India Semiconductor Association
CXO Conclave
Vijay Ullal
Group President
Consumer & Automotive Solutions
Maxim Integrated Products
India Semiconductor Association
CXO Conclave
1
Semiconductor Industry Trends
2
Adapting to These Trends
3
Future Engagements in India
4
Q&A
Maxim Integrated Products, Inc. Company Confidential
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3
1 Semiconductor Industry
Trends
Semiconductor
Industry
Trends
 System-Level Solutions
 Integration
 Sensors – The Third Revolution
 The End of Lateral Scaling?
 Complex and Global Eco-system
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Why System Level Solutions?
Time-toMarket
R&D Budgets
Performance
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Complexity
Expertise
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Why Integration?
Smaller, lighter, faster, simpler, cheaper
Phones
Computers
Wireless
Communications
Automobiles
1980s
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2000s
Today
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Why Integration?
Smaller, lighter, faster, simpler, cheaper
Medical/Industrial
Automotive
Energy
• Portability, reliability
• Space, weight
• Fewer parts = reliability
• Simplicity, TTM
Mobile
• Space, battery life
Communications
Infrastructure
• Size and power
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Computing
• Size, simplicity
Consumer
• Space, cost. power
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Analog Integration
An Irreversible Trend
1
2
3
Building
Blocks
System
Solutions
Analog
Integration
Amp
Interface
Data
Converter
Power
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Sensors: The Third Revolution
Robots that never get tired or grumpy
• Example: cars that drive themselves
Gadgets & homes that are always aware
• Example: Phones & homes that adapt to the user
Systems that monitor & heal themselves
• Example: smart energy grid
Maxim Integrated Products, Inc. Company Confidential
Maxim Integrated Products, Inc. Company Confidential
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11
Is Lateral Scaling Dead?
Development Costs, $M
Mask Costs, $K
$10,000
$50
$40
$1,000
$30
$100
$20
$10
$10
$1
$0
1980'S
2000'S
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2um
65nm
12
Companies Receiving Initial Venture Funding
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Complex and Global Eco-system
Software
SOC
SOC
Outsource
Mfg.
Outsource
Mfg.
Outsource
Mfg.
EDA
EDA
EDA
EDA
Semi
Equip
Semi
Equip
Semi
Equip
Semi
Equip
Semi
Equip
IDM
IDM
IDM
IDM
IDM
IDM
1960’s
1970’s
1980’s
1990’s
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2000’s
2010’s
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2 Adapting
to These
Trends to These Trends?
How
is Maxim
Adapting
 Embracing and Leading the Integration Trend
 Organizing by End-Market
 Investing in Sensors
 Developing 3D Technologies
 Partnering Globally in R&D and Manufacturing
 Refining Culture
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High-Performance Analog
Better designs start with better building blocks
Industry leading
temp accuracy
Highest precision and
smallest packages
Most flexible
supervisory products
Multichannel Low
power high precision
Lowest power with
highest precision
Robust 8kV ESD
rating, latch-up
immunity
High density, high
efficiency
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Highest ESD & fault
protected transceivers
Multichannel, low
power, Automated
Calibration
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Embracing and Leading Analog Integration
Solving Tough Technical Problems
Different Analog
Processes
Interference and
Noise
Mixing Analog
and Digital
 Different processes
for each technology
 Isolating analog and
digital crosstalk
 Advanced process
for both types
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Analog Integration – Mobile Power SoC
64% smaller with 37% fewer components
Analog
Integration
Handset Motherboard
Competing
Solution
Maxim
Solution
9
2
IC Size (mm2)
161
38
Component Count
121
76
Component Area (mm2)
321
117
IC Count
Baseband
Processor
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Applications
Processor
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Embracing and Leading Analog Integration
Other examples
Financial
Terminals
 Full system design with case
 Secure micro for data
encryption
IP TV Camera
 USB camera on a card
 Full 1080P streaming
capabilities
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Smart Meters
 Smart meter platform
 Industry leading accuracy to
0.1%
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Embracing and Leading in Analog Integration
% of Maxim Business from Integration
