HMC363S8G SMT GaAs HBT MMIC DIVIDE-BY-8, DC

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HMC363S8G
v01.0701
MICROWAVE CORPORATION
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 12.0 GHz
3
Typical Applications
Features
Prescaler for DC to X Band PLL Applications:
Ultra Low SSB Phase Noise: -153 dBc/Hz
• Satellite Communication Systems
Wide Bandwidth
• Fiber Optic
Output Power: -6 dBm
• Pt-Pt and Pt-MPt Radios
Single DC Supply: +5V
• VSAT
S8G SMT Package
General Description
FREQUENCY GENERATION - SMT
Functional Diagram
The HMC363S8G is a low noise Divide-by-8
Static Divider with InGaP GaAs HBT technology
in an 8 lead surface mount plastic package. This
device operates from DC (with a square wave
input) to 12 GHz input frequency with a single
+5.0V DC supply. The low additive SSB phase
noise of -153 dBc/Hz at 100 kHz offset helps the
user maintain good system noise performance.
Electrical Specifications, TA = +25° C, 50 Ohm System, Vcc= 5V
Parameter
Conditions
Maximum Input Frequency
Minimum Input Frequency
Input Power Range
Output Power
Reverse Leakage
SSB Phase Noise (100 kHz offset)
Output Transition Time
Min.
Typ.
12
13
Sine Wave Input. [1]
Max.
GHz
0.2
0.5
GHz
Fin= 1 to 7 GHz
-15
>-20
+10
dBm
Fin= 7 to 11 GHz
-10
>-15
+2
dBm
Fin= 11 to 12 GHz
-5
>-8
0
dBm
Fin= 12 GHz
-9
-6
dBm
Both RF Outputs Terminated
65
dB
Pin= 0 dBm, Fin= 6 GHz
-153
dBc/Hz
Pin= 0 dBm, Fout= 882 MHz
100
ps
70
mA
Supply Current (Icc)
1. Divider will operate down to DC for square-wave input signal.
3 - 48
Units
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Visit us at www.hittite.com, or Email at sales@hittite.com
HMC363S8G
v01.0701
MICROWAVE CORPORATION
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 12.0 GHz
20
20
10
10
0
INPUT POWER (dBm)
Recommended
Operating Window
-10
-20
0
Min Pin +25 C
Max Pin +25 C
Min Pin +85 C
Max Pin +85 C
Min Pin -40 C
Max Pin -40 C
-10
-20
-30
-30
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
0
1
2
3
4
INPUT FREQUENCY (GHz)
6
7
8
9
10 11 12 13 14 15
SSB Phase Noise
Performance, Pin= 0 dBm, T= 25 °C
0
0
+25 C
+85 C
-2
-40 C
-3
-4
-5
-6
-7
-8
-20
SSB PHASE NOISE (dBc/Hz)
-1
OUTPUT POWER (dBm)
5
INPUT FREQUENCY (GHz)
Output Power vs. Temperature
-9
-10
0
1
2
3
4
5
6
7
8
9
-40
-60
-80
-100
-120
-140
-160
2
10
10 11 12 13 14 15
10
INPUT FREQUENCY (GHz)
0
10
4
10
5
10
6
10
7
Reverse Leakage, Pin= 0 dBm, T= 25 °C
0
Pfeedthru
2nd Harmonic
3rd Harmonic
-10
POWER LEVEL (dBm)
-10
3
OFFSET FREQUENCY (Hz)
Output Harmonic
Content, Pin= 0 dBm, T= 25 °C
OUTPUT LEVEL (dBm)
3
-20
-30
-40
-50
Both Output Ports Terminated
One Output Port Terminated
FREQUENCY GENERATION - SMT
INPUT POWER (dBm)
MMIC
SUB-HARMONICALLY
PUMPED
MIXER
- 25 GHz
InputGaAs
Sensitivity
Window,
T= 25 °C
Input
Sensitivity
Window17
vs. Temperature
-20
-30
-40
-50
-60
-70
-60
-80
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
INPUT FREQUENCY (GHz)
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
INPUT FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Visit us at www.hittite.com, or Email at sales@hittite.com
3 - 49
HMC363S8G
v01.0701
MICROWAVE CORPORATION
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 12.0 GHz
3
AMPLITUDE (mV)
Output Voltage Waveform,
Pin= 0 dBm, Fout= 882 MHz, T= 25 °C
300
RF Input (Vcc = +5V)
+13 dBm
200
Vcc
+5.5V
100
VLogic
Vcc -1.6V to Vcc -1.2V
Storage Temperature
-65 to +150 deg C
Operating Temperature
-40 to +85 deg C
0
-100
Typical Supply Current vs. Vcc
-200
FREQUENCY GENERATION - SMT
Absolute Maximum Ratings
-300
22.7 22.9 23.1 23.3 23.5 23.7 23.9 24.1 24.3 24.5 24.7
TIME (nS)
Vcc (V)
Icc (mA)
4.75
64
5.0
70
5.25
75
Note: Divider will operate over full voltage range shown above
Pin Locations & Outline Drawing
1. MATERIAL:
A. PACKAGE BODY - LOW STRESS INJECTION-MOLDED PLASTIC,
SILICA & SILICONE INPREGNATED.
B. LEADFRAME MATERIAL: COPPER ALLOY
2. PLATING: LEAD-TIN SOLDER PLATE
3. DIMENSIONS ARE IN INCHES (MILLIMETERS)
4. CHARACTERS TO BE HELVETICA MEDIUM, .030 HIGH USING WHITE
INK, LOCATED APPROX AS SHOWN.
5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
3 - 50
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Visit us at www.hittite.com, or Email at sales@hittite.com
HMC363S8G
v01.0701
MICROWAVE CORPORATION
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 12.0 GHz
Pin Description
Function
Description
1
OUT
Divided output 180° out of phase with pin 3.
2
N/C
No connection.
3
OUT
4
VCC
5
IN
RF Input must be DC blocked.
6
VCC
Supply voltage 5V ± 0.25V can be applied to pin 4 or 6.
7
IN
RF Input 180° out of phase with pin 5 for differential operation. AC
ground for single ended operation.
8
GND
Ground: Backside of package has exposed metal ground slug which
must be connected to ground.
Interface Schematic
Divided Output.
Supply voltage 5V ± 0.25V can be applied to pin 4 or 6.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Visit us at www.hittite.com, or Email at sales@hittite.com
3
FREQUENCY GENERATION - SMT
Pin Number
3 - 51
HMC363S8G
v01.0701
MICROWAVE CORPORATION
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 12.0 GHz
HMC363S8G Evaluation PCB
FREQUENCY GENERATION - SMT
3
The circuit board used in the final application should use RF circuit design techniques. Signal lines should
have 50 ohm impedance while the package ground leads and backside ground slug should be connected
directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon
request. This evaluation board is designed for single ended input testing. J2 and J3 provide differential
output signals.
Evaluation Circuit Board Layout Design Details
Item
Description
J1 - J3
PC Mount SMA RF Connector
C1 - C4
100 pF Capacitor, 0402 Pkg.
C5
1000 pF Capacitor, 0603 Pkg.
C6
10 µF Tantalum Capacitor
U1
HMC363S8G Divide-by-8
PCB*
104627 Eval Board
* Circuit Board Material: Rogers 4350
3 - 52
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Visit us at www.hittite.com, or Email at sales@hittite.com
v01.0701
HMC363S8G
MICROWAVE CORPORATION
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 12.0 GHz
HMC363S8G Application Schematic
FREQUENCY GENERATION - SMT
3
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Visit us at www.hittite.com, or Email at sales@hittite.com
3 - 53
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