Transworid Research Network 37/661 (2), Fort P.O., Trivandrum-695 023, Kerala, India RFSFARCH ‘. F1W()P K Thin Solid Films: Process and Applications, 2008: 189-227 ISBN: 978-81-7895-314-4 Editor: S.C. Nam ‘Ti0 thin films for 2 photocatalytic applications K. Eufinger’, D. Poelman , H. Poelman 2 , R. De Gryse 2 2 and G.B. Marin 3 Centexbel-Gent, Zwijnaarde, Belgium; 2 Department of Solid State Sciences Ghent University, Gent, Belgium; 3 Laboratorium voor Petrochemische Techniek, Department of Chemical Engineering, Ghent University Gent, Belgium Abstract 2 is a wide band gap semiconductor which Ti0 has become well known as photoactivated catalystfor water and air purfication and self cleaning surfaces. When illuminated with ultra-band gap ultraviolet (UV) light, electron-hole pairs are ,generated. To be utilized, the charge carriers need to migrate to the surface of the thin film, where they can initiate redox reactions such as the breakdown oforganicpollutants. The charge carriers can also become trapped at defect sites in the material, which enhances their chance of recombination so that they are lost to the process. As a result, the photocatalytic activity of Ti0 2 depends Correspondence/Reprint request: Dr. D. Poelman, Department of Solid State Sciences, Ghent University, Gent Belgiurn. E-mail: Dirk.Poelinan@UGent.be 190 K. Eufmger et al. defect on several factors, inciuding the surface area and the number of of states. In turn, these are determined by the stoichiometry, the degree crystallinity and the crystallite size. Another important factor is the film a thickness: Depending on the film morphology and the light source used of critical thickness is observed below which there is a strong dependence the the photocatalytic activity on the film thickness and above which dependence is much smaller. The influences of -surface area and film thickness are ofien underestimated and in many cases even neglected when e comparing dijferent thin films. A major issue is also the lack of a suitabl 2 catalysts in the form of reference thin film, which exists for powder Ti0 Degussa P25. in In this paper we will give an overview of the state of the art 2 thin film deposition, with a special emphasis on direct photocatalytic Ti0 we current (d.c.) magnetron sputtering as deposition technique. In this context when will also discuss important issues that need to be taken into account comparing dfferent thin films. 1. Introduction 2 as a photocatalytic material was discovered by The importance of Ti0 of Fujishima and Honda in 1972, who observed the photocatalytic splitting 2 is activated by 2 electrodes [1]. In the photocatalytic process Ti0 water on Ti0 illumination with (UV) light having an energy higher than the band gap. Given a band gap of Eg = 3.2 eV for anatase and 3.0 eV for rutile [2] this corresponds c to wavelengths below 387 and 413 nm, respectively. The photocatalyti breakdown reaction proceeds via intermediate steps ending in the 2 and niineral acids. The initial step mineralization of the organic to water, C0 ns is the electron-hole pair formation, followed by theirseparation. The electro es can be used for reduction, the holes for oxidation processes [2]. The lifetim d of the electron and the hole have an influence on how well they can be utilize 2 lattice for the subsequent redox reaction. Structural imperfections in the Ti0 generate trap sites and recombination centers, leading to a decrease of the electron and hole concentration [3-5]. In recent years, applications to environmental clean up have been one of the most active areas in heterogeneous photocatalysis [4-8]. Here one looks at the photo-degradation of hydrocarbons either in water or in air using . There are several advantages 2 suspended small particles or thin films of Ti0 2 is of this material over other photocatalytically active semiconductors: Ti0 as low cost, chemically inert, absolutely non-toxic, highly photoactive, as well self-regenerating and can easily be recycled [4]. Additionally, the redox 0/ *OH couple (-2.8 eV) lies within its band gap energy [2], 2 potential of the H so that it can be used for water splitting. 2 thin films for photocatalytic applications Ti0 • - - - - 191 Ti0 has several naturally occurring modifications, the most common 2 ones being rutile, anatase and brookite. Most research with respect to photocatalysis is performed using anatase [4-8], while in all other aspects rutile has been much more thoroughly characterized (e.g. electronic behavior, bulk structural investigations). This is mostly due to the preparation methods: While it is easier to obtain anatase than rutile at low temperatures below 600°C, it is impossible to obtain anything but rutile at temperatures above 800°C, the transition temperature to the thermodynamically most stable phase rutile [4]. Latter is the case during standard ceramic processing which requires temperatures of up to 1700°C. Very littie is known about the brookite phase. While Ti0 2 powders or films obtained at low temperatures are fmely grained (nanocrystalline) because little gram growth can occur, gram growth at temperatures above 8 00°C can be substantial. Therefore, depending on the preparation method, the nature of the Ti0 2 particle or film surface, as well as the active surface area are usually very different for anatase and rutile powders. Since for a catalyst its active surface area is important, differences in surface area must be taken into account when comparing the activity of different materials. 2 powder or thin film requires Generatmg a larger surface area for a Ti0 reducing the gram size. Most photocatalytic materials are nanocrystalline, i.e. having a gram or crystallite size below 100 nm. When the crystallite size decreases below about 10 nm, gram boundaries, which present a defective lattice, start to dominate the material. Defects in the lattice structure are detrimental to the photocatalytic activity as they act as trap sites for the photogenerated charge carriers, increasing their probability of recombination. This is why the highly defective amorphous state is expected to show no significant or only a very low photocatalytic activity, [4, 5, 7, 9]. Studies have shown, though, that Ti0 2 which does not show any X-ray .ffraction pattem (and is thus called XRD amorphous) shows very small crystalline domains when investigated with transmission electron microscopy (TEM) [10]. In general, amorphous Ti0 2 has been studied littie. Originally, Ti0 2 was applied in powder form for water cleaning. The difficulty to separate the powder from the water and expanding the applications to air cleaning resulted in using thin films of immobilized powder or directly deposited Ti0 . The complete reactor walis can be coated 2 to act as photocatalytically active surfaces, but it has to be ensured that the complete catalyst surface is illuminated. Additionally, it is not always practical to coat the reactor wails. Therefore, often a coated sample area is tested inside the reactor. Since thin films are fixed to the substrate, they will not have an as large active surface area compared to that of a suspended powder. 192 K. Eufmger et al. There are different methods for thm film deposition which can be divided into two general areas, namely wet chemical and vapor deposition. The wet chemical technique employed most often is sol-gel [4, 1 1]. In earlier years the limitations of this wet process were due to the fact that the films had to be calcined at temperatures between 500-600°C, in order to achieve good stoichiometry and crystallinity. More recent investigations showed that these high temperatures were due to the wrong substrate choice (soda-lime glass) and caused by Na-contamination of the films [12]. Further development of 2 the sol-gel technique has led to. procedures which can yield crystalline Ti0 powders at temperatures lower than 200°C [13]. For good bonding of a sol gel film to a glass substrate, temperatures above 400°C are still necessary, though [4]. Chemical vapor deposition (CVD) and physical vapor deposition (PVD), including electron beam evaporation and (magnetron) sputtering [14] are frequently used vapor deposition techniques. With CVD powders as well as thin films can be synthesized, depending on the processing conditions. Physical vapor deposition techniques are used exclusively for thin film deposition. The main advantage of vapor deposition techniques, especially P\7D, is that good adhesion of the film to the substrate can be achieved. A second advantage is that the process conditions can be controlled to yield crystalline thin films without extended extemal substrate heating. 2 In this review we will first give an introduction to the activity of Ti0 (seçtion 2) and discuss the important factors determining the photocatalytic activity of a thin film (section 3). Then we will give an overview of the 2 thin film deposition (section 4) and using different techniques used for Ti0 .. targets we will 2 the example of d.c. magnetron sputtering from ceramic TiO 2 thin films with a high photocatalytic activity point out how to deposit Ti0 (section 5). In the end we will formulate some general considerations when 2 thin films (section 6). The issue of testing the photocatalytic activity of Ti0 doping, which is used to modify the electronic properties and thus the 2 will not be addressed as it is: beyond the scope photocatalytic activity of Ti0 of this review. A detailed discussion can be found in [15]. 2 2. Photocatalytic activity of Ti0 Photocatalytic reactions are a special type of catalyzed chemical reactions which proceed under the mvolvement of light. When the catalyst is a , this is called semiconductor photocatalysis. When 2 semiconductor like Ti0 ) is activated by light electron-hole pairs are 2 the semiconductor (Ti0 generated, and the electrons and holes can be utilized for electron transfer (redox) reactions at the surface of the semiconductor. All possible processes are summarized in Figure 1. 2 thm films for photocatalytic applications Ti0 193 UV-Iight Figure 1. Scheme of the photocatalytic breakdown reaction of an organic molecule (OR) on the surface of a photoactivated semiconductor. 