Analog Devices Welcomes
Hittite Microwave Corporation
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LS7 – 7 x 7 mm
LEADLESS CERAMIC PACKAGE
PACKAGE OUTLINES
LS7 Package Outline Drawing
NOTES:
1. PACKAGE BODY MATERIAL: ALUMINA, WHITE
2. LEAD AND GROUND PADDLE PLATING: ELECTOLESS Ni PLATE 118uin (3.0um) NOM
AND ELECTROLESS Au 25–50uin (0.635–1.27um). PLATING THICKNESS MEASURED
ON POINT “P”.
3. DIMENSIONS ARE IN INCHES [MILLIMETERS].
4. LEAD SPACING TOLERANCE IS NON–CUMULATIVE, DIMENSIONS LOCATED ABOUT
–A– AND –B–
WITHIN .005”.
5. C
HARACTER TO BE INK OR LASER MARKED WITH .018” MIN TO .030” MAX HEIGHT
REQUIREMENTS. UTILIZE MAXIMUM CHARACTER HEIGHT BASED ON LID DIMENSIONS
AND BEST FIT. LOCATE APPROX. AS SHOWN.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN.
Package Information
Part Number
Package Body Material
Lead Finish
MSL Rating [2]
Package Marking [1]
HMCXXXXLS7
ALUMINA WHITE
Gold over Nickel
MSL3
HXXX
XXXX
[1] 4-Digit lot number XXXX.
[2] Max peak reflow temperature of 260 °C.
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
2 Elizabeth Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
LS7 – 7 x 7 mm
LEADLESS CERAMIC PACKAGE
SOLDERMASK
PAD SIZE
2X .0 1 0" X .04
5"
2X.0325"
[0.82]
PACKAGE OUTLINES
Suggested LS7 PCB Land Pattern
4X.0354"
[0.90]
.316"
.306"
GROUND PAD
.260"
.256"
PAD SIZE
16X .020"X.041"
.231"
.014"
6X.0394"
[1.00]
PIN1
.071"
2X.014"
.059"
.056"
Ø.010"
TYPICAL VIA
.010"
.316"
.306"
2X.010"
.250"
.066"
.065"
.010"
.000"
2X.010"
.240"
.000"
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
2 Elizabeth Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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