SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT

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Data Sheet
SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH
General Description
Features
The AP3616 is an sixteen-channel constant current
sink with current match used for LED driver. It uses an
external resistor to set the current for sixteen LED
strings with an accuracy of ±1.5%. The full scale LED
current can be adjusted from 20mA to 75mA for each
channel. The LED lightness can be adjusted by PWM
dimming function.
·
·
·
·
·
·
·
·
·
·
The device can keep working normally without any
damage when LEDs are short or open. It features under
voltage lockout protection and over temperature protection.
The AP3616 has three interface terminals (FB, SYN
and FBX pins). The FB and SYN pins allow the device
to work with a DC/DC converter to drive LED arrays
for good performance. And the FBX pin enables the
device to be connected in parallel.
AP3616
Input Voltage Range: 4.2V to 27V
Maximum Output Current: Typical 1.2A (75mA
per Channel)
Current Match Accuracy (Typical): ±1.5%
PWM / Linear Dimming Control
Open LED Self-check and Protection
Flexible Short LED Protection
Under Voltage Lockout Protection
Over Temperature Protection
FBX and SYN Pins Enable Parallel Application
Over Voltage Protection
Applications
·
·
·
LCD Display Modules
LCD Monitor
LCD TV
The AP3616 is available in SOIC-28 and HSOP-28
packages.
SOIC-28
HSOP-28
Figure 1. Package Types of AP3616
Jul. 2012 Rev. 1. 2
BCD Semiconductor Manufacturing Limited
1
Data Sheet
SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH
AP3616
Pin Configuration
M Package
(SOIC-28)
M28 Package
(HSOP-28)
CH1
CH2
CH3
CH4
CH5
CH6
1
28
2
27
3
26
CH7
CH8
FLAG
FB
FBX
EN
VIN
GND
4
25
5
24
6
23
7
22
8
21
9
20
10
19
11
18
12
17
13
16
14
15
CH9
CH10
CH11
CH12
CH13
CH14
CH1
CH2
CH3
CH4
CH5
CH6
CH7
CH15
CH16
OVP
SCP
SYN
SYNF
DIM
ISET
CH8
CH9
CH10
CH11
CH12
CH13
CH14
1
28
2
27
3
26
4
25
5
24
6
23
7
22
8
21
9
20
10
19
11
18
12
17
13
16
14
15
CH16
OVP
SCP
SYN
SYNF
DIM
ISET
GND
VIN
EN
FBX
FB
FLAG
CH15
Figure 2. Pin Configuration of AP3616 (Top View)
Jul. 2012 Rev. 1. 2
BCD Semiconductor Manufacturing Limited
2
Data Sheet
SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH
AP3616
Pin Description
Pin Number
Pin Name
Function
SOIC-28
HSOP-28
1 to 8
28 to 21
1 to 8
9 to 15 & 28
9
16
FLAG
Error flag pin. When LED load goes to error (short or open ), the flag
open drain output will close
10
17
FB
Feedback pin. This pin is an interface terminal, which samples the
voltage of each channel, and outputs the lowest voltage of the string
to DC/DC converter
11
18
FBX
This pin is an interface terminal. Connect it to FB pin can achieve
parallel application. If not used, leave it unconnected
12
19
EN
Enable pin. Logic high enables the IC and logic low disables the IC
13
20
VIN
Input voltage pin
14
21
GND
Ground pin
15
22
ISET
LED current setting pin. An external resistor is connected to this pin.
