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Malisse Tel.: +32-16-281 272 e-mail: mpc@imec.be http://www.europractice-ic.com Contact: T. Drischel Tel.: +49 9131 776 4463 e-mail: europrac@iis.fraunhofer.de Manufacturing centers • Low-cost prototyping service on regular Multi-Project Wafer (MPW) runs • Low-cost, low-volume service (up to millions of devices) • A wide range of IC-technologies, down to 28nm (CMOS, SiGe, SiGe:C) • Low-volume price estimation service • Design and electrical rule checking on every submitted design • Packaging service offering a wide range of ceramic and plastic packages • Prototype and volume testing • Customer interface with a single Manufacturing Center of choice (see below) • Easy-to-use design order/registration process via WWW • Cell libraries & design kits available. ON Semi 0.7µ C07M-D & C07M-A ON Semi 0.5µ CMOS EEPROM C5F & C5N ON Semi 0.35µ C035U 4M ON Semi 0.7µ C07M-I2T100 100 V ON Semi 0.35µ C035 - I3T80U 80 V ON Semi 0.35µ C035 - I3T50U 50 V ON Semi 0.35µ C035 - I3T50U (E) 50 V ON Semi 0.35µ C035 - I3T25U 3.3/25 V ONC18MS - 0.18 µm ONC18MS-LL - 0.18 µm ONC18HPA - 0.18 µm ONC18-I4T - 0.18 µm 45/70V ams 0.35µ CMOS C35B4C3 ams 0.35µ CMOS C35OPTO ams 0.35µ HV CMOS H35B4D3 ams 0.35µ SiGe-BiCMOS S35 ams 0.18µ CMOS C18 ams 0.18µ HV CMOS H18 50V/20V BARC Diode for ams 0.35µ CMOS C35OPTO WLCSP for ams 0.35µ CMOS C35B4C3 IHP SGB25V 0.25µ SiGe:C IHP SGB25VGD 0.25µ SiGe:C IHP SG25H1 0.25µ SiGe:C IHP SG25H3P 0.25µ Complementary SiGe:C IHP SG25H3 0.25µ SiGe:C IHP SG25H4 0.25µ SiGe:C IHP SG25H_EPIC (based on SG25H4) IHP SG13S SiGe:C IHP SG13C SiGe:C IHP SG13G2 SiGe:C IHP SG25 PIC IHP BEOL SG25 IHP BEOL SG13 X-FAB XH018 0.18µ HV NVM X-FAB XT018 0.18µ HV SOI X-FAB XS018 0.18µ OPTO TSMC 0.18 CMOS L/MS/RF TSMC 0.18 CMOS HV CV018LD TSMC 0.18 CMOS HV BCD Gen 2 TSMC 0.13 CMOS L/MS/RF, G or LP (8”) TSMC 0.13 CMOS L/MS/RF, G or LP (12”) TSMC 90nm CMOS L/MS/RF, G or LP TSMC 65nm CMOS L/MS/RF, G or LP TSMC 40nm CMOS L/MS/RF, G or LP TSMC 28nm CMOS Logic, HPL (HKMG) TSMC 28nm CMOS Logic, LP (SION) TSMC 28nm CMOS Logic, HPM (HKMG) UMC L180 Logic GII UMC L180 Mixed-Mode/RF UMC L180 Logic LL UMC L180 EFLASH Logic GII UMC CIS180 – CONV diode UMC CIS180 – ULTRA diode UMC CIS11 UMC L130 Logic UMC L130 MM/RF UMC L110AE L/MM/RF UMC L65N L/MM/RF - SP UMC L65N L/MM/RF - LL GF 55 nm LPe/LPx-NVM/LPx-RF (mini@sic: only LPe) GF 40 nm LP/LP-RF/RF-mmWave GF 28 nm SLP/SLP-RF/HPP (mini@sic: only SLP) GF 22 nm FDX MEMSCAP METALMUMPS MEMSCAP PolyMUMPS MEMSCAP SOIMUMPS MEMSCAP PIEZOMUMPS ePIXfab-imec SiPhotonics Passives ePIXfab-imec SiPhotonics ISIPP25G+ ePIXfab-LETI SiPhotonics Passives + Heater Micralyne MicraGEM-Si Teledyne Dalsa MIDIS general MPW runs general + MPW runs including mini@sic conditions * only mini@sic conditions serviced by imec serviced by Fraunhofer IIS If you require an estimate for a specific project or wish to discuss the opportunities of the low-cost Multi-Project Wafer service, you are invited to contact any of the Manufacturing Centers. For general inquiries or assistance, please contact the EUROPRACTICE ASIC Service office : This project has received funding from the European Union’s Seventh Programme for research, technological development and demonstration under grant agreement No 610018. Tel.: +32 16 281 272 e-mail: mpc@imec.be For final MPW dates, please consult the website at http://www.europractice-ic.com . design & layout: ASIC Multi-Project Wafer Schedule The EUROPRACTICE IC Manufacturing and Testing Service (ASIC Service) is co-ordinated by IMEC and offers industry and academia a fully supported, low-cost route to ASIC design, prototyping and low-volume manufacturing.