APL3555
USB Power-Distribution Switches
Features
General Description
•
62mΩ Power Switch On Resistance
•
Wide Supply Voltage Range: 2.7V to 5.5V
The APL3555 series of power switches are designed for
USB applications. The 62mΩ N-channel MOSFET power
•
Fix Current Limit Protection
•
Fast Over current Response: 2us (typ.)
•
Over-Temperature Protection
•
Fault Indication Output
•
Enable Input
•
Built-in Soft-Start
switch satisfies the voltage drop requirements of USB
specification.
The protection features include current-limit protection,
short-circuit protection, and over-temperature protection.
The device limits the output current at current limit threshold level. When VOUT drops below VIN-1V, the devices limit
the current to a lower and safe level. The over-temperature protection limits the junction temperature below
140oC in case of short circuit or over load conditions.
Other features include a deglitched OCB output to indicate the fault condition and an enable input to enable or
disable the device.
Applications
•
•
Notebook and Desktop Computers
•
High-Side Power Protection Switchs
•
MHL Ports
Simplified Application Circuit
USB Ports
5V
USB Port
VIN
VOUT
APL3555A/B/C/D
USB
Controller
OCB
EN/ENB
GND
Pin Configurations
VOUT 1
5 VIN
GND 2
OCB 3
4 EN
SOT-23-5
APL3555A/C
(Top View)
VOUT 1
5 VIN
GND 2
OCB 3
4 ENB
SOT-23-5
APL3555B/D
(Top View)
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Mar., 2016
1
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APL3555
Ordering and Marking Information
Package Code
B : SOT-23-5
Operating Ambient Temperature Range
Assembly Material
I : -40 to 85 oC
Handling Code
Handling Code
TR : Tape & Reel
Temperature Range
Output Current/EN Function
Package Code
A : 2A/Active High B : 2A/Active Low C : 1A/Active High
Output Current/EN Function
D : 1A/Active Low
Assembly Material
G : Halogen and Lead Free Device
APL3555
APL3555Ο B:
L5ΟX
Ο-Output Current/EN Function Code
X - Date Code
Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant)and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings
Symbol
VIN
VOUT
VENB, VEN
VOCB
TJ
(Note 1)
Parameter
Rating
Unit
VIN Input Voltage (VIN to GND)
-0.3 ~ 7
V
VOUT to GND Voltage
-0.3 ~ 7
V
EN, ENB to GND Voltage
-0.3 ~ 7
V
OCB to GND Voltage
-0.3 ~ 7
Maximum Junction Temperature
TSTG
Storage Temperature
TSDR
Maximum Lead Soldering Temperature, 10 Seconds
V
150
o
-65 ~ 150
o
260
o
C
C
C
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Thermal Characteristics
Symbol
θJA
Pa ram ete r
Junctio n-to-Amb ient Resistance in Fr ee A ir
Typica l Value
(N ote 2)
Unit
o
S OT-2 3-5
23 5
C/W
Note 2 : θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
Recommended Operating Conditions (Note 3)
Sym bol
VIN
I OUT
Pa ra mete r
V IN In put Vol tag e
Range
Unit
2.7 ~ 5.5
V
O UT Output Curren t (AP L355 5A/B)
0 ~2
O UT Output Curren t (AP L355 5C/D)
0 ~1
A
TA
A mbient Temp erature
-40 ~ 85
o
TJ
Jun ction Temper ature
-4 0 ~ 125
o
C
C
Note 3 : Refer to the typical application circuit
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Mar., 2016
2
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APL3555
Electrical Characteristics
Unless otherwise specified, these specifications apply over VIN=5V, VEN =5V or VENB=0V and TA= -40 ~ 85 oC. Typical values are
at TA=25oC.
Sym bol
Param ete r
APL35 55
Te st Conditions
Min.
Unit
Typ.
Max .