Current on each channel can be expressed by ICHANNEL=1.194*1560/RISET
16
23
DIM
Dimming control pin. Adding a PWM signal or DC signal to this pin
to control LED dimming. Connect it to high voltage level if not used
17
24
SYNF
Synchronous PWM frequency setting pin. A nF level of capacitor
should be connected to this pin to set PWM frequency at about 80Hz
to 25kHz
18
25
SYN
PWM dimming synchronous pin, this pin outputs DC transformed
PWM signal to synchronize parallel AP3616 and power converter, if
not used, leave it unconnected
19
26
SCP
LED short trigger voltage setting pin. This pin is used to set the LED
short circuit protection voltage level
20
27
OVP
This pin is used to trigger OVP condition. OVP triggering voltage
should be lower than the OVP voltage of its cascade chip, such as ,
AP3039A in Figure 19
CH1 to CH8 White LED cathode connection pins. If not used, leave them unconCH9 to CH16 nected
Jul. 2012 Rev. 1. 2
BCD Semiconductor Manufacturing Limited
3
Data Sheet
SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH
AP3616
Functional Block Diagram
CH1_IREF
x3120
1 1
2µA
COMP
(
SCP
200mV
COMP
x1
AGND
Short
Detection
COMP
x7
COMP
21 15
&
28
_
VDD
19(26)
+
+
_
0.26V
VREF
SCP
SCP Open
Detection
18(25)
SYN
Open
Detection
16(23)
PWM
Latch
Block
DIM
13µA
9(16)
Open LED
COMP
10(17)
SET
RS
RESET
COMP
Q_BAR
SEL
LOW
11(18)
FBX
2.2V
17(24)
+
_
13µA
x1
Bandgap
x4
x4
AMP
EN
SYNF
0.5V
VDD
Regulator
12(19)
VIN 13(20)
14(21)
+
_
VREF
UVLO
GND
VDD=5V
COMP
VDD
VCH 16 to 1
EN
OVP
1.194V
SCP
Short LED
FB
VREF
AGND
VDS1
VDS1=VDD
FLAG
COMP
AMP
x1
8 8
28 9
CH16
OVP_EN
(
CH1
20(27)
PGND
CH_IREF 1 to 16
15(22)
ISET
AGND
PGND
A(B)
A for SOIC-28
B fro HSOP-28
Figure 3. Functional Block Diagram of AP3616
Jul. 2012 Rev. 1. 2
BCD Semiconductor Manufacturing Limited
4
Data Sheet
SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH
AP3616
Ordering Information
AP3616
-
Circuit Type
G1: Green
Package
M: SOIC-28
M28:HSOP-28
Package
Blank: Tube
Temperature Range
SOIC-28
HSOP-28
-40 to 85oC
Part Number
Marking ID
Packing Type
AP3616M-G1
AP3616M-G1
Tube
AP3616M28-G1
AP3616M28-G1
Tube
BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and green.
Absolute Maximum Ratings (Note 1)
Parameter
Symbol
Value
Unit
VIN
30
V
VFLAG
30
V
VEN
30
V
VCHX
-0.3 to 60
V
Input Voltage
FLAG Pin Voltage
EN Pin Voltage
Voltage on Each Channel
Voltage on Other Seperate Pins
Thermal Resistance (Junction to
Ambient, No Heat Sink)
SOIC-28
θJA
HSOP-28
Operating Junction Temperature
Lead Temperature (Soldering, 10sec)
ESD (Human Body Model)
ESD (Machine Model)
-0.3 to 6
V
72
oC/W
59
o
TJ
150
TSTG
-65 to 150
C/W
oC
o
2000
C
V
200
V
Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated
under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods
may affect device reliability.
BCD Semiconductor Manufacturing Limited
Jul. 2012 Rev. 1. 2
5
Data Sheet
SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH
AP3616
Recommended Operating Conditions
Parameter
Symbol
Min
Max
Unit
Input Voltage
VCC
4.2
27
V
Recommended PWM Dimming Frequency
fPWM
0.08
25
kHz
20
40
20
60
20
75
-40
85
Full Scale Setting Current per Channel
VCHX=0.5V
ICHX
VCHX=0.8V
VCHX=1.2V
TA
Operating Temperature Range
mA
oC
Electrical Characteristics
VIN=24V, VEN=5V, TA=25oC, unless otherwise specified. Boldface type apply over the full operating tempera-
ture range (TA=-40oC to 85oC).
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
VCC SECTION
Quiescent Current
IQ
ISET, SYN and FB
Pin Floating
2
4
mA
Shutdown Supply Current
ISTBY
0.1
1
µA
Under Voltage Lockout Threshold
VUVLO
VEN=0V, ISET,SYN
and FB Pin Floating
VIN Falling Edge
3.9
4.15
V
Under Voltage Lockout Hysteresis
VUVLO_HYS
3.65
300
mV
CHANNEL SECTION
Maximum Output Current per Channel
ICHX_MAX
VCHX=0.8V, RISET=0
Current Sink Saturation Voltage per
Channel
VCHX_SAT
ICHX=60mA
75
mA
0.6
V
I
=60mA,
Current Matching Accuracy between Any
ICH_MATCHING CHX
Two Channels
VCH=0.8V
3
%
Output Current Load Regulation
VCHX=0.5V to 2.8V
4
%
Output Current Line Regulation (Note 2)
VCHX=4.2V to 2.8V
2
%/V
Note 2: Guaranteed by design (GBD).
