DCR850G26
Phase Control Thyristor
DS6040-1 April 2011 (LN28251)
KEY PARAMETERS
FEATURES

Double Side Cooling

High Surge Capability
VDRM
IT(AV)
ITSM
dV/dt*
dI/dt
2600 V
850 A
11000 A
1000 V/µs
200 A/µs
* Higher dV/dt selections available
APPLICATIONS

High Power Drives

High Voltage Power Supplies

Static Switches
VOLTAGE RATINGS
Part and
Ordering
Number
DCR850G26
DCR850G24
DCR850G22
DCR850G20
Repetitive Peak
Voltages
VDRM and VRRM
V
2600
2400
2200
2000
Conditions
Tvj = -40°C to 125°C,
IDRM = IRRM = 60mA,
VDRM, VRRM tp = 10ms,
VDSM & VRSM =
VDRM & VRRM +100V
respectively
Lower voltage grades available.
ORDERING INFORMATION
Outline type code: G
(See Package Details for further information)
Fig. 1 Package outline
When ordering, select the required part number
shown in the Voltage Ratings selection table.
For example:
DCR850G26
Note: Please use the complete part number when ordering
and quote this number in any future correspondence
relating to your order.
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DCR850G26
SEMICONDUCTOR
CURRENT RATINGS
Tcase = 60°C unless stated otherwise
Symbol
Parameter
Test Conditions
Max.
Units
850
A
Double Side Cooled
IT(AV)
Mean on-state current
IT(RMS)
RMS value
-
1330
A
Continuous (direct) on-state current
-
1200
A
IT
Half wave resistive load
SURGE RATINGS
Symbol
ITSM
2
It
Parameter
Surge (non-repetitive) on-state current
Test Conditions
Max.
Units
10ms half sine, Tcase = 125°C
11.0
kA
VR = 0
0.605
MA s
Min.
Max.
Units
2
I t for fusing
2
THERMAL AND MECHANICAL RATINGS
Symbol
Parameter
Test Conditions
Rth(j-c)
Thermal resistance – junction to case
Double side cooled
DC
-
0.035
°C/W
Rth(c-h)
Thermal resistance – case to heatsink
Double side cooled
DC
-
0.008
°C/W
Tvj
Virtual junction temperature
Blocking VDRM / VRRM
-
125
°C
Tstg
Storage temperature range
-40
140
°C
Fm
Clamping force
12
18
kN
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DCR850G26
SEMICONDUCTOR
DYNAMIC CHARACTERISTICS
Symbol
IRRM/IDRM
Parameter
Test Conditions
Min.
Max.
Units
-
60
mA
1000
-
V/µs
Peak reverse and off-state current
At VRRM/VDRM, Tcase = 125°C
dV/dt
Max. linear rate of rise of off-state voltage
To 67% VDRM, Tj = 125°C, gate open
dI/dt
Rate of rise of on-state current
From 67% VDRM to 1000A
Repetitive 50Hz
-
200
A/µs
Gate source 30V, 10,
Non-repetitive
-
1000
A/µs
1.70
V
tr < 0.5µs, Tj = 125°C
VT
VT(TO)
rT
tgd
On-state voltage
IT = 1500A, Tcase = 125°C
Threshold voltage
Tcase = 125°C
-
0.95
V
On-state slope resistance
Tcase = 125°C
-
0.50
m
VD = 67% VDRM, gate source 30V, 10
-
3.0
µs
250
µs
Delay time
tr = 0.5µs, Tj = 25°C
tq
Turn-off time
Tj = 125°C, VR = 100V, dI/dt = 10A/µs,
dVDR/dt = 20V/µs linear to 67% VDRM
QS
Stored charge
IT = 1000A, tp = 1000us,Tj = 125°C,
dI/dt =10A/µs,
-
2200
µC
IRR
Reverse recovery current
-
125
A
IL
Latching current
Tj = 25°C,
-
1
A
IH
Holding current
Tj = 25°C,
-
200
mA
GATE TRIGGER CHARACTERISTICS AND RATINGS
Symbol
Parameter
Test Conditions
Max.
Units
3
V
VGT
Gate trigger voltage
VDRM = 5V, Tcase = 25°C
VGD
Gate non-trigger voltage
At 40% VDRM, Tcase = 125°C
TBD
V
IGT
Gate trigger current
VDRM = 5V, Tcase = 25°C
300
mA
IGD
Gate non-trigger current
At 40% VDRM, Tcase = 125°C
TBD
mA
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DCR850G26
SEMICONDUCTOR
CURVES
10000
Instantaneous on-state current, IT - (A)
9000
8000
7000
VTM EQUATION
6000
VTM = A + Bln (IT) + C.IT+D.IT
5000
4000
Where A = 0.440868
B = 0.0637241
C = 0.000258024
D = 0.00399011
These values are valid for Tj = 125°C
3000
2000
Tj=25°C
1000
Tj=125°C
0
0
1
2
3
4
5
Instantaneous on-state voltage,VT - (V)
6
Fig.2 Maximum &minimum on-state characteristics
0.04
Double side cooled
t