2.1. Photoactivation of Ti0 2 Irradiation of the semiconductor Ti0 2 with light having an energy larger than the band gap (E Ebg) will generate electron-hole pairs, followed by their separation: 2 Ti0 hv >TiO ( 2 e/h)—*eb +hb (1) As shown in Figure 1 the separated electrons and holes can migrate to the sample surface, where the electrons are available for reduction, the holes for oxidation processes [2]. The electrons are associated with the Ti 4 (forming ), but they are immediately scavenged by adsorbed oxygen, resulting in the 3 Ti reduction of the latter. As a result, the lifetime of the Ti 3 states is very short, so that the Ti0 2 is never truly in a reduced state [7]. The holes are associated mostly with —OH groups present at the surface due to saturation of the terminating 0 with water molecules from the ambient air. Also O and 03 are suggested as hole trap sites [4, 6, 7], the latter being formed from chemisorbed 02. The resulting radicals oxidize the adsorbed organic compound(s) while being reduced themselves. The lifetimes of the electron and the hole determine their efficiency for the subsequent redox reaction. Structural imperfections in the Ti0 2 lattice generate trap sites and recombination centers, leading to a decrease of the electron and hole concentration [3-5]. 2.2. Photocatalytic (breakdown) reactions We now look at the potentials of the electrons and holes generated by photoactivation in Ti0 . The electrons have a reduction potential reflected by the 2 energy level of the bottom of the conduction band, while the holes have an oxidizing potential reflected by the top of the valence band. Therefore, the redox potential of the redox couple to be catalyzed must be situated between these two K. Eufmger et al. 194 energy levels, i.e. within the band gap of the semiconductor [2,4, 8]. In the case of reactions in water, the positions of the band edges can be referred to the normal hydrogen electrode (NNE) [2], which is also a reference for the redox couples of cijemical reactions in water. The redox potential, though, is influenced by the pH of the solution, which can also influence the surface of the solid semiconductor. For reactions in the gas phase no standards such as the NHE have been defmed. Here, among others, the value of the redox potential difference will depend on the extent of interaction between the two phases, inciuding the degree of chemisorption, the gas pressure and humidity. The photocatalytic breakdown reaction of an organic compound normally proceeds via intermediate steps, ending in the mineralization of the organic to , water and mineral acids, summarized by equation (2): 2 C0 2 Organic+0 hv band gap energy +mineral acids +H 0 22 >C0 semicondudor Mineral acids are generated if there are any hetero-atoms, such as S, N, and Cl present in the organic. This catalytic process is exergonic (i.e. the free Gibbs enthalpy AG < 0) and the energy of the photons is not used in the reaction other than to excite the catalyst. As discussed in the previous paragraph, the band gap and the position of the band edges of the semiconductor determine which breakdown reactions it can catalyze [2]. Other examples of photocatalytic ‘breakdown’ reactions are partial oxidation reactions, of e.g. alcohols to aldehydes or ketones, which can also be seen as synthesis of new organic molecules. This inciudes photocatalytically assisted polymerization [16]. A good overview of the different possible reactions is given in [4]. These processes should not be confused with the endergonic (non-spontaneous) synthesis (i.e. photosynthesis) of organic molecules which occurs in biological processes. 3. Structural factors controlling the photocatalytic activity of thin films 2 film normally consists of crystalline grains which are characterized A Ti0 by their crystal phase, size, shape and arrangement on the substrate. As a result it can be expected to show a broad range of defects. In this section we will 2 structure and discuss the influence of individual defects on the TiO photocatalytic activity, but as will become dear, many defects do not occur alone but only together with others. Doping is not a topic of this review article but we would like to point Out the effect of sodium uptake from the substrate. The defect state of the thin film, as well as its crystal phase, influences its electronic nature. As a result the observed optical band gap and the charge 2 thin films for photocatalytic applications Ti0 195 carrier mobility can be altered, which in turn influences the photocatalytic activity. The latter also depends strongly on the nature and area of the film surface, where the catalytic reaction takes place. 3.1. Crystal structure An important factor for the photocatalytic activity is the crystal structure of the catalyst. The three most studied polymorphs of Ti0 2 are rutile, anatase and brookite, with the former two being the most important for photocatalytic applications. Even though the crystal lattices of rutile and anatase are similar, there are a few significant differences. While rutile has a direct forbidden band gap of 3.02 eV, the one of anatase is indirect allowed and has a value of 3.2 eV. Rutile and anatase also have different numbers of active sites [4]. A common observation is that for anatase always good photocatalytic actïvity is observed, while rutile shows good photocatalytic activity in some [17] and almost zero activity in other studies [2, 4]. The small difference in band gap between rutile and anatase cannot explain their different activity. A main difference, though, is their recombination rate of photoinduced electrons and holes, which is higher for rutile [2]. Often heat treatment at high temperatures is used to obtain the rutile phase, resulting in the irreversible loss of surface hydroxylation and increased crystal growth, both of which decrease the photocatalytic activity of Ti0 . On the other hand a combination of the two 2 crystal phases can lead to an enhancement of the photocatalytic activity [1820]. A good example is the P25 powder from Degussa, which has become a reference powder photocatalyst. According to [18, 20] it is the interface between the two phases that yields the active sites. Brookite has been investigated to a much less extent. A study on single crystal brookite, which had a pale brown color, yielded a band gap of 1.9 eV, which was claimed to be indirect [21]. Since it is difficult to obtain in pure form, not enough is known about brookite to compare its photocatalytic activity to that of anatase and rutile. In [22] brookite powders were synthesized and compared to Degussa P25. As the band gap is substantially lower than that of anatase and rutile it can be expected that its photocatalytic behavior will be quite low. The relative stability of the three most common Ti0 2 modifications is particle size dependent. Below a crystal size of about 15 nm anatase is the most stable phase while for crystal sizes above 35 nm rutile is the stable phase. For the range between 15 and 35 nm rutile and brookite seem to have the same stability [4, 5]. 3.2. Crystal defects Any real material does not have a perfect crystal structure. Even in a single crystal one finds point defects (misplaced lattice atoms/ ions, vacancies, 196 K. Eufmger et al. foreign atoms! ions) and dislocations. In polycrystalline materials defects are added due to the presence of gram and crystallite boundaries. These defects can introduce energy levels inside the band gap, their location depending on the nature of the defect. According to semiconductor theory [23] donor states are found just below the conduction band, while acceptor states are found just above the valence band. Defect levels deep inside the band gap are trap levels, both for electrons as well as for holes. In photocatalysis literature often the term ‘trap site’ is used, which denotes a site that can permanently (deep) or temporarily (shallow) bind a charge carrier. The definition of a trap site is not straightforward, though, since all levels inside the band gap have the potential to be trap sites. The deeper the trap site lies within the band gap the higher its trapping power, i.e. the lower the chance that the trapped charge carrier can leave the trap withm its lifetime. But also the donor and acceptor levels close to the band edges can act as trap sites. The latter enhance the separation of the electron-hole pairs, but if the charge carriers are too strongly bonded they are not available for the photocatalytic redox reaction. As a result, the activity enhancement or reduction by a defect depends strongly on its nature, and the presence of other defects. 3.2.1. Crystallinity The degree of crystallinity was found to be an important factor influencing the photocatalytic activity of Ti0 . It depends on the actual crystallite size and 2 the ratio between crystalline and amorphous phase present in the material. A higher degree of crystallinity resuits in a lower number of crystal defects, which is beneficial for the photocatalytic activity of Ti0 . Note that gram size 2 and crystallite size may not be identical. The crystallite size is defined by the domain (within a gram) having the same crystallographic orientation, while a gram is defined by the presence of (visible) gram boundaries. Therefore, it is possible to have different crystallites within one gram. When trying to asses the effect of crystallite size on the photocatalytic activity one faces as main difficulty how to change the crystallite size while keeping the gram size constant. One needs to increase the temperature to promote crystal growth in anatase Ti0 , which normally resuits in gram 2 growth and possibly transformation to the rutile structure. Careful studies using Si0 2 as gram growth inhibiting additive have shown that a higher degree of crystallinity resuits in a higher photocatalytic reactivity [24-26]. The gram growth inhibiting properties of Si0 2 also retard the anatase to rutile transformation which allows annealing at higher temperatures, resulting in improved crystallinity [4]. When decreasing the gram size below ca. 10 to 20 nm the degree of crystallinity is severely reduced due to the high surface to bulk ratio, since the surfaces (gram boundaries) represent a high defect state. 2 thin films for photocatalytic applications Ti0 197 The “amorphous Ti0 ” phase represents the highest state of disorder, i.e. 2 has a completely random structure [11]. With Ti0 2 the definition of amorphous is difficult, as there is always some degree of local ordering observed [10]. Here we will define “amorphous Ti0 ” as the phase where no signal can be 2 detected by x-ray diffraction (XRD), which means that the material has crystalline domains of a size below the detection limit (<3-5 nm). Usually grains around 5 nm are detected as very broad peaks around the position expected from the diffraction spectrum of the material and such materials are often labeled ‘nanostructured’ [27]. This can be confusing as the usual definition of the nanoscale is < 100 nm [28]. Very littie is known on the electronic structure of amorphous Ti0 . Most 2 discussions agree that the high defect concentration should result in poor charge carrier conduction [5, 13]. In [5] it is claimed that for such materials (which they count as nanocrystalline Ti0 ) one observes a direct forbidden 2 band gap transition as compared to the indirect allowed transition observed in well crystallized anatase. Completely amorphous Ti0 2 is expected not to show any photocatalytic activity [13, 16]. As a result, only rarely the photocatalytic activity of amorphous films or powders is measured [13, 29]. In our own studies we have found that XRD amorphous Ti0 2 films can have a substantial photocatalytic activity, though, depending on their microstructure [30]. The photocatalytic activity of such films increases by a factor of almost 3 when crystallizing anatase [30, 31], confirming that a higher degree of crystallinity is indeed beneficial. 