EUROPRACTICE MPW 2016 calendar

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2016
January
February
March
April
Sun
May
June
July
August
September
October
SERVICES
November
December
1
Mon
1
Tues
2
Wed
3
Thurs
4
05 09
2
1
3
2
4
3
5
18 22
1
2
1
3
2
4
31
1
2
44
1
3
1
4
2
Fri
1
5
4
1
6
3
1
5
2
Sat
2
6
5
2
7
4
2
6
3
1
5
3
Sun
3
7
6
3
8
5
3
7
4
2
6
4
Mon
4
8
7
4
9
6
4
8
5
3
7
5
Tues
5
9
8
5
10
7
5
9
6
4
8
6
Wed
6
10
9
6
11
8
6
10
7
5
9
7
Thurs
7
11
10
7
12
9
7
11
8
6
10
8
Fri
8
12
11
8
13
10
8
12
9
7
11
9
Sat
9
13
12
9
14
11
9
13
10
8
12
10
Sun
10
14
13
10
15
12
10
14
11
9
13
11
Mon
11
15
14
11
16
13
11
15
12
10
14
12
Tues
12
16
15
12
17
14
12
16
13
11
15
13
Wed
13
17
16
13
18
15
13
17
14
12
16
14
Thurs
14
18
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14
19
16
14
18
15
13
17
15
Fri
15
19
18
15
20
17
15
19
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14
18
16
Sat
16
20
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21
18
16
20
17
15
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17
Sun
17
21
20
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22
19
17
21
18
16
20
18
Mon
18
22
21
18
23
20
18
22
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17
21
19
Tues
19
23
22
19
24
21
19
23
20
18
22
20
Wed
20
24
23
20
25
22
20
24
21
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23
21
Thurs
21
25
24
21
26
23
21
25
22
20
24
22
Fri
22
26
25
22
27
24
22
26
23
21
25
23
Sat
23
27
26
23
28
25
23
27
24
22
26
24
Sun
24
28
27
24
29
26
24
28
25
23
27
25
Mon
25
29
28
25
30
27
25
29
26
24
28
26
Tues
26
26
31
28
26
30
27
25
29
27
Wed
27
27
29
27
31
28
26
30
28
Thurs
28
28
30
28
29
27
29
Fri
29
29
29
30
28
30
Sat
30
30
30
29
31
Sun
31
31
30
01 06 10 14 19 23 27 32 36 40 45 49
02 07 11 15 20 24 28 33 37 41 46 50
03 08 12 16 21 25 29 34 38 42 47 51
04
29
30
31
13 17 22 26 30 35 39 43 48 52
Mon
31
IMEC • Europractice Office
IC Manufacturing Center
Kapeldreef 75
B-3001 Leuven, Belgium
Fraunhofer IIS
IC Manufacturing Center
Am Wolfsmantel 33
D-91058 Erlangen, Germany
Contact: P. Malisse
Tel.: +32-16-281 272
e-mail: mpc@imec.be
http://www.europractice-ic.com
Contact: T. Drischel
Tel.: +49 9131 776 4463
e-mail: europrac@iis.fraunhofer.de
Manufacturing centers
• Low-cost prototyping service on regular Multi-Project Wafer (MPW) runs
• Low-cost, low-volume service (up to millions of devices)
• A wide range of IC-technologies, down to 28nm (CMOS, SiGe, SiGe:C)
• Low-volume price estimation service
• Design and electrical rule checking on every submitted design
• Packaging service offering a wide range of ceramic and plastic packages
• Prototype and volume testing
• Customer interface with a single Manufacturing Center of choice (see below)
• Easy-to-use design order/registration process via WWW
• Cell libraries & design kits available.