i

Rthjc t    Rthi  1  e

i 1

Thermal Impedance Zth(j-c) (°C/W)
n
0.03
0.02
0.01




i
τi (s)
Rthi (°C/kW)
1
0.7085781
19.71901
2
0.1435833
4.240625
3
0.0361520
7.963806
4
0.0021308
3.043661
0
0.001
0.01
0.1
Time ( s )
1
10
100
Fig.3 Maximum (limit) transient thermal impedance – junction to case (°C/W)
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DCR850G26
SEMICONDUCTOR
1600
130
120
Mean power dissipation - (W)
1200
1000
800
600
400
180
120
90
60
30
200
0
0
Maximum case temperature, Tcase - (°C)
1400
110
100
90
80
70
60
50
40
30
20
10
0
100 200 300 400 500 600 700 800
Mean on-state current, IT(AV) - (A)
0
Fig.4 On-state power dissipation – sine wave
130
180
120
90
60
30
100 200 300 400 500 600 700 800
Mean on-state current, IT(AV) - (A)
Fig.5 Maximum permissible case temperature,
double side cooled – sine wave
1400
120
1200
100
Mean power dissipation - (W)
Maximum case temperature, Tcase - (°C)
110
1000
90
80
70
60
50
40
d.c.
180
120
90
60
30
30
20
10
0
800
600
400
d.c.
180
120
90
60
30
200
0
0
100 200 300 400 500 600 700 800
Mean on-state current, IT(AV) - (A)
Fig.6 Maximum permissible case temperature,
double side cooled – rectangular wave
0
100 200 300 400 500 600 700 800
Mean on-state current, IT(AV) - (A)
Fig.7 On-state power dissipation – rectangular wave
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DCR850G26
SEMICONDUCTOR
12.0
Conditons:
Tcase=125°C
VR=0
Pulse width = 10ms
11.0
Conditons:
Tcase=125°C
VR=0
half-sine wave
0.60
9.0
0.55
8.0
0.50
I2t (MA2s)
Surge current, ITSM - (KA)
10.0
0.65
7.0
6.0
0.45
0.40
5.0
0.35
4.0
3.0
0.30
2.0
0.25
1
10
Number of cycles
100
1
Fig.9 Single-cycle I t
5000
500
Conditons:
Tj=125°C
IT=1000A
VR=0
Reverse recovery current, IRR - (A)
4500
Stored charge, QS - (uC)
4000
3500
3000
2500
2000
Conditons:
Tj=125°C
IT=1000A
VR=0
1000
1
10
Rate of decay of on-state current, di/dt - (A/us)
Fig.10 Stored charge vs di/dt
10
2
Fig.8 Multi-cycle surge current
1500
Pulse width, tp - (ms)
100
400
300
200
100
0
1
10
Rate of decay of on-state current, di/dt - (A/us)
100
Fig.11 Reverse recovery current vs di/dt
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DCR850G26
SEMICONDUCTOR
4.50
4.00
Gate trigger voltage, VGT - (V)
3.50
Upper limit
3.00
2.50
2.00
1.50
1.00
Lower limit
0.50
Tj=-40°C
Tj=25°C
Tj=125°C
0.00
0
50
100
150
200
250
300
350
400
450
500
Gate trigger current IGT, - (mA)
Fig.12 Gate characteristics
12.0
PGM=20W
Gate trigger voltage, VGT - (V)
10.0
8.0
6.0
A
4.0
A is Recommended Triggering Area.
B is Unreliable Triggering Area.
C is Recommended Gate Load Line.
2.0
0.0
B
0.0
C
1.0
2.0
3.0
4.0
Gate trigger current IGT, - (A)
Fig.13 Gate characteristics
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DCR850G26
SEMICONDUCTOR
PACKAGE DETAILS
For further package information, please contact Customer Services. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
Package outline type code: G
Fig.14 Package outline
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DCR850G26
SEMICONDUCTOR
IMPORTANT INFORMATION:
This publication is provided for information only and not for resale.
The products and information in this publication are intended for use by appropriately trained technical personnel.
Due to the diversity of product applications, the information contained herein is provided as a general guide only and does not constitute