3.2.2. Oxygen vacancies (stoichiometry) Oxygen vacancies represent a special type of defect in Ti0 . They are 2 present when the material is not completely stoichiometric or they can be generated by impurities. As a result, oxygen vacancies will not occur on their own but only in combination with one or more other defects (e.g. Ti , 3 impurity). The effect of oxygen vacancies will vary, depending on the exact circumstances of their occurrence. This is reflected in the seemingly contradictory experimental resuits obtained by different researchers. Indications that oxygen vacancies are detrimental to the photocatalytic activity were found by [11] and [32] for d.c. magnetron sputtered Ti0 2 films. 180 Post oxidation of films using tracer and subsequent SIMS (secondary ion mass spectroscopy) analysis showed that with increasing amount of incorporated tracer the photocatalytic activity decreased [11]. From this, the decrease in photocatalytic activity was attributed to the increase in the number of defects associated with oxygen vacancies in the film. In [32] the photocatalytic activity was linked to the thin film stoichiometry determined by ESCA (electron spectroscopy for chemical analysis) showing a decrease in photocatalytic activity with decreasing oxygen content. In both cases the 198 K. Eufmger et al. conciusion was that for optimum photocatalytic perfo rmance the films must be fully stoichiometric. In [33] preparation of a visible light active photocata lyst of reduced Ti0 2 is claimed. The color of the catalyst is reported to be yellow and traces of N were found, indicating doping. In [34-36] it is reported that the doping of Ti0 2 thin films or powders with N resuits in visible (VIS ) light photocatalytic activity, which could explain the results obtained in [33]. In a different study by [35] commercially available anatase powder was redu ced in a H -plasma to 2 have an 0! Ti ratio of 1.68 (ESCA estimate). This powder had a yellowish color and showed a red shift of the optical absorptio n edge and VIS light photocatalytic activity. An electron spin resonance (ESR) signal of g = 2.003 found by the authors was assigned to electrons trapped on an oxygen deficient site [35]. On the other hand, [37] showed that H was incorporated into Ti0 2 thin films sputtered in a hydrogen atmosphere. The result was the formation of deep levels inside the band gap. These authors did not investigate the photocatalytic activity of their films, but the resuits indicate that also in the study presented in [35] the doping with H interferes with the role of the oxygen vacancies. Density of states (DOS) calculations performed by [11] showed no effect of single oxygen vacancies, but for double oxygen vacancies energy levels inside the band gap were generated. It was suggested that these energy levels can act as rëcombination centers for the charge carriers, decreasing their concentration and, therefore, the photocatalytic activity of the material. On the other hand, band gap calculations by [38] for anata se showed that oxygen vacancies introduced shallow donor states in he band gap. The authors expect these to increase the photocatalytic activity of Ti0 . 2 In conclusion, the effect of oxygen vacancies on the phot ocatalytic activity of Ti0 2 is quite complex. The experimental resuits indic ate that the presence of oxygen vacancies alone is not beneficial [11, 32], while a positive effect is found when they occur together with secondary defects due to N or H incorporation [33, 35]. 3.2.3. Lattice strain 1f the size of a defect is different from its host, a lattice distortion (i.e. strain) is introduced. Some early studies looked at the influence of an applied external stress on the band gap transition of Ti0 2 (rutile) [39]. It was found that the band gap increased with increasing applied (unia xial) stress along the a-axis, yielding a pressure coefficient of dEg/ dP of -1 .19 1 06 eV/ bar (note that the negative sign indicates compressive stress). In [40] the high band gap of 3.4 eV observed for magnetron sputtered anatase Ti0 2 thin films as compared to the bulk value of 3.2 eV was attributed to the distortion of the Ti0 2 unit ceil. Related authors also performed 4 2 thin films for photocatalytic applications Ti0 199 experiments and ab-initio calculations [41, 42] to determine the influence of lattice distortions (i.e. lattice strain) on the band gap of rutile and anatase Ti0 . 2 The increase of the band gap with decreasing lattice constant a and increasing lattice constant c was confirmed by experimental resuits of these authors. From these resuits one can extract a value of -4.89 106 eV/ bar for the dependence of the band gap Eg on an applied uniaxial stress along the a-axis [15], which is on the order of the one for rutile (see above). This shows a good agreement between the stress measurements and the strain calculations, considering that rutile has a higher Young’s modulus than anatase [43]. 3.3. Sodium contamination Early studies discovered that the photocatalytic activities of annealed Ti0 2 thin films depended strongly on the type of substrate used [44]. It was suspected that ions diffusing from the substrate into the film during annealing influenced its activity. Other authors investigated the effect of a soda-lime glass substrate on the photocatalytic activity of heat treated Ti0 2 films [12,46]. In [12] the resulting decrease in photocatalytic activity was related to the effect of Na on the gram growth in the thin film upon heat treatment. Na was found to retard the crystallization of anatase while increasing the particle size in the film. The photocatalytic activity was correlated to the particle size of the films, rather than to their Na content, the photocatalytic activity increasing with decreasing particle size (in the range of 25 to 40 nm). Na was expected to form a shallow donor state in Ti0 , which would make it a rather unlikely 2 recombination center. Therefore, the authors conciude that Na in the films influences the photocatalytic activity by changing the particle size and not by acting as recombination center. Experiments in our group have shown that Na inhibits crystallization by decreasing the degree of crystallinity and increasing the temperature needed for crystallization [46]. The photocatalytic activity was not only decreased for crystalline films, but also for films annealed below the crystallization temperature, which remained amorphous and in all cases the gram size remained constant [31, 46]. Latter indicates, in contrast to [12], that it is indeed the uptake of Na into the films that degrades the photocatalytic activity. In [45] the diffusion of Na into the Ti0 2 thin film from soda-lime glass was measured by ESCA depth profiling and a direct link between its lower photocatalytic activity and the Na-concentration was made. It was suggested that Na acted as recombination center for electrons and holes. Independent of the exact cause, the uptake of Na decreases the photocatalytic activity of Ti0 2 thin films substantially. As a result most investigators use soda-lime free substrates or a Si0 2 barrier coating [11, 47] to 200 K. Eufinger et al. avoid incorporation of Na when a heat treatment step is needed after deposition. Uptake of Si from any kind of glass is observed, but this is not 2 thin reported to have a negative influence on the photocatalytic activity of Ti0 films [45]. In conciusion, the best strategy concerning the effect of Na on the 2 is to avoid the possibility of Na-contamination by the properties of Ti0 correct choice of (glass) substrate. 3.4. Surface hydroxylation The surface hydroxyl groups are important shallow trap sites for the holes 2 (section 2.1). Therefore, they play a generated upon UV-illumination in Ti0 crucial role in the photocatalytic process. The degree of surface hydroxylation not only depends on the relative humidity but also on the surface structure of the catalyst. Hydroxyl groups are formed by water dissociation, so that it is favorable to have paired acid! base sites situated at the appropriate distance [4]. The water molecules are initially bonded to the surface sites with an acid character, namely Ti-cations with a coordination number lower than the bulk value of 6. Adjacent surface sites with a basic character, namely bridging oxygen atoms, then accept the proton. The conciusion is that the degree of surface hydroxylation increases with the number of acid sites present at the surface. The coordination number of Ti at the surface depends on the terminating crystal facet [6] but also decreases with its oxidation state. Therefore, sub-stoichiometric surfaces show an increased surface hydroxylation [4]. Si also has a lower coordination number of 4 (bulk) 2 increases the degree of surface and it is reported that its addition to Ti0 hydroxylation [48]. Consequently, the catalyst preparation conditions play a major role in surface hydroxylation [4,49]. The degree of surface hydroxylation in a gas atmosphere is related to its water content, while in solution it is related to its pH. Therefore both factors have an influence on the photocatalytic reaction rate [4]. 3.5. Particle size In general, particles in the nanometer range (<100 nm) show a physical and chemical behavior different from larger sized material. For very small particles (<35 nm) their size has an effect on the crystallographic phase stability and the chemical activity (section 3.1). It has become common to cail such materials nanostructured, with nanoparticles being ultrafinely dispersed particles and nanocrystalline materials being materials with a fine crystallite or gram size. Unfortunately the terms ‘crystal’ and ‘gram’ are sometimes used as synonyms even though they describe something completely different (section 3.2.1). 