82%
82%
80%
74%
72%
68%
67%
66%
Building Block
18%
18%
20%
26%
28%
32%
33%
34%
High Integration
CY06 CY07 CY08 CY09 CY10 CQ111 CQ211 CQ311
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Organized By End-Markets
Technology, Business Unit and Sales
Tunc Doluca
President & CEO
Technology
Development &
Innovation Group
Communications &
Power Solutions
Group
Office of the CTO
Battery & Industrial
Power
Maxim Labs
Advanced IP
Development
EDA
Process Development
3DHI & WLP
Industrial & Medical
Solutions Group
Interface, Switch &
Protection
Communications &
Timing
System Sensing &
Interconnect Products
Worldwide Sales &
Marketing
Audio
Americas & Global
Distribution
Automotive
Europe, Middle East &
Africa
Microcontrollers
Handheld Power
Mixed Signal
RF Solutions
System & Power
Management
Consumer &
Automotive Solutions
Group
Human Interface
Secure Info
Sensing Solutions
Signal Processing and
Conditioning
Storage
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Japan
Korea
Pacific Rim
Customer Operations
Marketing
Sales Operations
Automotive
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Investing in Sensors
Innovations in human interface will transform electronics
 Optical Sensors
 Touch Sensors
 Gesture Sensors
 Inertial Sensors – SensorDynamics
 Sensor Fusion - algorithms
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Investing in 3D Integration
One size fits all process technologies are too complex
180
Total Processes
Including 180nm
developed for Power
SOC and other advanced
cell phones
100
60
10
Including 0.4um
developed for audio
DACs and cell phone
Including 1.2um
developed to support
high performance power
for RF and data
communications
Including 3um designed
for A/D and D/A
1989
1995
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2003
2011
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Investing in 3D Integration
Specialized QFN
Packages
 Ease of routing
 As small as 1mm2
Wafer-Level
Packages
System-inPackage
 Higher density
 Better heat transfer
 Highest integration
 Most cost effective
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Partnering Globally in R&D
Partner with
Customers
Internal
Collaboration and
IP Sharing
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Integration Tools
and Processes
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Partnering Globally in R&D
40 Technology Centers Worldwide
Over 2,000 Engineers covering greater than 28 technologies
Milan, Italy
Seoul, Korea
Sunnyvale, CA
Catania, Italy
Dallas, TX
Bangalore, India
Shenzhen, China
Other locations: Arizona, California, Colorado, Florida, Illinois, Indiana, North Carolina, Massachusetts,
Michigan, Oregon, Rhode Island, Texas, Austria, France, Germany, Italy, Scotland, Turkey, UK, China,
Philippines, Taiwan, Japan
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Partnering Globally in Manufacturing
Flexible “Hybrid” Manufacturing
Capacity to support $3.4B in revenue
Beaverton,
Oregon
San Antonio,
Texas
San Jose,
California
Maxim Wafer Fabrication Facilities
Seiko-Epson
Japan
Powerchip, Taiwan
(200mm)
Partner Foundries (Maxim Process)
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Powerchip, Taiwan
(300mm)
TSMC, Taiwan
Partner
Merchant Foundries
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Partnering Globally in Manufacturing
High Volume Assembly and Test Capabilities
Batangas,
Philippines
Cavite,
Philippines
Chonburi,
Thailand
Maxim Assembly and Test Locations
ASE
Taiwan
Dallas,
Texas
Maxim Bump Fab
UTAC
Thailand
Partner Assembly & Test Houses
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Refining Our Culture
Innovate
Collaborate
“Be Bold”
“One Maxim”
Maximize Your
Potential
Make a
Difference
Core Values Build on Our Principles
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Future
forEngagements
Maxim ininIndia
3 Future
India
 Continue to attract the best R&D talent
 Provide the right environment for this talent
 Empower local leadership
 Partner for firmware, software and algorithms
 Partner with India’s top academic and research institutions
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Summary
 The semiconductor industry continues to evolve with
> System level solutions leading to analog integration
> Sensors and changing economics of lateral scaling
> A more complex and global eco-system
 We need to rapidly adapt to and lead these changes by
>
>
>
>
>
Embracing and Leading the Integration Trend
Organizing by End-Market
Investing in Sensor and 3D Technologies
Partnering Globally in R&D and Manufacturing
Refining Our Culture
 We will continue to invest in India as a major R&D Center
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