NLX2G07
Dual Non-Inverting Buffer,
Open Drain
The NLX2G07 MiniGatet is an advanced high−speed CMOS dual
non−inverting buffer with open drain output in ultra−small footprint.
The NLX2G07 input and output structures provide protection when
voltages up to 7.0 V are applied, regardless of the supply voltage.
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Features
MARKING
DIAGRAMS
UDFN6
1.0 x 1.0
CASE 517BX
A
M
UDFN6
1.2 x 1.0
CASE 517AA
K
High Speed: tPD = 2.3 ns (Typ) @ VCC = 5.0 V
Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
Power Down Protection Provided on inputs
Balanced Propagation Delays
Overvoltage Tolerant (OVT) Input and Output Pins
Ultra−Small Packages
These are Pb−Free Devices
M
V
•
•
•
•
•
•
•
M
1
1
IN A1
6
1
UDFN6
1.45 x 1.0
CASE 517AQ
OUT Y1
1
GND
2
5
R, A, K, V = Device Marking
M
= Date Code
VCC
ORDERING INFORMATION
IN A2
3
4
OUT Y2
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
Figure 1. Pinout (Top View)
IN A1
1
OUT Y1
IN A2
1
OUT Y2
Figure 2. Logic Symbol
PIN ASSIGNMENT
1
2
GND
3
IN A2
Y
4
OUT Y2
L
Z
5
VCC
6
OUT Y1
FUNCTION TABLE
A
L
H
© Semiconductor Components Industries, LLC, 2016
June, 2016 − Rev. 5
IN A1
1
Publication Order Number:
NLX2G07/D
NLX2G07
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
−0.5 to +7.0
V
VIN
DC Input Voltage
−0.5 to +7.0
V
DC Output Voltage
−0.5 to +7.0
V
VIN < GND
−50
mA
VOUT < GND
−50
mA
VOUT
Parameter
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
DC Output Source/Sink Current
±50
mA
ICC
DC Supply Current Per Supply Pin
±100
mA
IGND
DC Ground Current per Ground Pin
±100
mA
TSTG
Storage Temperature Range
−65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
150
°C
MSL
FR
ILATCHUP
Moisture Sensitivity
Level 1
Flammability Rating Oxygen
Index: 28 to 34
UL 94 V−0 @ 0.125 in
±500
Latchup Performance Above VCC and Below GND at 125°C (Note 5)
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/UESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
1.65
5.5
V
Digital Input Voltage
0
5.5
V
Output Voltage
0
5.5
V
−55
+125
°C
0
0
100
20
ns/V
VCC
Positive DC Supply Voltage
VIN
VOUT
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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2
NLX2G07
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
VIH
Low−Level
Input Voltage
VIL
VOL
Conditions
Low−Level
Input Voltage
Low−Level
Output
Voltage
TA = 255C
TA = +855C
TA = −555C to
+1255C
VCC
(V)
Min
1.65−
1.95
0.75 x
VCC
0.75 x
VCC
0.75 x
VCC
2.3 to
5.5
0.70 x
VCC
0.70 x
VCC
0.70 x
VCC
Typ
Max
Min
Max
Min
Max
V
1.65−
1.95
0.25 x
VCC
0.25 x
VCC
0.25 x
VCC
2.3 to
5.5
0.30 x
VCC
0.30 x
VCC
0.30 x
VCC
VIN = VIH or VIL
IOL = 50 mA
1.65−
5.5
0.1
0.1
0.1
VIN = VIH or VIL
IOL = 4 mA
IOL = 8 mA
IOL = 12 mA
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
1.65
2.3
2.7
3.0
3.0
4.5
0.24
0.3
0.4
0.4
0.55
0.55
0.24
0.3
0.4
0.4
0.55
0.55
0.24
0.3
0.4
0.4
0.55
0.55
0.08
0.2
0.22
0.28
0.38
0.42
Unit
V
V
ILKG
Z−State
Output
Leakage
Current
VIN = VIH,
VOUT = VCC or
GND
5.5
±5.0
±10
±10
mA
IIN
Input
Leakage
Current
0 v VIN v 5.5 V
0 to
5.5
±0.1
±1.0
±1.0
mA
IOFF
Power Off
Input
Leakage
Current
0 v VIN,
VOUT v 5.5 V
0
1.0
10
10
mA
ICC
Quiescent
Supply
Current
VIN = 0 or VCC
5.5
1.0
10
10
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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3
NLX2G07
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 nS)
VCC
(V)
Test
Condition
1.65−1.95
TA = −555C
to +1255C
TA = 255C
Min
Typ
Max
Min
Max
Unit
RL = R1 = 5000 W,
CL = 15 pF
1.8
5.3
11.5
1.8
12
ns
2.3−2.7
RL = R1 = 500 W,
CL = 50 pF
1.2
3.7
5.8
1.2
6.4
3.0−3.6
RL = R1 = 500 W,
CL = 50 pF
0.8
2.9
4.4
0.8
4.8
4.5−5.5
RL = R1 = 500 W,
CL = 50 pF
0.5
2.3
3.5
0.5
3.9
1.65−1.95
RL = R1 = 5000 W,
CL = 15 pF
1.8
5.3
11.5
1.8
12
2.3−2.7
RL = R1 = 500 W,
CL = 50 pF
1.2
2.8
5.8
1.2
6.4
3.0−3.6
RL = R1 = 500 W,
CL = 50 pF
0.8
2.1
4.4
0.8
4.8
4.5−5.5
RL = R1 = 500 W,
CL = 50 pF
0.5
1.4
3.5
0.5
3.9
Input Capacitance
5.5
VIN = 0 V or VCC
2.5
pF
COUT
Output Capacitance
5.5
VIN = 0 V or VCC
4
pF
CPD
Power Dissipation Capacitance
(Note 6)
3.3
5.5
10 MHz
VIN = 0 V or VCC
4
pF
Symbol
tPZL
tPLZ
CIN
Parameter
Propagation Delay
(Figures 3 and 4)
Propagation Delay
(Figures 3 and 4)
ns
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no−load
dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC.
