>>> STOP 2
Center for Power Electronics Systems
(CPES)
PI: Qing-Chang Zhong
Dept. of Automatic Control and Systems Engineering
The University of Sheffield
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

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Our host: Prof. Fred C. Lee
Overview of CPES
Industry Partnership Program (IPP)
Journey of CPES
 1st Decade: Information Technologies
 2nd Decade: Infrastructure Technologies
 3rd Decade: NSF ERC
 Post NSF ERC
CPES Annual Conferences
Our Host: Dr Fred C.Lee
• Director of the CPES.
• President of the IEEE Power Electronics Society
(1993-1994).
• A member of the U.S. National Academy of
Engineering.
• University Distinguished Professor at Virginia
Tech.
• In 2012, he was elected to Academia Sinica in
Taiwan and inducted into Virginia Tech Faculty
Entrepreneur Hall of Fame.
• A member of the board of directors for Zytec
(1987-1997), Artesyn (1997-2004), and Chairman
of the Board for VPT, Inc. (1993-2009).
• The Board of Directors for Delta Electronics, Inc.,
the
Delta
Education
and
Environmental
Foundation, and NEM, Inc. in Taiwan.
Millions
Millions
Growth of CPES
NSF-ERC
$10
$10
$8
$8
VPEC
$6
$6
VPEC
CIT/TDC
University
$4
VPEC
$4
Ind. Partnership
PERG
VIRGINIA POWER ELECTRONICS CENTER
$2
Sponsored
Research
$0
$2
$0
77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 00 01 02 03 04 05 06 07 08 Jan 09
(Group)
(University)
(State)
(National)
'09
Overview of NSF ERC
Virginia Tech
Rensselaer
Polytechnic
Institute
University
of Puerto Rico
Mayaguez
•
•
•
University
of Wisconsin
Madison
North
Carolina A&T State
University
Headquartered at Virginia Tech., ~ 1800m2
1998-2008
$30 million funding from NSF and $47 million
from industry partners and other funding
agencies in 10 years
6th Floor CPES Packaging Laboratory
Sink
Sink
Ball
milling
Polishing
CO2 Laser
Die
Bonder
Bench
Bench
Extruder
Die Shear
Bench
Fume Hood
Electro
plating
678
Packaging
Lab
Bench
Bench
Reflow
Belt
Vacuum
Solder
Reflow
Reflow
Wirebond
677
Deposition
Injection
Molding
Electro
plating
Bench
Solder Reflow
Bench
Wirebond
Sputtering
Sputtering
Fluid
Dispenser
Yag Laser
CPES Vision
Provide leadership through global collaborative
research and education for creating electric
processing systems of the highest value to society
CPES-VT Faculty
Fred C. Lee,
Center Director
Rolando Burgos
Qiang Li
Dushan Boroyevich,
Co-Director
Khai Ngo
Guo-Quan Lu
(Affiliated)
CPES-VT Research Faculty
Igor Cvetkovic
Alex Ji
David Gilham
Wenli Zhang
CPES Faculty Recognition in the Field
Fred Lee
William E.
Newell award.
Thomas Lipo DaanvanWyk
ThomasLipo
receives
receives
receives
William E. William E.
NikolaTesla
Newell award.
Newell award.
award.
Wyk
IEEE Fellows.
IEEE Fellows.
1987
1989
KhaiNgo is an
NSF
Presidential
Young
Investigator
(PYI).
James S.
Tucker
professor.
1990
1993
1995
IEEE Fellow.
IEEE Fellow.
1997
Thomas Jahns D Boroyevich
William E.
Nikola Tesla
Newell Award
award.
Thomas Lipo
ThomasJahns
Fellow of
receives the
William E. Newell The Royal Academy
award.
Of Engineering,
National Academy of
Engineering of the UK
.
1998
1999
2000
2001
2002
2003
IEEE Fellows.
2004
Elaine Scott is
Miguel Velez- Miguel Velez Ryes Acting
G. Q. Lu
Robert
EfrainNeill
’O
Director
Reyes
Lorenz
NSF
IEEE
IEEE WalterFee of the VT/Wake Forest receives IAS receives
Walter
Fee
CAREER award. receives NSF
School of
Outstanding Outstanding Young
CAREER Outstanding Young
Biomedical
Achievement Engineer Award
Award.
Engineer Awar.
Award.
