iDESYN
iD8602
PFM Step-Up DC-DC Converters
General Description
Applications
The iD8602 compact, high-efficiency, PFM step-up DC-

Remote Wireless Transmitters
DC converters are available in SOT-89-3, SOT-23-3 and

Personal Medical Devices
SOT-23-5 packages. They feature an extremely low

Digital Still Cameras
quiescent supply current to ensure the highest possible

Single-Cell Battery-Powered Devices
light-load efficiency. Optimized for operation from one to

Low-Power Hand-Held Instruments
two alkaline or nickel-metal-hydride (NiMH) cells, or a

MP3 Players
single Li+ cell, these devices are ideal for applications

Personal Digital Assistants (PDA)
where extremely low quiescent current and ultra-small
size are critical.
Features
Ordering Information
iD8602 - □□ □□□ □
Taping
Package
R: Tape and Reel
A22:SOT-89-3 F Type
A30:SOT-23-3
A50:SOT-23-5
Output Voltage Voltage Code
1.8 V
18
1.9 V
19
2.1 V
21
2.5 V
25
2.7 V
27
2.8 V
28
3.0 V
30
3.3 V
33
May. 2012

Up to 85% Efficiency

Ultra Low Input Current (9µA at Switch Off)

0.1μA Logic-Controlled Shutdown

±2.0% Output Voltage Accuracy

Fixed Output Voltage

Up to 200mA Output Current

0.8V to 5.5V Input Voltage Range

Low Start-up Voltage, 0.8V at 1mA

SOT-89-3, SOT-23-3 and SOT-23-5 Package
Marking Information
For marking information, please contact our sales
representative directly or through distributor around
your location.
1
V0.8
iDESYN
iD8602
Typical Application Circuit
Recommended Operating Conditions
Absolute Maximum Ratings
Supply Voltage VIN
7V
Power Dissipation, PD @ TA=25°C
Input Voltage VIN
Junction Temperature
SOT-89-3
571mW
SOT-23-3/ SOT-23-5
400mW
Ambient Operating Temperature
0.8V to 5.5V
-40°C to 125°C
-40°C to 85°C
Thermal Resistance, ja
SOT-89-3
175°C/W
SOT-23-3/ SOT-23-5
250°C/W
Lead Temperature
Storage Temperature
ESD Susceptibility
HBM (Human Body Mode)
MM (Machine Mode)
May. 2012
260°C
-65°C to 150°C
4kV
300V
2
V0.8
iDESYN
iD8602
Pin Configurations
1
2
(TOP VIEW)
3
GND VOUT LX
LX
LX
GND
3
5
4
1
2
GND
VOUT
1
3
EN VOUT NC
SOT-23-3
SOT-89-3
Pin Description
2
SOT-23-5
SOT-89-3
SOT-23-3
SOT-23-5
Name
3
3
5
LX
1
1
4
GND
--
--
1
EN
Chip Enable (Active High). Note that this pin is high impedance. There
should be a pull low 100k resistor connected to GND when the control
signal is floating.
--
--
3
NC
No Connecting
2
2
2
VOUT
Output Voltage
May. 2012
Description
Pin for Switching
Ground
3
V0.8
iDESYN
iD8602
Electrical Characteristics
All of the below electrical characteristics are tested at ambient temperature (25°C)
Parameter
Min
Typ
Max
Units
ΔVOUT
-2
--
+2
%
Input Voltage
VIN
--
--
5.5
V
Start-up Voltage
VST
IOUT = 1mA, VIN: 0 → 2.0V
--
0.8
1
V
Hold-on Voltage
VHO
IOUT = 1mA, VIN: 0 ← 2.0V
0.7
--
--
V
To be measured at VIN
continuous switching
--
35
--
IDD1
--
40
--
--
9
--
--
23
--
--
28
--
120
--
--
160
--
--
--
--
1.0
Output Voltage Accuracy
Input Current 1
VOUT ≤ 3.5V (1)
3.5V＜VOUT ≤ 5.0V (2)
Input Current 2 (1)(2)
Input Current 3
LX Switching Current
Symbol
IDD2
VOUT ≦ 3.5V (1)
3.5V＜VOUT ≤ 5.0V (2)
VOUT ≦ 3.5V (1)
