil
OZ
0.65
5/8
±2
5OZ(175um)
mil
mil
62 min innerlayer isolation annulus (single side)
mil
63 Min width of inner layer PAD (single side)
mil
64 Impedance tolerance
Min trace for Fastprint Logo on track legend
65 layer
66 HDI board
%
10
8
8(8mil for less than 6-layer PCB),10(10mil for above 8layer PCB),(8mil for pcb partial can shave pad)
5(for base copper 18,35um,pcb partial can be 4.5mil),6(for
base copper 70um),8(for bae copper 105um)
±5Ω(<50Ω),±10%(≥50Ω);≥50Ω can be ±5%（need to
evaluate ），
mil
mil
8(12、18um)，10(35um)，12（70um）
1+n+1,1+1+n+1+1,2+n+2
page 3，Total: 8 pages
PCB Manufacture Capabilities
PCB Manufacture Capabilities
mm
copper thickness 12mil ,resin thicknessg
65,80,100um(resin thickness after laminating will be
55,70,90um)
0.10(Laser drill hole Depth ≤55um),0.13(Laser drill hole
Depth ≤100um)
mm
0.60(≤6layer)
mm
1.20(≤8layer)
mm
5
0.45，Min drilling size 0.4mm, if above 0.4mm, need to
evaluate, or add the drilling size, and use another material
instead of PTFE
67 RCC material
68 Min laser drill hole size
Max PCB THK for mechnica drilling tool
69 diameter(0.10mm)
Max PCB THK for mechnica drilling tool
70 diameter(0.15mm)
Max PCB THK for mechnica drilling tool
71 diameter(0.25mm)
Min drilling diameter for PTFE Material
72
PCB THK tolreance (pcb thickness above
73 1MM)
74 PCB THK tolreance (pcb thickness ≤1MM)
Special PCB THK tolreance （not include
75 special layer by layer space demand）
76
77
78
79
Aspect ratio
Min diameter of Connecting Hole
Machining
Min routing tool diameter
Min gap between hole wall to line (None blind
80 and buried via PCB)
Min gap between hole wall to line (Blind and
81 buried via PCB)
82 Min via pad annulus of out layer
mm
mm
mm
mm
PCB thickness tolerance ±10%
±0.1
PCB thickness ≤2.0mm, tolreance±0.1；PCB thickness
2.0-3.0,tolreance±0.15；≥3.0mm, tolreance±0.2
20:1 (not include tooling size ≤0.2mm ,above 12:1, need
to evaluate)
0.45
Routing；V-CUT；Tab connecting；stamp holes
0.6
mil
6(≤8layer),8(≤12layer),9(≤20layer),10(≤28layer)
mm
mm
mil
9( once laminating)；10( twice or three times laminating)
4(12、18um) can be pcb partial
mil
3.5,4.5(35um),6(70um),8(105um)、10（140um）
page 4，Total: 8 pages
PCB Manufacture Capabilities
PCB Manufacture Capabilities
83
84
85
86
Min gap for no copper exposure after routing
Min NPTH diameter tolerance
Min PTH slot tolerance
Min diameter of routing tool diameter
87
88
89
90
Countsink hole
hole position tolerance
Min insulation belt width
inner layer oxidation
Min line gap of inner layer(105um based
copper,after line compensating)
Min line gap of inner layer (140um based
copper,after line compensating)
Min line gap of inner layer (18um based
copper,after line compensating)
Min line gap of inner layer (35um based
copper,after line compensating)
Min line gap of inner layer (70um based
copper,after line compensating)
Min line width of inner layer (105um based
copper,before line compensating)
Min line width of inner layer(140um based
copper,before line compensating)
Min line width of inner layer(18um based
copper,before line compensating)
Min line width of inner layer(35um based
copper,before line compensating)
Min line width of inner layer(70um based
copper,before line compensating)
91
92
93
94
95
96
97
98
99
100
mil
mil
mm
mm
mil
mil
8
±2 (Limited tolerance +0/-0.05 or +0.05/-0)
±0.15
0.6
PTH and NPTH，Max hole angle 130，Max hole diameter
less than 6.3mm
±3
3(Base copper 18um),4(Base copper 35um),≥3mil
Brown oxidation
mil
5
mil
7
mil
3
mil
3.5
mil
4
mil
5
mil
7
mil
3
mil
3
mil
4
page 5，Total: 8 pages
PCB Manufacture Capabilities