SUPPLY CURRENT
µA
No lo ad, V EN=0 V or V ENB=5V
-
-
1
No lo ad, V EN=5 V or V ENB=0V
-
65
-
µA
Lea ka ge Curren t
VOUT=GND, VEN=0V or VENB=5V
-
-
1
µA
Reverse Leaka ge Current
VIN=GND, VOUT =5 V, V EN =0V o r
V ENB=5V
-
-
1
µA
I OUT =1.5A,
o
T A= 2 5 C
-
62
78
mΩ
1.7
-
2 .6 5
V
-
0.2
-
V
APL3 555A /B
VIN=2 .7V to 5.5V, T A= 2 5 o C
2.1
2.5
2.9
A
APL3 555C/D
o
VIN=2 .7V to 5.5V, T A= 2 5 C
1.1
1.5
1.9
A
-
0.8
-
A
-
0.8
-
A
-
0.2
0.4
V
-
-
1
µA
OCB asse rtio n, T A= -40 ~ 8 5 C
5
12
20
ms
2
-
-
V
VIN Suppl y Curren t
POWER SWITCH
R DS(ON)
Po wer S witch On Resistan ce
S OT-2 3-5 Package
UNDE R-VOLTAGE LOCKOUT (UVLO)
VIN UVL O Thr eshold Voltage
V IN risin g, T A= -40 ~ 85 o C
VIN UVL O Hysteresis
CURRENT- LIMIT AND SHORT-CIRCUIT PROTECTIONS
ILIM
I SHORT
Curren t Limit Th reshold
Sho rt- Ci rcu it Ou tpu t Curre nt
APL3 555A /B
VIN=2 .7V to 5.5V
APL3 555C/D
VIN=2 .7V to 5.5V
OCB OUTPUT PIN
t D(OC B)
OCB Outpu t Lo w Voltage
IOCB=5mA
OCB Le akage Curren t
VOCB=5V
OCB Deglitch Time
o
EN OR ENB INPUT PIN
VIH
In put Logic HIG H
VIN=2 .7V to 5V
VIL
In put Logic LOW
VIN=2 .7V to 5V
In put Cu rrent
VOUT Dischar ge Resistance
VEN=0V or VENB=5V
-
-
0.8
V
-
-
1
µA
-
1 50
-
Ω
t D(ON )
Tu rn On Delay Time
-
80
-
µs
t D(OFF)
Tu rn Off De lay Time
-
5
-
µs
No lo ad, C OUT =1µF, VIN=5V
-
4 00
10 00
µs
TJ rising
-
1 40
-
°C
-
20
-
°C
tSS
Soft-Start Time
OVER-TEMPERATURE PROTECTION (OTP)
T OTP
Over-Temp erature Thresho ld
Over-Temp erature Hystere sis
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Mar., 2016
3
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APL3555
Typical Operating Characteristics
Switch On Resistance vs. Junction
Temperature
Switch On Resistance vs. Input
Voltage
110
130
VIN=5V
IOUT=1.5A
CIN=10µF
COUT =10µF
Switch On Resistance, RDS(on) (mΩ)
Switch On Resistance, RDS(on) (mΩ)
130
90
70
50
-50
-10
30
70
110
Junction Temperature ( OC)
110
90
70
50
2.5
150
IOUT =1.5A
CIN=10µF
COUT =10µF
TA=25OC
3
3 .5
4
4.5
5
5.5
Input Voltage (V)
Supply Current vs. Input Voltage
Supply Current vs. Junction
Temperature
120
120
110
Supply Current, ICC (µA)
Supply Current, ICC (µA)
100
80
60
40
VIN=5V
RLOAD=OPEN
CIN=10µF
COUT=10µF
20
-10
30
70
O
110
90
80
RLOAD=OPEN
CIN=10µF
COUT =10µF
TA=25OC
70
60
50
2 .5
0
-50
100
150
3
Junction Temperature ( C)
Current Limit Threshold vs .
Junction Temperature
3.0
Current Limit Threshold, ILIM (A)
Current Limit Threshold, ILIM (A)
3
2
1
VIN=5V
0
-50
-10
30
70
110
Junction Temperature (OC)
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Mar., 2016
3 .5
4
4.5
5
5.5
Input Voltage (V)
2.9
2.8
2.7
2.6
O
TA=25 C
2.5
2.5
150
Current Limit Threshold vs . Input
Voltage
3
3.5
4
4.5
5
5.5
Input Voltage (V)
4
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APL3555
Typical Operating Characteristics (Cont.)
Current-Limit Response vs. Output
Peak Current
2
VIN=5V
TA=25OC
200
EN Pin Threshold Voltage, VEN (V)
Current-Limit Response (µs)
250
EN Pin Threshold Voltage vs .
Junction Temperature
150
100
50
0
EN Rising
1 .6
1.2
EN Falling
0 .8
0 .4
0
0
2
4
6
8
10
VIN=5V
RLOAD=50Ω
CIN=10µF
COUT=10µF
12
-50
Output Peak Current (A)
Turn-Off Leakage Current vs.