3.5V＜VOUT ≤ 5.0V (2)
LX Leakage Current
IIN
ISWITCHING
ILEAKAGE
EN “High” Voltage
VENH
EN “Low” Voltage
VENL
Maximum Oscillator Frequency
FMAX
Oscillator Duty Cycle
DOSC
Test Conditions
To be measured at VOUT in
switch off condition
To be measured at VIN in
no load (guaranteed by I1
and I2)
VLX = 6.0V
VIN=1.2V, Same as IDD1,
LX Pin Oscillation Start
VIN=1.2V, Same as IDD1,
LX Pin Oscillation Stop
µA
µA
VLX = 0.4V
mA
0.75
µA
V
0.2
V
VOUT = 2.5V to 5.0V
140
190
240
kHz
VOUT = 1.8V to 2.4V
140
190
320
kHz
On (VLX “L”) side
65
75
85
%
--
80
--
%
0.65
0.8
1.0
V
Efficiency
VLX Voltage Limit
µA
LX Switch on
Notes:
(1) VIN = 1.8V, VSS = 0V, IOUT = 1mA, TA = 25°C, and use external circuit of typical application
(2) VIN = 3.0V, VSS = 0V, IOUT = 1mA, TA= 25°C, and external circuit of typical application
May. 2012
4
V0.8
iDESYN
iD8602
Function Block Diagram
EN/NC
*SOT-89-3
Chip Enable
V LX Limiter
LX
V OUT
Buffer
GND
+
PFM Control
OSC 190kHz
_
V REF
May. 2012
5
V0.8
iDESYN
iD8602
Typical Operating Characteristics
Start-up Voltage vs. Temperature
1.75
VOUT = 3.3V, COUT = 47μF, L = 47μH
2.00
1.75
1.50
Start-up (-40℃)
1.25
Start-up (-25℃)
Start-up (0℃)
1.00
Start-up (25℃)
0.75
Hold-on Voltage (V)
Start-up Voltage (V)
2.25
Hold-on Voltage vs. Temperature
0
20
40
60
80
0.75
Hold-on (2%) (-40℃)
Hold-on (2%) (-25℃)
Hold-on (2%) (0℃)
Hold-on (2%) (25℃)
Hold-on (2%) (50℃)
Hold-on (2%) (85℃)
0.50
0.00
100
0
20
40
60
80
100
Output Current (mA)
Efficiency vs. Output Current
Output Voltage vs. Output Current
3.32
VOUT = 3.3V, COUT = 47μF, L = 47μH
COUT = 47μF, L = 47μH
3.27
85
80
VIN=1.0V
VIN=1.5V
VIN=2.0V
VIN=2.5V
VIN=3.0V
75
70
Output Voltage (V)
90
Efficiency (%)
1.00
Output Current (mA)
95
65
3.22
3.17
3.12
VIN=1.0V
VIN=1.5V
VIN=2.0V
VIN=2.5V
VIN=3.0V
3.07
3.02
0
20
40
60
0
80 100 120 140 160 180 200
20
40
60
80 100 120 140 160 180 200
Output Current (mA)
Output Current (mA)
Output Ripple vs. Output Current
Input Current vs. Temperature
100
60
VOUT = 3.3V, COUT = 47μF, L = 47μH
Input Current 3
50
80
60
40
VIN=1.0V
VIN=1.5V
VIN=2.0V
VIN=2.5V
VIN=3.0V
20
0
0
20
40
60
Input Current (μA)
Output Ripple (mV)
1.25
0.25
Start-up (50℃)
Start-up (85℃)
0.50
VOUT = 3.3V, COUT = 47μF, L = 47μH
1.50
30
20
10
Close loop tested,
VIN = 1.8V, VOUT = 3.3V, IOUT = 0mA.
0
-40
80 100 120 140 160 180 200
-15
10
35
60
85
Temperature (°C)
Output Current (mA)
May. 2012
40
6
V0.8
iDESYN
iD8602
Low Start-up Voltage at 1mA
Low Start-up Voltage at 10mA
VIN (DC)
VIN (DC)
(1.00V/Div)
(1.00V/Div)
VOUT (DC)
VOUT (DC)
(2.00V/Div)
(2.00V/Div)
VLX (DC)
VLX (DC)
(2.00V/Div)
(2.00V/Div)
IOUT (DC)
IOUT (DC)
VIN = 1.0V, VOUT = 3.3V, (Resistive Load 1mA)
(500mA/Div)
(500mA/Div)
VIN = 1.0V, VOUT = 3.3V, (Resistive Load 10mA)
Time (4.00ms/Div)
Time (10.0ms/Div)
Steady State Operation (VIN = 1.0V)
Steady State Operation (VIN = 1.5V)
VLX (DC)
VLX (DC)
(2.00V/Div)
(2.00V/Div)
VOUT (AC)
VOUT (AC)
(10.0mV/Div)
(10.0mV/Div)
VIN = 1.0V, VOUT = 3.3V, IOUT = 30mA
VIN = 1.5V, VOUT = 3.3V, IOUT = 40mA
Time (4.00μs/Div)
Time (4.00μs/Div)
Steady State Operation (VIN = 2.0V)