2 there is quite Regarding the photocatalytic activity of nanocrystalline Ti0 some discussion on the influence of the crystallite and particle size. The degree 2 thm films for photocatalytic applications Ti0 201 of crystallization (i.e. the ratio between crystalline and amorphous phase) will decrease with decreasing gram size due to the increasing mfluence of the (amorphous) gram boundaries. Often the gram size and! or crystallinity of the thin films are not clearly defined or have a large spread, so that dependencies cannot be defined well. In the following we highlight the most important effects that are associated with a nanoscale structure in Ti0 . So far, no solid proof could be provided 2 that the general photocatalytic efficiency of very finely grained (< 10 nm) Ti0 2 (signifïcantly) exceeds that of larger grained material, as long as the gram size remains below 100 ilm. The photocatalytic activity of Ti0 2 having a (lateral) gram diameter above 1 I.Lm has been studied littie. 3.5.1. Chemical activity With nanostructured materials the particle surface area is large compared to the bulk of the particle. As a result the surface energy becomes more dominant, changing the Gibbs free energy of the material and, therefore, its chemical activity. On the other hand, the large surface area itself increases the catalytic activity of the nanostructured material by offering more active sites for the reaction to take place. The surface presents a defect state due to the presence of dangling bonds on the Ti0 2 surface, which is sometimes interpreted as an increased number of oxygen vacancies. It is argued that this is why nanosized Ti0 2 will also have a higher density of oxygen vacancies than large gram size Ti0 2 [5]. These defect states are preferred sites for the adsorption of water and 02 from the ambient air, the former resulting in the formation of hydroxyl groups (section 3.4). 3.5.2. Optical and electronic properties The fact that the gram dimension is smaller than the wavelength of visible light (ca. 400-700 nm) also resuits in different interaction with such light. Compared to films with a larger gram size, which can be opaque, one observes that the degree of light scattering is decreased [8, 50]. This means that the films remain optically transparent. The small gram size also has the advantage that the charge carriers do not have to migrate far before they reach the surface of the gram, where they are needed for the redox reaction at the catalyst surface (Figure 1). On the other hand, the small particle size is associated with a higher number of defects in the form of surfaces [4], while the number of inner gram defects is decreased [51]. Defects act as trap sites, so that the number of trap sites decreases in the bulk but due to the increased surface area a larger number of surface trap sites is generated. When the ratio of surface to bulk reaches a critical value the increasing number of trap sites can offset the positive influence of the short carrier mgration distance. As a result, there is a critical 202 K. Eufmgeretal. size below which the surface recombination of electrons and holes becomes dominant due to the increased surface to volume ratio. The optimum gram size is reported to be around 10-20 nm [52], below which a decrease in photocatalytic activity is observed. 3.5.3. Quantum size effect (very small gram sizes) For decreasing particle sizes, quantum mechanical calculations show a transition from semiconductor to molecular properties. This means that the band structure of the semiconductor breaks up into quantum levels, the transition point being where the particle size reaches the order of the de Broglie wavelength of the charge carriers in the semiconductor. For most semiconductors this lies in the range of 5-25 nm, the exact value depending on the material [8]. This change in electronic structure is commonly referred to as ‘Quantum size effect’ (QSE) or ‘Q-effect’ and the respective particles are called ‘Q-particles’. The most wide-spread, simple theoretical framework to study the influence of confinement effects and how they depend on the primary particle size is the so-called effective mass approximation (EMA). More comprehensive discussions of the quantum size effect and the EMA are given in [2, 5, 7, 8, 53, 54]; the original theoretical framework was developed by Brus in his work on CdS clusters [55]. Strictly speaking the theory behind the quantum size effect is only valid for (i) freely suspended particles, where the charge carriers are confined within the particle and (ii) a covalent material, where the electronic band theory is 2 thin film, valid [55]. Both conditions are not fulfihled in the case of a Ti0 where the bonding is partially ionic and the particles are embedded, allowing charge carrier migration across the gram boundaries. Latter is also valid for strongly aggiomerated powders where charge carrier transport is no longer limited to the individual grains but to the (much) larger aggiomerate. The 2 [5, 7, 55], even quantum size effect could not be verified for (anatase) Ti0 though claims have been made that it is responsible for the blue shift of the band gap in nanocrystalline anatase powder [54]. 3.5.4. Nature of the band gap transition There is some discussion in literature about the nature of the band gap . Some authors 2 transition in nanostructured (anatase) and amorphous Ti0 [5, 54] claim that for small gram sizes the band gap transition switches from indirect to direct, which is of interest as the absorption at threshold and the emission of light is much stronger for the direct transition. This should result in a more efficient absorption of light and in improving the photochemical performances of the nanostructured materials. In [54] it was decided on basis of the best fitting resuits to the experimental data that the band gap of very finely grained anatase was direct. 2 thin films for photocatalytic applications Ti0 203 The authors suggest that photoluminescence studies could be used to support the observations. In [5] it is argued that the confinement of charge carriers to a limited space causes their wave functions to spread out in momentum space, in turn increasing the likelihood of radiative transitions for bulk indirect semiconductors. Again, this argument is not valid for thin films and agglomerated powders where the charge carriers cannot be strongly confined (3.5.3). In [52] the enhancement of absorption observed in small nanocrystals is claimed to be the result of the very high surface to volume ratio. Here the share of surface atoms is sufficiently high to increase the chance of surface absorption, which increases the light absorption in total. Both arguments are actually based on the fact that a direct transition shows a stronger light absorption than an indirect transition. 3.6. Microstructure (film surface area) There are few consistent studies which investigate the effect of the thin film microstructure on the photocatalytic activity. Mostly the film crystallinity is studied but the gram structure and porosity are generally ignored. This is surprising because especially the film porosity will influence the active surface area, which in tum has a strong effect on the photocatalytic activity. Our own studies showed that the film microstructure is strongly related to the photocatalytic activity of the Ti0 2 thin films [30, 31]. It is usually impossible to determine the BET (Brunauer-Emmet-Teller absorption isotherm) surface area of a thin film because the total surface area of the sample is too small for the standard BET analyzers. These have a detection limit for the total surface area in the order of 0.1 -1 m and receptacle sizes in the cm 3 range. Additionally the receptacles are designed to analyze powder samples, so that coated substrates have to be cut into pieces, which resuits in a high amount of uncoated surface being tested. Note that the surface area of a (powder) catalyst is usually reported in m /g, which is not applicable 2 for a thin film catalyst where the weight of the thin film is normally more than 3 orders of magnitude lower than that of the substrate. One method to estimate the active surface area of a thin film is by looking at its microstructure. Pores will add to the surface area of a thin film (section 3.6.2), but their size will determine whether they can add to the active surface area (section 3.6.3). 3.6.1. Deternunation of the thin film porosity A simple way to estimate the porosity is through the refractive index of the thin film, which can easily be detennined from ellipsometric or optical transmission measurements [56, 57]. The refractive index of a mixed compound can be calculated from the indices of the individual components, using e.g. the Lorenz-Lorentz equation [56]: 204 K. Eufmger et aL q mi’ 2 n 2 , ,, s—, 1 fl• i 2 —=2 n +2 p ,= n +2 1 . — — !_Lj p } m with t=1 1=1 where n is the refractive index of a composite material of average molecular weight M and density p which can be viewed as consisting of m materials each having the mole fractionj, the molecular weight M, and the density p. A porous material can be modeled as a mixture with air. Since the refractive index of air is close to 1, equation (3) simplifies to: n?+2 n —1 n +2 (4) with P denoting the porosity, defined as (5) Expression (5) allows calculation of the film porosity from the refractive index if there are no other influences like second phases or dopants. Nevertheless, any calculation of the porosity should be taken as an estimate only. 3.6.2. Estimate of the surface area of a thin film from its porosity When depositing a thin film by d.c. magnetron sputtering under the conditions that yield porous zone 1 growth (please refer to section 5.2) one obtains irregular and separated column-grains (Figure 2). These column-grains have rounded tops and an elongated, approximatel y cylindrical shape. The rounded tops will in all cases increase the surface available for catalysis. The side surfaces of the column-grains can only partici pate Figure 2. Scanning electron microscope (SEM) images of Ti0 2 thin films deposited in zone 1 structure by d.c. magnetron sputtering (60 W, 1.4 Pa, 2 ceramic target): TiO top view, b) cross section. a) 2 thin films for photocatalytic applications Ti0 205 when the inter-gram spacing is large enough to allow diffusion of the reactant and reaction products. This inter-gram spacing actually defines the pore size in the thin film. In the following we shali first calculate the increase in the thin film surface area due the microstructure and then estimate the pore size for a given gram size, film thickness and density. 