VCC
A
50%
GND
tPZL
Y
tPLZ
50% VCC
HIGH
IMPEDANCE
VOL )0.3 V
Figure 3. Switching Waveforms
VCC
R1
PULSE
GENERATOR
DUT
RT
CL
RT = ZOUT of pulse generator (typically 50 W)
Figure 4. Test Circuit
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4
RL
VCC
2
NLX2G07
ORDERING INFORMATION
Package
Shipping†
NLX2G07MUTCG
UDFN6, 1.2 x 1.0, 0.4P
(Pb−Free)
3000 / Tape & Reel
NLX2G07AMUTCG
UDFN6, 1.45 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
NLX2G07CMUTCG
UDFN6, 1.0 x 1.0, 0.35P
(Pb−Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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5
NLX2G07
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA
ISSUE D
EDGE OF PACKAGE
PIN ONE
REFERENCE
2X
0.10 C
ÉÉ
ÉÉ
ÉÉ
L1
E
DETAIL A
Bottom View
(Optional)
TOP VIEW
2X
EXPOSED Cu
0.10 C
(A3)
0.10 C
A1
A
10X
0.08 C
MOLD CMPD
ÉÉÉ
ÉÉÉ
5X
DIM
A
A1
A3
b
D
E
e
L
L1
L2
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
1.20 BSC
1.00 BSC
0.40 BSC
0.30
0.40
0.00
0.15
0.40
0.50
MOUNTING FOOTPRINT*
6X
C
A1
A3
DETAIL B
Side View
(Optional)
SEATING
PLANE
SIDE VIEW
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
D
6X
0.42
0.22
L
3
L2
6X
b
0.10 C A B
0.05 C
6
0.40
PITCH
4
e
NOTE 3
1.07
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
6
NLX2G07
PACKAGE DIMENSIONS
UDFN6 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
A
B
D
L
L
L1
PIN ONE
REFERENCE
0.10 C
ÉÉÉ
ÉÉÉ
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
DETAIL B
MOLD CMPD
DETAIL B
0.05 C
6X
DIM
A
A1
A2
b
D
E
e
L
L1
ÉÉ
ÉÉ
EXPOSED Cu
TOP VIEW
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
OPTIONAL
CONSTRUCTIONS
A
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.07 REF
0.20
0.30
1.45 BSC
1.00 BSC
0.50 BSC
0.30
0.40
−−−
0.15
MOUNTING FOOTPRINT
0.05 C
A1
A2
SIDE VIEW
e
6X
C
6X
SEATING
PLANE
L
1.24
3
1
DETAIL A
6X
0.53
6
0.30
PACKAGE
OUTLINE
4
BOTTOM VIEW
6X
0.50
PITCH
DIMENSIONS: MILLIMETERS
b
0.10 C A B
0.05 C
1
NOTE 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
7
NLX2G07
PACKAGE DIMENSIONS
UDFN6 1.0x1.0, 0.35P
CASE 517BX
ISSUE O
PIN ONE
REFERENCE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
A B
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
E
0.10 C
2X
2X
0.10 C
DIM
A
A1
A3
b
D
E
e
L
L1
TOP VIEW
A3
0.05 C
A
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.12
0.22
1.00 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
0.05 C
SIDE VIEW
A1
C
RECOMMENDED
SOLDERING FOOTPRINT*
SEATING
PLANE
5X
e
5X
0.48
L
6X
0.22
3
1
L1
1.18
6
4
6X
BOTTOM VIEW
b
0.10
M
C A B
0.05
M
C
0.53
1
PKG
OUTLINE
NOTE 3
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NLX2G07/D