Steady State Operation (VIN = 3.0V)
VLX (DC)
VLX (DC)
(2.00V/Div)
(2.00V/Div)
VOUT (AC)
(20.0mV/Div)
VOUT (AC)
(20.0mV/Div)
VIN = 2.0V, VOUT = 3.3V, IOUT = 150mA
VIN = 3.0V, VOUT = 3.3V, IOUT = 100mA
Time (4.00μs/Div)
May. 2012
Time (40.0μs/Div)
7
V0.8
iDESYN
iD8602
Figure 3: Typical Application Circuit for SOT-23-5
Application Information
Capacitor Selection
A 47μF tantalum (SMT) output filter capacitor typically
L1
D1
provides 50mV to 100mV output ripple when stepping up
1
from 3.0V to 5.0V at 1mA to 200mA. Smaller capacitors
VOUT
loads or in applications that can tolerate higher output
C2
Values
in
the
10μF
to
47μF
range
LX
VIN
5
+
(down to 10μF with higher ESR) are acceptable for light
ripple.
EN
47µH
(Shield Inductor)
+
2
VOUT
3
NC
C1
22µF
GND
4
47µF
(Tantalum)
are
recommended for the iD8602. The equivalent series
resistance (ESR) of both bypass and filter capacitors
affects efficiency and output ripple. The output voltage
Inductor Selection
ripple is the product of the peak inductor current and the
An inductor value of 47μH performs well in iD8602
output capacitor’s ESR. Use low-ESR capacitors for best
applications. However, the inductance value is not critical,
performance, or connect two or more filter capacitors in
and the iD8602 will work with inductors in the 10μH to
parallel.
100μH range. Smaller inductance values typically offer a
smaller physical size for a given series resistance,
Figure 1: Typical Application Circuit for SOT-89-3
allowing the smallest overall circuit dimensions. However,
due to higher peak inductor currents, the output voltage
D1
ripple also tends to be higher. Circuits using larger
inductance values exhibit higher output current capability
L1
47µH
(Shield Inductor)
VIN
+
1
GND
2
VOUT
3
LX
and larger physical dimensions for a given series
resistance. The inductor’s incremental saturation current
VOUT
rating should be greater than the peak switch-current limit,
+
C2
which is 240mA for the iD8602. However, it is generally
47µF
(Tantalum)
C1
22µF
acceptable to bias the inductor into saturation by as much
as 20%, although this will slightly reduce efficiency. The
inductor’s DC resistance significantly affects efficiency.
Rectifier Diode
Figure 2: Typical Application Circuit for SOT-23-3
For optimum performance, a switching Schottky diode is
recommended. For low output power applications, a PN-
D1
junction switching diode will also work well, although its
1
greater forward voltage drop will reduce efficiency.
L1
GND
Thermal Considerations
47µH
(Shield Inductor)
LX
VIN
3
C1
VOUT
2
C2
VOUT
For continuous operation, do not exceed the maximum
+
22µF
operation junction temperature 125°C. The maximum
+
power dissipation depends on the thermal resistance
47µF
(Tantalum)
of IC package, PCB layout, the rate of surroundings
airflow and temperature difference between junctions
May. 2012
8
V0.8
iDESYN
iD8602
to ambient. The maximum power dissipation can be
PD  MAX 
J
Figure 4: Maximum Power Dissipation
MAX   TA 
 JA
Maximum Power Dissipation (W)
calculated by following formula:
T
 
