Tape and Reel Standards
Vishay Semiconductors
Tape and Reel Standards
AVAILABLE PACKAGING
PACKAGE
10" TAPE AND REEL
13" TAPE AND REEL
AMMO PACK # 1
AMMO PACK # 2
QUANTITY/REEL
QUANTITY/REEL
QUANTITY/BOX
QUANTITY/BOX
SOD57
5000
5000
SOD64
2500
2500
TAPING SPECIFICATIONS SOD57 AND SOD64
DESCRIPTION
SYMBOL
SPECIFICATION (mm)
A
5.0 ± 0.5
B
52 + 2 mm - 1 mm
ID1-D2l
1.4 max.
Component pitch
Inside tape spacing
Lead to lead eccentricity
Lead extension
K
0
Lead bending
M
1.2 max.
Cumulative pitch
P
2 per 10 pitch
Exposed adhesive
S
0.8 max.
Tape width
T
6.0 ± 0.4
Tape leader
Beginning and end of reel or ammo pack
300 min.
Consecutive missing components not allowed
< 0.1 %
Empty spaces
All polarized components shall be oriented in the same direction.
The cathode tape shall be colored, and anode tape shall be white or light beige
Polarity marking
0.8 (0.031) max.
|D1 - D 2| = 1.4 (0.055) max.
D1
K
D2
S
A
0.8
(0.031)
max.
M
P
B
6.0 ± 0.4
(0.236 ± 0.0157)
T
W
Dimensions A, M, K, P, S and T apply to both sides
15802
Fig. 1
Document Number: 84068
Rev. 1.9, 05-Nov-08
For technical questions, contact: Diodes-SSP@vishay.com
www.vishay.com
1
Tape and Reel Standards
Tape and Reel Standards
Vishay Semiconductors
10" REEL SPECIFICATION (SOD57 AND SOD64 PACKAGES)
DESCRIPTION
SYMBOL
REEL SIZE 10"
Arbor hole diameter
D0
30 ± 1 mm
Core diameter
D1
71 ± 1 mm
Reel diameter
D2
250 ± 2 mm
Drive hole diameter
D3
10 ± 1 mm
Reel width
W1
68 ± 1 mm
Drive/arbor hole spacing
W2
27.5 ± 1 mm
Core material
Plastic
Reel material
Plastic
W1
D0
D3
D2
D1
W2
15801
Fig. 2
AMMOPACK # 1 SPECIFICATION (SOD57 AND SOD64 PACKAGES) (Figure 3)
DESCRIPTION
SPECIFICATION
SYMBOL
Length
A
INCHES
MILLIMETERS
10.25 ± 0.2
260 ± 5.0
Width
B
2.75 ± 0.2
70 ± 5.0
Height
C
5.75 ± 0.65
146 ± 16.0
Note
Material: corrugated board (neutral)
A
C
Inspection hole
(both sides)
B
15800
Fig. 3
www.vishay.com
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For technical questions, contact: Diodes-SSP@vishay.com
Document Number: 84068
Rev. 1.9, 05-Nov-08
Tape and Reel Standards
Tape and Reel Standards
PREFORMED LEADS (SOD64 PACKAGES)
Vishay Semiconductors
SUFFIX RAS
Some types of automatic insertion machines have problems
in bending the relatively thick leads of SOD64 Sinterglass
Diodes. To overcome this, our diodes can be ordered with
preformed leads as follows. Preformed Sinterglass Diodes
are shipped in bulk.
= ±1
H±1
= ±1
SUFFIX RA
= ±1
4
= ±1
2.6 max.
2.2 ± 0.2
A ± 0.3
H±1
21497
Fig. 6
A ± 0.3
2.6 max.
21495
Fig. 4
SUFFIX RAP
= ±1
4
1.5
H±1
= ±1
0.4
2 ± 0.2
2.6 max.
Ø 1.3
A ± 0.3
21496
Fig. 5
COMMON BENDING VERSION:
SUFFIX
RA 15/10
RA 17.5/10
A
(mm)
H
(mm)
RAS 15/10
RAP 15/10
15
10
RAS 17.5/10
RAP 17.5/10
17.5
10
Note
Other bending versions are available on request.
Document Number: 84068
Rev. 1.9, 05-Nov-08
For technical questions, contact: Diodes-SSP@vishay.com
www.vishay.com
3