Jul. 2012 Rev. 1. 2
BCD Semiconductor Manufacturing Limited
6
Data Sheet
SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH
AP3616
Electrical Characteristics (Continued)
VIN=24V, VEN=5V, TA=25oC, unless otherwise specified. Boldface type apply over the full operating tempera-
ture range (TA=-40oC to 85oC).
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
DIMMING SECTION
PWM High Level Threshold Voltage
VIH_PWM
PWM Low Level Threshold Voltage
VIL_PWM
Linear Dimming Level
2.5
V
0.3
V
2.2
V
VL_DIM
0.5
ISCP
10.5
12.5
14.5
µA
1.170
1.194
1.218
V
LED SHORT PROTECTION SECTION
SCP Current
CURRENT SINK SECTION
ISET Reference Voltage
ICHX/ISET Current Multiplication Ratio
VISET
k
RISET=30k, CH1 to
CH16 Floating
RISET=30k, VCHX=1V
1615
ENABLE SECTION
EN Pin High Level Threshold
VIH_EN
EN Pin Low Level Threshold
VIL_EN
2.0
V
0.8
V
1.250
V
0.3
V
25
kHz
OVP SECTION
Threshold Voltage
VTHRESHOLD
1.130
1.194
FLAG SECTION
Saturation Voltage
VSAT
ISINK=2mA
SYN SECTION
PWM Frequency
fPWM
0.08
SYNF High Level Output Voltage
VOUT_H
2.4
SYNF Low Level Output Voltage
VOUT_L
V
0.4
V
FB SECTION
Feedback Output Current
IFB
VFB Drop to 97%
13
17
µA
TOTAL DEVICE
Thermal Shutdown Temperature
TOTSD
Thermal Shutdown Hysteresis
THYS
CHX Pin Left Foating
160
o
C
20
o
C
BCD Semiconductor Manufacturing Limited
Jul. 2012 Rev. 1. 2
7
Data Sheet
SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH
AP3616
Typical Performance Characteristics
VIN=24V, VEN=5V, RISET=30kΩ,, TA=25oC, unless otherwise specified.
200
0.56
0.54
160
0.52
140
Feedback Voltage (V)
Maximum Channel Current (mA)
180
120
100
80
60
40
20
0.50
0.48
0.46
0.44
0.42
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.40
1.6
4
6
8
10
Channel Voltage (V)
12
14
16
18
20
Feedback Current (µA)
Figure 4. Maximum Channel Current vs. Channel Voltage
Figure 5. Feedback Voltage vs. Feedback Current
70
65
60
55
50
50
Current per Channel (mA)
Current per Channel (mA)
60
40
30
20
10
45
40
35
30
25
20
15
f=100Hz
f=20kHz
10
5
0
0
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-5
2.2
0
Linear Dimming Voltage (V)
10
20
30
40
50
60
70
80
90
100
Duty Cycle (%)
Figure 7. Current per Channel vs. Duty Cycle
(PWM Dimming)
Figure 6. Channel Current vs. Linear Dimming Voltage
Jul. 2012 Rev. 1. 2
BCD Semiconductor Manufacturing Limited
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Data Sheet
SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH
AP3616
Typical Performance Characteristics (Continued)
VIN=24V, VEN=5V, RISET=30kΩ,, TA=25oC, unless otherwise specified.
65
1.4
64
1.3
ISET Reference Voltage (V)
Channel Current (mA)
63
62
61
60
59
58
57
56
55
1.2
1.1
1.0
0.9
0.8
-50
-25
0
25
50
75
100
125
150
-50
o
-25
0
Temperature ( C)
25
50
75
100
125
150
o
Temperature ( C)
Figure 9. ISET Reference Voltage vs. Temperature
Figure 8. Channel Current vs. Temperature
0.8
2.2
2.1
0.7
2.0
1.9
Quiescent Current (mA)
Saturation Voltage (V)
0.6
0.5
0.4
0.3
0.2
1.8
1.7
1.6
1.5
1.4
1.3
1.2
0.1
1.1
0.0
-50
-25
0
25
50
75
100
125
1.0
150
3
o
Temperature ( C)
6
9
12
15
18
21
24
27
Input Voltage (V)
Figure 10. Saturation Voltage vs. Temperature
Figure 11. Quiescent Current vs. Input Voltage
BCD Semiconductor Manufacturing Limited
Jul. 2012 Rev. 1. 2
9
Data Sheet
SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH
AP3616
Typical Performance Characteristics (Continued)
Current per Channel (mA)
VIN=24V, VEN=5V, RISET=30kΩ,, TA=25oC, unless otherwise specified.