Engineering
Grainger
Professor
Grainger Distinguished MeadWitter
Professor Professor Consolidated J Byron Maupin
Paper
Professor
Puerto Rico Foundation
Professor
Thomas Lipo
the National
Academy of
Engineering.
2005
F C Lee
Ernest
Blickle
Award
2006
2007
2008
Miguel Velez
Scott Huxtable
Reyes is
receives
inducted into NSF
CAREER
the Puerto Rico
award.
Academy of
Arts and
Sciences.
Abdollah Homaifar
Duke Energy
named American
Endowed
Electric Professor
Professor
“World class research activities in drives and converters and other cpesresearch programs that build on those strengths.” NSF Site Visit 2001
11
CPES Research & Impacts
A Billion D
- ollar Industry!
-on VRM and POL Converters
Telecom POL
DCX
+VR
Fuji
VRM
Control IC
-
Industry Products
98
99
01
00
VR
02
03
04
05
06
07
08
CPES Research
i1
Intel
1.5V
30A
1GHz
L1
Processor
M
i2
IPE
M
L2
IM
MultiPhase VRM
*
4 Channel VRM
L
nd
-
Isolation
Q1Q2
io1
Q3Q4
io
-
*
-
C
Channel 2 Buck
Lateral
Power IC
Contr
ol
DCR
Ro
n2
R
V
c
C

V
IL
c
Current
Sensing
*U.S. Patent,
No.7,254,047
RL


Q5Q6
Channel 1 Buck
CPES
Vin
io
Co
2
io3
V
o
Coupled Inductor
3-D POL cpes12
Power Electronics Integration
Technologies
LTCC
Magnetic
Substrate
PWM
CsnubVin Vsw
Cboot
HS
Gate
MOSFET
Driver
Dboot
Lo
LS
MOSFET
+5V GND
Vo
Cdec
Co
Power
supplies
on DBC
97.5%,
70w/cc
3D Power
supplies
cpes13
CPES Achievement Highlights
(1998-2008)
- 15 new power
electronics
courses
developed
- 27 distance
delivery
courses
- 86 power
electronics and
related courses
- 60 short
courses to
industry
- Connectivity
with 135
academic
institutions
worldwide
Current Year …
- 30 faculty, 97 students,
3 research staff
- 79 industry partners
- Over $6 M in research
annually
System
Integration
– 286 graduate
degrees (105
Ph.D., 181 M.S.)
– Over 1700
technical papers,
theses and
dissertations
– 131 invention
disclosures
– 50 patents
awarded
– 328 licenses
issued by VTIP
– 148 industry
internships
– 251 technology
transfer
activities
Partnering with industry to advance
IPEM
power electronics technologies
CPES Industry Consortium
PRINCIPAL PLUS MEMBER ($50K/year)
ABB, Inc.
Chicony Power Technology Co., Ltd.
Delta Electronics
GE Global Research
International Rectifier
LiteOn Technology Corporation
NXP Semiconductors
Richtek Technology Corporation
Texas Instruments
ZTE Corporation
Agilent Technologies
China National Elec. Apparatus Res. Inst.
Emerson Network Power
Groupe SAFRAN
Intersil Corporation
National Semiconductor Corporation
OSRAM Sylvania, Inc.
Rolls-Royce
TriQuint Semiconductor, Inc.
ALSTOM Transport
Crane Aerospace & Electronics
GE Energy
Huawei Technologies Co., Ltd.
Linear Technology
Nissan Motor Co., Ltd.
Power Integrations, Inc.
Siemens Corporate Research
United Technologies Research Center
PRINCIPAL MEMBER ($25K/year)
AcBel Polytech, Inc.
Enpirion, Inc.
Maxim Integrated Products
Analog Devices
Fairchild Semiconductor Corporation
Eaton Corporation, Innovation Center
GHO Ventures, LLC
ASSOCIATE MEMBER ($10K/year)
Crown International
Delphi Electronics & Safety
Intel Corporation
LS Industrial Systems Co., Ltd.
Murata Power Solutions
Shindengen Electric Mfg. Co., Ltd.
TDK-Lambda Corporation
Universal Lighting Technologies, Inc.
Cummins, Inc.
Enphase Energy, Inc.
Johnson Controls, Inc.
Microsoft Corporation
NetPower Technologies, Inc.
Silergy Technology
The Boeing Company
Vacon, Inc.
Danfoss Power Electronics
Hitachi Computer Peripherals Co., Ltd.