1f a thin film has a completely dense structure and a flat surface, the active surface area is equal to the geometrical area of the substrate (Figure 3., left). A rough surface, on the other hand, will have a larger area. We can estimate this increase by assuming that the surface consists of a collection of semi-spheres (the tops of the individual grains, see Figure 3., right). A circle with radius R will have a flat surface area of ‘rR , but a semi-spherical surface area of 2 irR 2 . 2 As a result, the gain in surface area when going from a flat to a rough surface, consisting of half spheres, is only a factor of 2. Much more effective area can be gamed if the film consists of free standing columns (Figure 3., right). For the sake of simplicity we assume that every column has a flat top and a fixed square column section, with size d (Figure 4). The height of the columns is identical to the film thickness h. Porosity is taken into account by separating the columns by a distance f (Figure 4). Thinfilm Thin film Iflflflflfl[]flflE Substrate S ubstrate Figure 3. Sketch of a thin film (in cross section) consisting of (spaced) column-grains (right), illustrating that the dense structure normally assigned to a thin film (left) is not necessarily correct. :4—x 4— d : —+ 1 f 1 4- Figure 4. Sketch of the column-gram thin film structure (top view) showing the cdl used for calculation of the surface area and the free space between the column-grains. K. Eufmger et al. 206 The projected (geometrical) surface area, equal to the substrate area (which is assumed flat) is (d +J)2 per gram. On the other hand, the total column surface area, inciuding the column sides, is: (6) 4dh d + 2 The ratio of the active surface area of the free-standing columns to the area of a dense film will be: d 4dh +4dh 2 d + 2 d 2 (d+f) (7) sincef« d (see Table 1.) for realistic thin films. 1f we take a film thickness of h = 400 nm and a column diameter of d = 50 nm, this ratio is 33, so that the total active area increases considerably when the film consists of free-standing columns. 3.6.3. Estimate of the pore size of a thin film from its porosity The porosity P can be defmed as the fraction of free space in the film, and is a value which can be estimated from the effective refractive index of the films according to equation (4). 1f the columns themselves are completely dense, then we can relate the porosity P to the spacing fbetween the column grains (Figure 4.): (8) 2 (d+f) Solving forfyields: 1 —1 f=d( J(1-P) The calculated spacing fbetween two column-grains for a given porosity P is listed in Table 1. Note that these values only give an estimate since they were calculated taking the column-grains as 100% dense. Since this is most likely not the case the true inter-column spacing will be smaller. The inter-gram spacing f is nothing other than the pore size of the thin film. According to the IUPAC (International Union of Pure and Applied Chemistry) definition one distinguishes the following different pore types according to their diameterx [58]: macropores: x> 50 nm mesopores: 2 x 50 nm micropores: x < 2 nm 2 thm films for photocatalytic applications Ti0 207 Table 1. Calculation of the inter-gram spacing .f from the porosity according to Figure 4. From Table 1. one can see that from a porosity of about 7.5% on the thm films are mesoporous. Usually micropores are too small to be catalytically active, while mesopores are known to increase the active surface area of a catalyst. The minimum size a pore needs to have in order to be active depends on several factors. These inciude the diffusion coefficient of the reactants into and products out of the pores (determined by their size and electronic nature), their concentration in the atmosphere surrounding the catalyst and the flow rate of the carrier gas stream passing over the catalyst bed. Our own resuits have shown a strong dependence of the photocatalytic activity of column-grained Ti0 2 thin films on porosity values up to 22.5%, when measuring the breakdown of ethanol in a batch reactor [59]. Increasmg the porosity above this value no longer had an influence on the photocatalytic activity, indicating that a critical pore size was reached which allowed the breakdown reaction of ethanol to proceed freely. 3.7. Film thickness Not much is reported on the effect of thickness on the photocatalytic activity of thin films [12, 45, 60], even though some authors are aware of the influence and correct for the variations in sample thickness [13]. In order to study the true influence of film thickness it is important that the structure of the film does not change with film thickness, which was not the case in [60]. In [45] thin films with thickness between 50 and 250 nm were studied. Here it was found that the photocatalytic activity reached its maximum at ca. 140 nm, after which it remained constant. In [12] a critical film thickness of ca. 360430 nm is reported. The difference between the two studies mdicates that this critical film thickness is dependent on the thin film preparation techniques and/ or the experimental setup for testing their photocatalytic activity. As we have shown in section 3.6.3 the density of a column-grained structure determines its inter-gram porosity, and as a result its surface area. The catalytic activity of these pores will depend on the experimental setup, including the size and nature of the organic test substance used. Neither [12] nor [45] report anything on the microstructure of the thin films studied. Tada et al. tried to determine the nature of this critical film thickness and proposed that there is a limited diffusion length of the charge carriers and a K. Eufinger et al. 208 cumulative light absorption with increasing film thickness [45], as depicted in Figure 5. Their experimental resuits indicated that the critical film thickness was ca. 100-150 nm, from which they deduced a charge carrier diffusion length of about 300 nm. 2 thin films (22.5% porosity) with Our own experiments using porous Ti0 a column-gram structure have confirmed this reasoning. The data showing the dependence of the photocatalytic activity on the film thickness (Figure 6.) can be fitted at first sight by two linear graphs (dark). On the other hand, an exponential fit describing the light absorption in the film (at an intermediate wavelength of the given lamp spectrum) can also be applied (light, dotted curve). a) b) UV-light J]jJfj Thin film Thin film . Charge carriers Ecn oc Substrate S u bstrate Figure 5. Sketch showing the limiting factors for the photocatalytic activity of thin films: (a) increasing light absorption, (b) the charge carrier diffusion length. 1 ““•..•; 1 . 14 .. 1 ê 0.8 -1___ 1.2-, / 1 1 ,/ gO.6 o O8 . •/ :/ 0.4 0.6 absorp. fit / 0.2 , .1.6 . / — — linear fit 4’ reaction rate 04 ,.. 0.2 n 0 200 400 600 800 0 1000 film thickness (nm) Figure 6. Dependence of the photocatalytic activity on the film thickness for XRD 2 ceramic 2 thin films deposited by d.c. magnetron sputtering (TiO amorphous Ti0 which seem sections linear two by target, pure Ar at 1.4 Pa, 60 W). The data are fitted to indicate a possible critical film thickness of about 350 nm, and an exponential fit describing the absorption of UV-light with increasing film thickness. 2 thin films for photocatalytic applications Ti0 209 Thin film Substrate Figure 7. Sketch showing the possible diffusion paths of photogenerated charge carriers in column-grained Ti0 2 thin films. In order to determine which of the two mechanisms is correct we performed separate photocatalytic measurements for two samples of different thickness using (i) the complete spectral range of the lamp and (ii) only the wavelengths above 345 nm. The resuits indicated that the higher wavelength light, which enters deeper into the thin film, showed a similar photocatalytic activity per active photon arriving at the film surface. This should not be observed if the diffusion length of the charge carriers was the limiting factor. Additionally the column-gramed film structure (Figure 3.) also explains, why the carrier diffusion cannot be the limiting factor for these porous films. In Figur 7. possible diffusion paths of the charge carriers in the column-grains are shown. Since the diameter of the columns is only about 50 nm, charge carriers generated anywhere inside the gram do not need to diffuse more than about 25 nm to reach its surface. As a result, the limiting factor that the thickness imposes on the photocatalytic activity is the fact that most of the incoming light is absorbed in the first few 100 nm of the film. Increasing the film thickness does not lead to much more absorption. This allows to use the linear expressions from Figure 6. to determine a ‘critical value’, above which the photocatalytic activity depends less strongly on the film thickness. The conciusion is that the film thickness is an important parameter for the photocatalytic activity of Ti0 2 thin films. Care must be taken when designing experiments to find the critical film thickness above which the photocatalytic activity is less dependent on this factor to avoid experimental errors. As already discussed, the active pore size depends on the chosen organic test substance, which can be expected to influence this critical film thickness. 