PCB Manufacture Capabilities
Min line gap of out layer(105um based
101 copper,after line compensating)
Min line gap of out layer(12、18um based
102 copper,after line compensating)
Min line gap of out layer(140um based
103 copper,after line compensating)
Min line gap of out layer(35um based
104 copper,after line compensating)
Min line gap of out layer(70um based
105 copper,after line compensating)
Min line width of out layer(105um based
106 copper,before line compensating)
Min line width of out layer(12、18um based
107 copper，before line compensating)
Min line width of out layer(140um based
108 copper,before line compensating)
Min line width of out layer(35um based
109 copper,before line compensating)
Min line width of out layer(70um based
110 copper,before line compensating)
Min gap between line to pad of out layer, Min
gap between pad to pad of out layer(after line
111 or pad compensating)
112 Min warpage
113 Max size of dry film covering slot
Max width of dry film covering hole (single
114 side)
115 Max hole diameter of dry film coveing
116 Angle tolerance of Gold finger chamfer
mil
6
mil
3.0(for 18um copper), 2.5(for 12um copper)
mil
7
mil
3.5
mil
5
mil
8
mil
4(for 18um copper), 3 ( for 12um copper)
mil
9
mil
4.5
mil
6
mil
%
mil
mm
3(for 12、18um copper)，3.5(for 35um copper),5( for
70um copper),6(for 105、140um copper)
0.1(≤0.3 need to evaluate）
5mm*3.0mm；Min dry film clearance(single side) above
15mil
10
4.5
±5°
page 6，Total: 8 pages
PCB Manufacture Capabilities
PCB Manufacture Capabilities
Rest thcikness tolerance of Gold finger
117 chamfer
118 Max Length of Gold finger
119 Min gap between Gold finger
121 different length Gold finger surface treatment
122 V-CUT angle model
V-CUT no copper exposure, distance between
123 V-cut line to Circuit(1.0<PCB THK≤1.6mm)
V-CUT no copper exposure, distance between
124 V-cut line to Circuit(1.6<PCB THK≤2.4mm)
V-CUT no copper exposure, distance between
125 V-cut line to Circuit(2.5<PCB THK≤3.0mm)
V-CUT no copper exposure, distance between
126 V-cut line to Circuit(PCB THK≤1.0mm)
127 V-CUT symmetrical tolrance
128 V-CUT angle tolreance
129 V-CUT rest thickness tolreance
130 Max diameter peelable soldermask cover
Distance between Peelable soldermask and
133 pad
137 Min gap of copper net for ground
138 Min width of copper net for ground
(for 12、18um based copper) Min Legend
139 width and gap
(for 35um based copper) Min Legend width
140 and gap
(for 70um based copper) Min Legend width
141 and gap
mil
inch
mil
±5
2
6
flash gold / immersion gold plating ；electrical hard gold
plating
20°，30°，45°,60°
mm
0.36(20°),0.4(30°),0.5(45°),0.6(60°)
mm
0.42(20°),0.51(30°),0.64(45°),0.8(60°)
mm
0.47(20°),0.59(30°),0.77(45°),0.97(60°)
mm
0.3(20°),0.33(30°),0.37(45°),0.42(60°)
mil
o
mil
mm
±4
±5°
±4
2
mil
mil
12
5（ for 12、18、35 um copper），8（for 70 um copper）
mil
5（for 12、18、35 um copper），10（for 70 um copper）
legend width: 4mil；legend high：25mil
legend width: 5mil；legend high：30mil
legend width: 6mil；legend high：45mil
page 7，Total: 8 pages
PCB Manufacture Capabilities
PCB Manufacture Capabilities
142
143
144
145
146
147
148
149
152
153
154
155
Min gap between Legend and Pad
Min connect resistance
Min gap of Test point to pcb edge
Normal Max Test Currency
Nornal Max Test voltage
Min Gap of test Pad to Pad
Min size of Test Pad
Max insulative resistance
Ionic clearness test
Circuit peelable strength
Hardness of soldermask
Burning resisting
mil
Ω
mm
mA
V
mil
mil
MΩ
ug/cm2
Newton/cm
H
6
10
0.5
200
250
3.9
3.9
100
≤1
7.8
6
94V-0
page 8，Total: 8 pages