ON Semi 0.7µ C07M-D & C07M-A
ON Semi 0.5µ CMOS EEPROM C5F & C5N
ON Semi 0.35µ C035U 4M
ON Semi 0.7µ C07M-I2T100 100 V
ON Semi 0.35µ C035 - I3T80U 80 V
ON Semi 0.35µ C035 - I3T50U 50 V
ON Semi 0.35µ C035 - I3T50U (E) 50 V
ON Semi 0.35µ C035 - I3T25U 3.3/25 V
ONC18MS - 0.18 µm
ONC18MS-LL - 0.18 µm
ONC18HPA - 0.18 µm
ONC18-I4T - 0.18 µm 45/70V
ams 0.35µ CMOS C35B4C3
ams 0.35µ CMOS C35OPTO
ams 0.35µ HV CMOS H35B4D3
ams 0.35µ SiGe-BiCMOS S35
ams 0.18µ CMOS C18
ams 0.18µ HV CMOS H18 50V/20V
BARC Diode for ams 0.35µ CMOS C35OPTO
WLCSP for ams 0.35µ CMOS C35B4C3
IHP SGB25V 0.25µ SiGe:C
IHP SGB25VGD 0.25µ SiGe:C
IHP SG25H1 0.25µ SiGe:C
IHP SG25H3P 0.25µ Complementary SiGe:C
IHP SG25H3 0.25µ SiGe:C
IHP SG25H4 0.25µ SiGe:C
IHP SG25H_EPIC (based on SG25H4)
IHP SG13S SiGe:C
IHP SG13C SiGe:C
IHP SG13G2 SiGe:C
IHP SG25 PIC
IHP BEOL SG25
IHP BEOL SG13
X-FAB XH018 0.18µ HV NVM
X-FAB XT018 0.18µ HV SOI
X-FAB XS018 0.18µ OPTO
TSMC 0.18 CMOS L/MS/RF
TSMC 0.18 CMOS HV CV018LD
TSMC 0.18 CMOS HV BCD Gen 2
TSMC 0.13 CMOS L/MS/RF, G or LP (8”)
TSMC 0.13 CMOS L/MS/RF, G or LP (12”)
TSMC 90nm CMOS L/MS/RF, G or LP
TSMC 65nm CMOS L/MS/RF, G or LP
TSMC 40nm CMOS L/MS/RF, G or LP
TSMC 28nm CMOS Logic, HPL (HKMG)
TSMC 28nm CMOS Logic, LP (SION)
TSMC 28nm CMOS Logic, HPM (HKMG)
UMC L180 Logic GII
UMC L180 Mixed-Mode/RF
UMC L180 Logic LL
UMC L180 EFLASH Logic GII
UMC CIS180 – CONV diode
UMC CIS180 – ULTRA diode
UMC CIS11
UMC L130 Logic
UMC L130 MM/RF
UMC L110AE L/MM/RF
UMC L65N L/MM/RF - SP
UMC L65N L/MM/RF - LL
GF 55 nm LPe/LPx-NVM/LPx-RF (mini@sic: only LPe)
GF 40 nm LP/LP-RF/RF-mmWave
GF 28 nm SLP/SLP-RF/HPP (mini@sic: only SLP)
GF 22 nm FDX
MEMSCAP METALMUMPS
MEMSCAP PolyMUMPS
MEMSCAP SOIMUMPS
MEMSCAP PIEZOMUMPS
ePIXfab-imec SiPhotonics Passives
ePIXfab-imec SiPhotonics ISIPP25G+
ePIXfab-LETI SiPhotonics Passives + Heater
Micralyne MicraGEM-Si
Teledyne Dalsa MIDIS
general MPW runs
general + MPW runs including mini@sic conditions
* only mini@sic conditions
serviced by imec
serviced by Fraunhofer IIS
If you require an estimate for a specific project or wish to discuss the
opportunities of the low-cost Multi-Project Wafer service,
you are invited to contact any of the Manufacturing Centers.
For general inquiries or assistance, please contact the
EUROPRACTICE ASIC Service office :
This project has received funding
from the European Union’s Seventh
Programme for research, technological
development and demonstration under
grant agreement No 610018.
Tel.: +32 16 281 272
e-mail: mpc@imec.be
For final MPW dates, please consult the website at
http://www.europractice-ic.com .
design & layout:
ASIC Multi-Project Wafer Schedule
The EUROPRACTICE IC Manufacturing and Testing Service (ASIC Service) is
co-ordinated by IMEC and offers industry and academia a fully supported,
low-cost route to ASIC design, prototyping and low-volume manufacturing.
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