any guarantee of suitability for use in a specific application.The user must evaluate the suitability of the product and the completeness of
the product data for the application. The user is responsible for product selection and ensuring all safety and any warning requirements
are met. Should additional product information be needed please contact Customer Service.
Although we have endeavoured to carefully compile the information in this publication it may contain inaccuracies or typographical
errors. The information is provided without any warranty or guarantee of any kind.
This publication is an uncontrolled document and is subject to change without notice. When referring to it please ensure that it is the
most up to date version and has not been superseded.
The products are not intended for use in applications where a failure or malfunction may cause loss of life, injury or damage to property.
The user must ensure that appropriate safety precautions are taken to prevent or mitigate the consequences of a product failure or
malfunction.
The products must not be touched when operating because there is a danger of electrocution or severe burning. Always use
protective safety equipment such as appropriate shields for the product and wear safety glasses. Even when disconnected any
electric charge remaining in the product must be discharged and allowed to cool before safe handling using protective gloves.
Extended exposure to conditions outside the product ratings may affect reliability leading to premature product failure. Use outside the
product ratings is likely to cause permanent damage to the product. In extreme conditions, as with all semiconductors, this may include
potentially hazardous rupture, a large current to flow or high voltage arcing, resulting in fire or explosion. Appropriate application design
and safety precautions should always be followed to protect persons and property.
Product Status & Product Ordering:
We annotate datasheets in the top right hand corner of the front page, to indicate product status if it is not yet fully approved for
production. The annotations are as follows:Target Information:
Preliminary Information:
No Annotation:
This is the most tentative form of information and represents a very preliminary specification.
No actual design work on the product has been started.
The product design is complete and final characterisation for volume production is in
progress.The datasheet represents the product as it is now understood but details may change.
The product has been approved for production and unless otherwise notified by Dynex any
product ordered will be supplied to the current version of the data sheet prevailing at the
time of our order acknowledgement.
All products and materials are sold and services provided subject to Dynex’s conditions of sale, which are available on request.
Any brand names and product names used in this publication are trademarks, registered trademarks or trade names of their
respective owners.
HEADQUARTERS OPERATIONS
CUSTOMER SERVICE
DYNEX SEMICONDUCTOR LIMITED
Doddington Road, Lincoln, Lincolnshire, LN6 3LF
United Kingdom.
Phone: +44 (0) 1522 500500
Fax:
+44 (0) 1522 500550
Web: http://www.dynexsemi.com
Phone: +44 (0) 1522 502753 / 502901
Fax:
+44 (0) 1522 500020
e-mail: power_solutions@dynexsemi.com
 Dynex Semiconductor Ltd.
Technical Documentation – Not for resale.
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