Junction Temperature
-10
30
70
110
Junction Temperature (OC)
70
OCB Deglitch Time, T D(OCB) (ms)
8
VIN=5V
RLOAD=1Ω
CIN=10µF
COUT =10µF
4
100
-10
30
70
2.5
UVLO Falling
1 .5
IOUT =15mA
CIN=10µF
COUT=10µF
0.5
-50
-10
30
70
110
Junction Temperature (OC)
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Mar., 2016
5
150
Turn-Off Falling Time vs . Junction
Temperature
VIN=5V
RLOAD=30Ω
CIN=10µF
COUT =1µF
80
60
40
20
0
-50
150
110
Junction Temperature (OC)
ULVO Rising
1
150
12
UVLO Threshold Voltage vs .
Junction Temperature
2
110
16
0
-50
150
Turn-Off Falling Time, tF (µs)
Turn-Off Leakage Current, ILEAK (µA)
1
3
UVLO Threshold Voltage, VUVLO (V)
VIN=5V
RLOAD=0Ω
CIN=10µF
COUT =10µF
SD mode
2
0
-50
30
Junction Temperature (OC)
OCB Deglitch Time vs. Junction
Temperature
4
3
-10
-10
30
70
110
Junction Temperature (OC)
150
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APL3555
Typical Operating Characteristics (Cont.)
Turn-On Rising Time, tR (µs)
700
Turn-On Rising Time vs . Junction
Temperature
600
500
400
300
V IN=5V
RLOAD=30Ω
CIN=10µF
COUT =1µF
200
100
0
-50
-10
30
70
110
Junction Temperature (OC)
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Mar., 2016
150
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APL3555
Operating Waveforms
Turn Off Response
Turn On Response
VENB
VOUT
2
VENB
1
1
VOUT
2
VIN=5V,C OUT=10µ F/Electrolytic,
C IN=10 µF/Electrolytic,R LOAD=30Ω
CH1:V ENB,5V/Div, DC
CH2:V OUT,2V/Div, DC
TIME:200 µs/Div
VIN=5V,C OUT=10µ F/Electrolytic,
C IN=10 µF/Electrolytic,R LOAD=30Ω
CH1:V ENB,5V/Div, DC
CH2:V OUT,2V/Div, DC
TIME:100µ s/Div
UVLO at Rising
UVLO at Falling
VIN
V IN
1
1
V OUT
2
2
VIN=5V,C OUT=10µ F/Electrolytic,
C IN=10 µF/Electrolytic,R LOAD=30Ω
CH1:V IN,1 V/Div, DC
CH2:V OUT,1V/Div, DC
TIME:4ms/Div
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Mar., 2016
VOUT
VIN=5V,C OUT=10µF/Electrolytic,
C IN=10 µF/Electrolytic,R LOAD=30Ω
CH1:V IN,1V /Div, DC
CH2:V OUT,1V/Div, DC
TIME:4ms/Div
7
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APL3555
Operating Waveforms (Cont.)
OCB Response During Over Load
OCB Response During Short Circuit
1
VENB
1
VOCB
VOCB
2
2
3
VENB
IOUT
IOUT
3
VIN=5V,C OUT=10µF/Electrolytic,
C IN=10 µF/Electrolytic,R LOAD=0Ω
CH1:V ENB,5V/Div, DC
CH2:V OCB,5 V/Div, DC
CH3:I OUT ,1 A/Div, DC
TIME:4ms/Div
VIN=5V,C OUT=10µF/Electrolytic,
C IN=10 µF/Electrolytic,R LOAD=1Ω
CH1:V ENB,5V/Div, DC
CH2:V OCB,5V /Div, DC
CH3:I OUT ,1A /Div, DC
TIME:4ms/Div
Load-Transient Response
OCB Response with Ramped Load
VOCB
VOUT
2
VOUT
1
1
3
IOUT
2
VIN=5V,COUT =10µF/Electrolytic,
C IN=10µF/Electrolytic
CH1:VOUT ,5V/Div, DC
CH2:VOCB,5V/Div, DC
CH3:I OUT,1A/Div, DC
TIME:2ms/Div
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Mar., 2016
IOUT
V IN=5V ,C OUT =10 µF/Electrolytic,
C IN=10µ F/Electrolytic,IOUT =0 to 2A
CH1:VOUT ,1 V/Div, DC
CH2:IOUT ,1A/Div, DC
TIME:2 µs/Div
8
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APL3555
Pin Description
PIN
FUNCTIO N
NO.