63.6
63.4
63.2
63.0
62.8
62.6
62.4
62.2
62.0
61.8
61.6
61.4
61.2
61.0
60.8
60.6
60.4
60.2
60.0
VDIM
5V/div
VSYN
5V/div
VGATE
10V/div
o
TA=-40 C
o
TA=125 C
ICH
50mA/div
o
TA=25 C
0
2
4
6
8
10
12
14
16
Time 4ms/div
Channel
Figure 12. Current per Channel vs. Channel
Figure 13. PWM Dimming (f=100Hz, Duty Cycle=50%)
VSYNF
1V/div
VDIM
5V/div
VSYN
5V/div
VSYN
5V/div
VGATE
10V/div
VGATE
10V/div
ICH
50mA/div
ICH
100mA/div
Time 20µs/div
Time 800µs/div
Figure 14. PWM Dimming (f=20kHz, Duty Cycle=50%)
Figure 15. Linear Dimming (VDIM=1.4V)
Jul. 2012 Rev. 1. 2
BCD Semiconductor Manufacturing Limited
10
Data Sheet
SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH
AP3616
Typical Performance Characteristics (Continued)
VIN=24V, VEN=5V, RISET=30kΩ,, TA=25oC, unless otherwise specified.
VOVP
1V/div
VSCP
1V/div
ICH
50mA/div
I CH
100mA/div
VFB
1V/div
VCH
5V/div
VFLAG
5V/div
VFLAG
5V/div
Time 4µs/div
Time 400µs/div
Figure 16. LED Open Protection
Figure 17. LED Short Protection
VGATE
5V/div
ICH
50mA/div
Time 2s/div
Figure 18. OTP and Recovery
BCD Semiconductor Manufacturing Limited
Jul. 2012 Rev. 1. 2
11
Data Sheet
SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH
AP3616
Function Description
The AP3616 integrates an OVP circuit. The OVP pin
is connected to the center tap of voltage-divider (ROV3
and ROV4) that placed between high voltage output
and GND (Figure 19). If the voltage on OVP pin
exceeds 1.194V, which may results from open loop or
excessive output voltage, the AP3616 will start LED
open protection.
1. LED Current Setting
The maximum LED current per channel can be
adjusted up to 75mA via ISET pin. When ≥ 75mA
current is needed in application, two or more channels
can be paralleled to provide larger drive current. Connect a resistor RISET between ISET pin and GND to
set the reference current ISET. The LED current is
determined by the following equation.
I LED ( mA ) =
VOVP =
k ⋅ V ISET
156 0 × 1.194
=
R ISET ( kΩ )
R ISET ( kΩ )
(R OV3 + R OV4 ) ×1.194V
R OV4
4. LED Short-circuit Protection
The AP3616 integrates an LED short-circuit
protection circuit. During normal operation, any shortcircuited LED will cause the corresponding LED pin
voltage to rise. If any LED pin voltage exceeds 8
times of the voltage at SCP pin, the corresponding
LED current sink will be latched off, while the
remaining string(s) keep normal operation. Toggle the
VIN and/or EN to reset the latch. An internal current
source was connected to this pin, a resistor connected
here is used to set the shorting LED trigger voltage.
2. Dimming Control
The AP3616 provides two dimming methods: external
PWM signal or DC voltage input. Applying a PWM
signal to DIM pin to adjust the LED current, that
means, the LED current of all enabled channels can be
adjusted at the same time and the LED brightness can
be adjusted from 1%*ICHX_MAX to 100%*ICHX_MAX.
During the high level period of PWM signal, the LED
is turned on and 100% of the current flows through
LED, while during the low level period of the PWM
signal, the LED is turned off and almost no current
flows through the LED, thus changing the average
current through LED and finally adjusting LED
brightness. The external PWM signal frequency
applied to PWM pin is allowed to be 80Hz or higher.
5. LED Open-circuit Protection
The AP3616 integrates an LED Open-Circuit Protection circuit. When any LED string is open, VOUT will
boost up until the voltage at OVP pin reaches an
approximate 1.194V threshold. The IC will automatically ignore the open string(s) whose CHX pin voltage
is less than 100mV.