3.8. Designrng a highly photoactive Ti0 2 thin film: Summary To summarize sections 3.1 to 3.7, we can state that to optimize the photocatalytic activity of a Ti0 2 thin film one has to control two parameters, namely the surface area and the defect structure, which is primarily reflected in its crystallinity. K. Eufinger et al. 210 be increased by decreasing the gram • The surface area of the thin film can nt for finding the minimum pore size size and increasing the porosity. Importa of the organic substance to be broken will be the dimensions and the nature down. eases by increasing the number of • The crystallinity of the thin film incr the gram surface can be taken as a crystallites as well as their size. Since crystallinity increases witb gram highly defective, non-crystalline phase the size (lower surface to volume ratio). size (high surface area) and The result is that one needs to balance gram optimum resuits. In general it is crystallinity (low defect state) for the low as possible. interesting to keep the number of defects as 2 thin film ination of the Ti0 Additionally, it is necessary to avoid contam the substrate. by inward diffusion of Na or other ions from es 4. Ceramic thin film deposition techniqu 4.1. General considerations 2 ues used for Ti0 can roughly niq The variety of thin film deposition tech chemical and vapor deposition. The be divided into two areas, namely wet the substrate is either coated with a former is a solution based technique where 2 thin film is grown onto the substrate colloidal solution (sol-gel) or a Ti0 deposition various techniques are (electrochemical deposition). In vapor Ti0 In the . some precursor or 2 employed to generate a vapor phase of Ti, te. 2 film is formed by oxidation at the substra former two cases the Ti0 substrate material. It must be An important issue is also the choice of to remain inert and undamaged compatible with the deposition conditions as be resistant to the temperatures also st mu te stra sub The . ion osit dep ing dur the thin film and not cause any required for calcination! crystallization of nt example are polymer substrates contamination (see section 3.3). An importa ce (typically 150°C), and can pose which have a rather low temperature resistan ssing of e.g. water. a problem in vacuum chambers due to out-ga 4.2. Wet chemical techniques ues employed for thm film The most important wet chemical techniq osition, with the former being by deposition are sol-gel and electrochemical dep briefly discuss the mam aspects of far the most frequently used [4, 11]. We will nded literature for further reading. these two techniques and refer to the more exte 4.2.1. Sol-gel nd advantages for thin film The sol-gel technique has some profou ibility and ease of processing. deposition, namely purity, homogeneity, flex 2 thm films for photocatalytic applications Ti0 211 Depending on the type of precursor used, one distinguishes between the non alkoxide and the alkoxide route. Former uses inorganic Ti-saits, while latter uses metal-organic (alkoxides) as precursors. The first step in the sol-gel process is the formation of a colloidal suspension of solvent stabilized titanium oxide particles (sol) by controlled precipitation. The sol is then coated onto the substrate by different techniques like dip or spin coating. During drying (evaporation of the solvent) a ge! is formed, which has a very loose structure. Any remaining inorganic salt must be carefully removed by washing of the gel film. The route employed most is the one using alkoxides (generic formula O-R, with R denoting an organic rest). The most popular ones are the tetra-ethoxide, iso-propoxide and n-butoxide of Ti, with the general formula 4 Ti(O-R) Here . the sol is formed by controlled hydrolysis followed by poly-condensation of the metal-organic precursor. In order to have good control of the process one aims to use precursors that allow for separating and slowing down the two steps. For both routes the structure of the thin film can be influenced by the nature of the precursor and the solvent as well as by adding surfactants. Since the film thickness achieved by one coating cycle is below 100 nm, several coatingcycles are needed to obtain thicker films. A very good overview on depositing sol-gel films of Ti0 2 can be found in [4]. In earlier years the limitation of the sôl-gel process was the necessity to calcine the films at temperatures between 500-600°C, in order to achieve good stoichiometry and crystallinity [12] which limited the applicable substrate materials. More recent investigations showed that the need for such high temperatures was due to the wrong substrate choice and caused by Na contamination of the films (section 3.3). For good bonding of a sol-gel film with a glass substrate temperatures above 400°C are stil! necessary, though [4]. 4.2.2. Electrochemical deposition Electrochemica! deposition, also referred to as electrolysis or electroplating, is a technique which has been known for a long time. Here the 2 thin film is deposited onto a metal electrode from a solution of a Ti Ti0 compound like TiC1 4 [61, 62], TiC1 3 [62, 63], Ti(S0 2 [64-66] or ) 4 (NH [ ] ) 4 0 2 TiO(C 4) [67]. Care must be taken that the chosen salt does not hydrolyze in the solvent used, which would result in precipitation (i.e. powder formation). Often hydrogen peroxide is added as oxidant in combination with the Ti-compound [61, 64, 66]. Surfactants can be added to influence the growth and structure of the deposited film [62, 68]. 1f the substrate is conductive a d.c. process can be used [62, 64]. As the deposited coating is insulating, often a pulsed d.c. [32] or a.c. [67] process is necessary. The latter two also have the advantage that they can be used for coating an insulating 212 K.Eufmgeretal. substrate or to fl11 the porous structure of an alumina film grown by anodic oxidation [32, 67]. In most cases a porous, XRD amorphous Ti0 2 film is deposited, which is beneficial for catalytic applications. Annealing at temperatures between 300 and 500°C is needed to obtain crystalline anatase films [61, 66, 69]. Some references report direct deposition of crystalline Ti0 2 [62]. A related technique is the anodic oxidation of Ti-metal, where a thin oxide film is grown on the surface of the anode. There are few reports about growing such films for photocatalytic applications [70]. 4.3. Vapor deposition techniques Vapor deposition techniques inciude chemical vapor deposition (with or without plasma enhancement, i.e. CVD or PEC\TD) and physical vapor deposition (PVD), inciuding electron beam evaporation and (magnetron) sputtering. With (PE)CVD powders as well as thin films can be deposited, depending on the processing conditions. Physical vapor deposition techniques are used exclusively for thin film deposition. The main advantage of vapor deposition techniques, especially P\JD is that good adhesion of the film to the substrate can be achieved. A second advantage of vapor deposition techniques is that the process conditions can be controlled to yield crystalline thin films without extemal substrate heating, while substrate self heating can occur during the process. 4.3.1. Chemical vapor deposition techniques Chemical vapor deposition (CVD) Chemical vapor deposition (CVD) techniques are based on the oxiclative decomposition of a volatile Ti-precursor to form a Ti0 2 film on the substrate (Figure 8.). Variations of the technique inciude using an aerosol, which is formed in the reaction chamber, so that droplets are deposited. 1f a thin film is desired, care has to be given, that the process does not result in powder formation. Ti-precursor reaction zone 0-precursor]\ 0 0’ *Q carrier gas, precursors -. 0 • 0 •0 0 • 0 — exhaust) ° • . substrate 0 0 0 0 0 Figure 8. Scheme of a generic chemical vapor deposition process. 2 thin films for photocatalytic applications Ti0 213 A study showing the factors determining powder or film formation is given in [71]. In order to promote the deposition of a well adhering, crystalline film it is necessary to work at elevated temperatures or use other methods to introduce additional energy into the reactive zone. The main advantages of CVD are that complex surfaces can be coated and the film porosity can easily be controlled. In the original (CVD) process a volatile inorganic Ti-compound (TiC1 ) is 4 decomposed at the substrate in the presence of oxygen and! or water to Ti0 2 and HC1. The Ti-precursor is introduced into the reactor together with a carrier gas, usually by bubbling it through the precursor fluid. Initially thermal energy (heat) was used to promote the oxidation reaction and enhance film crystallization. At temperatures between 300 to 700°C the anatase phase is formed while at higher temperatures the rutile phase crystallizes. The exact crystallization temperature depends on the nature of the process. Further devëlopment of the CVD technique implemented other energy sources which allow thin film crystallization at lower temperatures. Additionally, the carrier gas flow and the concentration of the reactants influence the structure and properties of the deposited film. Depending on the technique and the reaction parameters used, quite high deposition speeds up to 10 nm/s can be reached. In the following some variations of the standard thennal CVD technique will be discussed briefly. Since TiC1 4 is a quite unstable compound, investigators started using organic Ti-compounds, i.e. metal-organic (MO) precursors, which has led to the term MOCVD. The standard organic precursor is titanium tetra isopropoxide (TTIP), also called Ti(IV)-isopropoxide, with the chemical formula Ti(O-CH(CH , which is normally implemented in form of a 4 2 ) 3 solution in isopropanol. This material has a quite good stability towards ambient air and a low toxicity so that it is easy to handle. Other organic Ti compounds have also been used [72-75], inciuding precursors that do not need addition of oxygen or water [76]. There is a continuous development of new precursors with the aim to influence the deposition process and, as a result, the film properties. To enhance the dissociation of the precursors and or lower the reaction temperature different secondary energy sources can be used. Examples are (r.f.) plasma enhancement (PECVD) [77-87], thermal plasma (TPCVD) [88], laser irradiation (LCVD) [89, 90] or ultraviolet light (UV) [91], with plasma enhancement being the most implemented one. Methods different than bubbling can also be used to introduce the Ti precursor(s), e.g. liquid injection (LICVD) [91, 92], liquid delivery [93], liquid mist spray [72] or liquid aerosol [94]. Related to the latter two techniques is spray pyrolysis. The pressure in the reaction chamber can range from atmospheric (APCVD) [71, 72, 95, 96] over low pressure [60, 84, 85] to high vacuum [25]. 214 K. Eufmger et al. Atomic layer deposition Further development of (M0)CVD has led to ALD (atomic layer deposition) [97-101]. Here the reaction conditions and precursors are chosen in a way as to yield a layer-by-layer growth of the film: First the Ti-precursor is introduced and coated as a monolayer on the substrate, then an oxidizing agent is introduced (e.g. 02), which oxidizes this layer. By repeating these steps a (dense) thin film can be grown. Due to the low deposition rate, being on the order of 1 0 nm!s, ALD is a very slow and therefore very expensive deposition technique. The advantage is, though, that any surface shape can be coated in a very homogeneous marmer, leading to so-called conformal coatings. 