V I S H AY I N T E R T E C H N O L O G Y, I N C .
ESD Protection Diodes
VESD05A4A-HS4 and VESD09A4A-HS4
New Ultra-Compact LLP1010-5L Package With 1-mm
by 1-mm Footprint and Low 0.4-mm Profile
FEATURES
• Low load capacitance:
–– 12 pF for the VESD05A4A-HS4
–– 6.2 pF for the VESD09A4A-HS4
• Maximum working ranges:
–– 5 V for the VESD05A4A-HS4
–– 9 V for the VESD09A4A-HS4
• Low leakage current < 0.1 µA
• Provide transient protection for four data lines as per IEC 61000 4 2 (ESD)
at ± 15 kV (contact discharge) and ± 20 kV (air discharge)
• Environmentally friendly “green” molding compound; Lead (Pb)-free devices
KEY APPLICATIONS
• 4
-line ESD data port protection in space-limited mobile electronics, such as portable
gaming systems, MP3 players, and cell phones
RESOURCES
• Datasheet: VESD05A4A-HS4 - http://www.vishay.com/doc?81786
VESD09A4A-HS4 - http://www.vishay.com/doc?81803
• For technical questions contact ESD-Protection@vishay.com
• Material categorization: For definitions of compliance please see
http://www.vishay.com/doc?99912
One of the World’s Largest Manufacturers of
Discrete Semiconductors and Passive Components
PRODUCT SHEET
1/2
VMN-PT0109-1411
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC
DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V I S H AY I N T E R T E C H N O L O G Y, I N C .
ESD Protection Diodes
VESD05A4A-HS4 and VESD09A4A-HS4
New Ultra-Compact LLP1010-5L Package With 1-mm
by 1-mm Footprint and Low 0.4-mm Profile
KEY SPECIFICATIONS:
PART NUMBER
VESD05A4A-HS4
VESD09A4A-HS4
WORKING RANGE
5V
9V
CAPACITANCE
12 pF
6.2 pF
SURGE CURRENT
> 2.5 A
> 1.5 A
LEAKAGE CURRENT
0.1 µA at 5 V
0.1 µA at 9 V
ELECTRICAL CHARACTERISTICS
Ratings at 25 ºC ambient temperature, unless otherwise specified
VESD05A4A-HS4
MAX.
UNIT
< 0.01
-
-
12
7.5
4
5
0.1
8
12
2.5
15
8.5
lines
V
V
µA
V
V
V
pF
pF
1.05 [0.041]
0.125 [0.005] Ref.
0.1 [0.004]
0.05 [0.002]
0.125 [0.005] Ref.
2/2
0 [0.000]
0.95 [0.037]
FOOT PRINT RECOMMENDATION:
0.7 [0.028]
0.15 [0.006]
1.05 [0.041]
0.5 [0.020] Exp. DAP
0.25 [0.010]
0.1 [0.004]
0.7 [0.028] Ref.
0.35 [0.014] Bsc
0.2 [0.008]
0.22 [0.009] Exp. DAP
0.35 [0.014]
soldermask opening ± 0.03
measured middle of the package
0.95 [0.037]
Pin 1 marking
0.03 [0.001]
solder resist mask
0.33 [0.013]
0.35 [0.014]
0.40 [0.016]
0.3 [0.012]
solder pad
PRODUCT SHEET
UNIT
lines
V
V
µA
V
V
V
pF
pF
0.5 [0.020] Exp. DAP
SYMBOL MIN. TYP. MAX.
Nchannel
4
0.22 [0.009] Exp. DAP
9
VRWM
VR
9
IR
< 0.01 0.1
VBR
11.2
13
VC
23
0.25 [0.010]
VF 0.15 [0.006]
2
6.2
10
CD
3.2
4
0.2 [0.008]
0.7 [0.028] Ref.
0.125 [0.005] Ref.
0 [0.000]
0.03 [0.001]
CD
0.175 [0.007]
0.05 [0.002]
0.175 [0.007]
0.35 [0.014]
0.7 [0.028]
0.33 [0.013]
0.95 [0.037]
0.40 [0.016]
BiAs mode: each input (pin 1, 3, 4 and 5) to ground (pin 2 and/or 6)
PARAMETER
TEST CONDITIONS/REMARKS
Protection
paths
Number
of lines which can be protected
Pin 1 marking
Reverse stand-off voltage
Max. reverse working voltage
Reverse voltage
at IR = 0.1 μA
Reverse current
at VRWM = 9 V
Reverse breakdown voltage
at IR = 1 mA
1.05 [0.041]
Reverse clamping
voltage
at IPP = 1.5 A
0.95 [0.037]
Forward clamping voltage
at IPP = 1.5 A
at VR = 0 V; f = 1 MHz
Capacitance
at VR = 4.5 V; f = 1 MHz
1.05 [0.041]
Revision 31-May-12
TYP.
5
6
-
0.5 [0.020] Exp. DAP
VESD09A4A-HS4
FOOT PRINT RECOMMENDATION:
MIN.
Nchannel
VRWM
VR
IR
VBR
VC
VF
0.35 [0.014] Bsc
0.15 [0.006]
SYMBOL
Number of lines which can be protected
Max. reverse working voltage
at IR = 0.1 μA
at VRWM = 5 V
at IR = 1 mA
at IPP = 2.5 A
at IPP = 2.5 A
at VR = 0 V; f = 1 MHz
at VR = 2.5 V; f = 1 MHz
0.1 [0.004]
Capacitance
0.2 [0.008]
0.35 [0.014] Bsc
Protection paths
Reverse stand-off voltage
0.22 [0.009] Exp. DAP
Reverse voltage
Reverse current
Reverse breakdown voltage
Reverse clamping voltage
Forward clamping
voltage
0.25 [0.010]
0.7 [0.028] Ref.
Revision 04-Jun-12
BiAs mode: each input (pin 1, 3, 4 and 5) to ground (pin 2 and/or 6)
PARAMETER
TEST CONDITIONS/REMARKS
0.3 [0.012]
0.35 [0.014]
solder resist mask
VMN-PT0109-1411
0 [0.000]
0.03 [0.001]
0.33 [0.013]
0.40 [0.016]
solder pad
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT
TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Pin 1 marking
soldermask opening ± 0.03
measured middle of the package