Lexmark International
Monolithic Power Systems
Nippon Chemi-Con Corporation
Solectria Renewables, LLC
Toyota Motor Corporation
AFFILIATE MEMBER (in-kind or <$10K/year)
ANSYS, Inc.
Power Hub Systems
Tektronix, Inc.
CISSOID
Simplis Technologies, Inc.
Trendsetter Electronics
Plexim GmbH
Synopsys, Inc.
VPT, Inc.
CPES Industry Members Worldwide
67 members
41 – N. America
8 – Europe
18 – Asia
CPES IPPF
Openness
Sharing
CPES MEMBERSHIP GROWTH
Industry Membership Funding Growth
Principal-Level Participation
28 Principal Plus, 8 Principal Members
VIPs
Ken
Phillips
Co-Chair
John Steel Pierre
IAB Chair Thollot
Secretary
Abdollah Homaifar
CPES Scientific Advisory Board
CPES Governing Board
CPES IAB Leadership
Marwan Bikdash
Ramon
Vasquez
UPRM
Tom Jahns
Paul
Peercy
UWM
Tom Lipo
Alan
Cramb
RPI
Richard
Benson
VT
Joseph
Monroe
NCAT
David
Blackburn
Ralph
Cavin
Fereshteh
Fatehi
1979
1977
In the
PERG 2nd
beginning… faculty
Fred Lee
Dan Chen
UPRM
Efraín O'Neill
Jian Sun
Annette Muetze
1983
1985
3rd VPEC 4th VPEC
faculty
faculty
Vatché Vorperian Bo Cho
Javier
Uceda
1989 1990
2 new VPEC
faculty
1994
7th VPEC
faculty
Ray RidleyDushan Boroyevich Alex Huang
Beth Tranter
Administrative/Educatio
n Director
Linda Long
Finance
Director
Miguel Velez Manuel Jiménez
Rena Huang
Giri
Venkataramanan
Greg Nellis
Al
Tucker
Bob Lorenz
Paul Chow
NCAT
John
Bob
Kassakian Steigerwald
Teresa Shaw
Industrial Liaison
Carlos Cuadros
Leila Parsa
1998 1999
Daan van
Wyk
2001
New CPES faculty
Fred Wang
2006
Khai Ngo
2008
Ming Xu
Additional CPES-VT Faculty
Guo-Quan Lu
Hardus
Odendaal
Elaine
Scott
Karen Thole
Journey of CPES
The Beginning: Aerospace Industries
PERG
1st Decade: Information Technologies
Telecom
Server
VPEC
CIT/TDC
Network
Desktop
Laptop
High Frequency Power Conversion
VPEC
VIRGINIA POWER ELECTRONICS CENTER
•
•
•
•
ZCS Quasi-Resonant Converters
ZVS Quasi-Resonant Converters
ZVS Multi-Resonant Converters
Soft-Switching PWM Converters
Over 25 US Patents in these areas
2nd Decade: Infrastructure Technologies
VPEC
HEV Propulsion
PNGV
Sponsors:
Ford
General Motors
Daimler-Chrysler
US Army TACOM
Powering the Fuel Cell Vehicles
Ford
Daimler-Chrysler
Ballard
Fuel Cell vehicle
DC/DC converter
powering the
fuel cell
Aircraft Electric Power Systems
Electrically Driven
Flight Actuators
Smart
Actuators
Batteries
Internal Engine
Electric Starter/
Generators
270 V DC
Power Distribution
System
Thales
Solid State
Power Controllers
Cabin Pressure and
Temperature Control
Avionics
All Electric Ship
Concept
Aircraft Electric Service Station
Concept
1995
Technology
1998
Product
2001
Deployment
2002
Aircraft
Electric
Service
Station
Power
Electronics
Building
Block
(PEBB)
Newport News
Shipbuilding
CVN 75
3rd Decade: NSF ERC
Fundamental
Knowledge
Enabling
Technology
Engineered
Systems
Center Director
F. C. Lee, VT
IPEM-Based Power
Conversion Systems
(IPEM-PCS)
D. Boroyevich, VT
Electro-Magneto-Thermo-Mechanical Integration Technology (EMTMIT)
T. M. Jahns, UW-M
T. A. Lipo, UW-M
Microprocessor
and Converter
Integration
Advanced Power
Semiconductors
(APS)
T. P. Chow, RPI
Integratable
Materials
(IM)
G. Q. Lu, VT
Standard-Cell
Active IPEMs
Standard-Cell
Passive IPEMs
High-Density
Integration
(HDI)
J. D. van Wyk, VT
Motor and
Converter
Integration
Thermal-Mechanical Control & Sensor
Integration
Integration
(TMI)
(CSI)
E. P. Scott, VT
R. D. Lorenz, UW-M
Vision during ERC
“Develop an Integrated Power Electronics System Approach
via Integrated Power Electronics Modular (IPEM) Building
Blocks Toward System Integration to Improve
Quality, Reliability and Reduce Cost”
Power Processing
Signal Processing
IC
IPEM
$1T
$600B
$60B
1960
1970
1980
1990
2000 year
1970
1980
1990
2000 2010
year
More Automation Less Labor
Product
Specifications
Automatic Assembly Line
Active IPEM
Passive IPEM
Integration of Active Components
Control,
Optical
Isolation
Gate
Drive
Sensors,
+
Protection,
communication
Gate drivers,
protection and
sensors
Logic,
Optical
Isolation
+
Temp.