4.3.2. Physical vapor deposition techniques Evaporation Most evaporation techniques used for the deposition of Ti0 2 thin films are derived from electron beam evaporation (Figure 9.). Here the source material, usually Ti0 , a sub-oxide [102, 103] or Ti-metal [104] is heated with an 2 intense electron beam under an oxygen partial pressure below 0.1 Pa. The addition of oxygen is needed to obtain stoichiometric films. In a standard setup a low chamber pressure is needed to prevent scattering of the evaporated particles and oxidation of the electron gun. 1f the electron gun is differentially pumped higher pressures can be used in the deposition chamber. The evaporation rates can be quite high, namely on the order of 10 nmls. Crystalline (anatase or rutile) thin films can be obtained by either heating the substrate during deposition or annealing after deposition. The microstructure of the thin films can be controlled by the starting materials, the substrate temperature [105, 106], the deposition (02) pressure [107, 108], the evaporation rate and the angle of incidence [104]. Studies looking at a variety of parameters are given in [102, 109]. An additional plasma [106] or ion (beam) source [102, 105, 109, 110] can be implemented to control the thm film microstructure and stoichiometry. vacuum chamber Figure 9. Scheme of a setup for electron beam evaporation. 2 thm films for photocatalytic applications Ti0 215 Molecular beam epitaxy Molecular beam epitaxy (MBE) is a very precise evaporation tecbnique using an ultra low deposition speed. Here the Ti-precursor and the oxidizmg agent are introduced together as atomic or molecular beams. The layers are grown on a substrate which has a good lattice matching with the Ti0 2 phase to be grown, so that the thin film follows the crystallographic orientation of the substrate surface (epitaxial growth). In order to achieve this type of growth the deposition rate bas to be rather low and the substrate needs to be chosen as to yield a lattice match with the desired crystallographic orientation and phase of . A very good review on the subject of MBE growth of oxide thin films, 2 Ti0 2 is given in [111]. Since MBE requires single inciuding rutile and anatase Ti0 crystalline substrates, this is a technique which is not likely to be implemented for large scale deposition of photocatalytic layers. Nevertheless, it is an interesting technique for studying specific crystal planes of Ti0 . 2 Sputtering In diode sputtering a discharge is generated by applying a d.c. voltage between two electrodes (anode and cathode) in a low pressure gas, typically argon (Figure 10, left). The ions generated in the discharge are accelerated towards the cathode (target), bombarding its surface, which resuits in the removal (sputtering) of cathode atoms [112, 113]. The sputter rate from a diode discharge is low (partially due to the rather high pressures of 1-10 Pa needed to sustain the discharge). An improvement is the use of a magnetic field confinement of the discharge above the cathode, i.e. magnetron sputtering [114, 115] (Figure 10, right). This technique allows deposition at lower gas pressures (0.1 to 1.0 Pa) and as a result, higher deposition rates. Further modifications are the use of r.f and pulsed d.c. or a.c. power to avoid charging effects when sputtering from an insulating target or in the presence of a reactive gas which forms a non-conductive substrate: deposit thin film electrons: to anode Figure 10. Scheme of d.c. diode (left) and magnetron (right) sputtering. K. Eufmger et al. 216 compound with the sputtered target material. The deposition of Ti0 2 thin films with (reactive) d.c. magnetron sputtering will be discussed in more detail in section 5. 5. Deposition of Ti0 2 thin films by reactive d.c. magnetron sputtering In this chapter we will first give an overview of how the technique of (reactive) d.c. magnetron sputtering can be used to deposit Ti0 2 thin films (section 5.1). We will then discuss the parameters controllmg thin film growth with this technique (section 5.2) and how they can be implemented for growing 2 thm films having different crystal and microstructures (section 5.3). Ti0 5.1. Reactive d.c. magnetron sputtering D.c. magnetron sputtering is a physical vapor deposition technique, which is operated in a vacuum system at total gas pressures of 0.1-1 .OPa. 1f the sputtering gas is inert, it will not undergo any chemical reaction with the target material so that the composition of the thin film is controlled by the target composition. When a second gas, which can react with the target material, is added, to the sputtering gas the technique is called ‘reactive sputtering’ [116-118]. The addition of a reactive gas has profound implications on the sputtering process and, therefore, on the deposition of the thin film. At low reactive gas concentrations the same deposition conditions as for metallic sputtering (inert gas only) are observed, so that metal rich thin films are deposited. For intermediate reactive gas concentrations the process becomes unstable, so that controlled thin film deposition in this range is not possible. For high reactive gas concentrations the discharge conditions are quite different so that one speaks about ‘reactive’ sputtering. In this regime a stoichiometric compound Reactive gas: 02, N 2 sputter gas: Ari target powersupply Figure 11. Scheme of a reactive d.c. magnetron sputtering setup. 2 thin films for photocatalytic applications Ti0 217 film is deposited. For reactive sputtering the deposition rate is low, which is unattractive for most applications. Therefore, methods have been developed to stabilize the sputter process for intermediate reactive gas concentration which allows depositing stoichiometric thin films at a higher rate [116-11 8]. In the case of Ti0 2 thin film deposition it is possible to use a sub stoichiometric ceramic TiO . target having a sufficient d.c. conductivity to 2 enable d.c. sputtering [22, 119-122]. In [123] the deposition rate of a Ti0 175 target in pure Ar is 50% of the metallic deposition rate and 3 times that of the reactive rate. In [124] also a high deposition rate is reported for sputtering of a TiO (1.5 <x< 1.7) target in pure Ar. In [119] the deposition rate of TiO 2 in pure Ar is reported to be 6 times that of the rate in the reactive mode. It seems that, when sputtered in pure Ar, the oxide target operates in the transition region of the metallic target [125], and it is possible to deposit stoichiometric films under these conditions [30, 126]. With increasing oxygen flow the same sputtering conditions as for the metallic target in the reactive sputtering mode are reached [125]. For TiO .. targets no unstable sputtering regime is observed 2 [22, 122, 125], so that high rate deposition of stoichiometric films does not require sophisticated process control [123, 124]. 5.2. Structural development durmg film growth A well known and much referred to model for the microstructural development during thin film growth by metal evaporation is the one developed Movchan and Demchishin [127], which was extended to sputtering by Thornton [128]. Latter describes the changes in microstructure observed when depositing thick (metallic) films with the substrate temperature T (referred to the melting temperature Tm), and the inert gas pressure as parameters. According to the observed thin film structure the growth was divided into different zones. The Thomton model was further developed by [129] relating the different zones to the particle energy instead of the surface temperature. It is beyond the scope of our review to discuss this structure zone model in detail, but we will give a summary here and point Out how it can be used to define the deposition conditions for thin film structures that are of interest for depositing photocatalytic Ti0 2 films. In the structure zone model by [129] the thin film growth is divided into three different growth zones (1-3), with an intermediate zone T between zone 1 and zone 2. In zone 1 the particle energy on the substrate surface is too low to allow diffusion. For very low particle energies a so-called hit-and-stick growth occurs, which resuits in amorphous or nanocrystalline, highly porous and finely grained films. With increasing particle energy kinetic crystal growth can occur in this zone 1, but the film density remains low. From zone T on the arriving particles have enough energy to move on the substrate surface, so that 218 K. Eufmger et al. preferential crystal growth can occur. As a result, the film density and the size of the single crystal grains increase. In zone 3 the particle energy is high enough to allow bulk diffusion, which should ultimately lead to the growth of a single crystal film. The presence of defects and impurities prevents this due to the formation of gram boundaries, though [129]. The important issues for depositing photocatalytic Ti0 2 are crystallinity, stoichiometry (degree of oxidation), density and surface morphology. From the description of the structure zones it becomes dear that zone 1, and to some extent zone T, are the most interesting for photocatalytic Ti0 2 thin film growth. The low density and small gram size will increase the surface area of the thin film (section 3.6), enhancing its photocatalytic activity. 5.3. Controlling the structure of Ti0 2 thin films As already discussed in section 3.1 the rutile phase is the thermodynamically stable one, but since the energies of the anatase and brookite phases are only slightly higher, they can exist as metastable phases up to the transformation temperature of about 800°C [4]. For the gram sizes below about 15 nm anatase is more stable than rutile or brookite, so that the crystal phase formed can be controlled by the gram size. The discussion of the thin film growth using the structure zone model (section 5.2) becomes more complex in the case of Ti0 2 for two reasons: (i) one has to take into account different crystal phases possible and (ii) the sputtering process is reactive so that the oxygen partial pressure is an additional parameter. In the following we give a short summary of the different deposition conditions used to obtain rutile, anatase or amorphous Ti0 2 films with reactive (d.c.) magnetron sputtering. No reference to the growth of brookite films using (d.c.) magnetron sputtering was found. Under most standard sputtering conditions and the substrate at room temperature the particles forming the thin film remain quasi immobile on the film surface so that the films follow the zone 1 type growth. This means that the Ti0 2 films are either XRD amorphous (section 3.2.1) or show only a very low degree of crystallinity [130]. D.c. sputtering almost exclusively leads to the deposition of the amorphous or the anatase structure, while pulsed d.c. and r.f. sputtering can also yield rutile or mixed anatase/ rutile structures. For the latter techniques the energy received by the growing film per incoming particle is higher at the same input power, due to a lower deposition rate as well as a higher degree of ionization in the plasma. As a result, a higher substrate self heating [114, 1311 is observed. When crystalline films are deposited very often a preferential orientation is observed, which may vary according to the deposition conditions. The energy of the particles arriving at the substrate is mostly