NAME
2
GND
Gro und.
5
VIN
Po wer S uppl y Input. Con nect this pi n to external DC sup ply.
EN
(A/C)
En able Input. Pu lling th is pin to hig h will ena ble th e d evice and pu lling this pin to lo w wi ll d isa ble device.
The EN pin canno t be left floating.
ENB
(B/D)
En able Input. Pu lling th is pin to hig h will disabl e the device and pullin g this pin to low will ena ble device.
The ENB pin can not be l eft floa ting .
3
OCB
Fault Ind ica tio n P in. This pi n g oes low whe n a curr ent limit o r an over-temp erature condi tion is d ete cted
afte r a 1 2ms de glitch time.
1
VO UT
4
Ou tp ut Vo lta ge Pin. Th e output voltage foll ows the input vo ltage. Wh en ENB is h igh or EN i s low, the
outpu t voltage is disch arged b y an intern al resistor .
Block Diagram
VIN
VOUT
UVLO
Charge
Pump
EN/
ENB
Short-Circuit
Protection
Current
Limit
Gate Driver and
Control Logic
OCB
GND
OTP
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Mar., 2016
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APL3555
Parameter Measurement Information
POR
VIN
0V
EN
0V
90%VOUT
VOUT>1.5V
VOUT
0V
TD(ON)
TSS
80us 400us
IOUT
OCB
Current
Limit
0A
high
high
low
NO TD(OCB)
TIOS
2us
TD(OCB)
12ms
Figure 1. Sequence of Power On & Current Limit & OCB Indicate
Copyright  ANPEC Electronics Corp.
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APL3555
Typical Application Circuit
USB Port
3.3V
5V
CIN
50kΩ
10µF
USB
Controller
VIN
VOUT
APL3555A/B/C/D
COUT
10µF
VBUS
D+
D-
OCB
GND
EN/ENB
GND
Copyright  ANPEC Electronics Corp.
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APL3555
Function Description
VIN Under-Voltage Lockout (UVLO)
Enable/Disable
The APL3555 series of power switches have a built-in
Pull the ENB above 2V or EN below 0.8V will disable the
device, and pull ENB pin below 0.8V or EN above 2V will
under-voltage lockout circuit to keep the output shutting
off until internal circuitry is operating properly. The UVLO
enable the device. When the IC is disabled, the supply
current is reduced to less than 1µA. The enable input is
circuit has hysteresis and a de-glitch feature so that it will
typically ignore undershoot transients on the input. When
compatible with both TTL and CMOS logic levels. The
EN/ENB pin cannot be left floating.
input voltage exceeds the UVLO threshold, the output
voltage starts a soft-start to reduce the inrush current.
Over-Temperature Protection
Power Switch
The power switch is an N-channel MOSFET with a low
When the junction temperature exceeds 140oC, the internal thermal sense circuit turns off the power FET and
RDS(ON). The internal power MOSFET does not have the
body diode. When IC is off, the MOSFET prevents a cur-
allows the device to cool down. When the device’s junction temperature cools by 20 oC, the internal thermal
rent flowing from the VOUT back to VIN and VIN to VOUT.
sense circuit will enable the device, resulting in a pulsed
output during continuous thermal protection. Thermal
Current-Limit Protection
protection is designed to protect the IC in the event of
over temperature conditions. For normal operation, the
The APL3555 series of power switches provide the current-limit protection function. During current limit, the de-
junction temperature cannot exceed TJ=+125oC.
vices limit output current at current limit threshold. For
reliable operation, the device should not be operated in
current limit for extended period.
Short-Circuit Protection
When the output voltage drops below VIN-1V, which is
caused by an over-load or a short-circuit, the devices limit
the output current down to a safe level. The short-circuit
current limit is used to reduce the power dissipation during short-circuit conditions. If the junction temperature
reaches over-temperature threshold, the device will enter the thermal shutdown.
OCB Output
The APL3555 series of power switches provide an opendrain output to indicate that a fault has occurred. When
any of current-limit or over-temperature protection occurs
for a deglitch time of tD(OCB), the OCB goes low. If fault
condition release, OCB will goes high when VOUT > 1.5V
(see Figure 1). Since the OCB pin is an open-drain output,
connecting a resistor to a pull high voltage is necessary.
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Mar., 2016
12
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APL3555
Application Information
Input Capacitor
A 1µF or higher ceramic bypass capacitor from VIN to GND,
located near the APL3555, is strongly recommended to
suppress the ringing during short circuit fault event.