Sens.
Current
Sensor
Gate
Drive
Temp.
Sens.
Voltage
Sensor
+
Serial Communications Link & Auxiliary Power Supply
Active IPEM
Chip/wire/SMC
A
C
_
Integration of Passive Components
sensors
protection and
+
-
Gate drivers,
Passive IPEM
+
I core
Promoting IPEMs
For Different Power Ranges and Applications
10-100 W IPEMs
1-10 kW IPEMs
10 kW - 10 MW IPEMs
IR iPOWIRTM
Semikron IPM
CPES Integrated
EMI Filter
CPES 800 V, 40 A
ZVZCT phase-leg
TI SWIFTTM
Philips PIP20x
CPES Flip-ChipOn-Flex Phase-Leg
CPES Transmission
Line Filter
CPES Monolithic
VRM
IR, Philips, On Semi,
Intersil, Linear Tech,
TI, Renesas, NSC,
Power One, Infineon,
ST, Maxim, Micrel,
Volterra, Primarion,
Fairchild, Analog
CPES Active
IPEM
CPES Passive IPEM
ABB, Hitachi, IXYS, Toshiba, Semikron, Fuji,
Infineon, Eupec, Powerex
CPES
1.8 kV, 60 A, 3-level
ZVZCT phase-leg 4.5 kV, 4 kA ETO
ONR, DOE, NSWC, Thales, Northrop
Grumman, Rockwell Automation,
General Dynamics, ABB, Bettis, Alstom,
ACI, PEMCO, TVA
CPES industry consortium members or research sponsors
Power Management for Microprocessor
20 US Patents
320nH
C
320nH
320nH
320nH
1.2mF
Post NSF ERC
Application Areas
Power Management for
Computers, Telecommunication
Point-of-Load Conversion
Vehicular Power
Converter Systems
Renewable Energy
Systems
Technology Areas
Power Conversion
Topologies and
Architectures
Power Electronics
Components
Modeling and Control
EMI and Power Quality
High Density Integration
Mini-Consortium
Power Management Consortium (PMC)
(1998 – present)
Work Scope:
• Devices and Magnetics
• Modeling and control (analog & digital)
• 3D integration
• High performance VRM/POL converters
• DC/DC converters and Bus converters
• EMI and PFC
• Power architecture and management
Mini-Consortium for
High Density Integration (HDI)
Work Scope:
• High-Temperature
Integration Technologies
• Components
• Module-Level Integration
• System-Level Integration
Current Principal Plus Members in this area:
Research Sponsors
Industry Consortium
Mini-Consortium for
Renewable Energy and Nanogrids (REN)
Work Scope
•PV System
•Plug-in Hybrid Electric
Vehicles / Battery Storage
•Wind Power
•Energy Management for
the Nanogrid
•AC Nanogrid
•DC Nanogrid
•Solid State Lighting
Current Principal Plus Members in this area:
Research Sponsors
College of
Engineering
Industry Consortium
ICTAS
CPES Annual Conferences
• Started in 1981, now already the 32nd
• The 2013 CPES Conference
• 183 participants from 10 countries
• 71 companies and 12 universities.
• 73 papers presented in 5 Technical
Sessions and 5 Dialogue Sessions.
• 2 tutorials
• 4 invited talks
Acknowledgements
Dr Fred C. Lee provided the original version
of most of the slides in different files.