determined by the sputter gas pressure and the target-to-substrate distance [114]. Both 2 thin films for photocatalytic applications Ti0 219 control the extent of particle collision in their path between target and substrate: Each collision leads to energy loss, and the number of collisions increases with increasing pressure and target-to-substrate distance. Important is also the oxygen partial pressure because (i) the deposition rate decreases with increasing oxygen flow rate, remaining stable once the reactive mode is established and (ii) the discharge voltage increases strongly upon transition from the metallic to the reactive mode (when using metallic Ti targets). The former decreases the energy received by the growing film per unit time while the latter increases the energy per arriving particle. An additional factor is the increase in substrate temperature either due to external heating or self heating during the process. The total energy deposited in the thin film can additionally be varied by the number of incoming particles per unit time. Latter is varied by the sputter rate, which itself depends mostly on the discharge current [114]. Another method to increase the energy of the particles bombarding the thin film is by using so-called’ unbalanced’ magnetron sputtering [129]. Here the magnetic field lines direct the flux of charged particles present in the plasma to the substrate, delivering additional energy to the growing film. From the above discussion one can expect that rutile films are formed for higher particle energies combined with a low deposition rate. Both result in larger gram sizes, allowing the thermodynamically stable phase to form. This is confirmed by experimental resuits for r.f., a.c. or pulsed d.c. sputtering given in [132-136]. Very recently it was reported that an almost pure rutile film was obtained using d.c. magnetron sputtering [137]. On the other hand, amorphous or nanocrystalline films are expected to form at low particle energies and low substrate temperatures, which is confirmed by experimental resuits [32, 132, 135, 136, 138-140]. Anatase is reported to form at medium particle energies, especially when smaller grains are formed. Elevated substrate temperatures will enhance crystallization, but one needs to keep in mmd that temperatures above 800°C almost exclusively result in the crystallization of rutile as well as strong gram growth [4]. For r.f. sputtering the formation of anatase falis between the conditions listed for rutile and amorphous Ti0 . For d.c. sputtering it was 2 found that the crystallization of anatase was promoted by increasing the arriving particle energy [32, 138, 139-142]. The results indicate that there is no difference using Ti and TiO .. as target material. 2 5.4. Important issues for improving the photocatalytic activity Up to now the highest photocatalytic activity has been reported for anatase or anatase/ rutile mixed phases, so that the obvious aim is to deposit such structures. The disadvantages of depositing crystalline thin films are the larger gram size due to crystal growth and the elevated deposition temperatures K. Eufmger et al. 220 needed. Our own studies have shown that amorphous thin films can have a quite high photocatalytic activity when their porosity is larger than 20% [30]. Such films have a low gram diameter of 50 nm, which increases their active surface area (section 3.6). Since they are deposited at temperatures below 50°C it is possible to deposit them on heat sensitive substrates. Amorphous films can be crystallized by an anneal treatment at temperatures between 300 and 400°C [30, 143, 144]. These temperatures are too low for gram growth so that the fine gram size of the as deposited coating is preserved. 6. Measuring the photocatalytic activity of Ti0 2 thin films In order to determine the activity of a photocatalyst it is necessary to have an experimental procedure to either directly measure the conversion of light energy into the lowering of the activation energy of a given breakdown reaction or to compare the evolution of a chemical reaction between different catalysts and! or organic substances. The former is rather difficult, if not impossible to measure directly, while the latter gives only indirect evidence of the catalyst activity. In this paragraph we point out the special considerations for determining the photocatalytic activity of a thin film. Figure 12. (left) shows the sketch of a generic setup for measuring the photocatalytic activity of a thin film catalyst. The concentration of the organic test substance (OR) and, if desired, of the decomposition product(s) (DP) are followed by the analyzer for example a gas chromatograph (GC), a mass spectrometer (MS) or a photo-spectrometer. Figure 12. (right) shows the evolution of the OR and the DP for the case of first order reaction kinetics. Normally the initial rate of the breakdown reaction (taken from the initial slope of the concentration of the organic as a function of time) is used as a measure for the catalytic activity of the thin film [145]. It can therefore be interesting to change the order of the reaction to zero as this results in an initially linear time of IIumnation 1 t t 1 1 Figure 12. Sketch of a generic measurement setup to follow the photocatalytic breakdown of an organic substance (OR) and its decomposition product (DP). 2 thm films for photocatalytic applications Ti0 221 decay of the OR concentration [8]. It is a rather complex procedure to determine the efficiency of a photocatalyst quantitatively. Standard definitions and procedures were established by the IUPAC [145, 146] for the testing of the photocatalytic activity of a powder suspended in water. These procedures are designed to report the absolute photocatalytic activity of a given Ti0 , 2 referenced to the number of active photons (UV) arriving at the powder surface. Unfortunately the suggested reference organic compounds (phenol as aromatic and formic acid as aliphatic organic) are not very suitable for testing in a gaseous environment [145]. Additionally, the true surface area of a thin film is usually not measurable (section 3.6.1), even though it can be estimated using the procedure outlined in section 3.6.2. As a result, most experimental settings for testing thin film photocatalysts are not compatible with the strict requirements stated by the ILTPAC, meaning that a more qualitative approach must be applied. One option is to use a reference thin film catalyst against which other thin films, organic substances or changes in the experimental settings can be tested. The major problem is, though, that no universally 2 thin film catalyst material exists. The only reports of a reference available Ti0 thin film were found in [47, 147], where a spin coated layer of the well-known powder catalyst Degussa P25 was used. A second suggested material was Pilkington ActiveTM [47], a CVD deposited thin film on Si0 2 coated glass, but this material has a very low photocatalytic activity due to is low thickness [31]. There are several important parameters when testing and comparing thin film photocatalysts. The first is the number of (active) photons (i.e. the IJV intensity) absorbed in the thin film. This number depends on the film thickness (section 3.7), the spectral range and power of the (UV) lamp used and how much light is lost between lamp and thin film surface. The second parameter is the initial concentration of the organic test substance in relation to the active thin film surface area, which determines the coverage of the catalyst surface and therefore the reaction kinetics [4, 8]. The third parameter is the nature of the organic test substance, which determines the active pore size and therefore the active surface area of the thin film. Additional parameters are the degree of surface hydroxylation (section 3.4) and the presence of oxygen. Latter is normally taken care of by working in air or by supplying a surplus of oxygen to the reaction chamber (e.g. by bubbling). 7. Conciusions and outlook In this review we discussed several aspects of TiO 2 thin film deposition fQ.r photocatalytic applications. We started with the factors influencing the 2 thin films, the two most important being the photocatalytic activity of Ti0 microstructure and the crystallinity. Even though the active surface area is one K. Eufmger et al. 222 of the most important factors for a catalyst, the effect of the microstructure on the photocatalytic activity is neglected in most studies on thin films. In this review we demonstrated how the microstructure (porosity) of the thin films can enlarge the surface area. Next to keeping the gram size small it is important to estimate the pore size of the thin film and to determine whether these pores are large enough to enable inward diffusion of the organic substance studied and outward diffusion of reaction products. Additionally the thickness of the thin film is important, especially for high porosity, because the depth of the pores and, as a result, the active film surface area increases. The thin film crystallinity is the other important factor. Crystalline defects can act as trap sites for the photogenerated charge carriers, reducing the number of charge carriers available for the reaction to be catalyzed. For high crystallinity it is interesting to minimize the number of gram boundaries, i.e. to increase the gram size. This is contrary to the desire to increase the surface area, so that usually a gram size range of about 10-20 nm is considered an optimum compromise between these two issues. From the three most common 2 crystalline phases anatase is reported to be the most photoactive one. This Ti0 is one of the reasons why most studies work with crystalline anatase thin films. Anatase is also the crystal phase which forms most easily for small gram sizes and at the processing conditions commonly used. 2 thin films can be deposited with a variety of techniques based on wet Ti0 chemical and vapor deposition techniques. The most popular ones are sol-gel, chemical vapor deposition (CVD), and magnetron sputtering, a physical vapor deposition (PVD) technique. Independent of the deposition technique used it is desirable to control the deposition parameters as to yield thin films that fulfill the two basic requirements of high surface area and good crystallinity. For many techniques crystalline thin films can only be obtained when heated during or after deposition. This limits the substrate material choice, with most polymers not being applicable. Additionally, uptake of sodium or other detrimental contaminants from the substrate must be avoided. 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