3.Over Voltage Protection
Jul. 2012 Rev. 1. 2
BCD Semiconductor Manufacturing Limited
12
Data Sheet
SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH
AP3616
Typical Application
R2
C1
(Optional) (Optional)
R3
L
+24V
Css
GND
CS
GND
RT
11
10
R10
(Optional)
9
RT
8
100k
U1
SYN
µ
R5 62k
RCS1
RCS2
300mΩ
300mΩ
FBX
VCC=24V
VIN
RG
C2
0.1 µ F/50V
2Ω
PWM / Linear
Dimming
1µF
(Optional)
51Ω
DIM
AP3616
FB
R10 PWM
CH16
OUT
SHDN
R4
100k
C3
6.8nF
R7
130k
R6
30k
R8
51Ω
OVP
VCC
EN
7
VIN
12x16
3.9k 10nF/16V
12
FLAG
6
CV
0.47µF/25V
RUVLO_2 2.7k
5
ROV4
4.3k
SYNF
4
FB
ROV2
4.3k
SCP
51Ω
EN
22nF/16V
CC
CH1
EN
3
RC
13
ROV3
150k
OVP2
CH2
+24V (VCC) R1
COMP
OV
14
ROV1
200k
OVP1
ISET
2
SS
LED Arrays
COUT2
10 µF/100V
GND
OVP1
UVLO
VOUT
D
MBRD360 COUT1
60V/3A 10 µF/100V
FQD13N06L
60V/11A
C4
(Optional)
1
AP3039A
20k
RUVLO_1
CIN2 CIN3
CIN1
22µF/50V
(Optional)
47µH/4A
R9
1k
OVP2
EN +5V
Single Chip Application (12S16P)
R2
C1
(Optional) (Optional)
(Optional)
L
+24V
Css
C2
0.1µF/50V
R4
100k
R6_1
30k
FBX
VCC=24V
C2
0.1µF/50V
C3_1
R7_1
6.8nF
130k
U3
VIN
CH16
R10 PWM
DIM
AP3616
FB
51Ω
FBX
C3
R7
R6
6.8nF
30k 130k
OVP
U2
SYN
DIM
FLAG
VCC=24V
VIN
RG
2Ω
AP3616
FB
EN
R5 62k
RCS2
300m Ω
SYNF
SYN
RCS1
300mΩ
SCP
100k
U1
CH1
R11_1
(Optional)
RT
CH2
RT
8
ISET
GND
10
9
GND
CS
CH16
GND
OVP
OUT
SHDN
12x32
3.9k 10nF/16V
11
FLAG
VCC
ROV4
4.3k
CH2
7
VIN
12
ROV2
4.3k
60V/11A
EN
6
FB
22nF/16V
CC
CH1
RUVLO_2 2.7k
CV
0.47µF/25V
5
EN
RC
13
SYNF
4
OV
14
SCP
3
51Ω
SS
COMP
ROV3
150k
OVP2
ISET
EN
UVLO
ROV1
200k
OVP1
COUT2
10µF/100V
GND
+24V (VCC) R1
2
LED Arrays
VOUT
D
MBRD360
COUT1
60V/3A
µ
FQD13N06L 10 F/100V
C4
(Optional)
1
OVP1
R3
47µH/4A
AP3039A
20k
CIN2 CIN3
RUVLO_1
CIN1
22µF/50V
PWM / Linear
Dimming
1 µF
(Optional)
R8
51Ω R9
1k
R9_1 OVP2
1k
R8_1
51Ω
+5V
+5V
OVP2
EN
Multi Chips Application (12S32P)
Figure 19. Typical Applications of AP3616
BCD Semiconductor Manufacturing Limited
Jul. 2012 Rev. 1. 2
13
Data Sheet
SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH
AP3616
Mechanical Dimensions
Unit: mm(inch)
SOIC-28
17.700(0.697)
18.100(0.713)
0.204(0.008)
0.330(0.013)
7.400(0.291)
7.700(0.303)
10.210(0.402)
10.610(0.418)
0°
8°
1.270(0.050)
BSC
0.330(0.013)
0.510(0.020)
0.400(0.016)
1.270(0.050)
0.100(0.004)
0.300(0.012)
2.350(0.093)
2.650(0.104)
2.290(0.090)
2.500(0.098)
Note: Eject hole, oriented hole and mold mark is optional.