When the load current trips the SCP threshold in an over
load condition such as a short circuit, hot plug-in or heavy
load transient the IC immediately turns off the internal
power switch that will cause VIN ringing due to the inductance between power source and VIN. Without the bypass capacitor, the output short may cause sufficient ringing on the input to damage internal control circuitry.
Input capacitor is especially important to prevent VIN from
ringing too high in some applications where the inductance between power source to VIN is large (ex, an extra
bead is added between power source line to VIN for EMI
reduction), additional input capacitance may be needed
on the input to reduce voltage overshoot from exceeding
the absolute maximum voltage of the device during over
load conditions.
Output Capacitor
A low-ESR 10µF aluminum electrolytic or tantalum between VOUT and GND is strongly recommended to reduce
the voltage droop during hot-attachment of downstream
peripheral. (Per USB 2.0, output ports must have a minimum 120µF of low-ESR bulk capacitance per hub).
Higher-value output capacitor is better when the output
load is heavy.
Layout Consideration
The PCB layout should be carefully performed to maximize thermal dissipation and to minimize voltage drop,
droop and EMI. The following guidelines must be
considered:
1. Please place the input capacitors near the VIN pin as
close as possible.
2. Output decoupling capacitors for load must be placed
near the load as close as possible for decoupling highfrequency ripples.
3. Locate APL3555 and output capacitors near the load to
reduce parasitic resistance and inductance for excellent load transient performance.
4. The negative pins of the input and output capacitors
and the GND pin must be connected to the ground plane
of the load.
5. Keep VIN and VOUT traces as wide and short as possible.
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Mar., 2016
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APL3555
Package Information
SOT-23-5
D
e
E
E1
SEE
VIEW A
b
c
0.25
GAUGE PLANE
SEATING PLANE
aaa C
L
0
A1
NX
A
A2
e1
VIEW A
S
Y
M
B
O
L
SOT-23-5
MILLIMETERS
MIN.
INCHES
TYP
MAX.
1.16
1.45
0.00
0.05
0.15
A2
0.90
1.10
1.30
b
0.30
0.38
0.50
c
0.08
0.17
0.22
D
2.70
2.93
E
2.60
MIN.
TYP.
MAX.
0.046
0.057
0.000
0.002
0.006
0.035
0.043
0.051
0.012
0.015
0.020
0.003
0.007
0.009
3.10
0.106
0.115
0.122
2.83
3.00
0.102
0.111
0.118
E1
1.60
1.80
0.055
0.063
0.071
e
0.95 BSC
0.037BSC
e1
1.90 BSC
0.075BSC
A
A1
K
0.30
0.45
0.60
0.012
0.018
0.024
0
0
4
8
0
4
8
aaa
0.10
0.004
Note : 1. Follow JEDEC TO-178 AA.
2. Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Mar., 2016
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APL3555
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
SOT- 23-5
A
H
T1
C
d
D
W
E1
F
178.0±2.00
50 MIN.
8.4+2 .0 0
-0.00
13.0+0 .5 0
- 0.2 0
1 .5 MIN.
2 0.2 MIN.
8.0±0.30
1.75±0.10
3.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
2.0±0.05
1.5+0.10
-0.00
1 .0 MIN.
0 .6 +0.00
-0 .4 0
3.2 0±0.20
3.10 ±0 .2 0
1.50±0.20
4.0±0.10
4.0 ±0.1 0
(mm)
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APL3555
Devices Per Unit
Package Type
Unit
Quantity
SOT-23-5
Tape & Reel
3000
Taping Direction Information
SOT-23-5
USER DIRECTION OF FEED
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APL3555
Classification Profile
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3°C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Mar., 2016
17
www.anpec.com.tw
APL3555
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness
<2.5 mm
≥2.5 mm
Volume mm
<350
235 °C
220 °C
3
Volume mm
≥350
220 °C
220 °C
3
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
1.6 mm – 2.5 mm
≥2.5 mm
Volume mm
<350
260 °C
260 °C
250 °C
3
Volume mm
350-2000
260 °C
250 °C
245 °C
3
Volume mm
>2000
260 °C
245 °C
245 °C
3
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
HBM
MM
Latch-Up
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
Description
5 Sec, 245°C
1000 Hrs, Bias @ Tj=125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
VMM≧200V
10ms, 1tr≧100mA
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Mar., 2016
18
www.anpec.com.tw