INTEGRATED CIRCUITS
ADDENDUM
SL2 FCS20
I-CONNECT SLI
Flip Chip Package Specification
Product Specification
Revision 3.0
Public
Philips
Semiconductors
January 2003
Philips Semiconductors
Product Specification Rev 3.0
I-CONNECT Specification
January 2003
SL2 FCS 20
CONTENTS
1
SCOPE...................................................................................................................................... 3
2
SPECIFICATIONS ...................................................................................................................... 4
2.1
Chip........................................................................................................................................... 4
2.2
ABSOLUTE MAXIMUM RATINGS
2.3
OPERATING CONDITIONS ........................................................................................................ 4
2.4
Electrical Characteristics............................................................................................................. 5
3
ORDERING INFORMATION ....................................................................................................... 5
4
DEFINITIONS ............................................................................................................................ 6
5
DISCLAIMERS ........................................................................................................................... 6
5.1
Life support applications.............................................................................................................. 6
5.2
Licence Policy ............................................................................................................................ 6
6
REVISION HISTORY .................................................................................................................. 7
1, 2
........................................................................................... 4
I•CODE is a registered trademark of Philips Electronics N.V.
2
Philips Semiconductors
Product Specification Rev 3.0
I-CONNECT Specification
January 2003
SL2 FCS 20
1 SCOPE
This document gives specifications for the product SL2FCS20; the I-CONNECT SLI.
•
The SL2FCS2001DV/DH is the integrated circuit SL2ICS2001 in the package SOT732AA1.
•
The SL2FCS2001DV/DC is the integrated circuit SL2ICS2001 in the package SOT732BB1.
Therefore this document encompasses all information not covered by the specification of the package and/or
the functional specification of the integrated circuit.
•
Detailed information on the package is given in the specification FCP 2.1 Flip Chip Package.
• Functionality of the integrated circuit is described in the Functional Specification I•CODE SLI Smart
Label IC SL2ICS2001.
3
Philips Semiconductors
Product Specification Rev 3.0
January 2003
I-CONNECT Specification
SL2 FCS 20
2 SPECIFICATIONS
2.1 Chip
Functionality of the integrated circuit is described in the I•CODE SLI Smart Label IC SL2ICS2001 Functional
Specification.
2.2 ABSOLUTE MAXIMUM RATINGS
1, 2
ABSOLUTE MAXIMUM RATINGS
TEST
CONDITIONS
MIN
TYP
1
MIL-STD-883D,
Method 3015.7,
Human Body Model
ESD Voltage Immunity
Input Peak Current
-60
MAX
UNIT
±2
kV peak
+60
mApeak
Processing temperature: refer to specification “FCP 2.1 Flip Chip Package”
NOTES:
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any conditions other than those described in the Operating Conditions and
Electrical Characteristics section of this specification is not implied.
2. This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima.
2.3 OPERATING CONDITIONS
SYMBOL
Tj op
ILA-LB
PARAMETER
TEST
CONDITIONS
Operating Junction Temperature
Input Current
MIN
TYP
1
- 25
2
MAX
UNIT
+ 85
°C
30
mArms
Minimum Supply Voltage
VLA-LB
fop
for READ/WRITE/EAS
Operating Frequency
3
± 2.5
± 2.6
± 2.9
Vrms
13.553
13.560
13.567
MHz
NOTES:
1. Typical ratings are not guaranteed. These values listed are at room temperature.
2. The voltage between LA and LB is limited by the on-chip voltage limitation circuitry (corresponding to parameter ILA-LB).
3. Bandwidth limitation (±7 kHz) according to ISM band regulations.
4
Philips Semiconductors
Product Specification Rev 3.0
January 2003
I-CONNECT Specification
SL2 FCS 20
2.4 Electrical Characteristics
Tjop = - 25 to +85 °C
SYMBOL
PARAMETER
Cres
Input Capacitance between LA - LB
Pmin
Minimum Operating Supply Power
m
tP sm
tD
R mod
tret
nwrite
2
TEST
CONDITIONS
VLA-LB = 2 Vrms
MIN
TYP
1
MAX
UNIT
22,7
23,5
25,1
pF
3
Modulation of RF Voltage for
Demodulator Response
280
Vmax - Vmin
m = Vmax + Vmin
Modulation Pulse Length
of RF Voltage
Demodulator Response Time
m ≥ 10 %, 100%
Load Modulation
EEPROM Data Retention
Tamb ≤ 55 °C
EEPROM Write Endurance
µW
**
**
**
%
**
**
**
µs
**
**
**
µs
**
**
**
Ω
10
Years
100 000
Cycles
NOTES:
1. Typical ratings are not guaranteed. These values listed are at room temperature.
2. Measured with an HP4285A LCR meter at 13.56 MHz.
3. Including losses in resonant capacitor and rectifier.
** : refer to ISO/IEC 15693-2 and 15693-3 including pulse shapes and tolerances; proper coil design assumed
3 ORDERING INFORMATION
Ordering Name
SL2FCS2001DV/DH
Description
I-CONNECT SLI,
Ordering Code
12NC: 9352 725 07118
Hot laminated backside tape
SL2FCS2001DV/DC
I-CONNECT SLI,
Cold laminated backside tape
5
12NC: 9352 725 06118
Philips Semiconductors
Product Specification Rev 3.0
I-CONNECT Specification
January 2003
SL2 FCS 20
4 DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be
published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress
above one or more of the limiting values may cause permanent damage to the device. These are stress
ratings only and operation of the device at these or at any other conditions above those given in the
Characteristics section of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
5 DISCLAIMERS
5.1 Life support applications
These products are not designed for use in life support appliances, devices, or systems where malfunction of
these products can reasonably be expected to result in personal injury. Philips customers using or selling
these products for use in such applications do so on their own risk and agree to fully indemnify Philips for
any damages resulting from such improper use or sale.
5.2 Licence Policy
Purchase of this Philips IC with a functionally according to ISO/IEC 15693 Standard does not convey an
implied license under any patent right on this standard. A license for the Philips portfolio of patents on the
ISO/IEC 15693 Standard can be obtained via the Philips Intellectual Property and Standards department.
For more information please contact the nearest Philips Semiconductors sales office.
6
Philips Semiconductors
Product Specification Rev 3.0
January 2003
I-CONNECT Specification
SL2 FCS 20
6 REVISION HISTORY
Table 1 Addendum Flip Chip Package Specification Revision History
REVISION
DATE
3.0
2.1
2.0
1.0
Jan. 2003
Oct. 2002
Sept. 2002
May 2002
CPCN PAGE
-
5
DESCRIPTION
Product version
typo of 12NC ordering code
Preliminary version
Initital version.
7
Philips Semiconductors
Product Specification Rev 3.0
I-CONNECT Specification
January 2003
SL2 FCS 20
NOTES
8
Philips Semiconductors - a worldwide company
Contact Information
For additional information please visit http://www.semiconductors.philips.com.Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2002
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without any notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Philips
Semiconductors