Jul. 2012 Rev. 1. 2
BCD Semiconductor Manufacturing Limited
14
Data Sheet
SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH
AP3616
Mechanical Dimensions (Continued)
Unit: mm(inch)
HSOP-28
17.890(0.704)
18.190(0.716)
0.204(0.008)
0.360(0.014)
0.400(0.016)
1.270(0.050)
10.000(0.394)
10.650(0.419)
7.400(0.291)
7.600(0.300)
0o ~8 o
0.800(0.031) TYP
5.050(0.199)
5.250(0.207)
0.230(0.009)
0.470(0.019)
0.100(0.004)
0.300(0.012)
2.180(0.086)
2.330(0.092)
2.280(0.090)
2.630(0.104)
Note: Eject hole, oriented hole and mold mark is optional.
Jul. 2012 Rev. 1. 2
BCD Semiconductor Manufacturing Limited
15
BCD Semiconductor Manufacturing Limited
http://www.bcdsemi.com
IMPORTANT NOTICE
IMPORTANT
NOTICE
BCD Semiconductor
BCD
Semiconductor Manufacturing
Manufacturing Limited
Limited reserves
reserves the
the right
right to
to make
make changes
changes without
without further
further notice
notice to
to any
any products
products or
or specifispecifications herein.
cations
herein. BCD
BCD Semiconductor
Semiconductor Manufacturing
Manufacturing Limited
Limited does
does not
not assume
assume any
any responsibility
responsibility for
for use
use of
of any
any its
its products
products for
for any
any
particular purpose,
particular
purpose, nor
nor does
does BCD
BCD Semiconductor
Semiconductor Manufacturing
Manufacturing Limited
Limited assume
assume any
any liability
liability arising
arising out
out of
of the
the application
application or
or use
use
of any
of
any its
its products
products or
or circuits.
circuits. BCD
BCD Semiconductor
Semiconductor Manufacturing
Manufacturing Limited
Limited does
does not
not convey
convey any
any license
license under
under its
its patent
patent rights
rights or
or
other rights
other
rights nor
nor the
the rights
rights of
of others.
others.
MAIN SITE
SITE
MAIN
- Headquarters
BCD
Semiconductor Manufacturing Limited
BCD
Semiconductor
Manufacturing Limited
- Wafer
Fab
No.
1600, Zi
Xing Road,
Shanghai ZiZhu
Science-basedLimited
Industrial Park, 200241, China
Shanghai
SIM-BCD
Semiconductor
Manufacturing
Tel:
Fax: +86-21-24162277
800,+86-21-24162266,
Yi Shan Road, Shanghai
200233, China
Tel: +86-21-6485 1491, Fax: +86-21-5450 0008
REGIONAL SALES OFFICE
Shenzhen OfficeSALES OFFICE
REGIONAL
- Wafer
FabSemiconductor Manufacturing Limited
BCD
Shanghai
SIM-BCD
Semiconductor Manufacturing Co., Ltd.
- IC Design
Group
800 Yi
Shan Road,
Shanghai
200233,
China Corporation
Advanced
Analog
Circuits
(Shanghai)
Tel: +86-21-6485
1491,YiFax:
0008200233, China
8F, Zone B, 900,
Shan+86-21-5450
Road, Shanghai
Tel: +86-21-6495 9539, Fax: +86-21-6485 9673
Taiwan Office
Shanghai
Semiconductor Manufacturing Co., Ltd., Shenzhen Office
BCD Taiwan
Semiconductor
Shenzhen SIM-BCD
Office
Office (Taiwan) Company Limited
Unit
A Room
1203, Skyworth
Bldg., Gaoxin
Ave.1.S., Nanshan
Shenzhen,
4F, 298-1,
Guang Road,(Taiwan)
Nei-Hu District,
Taipei,
Shanghai
SIM-BCD
Semiconductor
Manufacturing
Co., Ltd.District,
Shenzhen
Office
BCDRui
Semiconductor
Company
Limited
China
Taiwan
Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office
4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei,
Tel:
+86-755-8826
Tel: +886-2-2656
2808
Room
E, 5F, Noble 7951
Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China
Taiwan
Fax:
+86-755-88267951
7865
Fax: +886-2-2656
28062808
Tel: +86-755-8826
Tel: +886-2-2656
Fax: +86-755-8826 7865
Fax: +886-2-2656 2806
USA Office
BCD Office
Semiconductor Corp.
USA
30920Semiconductor
Huntwood Ave.Corporation
Hayward,
BCD
CA 94544,
USA Ave. Hayward,
30920
Huntwood
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