Where TJ(MAX) is the maximum operation junction
temperature 125°C, TA is the ambient temperature and
the JA is the junction to ambient thermal resistance.
For recommended operating conditions specification of
iD8602 where TJ(MAX) is the maximum junction
temperature of the die (125°C) and TA is the maximum
ambient temperature. The junction to ambient thermal
resistance JA is layout dependent. For SOT-89-3
0.8
0.7
0.6
0.5
0.4
0.3
0.2
SOT-89-3
0.1
SOT-23-3/SOT-23-5
0
-50
packages, the thermal resistance JA is 175°C/W on
-25
0
25
50
75
100
125
Ambient Temperature (°C)
the standard JEDEC 51-7 four-layers thermal test
board. The maximum power dissipation at TA = 25°C
can be calculated by following formula:
PD(MAX) = (125°C - 25°C) / (175°C/W) = 0.571W
for
SOT-89-3
packages.
The
maximum
power
dissipation depends on operating ambient temperature
for fixed TJ (MAX) and thermal resistance JA. For iD8602
packages, the Figure 4 of de-rating curves allows the
designer
to
see
the
effect
of
rising
ambient
temperature on the maximum power allowed.
May. 2012
9
V0.8
iDESYN
iD8602
Layout Considerations
Careful PC board layout is important for minimizing ground bounce and noise. Keep the IC’s GND pin and the
ground leads of the input and output capacitors less than 0.2in (5mm) apart using a ground plane. In addition, keep
all connections to VOUT and LX as short as possible.
Figure5: PCB Layout Guide (SOT-89-3)
Figure6: PCB Layout Guide (SOT-23-3)
May. 2012
10
V0.8
iDESYN
iD8602
Figure7: PCB Layout Guide (SOT-23-5)
May. 2012
11
V0.8
iDESYN
iD8602
Packaging
SOT-89-3
SYMBOLS
A
A1
b
b1
C
D
D1
HE
E
e
H
S
e1
May. 2012
DIMENSIONS IN MILLIMETERS
MIN
1.40
0.80
0.36
0.41
0.38
4.40
1.40
--2.40
2.90
0.35
0.65
1.40
NOM
1.50
1.040.42
0.47
0.40
4.50
1.60
--2.50
3.00
0.40
0.75
1.50
MAX
1.60
--0.48
0.53
0.43
4.600
1.75
4.25
2.60
3.10
0.45
0.85
1.60
12
DIMENSIONS IN INCH
MIN
0.055
0.031
0.014
0.016
0.014
0.173
0.055
--0.094
0.114
0.014
0.026
0.054
NOM
0.059
0.041
0.016
0.185
0.016
0.177
0.062
--0.098
0.118
0.016
0.030
0.059
MAX
0.063
--0.018
0.020
0.017
0.181
0.069
0.167
0.102
0.122
0.018
0.034
0.063
V0.8
iDESYN
iD8602
SOT-23-3
SYMBOLS
A
A1
A2
b
C
D
E
e
H
L
Θ1
May. 2012
DIMENSIONS IN MILLIMETERS
MIN
1.00
0.00
0.70
0.35
0.10
2.70
1.40
--2.60
0.370
1°
NOM
1.10
--0.80
0.40
0.15
2.90
1.60
1.90(TYP)
2.80
--5°
MAX
1.30
0.10
0.90
0.50
0.25
3.10
1.80
--3.00
--9°
13
DIMENSIONS IN INCH
MIN
0.039
0.000
0.027
0.013
0.004
0.106
0.055
--0.102
0.015
1°
NOM
0.043
--0.031
0.016
0.006
0.114
0.063
0.075
0.110
--5°
MAX
0.051
0.004
0.035
0.020
0.001
0.122
0.071
--0.118
--9°
V0.8
iDESYN
iD8602
SOT-23-5
SYMBOLS
A
A1
A2
b
C
D
E
e
H
L
Θ1
e1
May. 2012
DIMENSIONS IN MILLIMETERS
MIN
NOM
MAX
1.00
1.10
1.30
0.00
--0.10
0.70
0.80
0.90
0.35
0.40
0.50
0.10
0.15
0.25
2.70
2.90
3.10
1.50
1.60
1.80
--1.90(TYP)
--2.60
2.80
3.00
0.370
----1°
5°
9°
--0.95(TYP)
---
14
DIMENSIONS IN INCH
MIN
NOM
MAX
0.039
0.043
0.051
0.000
--0.004
0.027
0.031
0.035
0.013
0.016
0.020
0.004
0.006
0.001
0.106
0.114
0.122
0.059
0.063
0.071
--0.075
--0.102
0.110
0.118
0.015
----1°
5°
9°
--0.037
---
V0.8
iDESYN
iD8602
Footprint
SOT-89-3
SOT-23-3
May. 2012
Footprint Dimension (mm)
Package
Number of
PIN
P1
P2
A
B
C
D
M
SOT-23-3
3
0.95
1.90
3.60
1.60
1.00
0.80
2.70
15
Tolerance
±0.10
V0.8
iDESYN
iD8602
SOT-23-5
May. 2012
16
V0.8