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Resistors
Water Insoluble Nitride Thin Film
Precision Chip Resistors
Make Possible
WIN Series
TaN thin film technology
Inherent moisture protection superior to that of passivated
nichrome chip resistors
High stability in humid and polluted environments
Typical 85°C, 85%RH biased humidity 2000 hour stability <0.1%
Typical moisture resistance stability ±100ppm
Precision ±0.05% tolerance and ±15ppm/°C
Anti-sulfur terminations
All Pb-free parts comply with EU Directive 2011/65/EU (RoHS2)
Electrical Data
Power rating @ 70°C
Resistance range
Limiting element voltage (maximum voltage)
Resistance tolerance
T0603
T0805
T1206
watts
0.1
0.25
0.33
ohms
5R to 100K
5R to 267K
5R to 1M0
Vdc or
rms
75
100
200
%
TCR
±0.05 ±0.1 ±0.5 ±1
ppm/°C
±15 ±25 ±50
Standard values
E24, E96, E192
Ambient temperature range
°C
-65 to +150
Physical Data
Dimensions in mm & (inch) and weight in mg
L
W
1.58 ± 0.15
(0.062 ± 0.006)
0.80 ± 0.10
(0.031 ± 0.004)
0.45 ± 0.10
0.27 ± 0.20
0.34 ± 0.20
(0.018 ± 0.004) (0.011 ± 0.008) (0.013 ± 0.008)
2.0
2.02 ± 0.15
T0805
(0.080 ± 0.006)
1.28 ± 0.15
(0.050 ± 0.006)
0.45 ± 0.10
0.31 ± 0.20
0.40 ± 0.20
(0.018 ± 0.004) (0.012 ± 0.008) (0.016 ± 0.008)
4.3
3.15 ± 0.15
(0.124 ± 0.006)
1.57 ± 0.15
(0.062 ± 0.006)
0.50 ± 0.15
0.45 ± 0.25
0.52 ± 0.25
(0.020 ± 0.006) (0.018 ± 0.010) (0.020 ± 0.010)
9.6
T0603
T1206
T
C
A
Wt. nom
C
T
L
A
W
Construction
Conductors, thin film resistive element and epoxy outer protection are applied to an alumina substrate. The chips are supplied with
wrap-around terminations suitable for soldering. The terminations have an electroplated nickel barrier and either 100% matt tin or 60/40 SnPb finish.
Marking & Solvent Resistance
WIN resistors have no marking on the component body. The body protection is resistant to all normal cleaning solvents suitable for printed circuits
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
www.ttelectronicsresistors.com
© TT Electronics plc
02.16
Resistors
Water Insoluble Nitride Thin Film Precision Chip Resistors
Make Possible
WIN Series
Manufacturing Capabilities Data
Water
Water Insoluble
Insoluble Nitride
Nitride Thin
Thin Film
Film Precision
Precision Chip
Chip Resistors
Resistors
WIN
WIN Series
Series
Water
Insoluble Nitride Thin Film Precision Chip Resistors
Performance Data
WIN Series
Test
Performance
Performance Data
Data
Performance Data
ΔR
ΔR
ΔR
Method
Method
Method
MIL-PRF-55342
WIN
actual
MIL-PRF-55342
WIN
actual
MIL-PRF-55342
ΔR
Limits
Limits(max)
(max) performance
performance(typ)
(typ)
Limits
(max)
Test
Method
MIL-PRF-55342
WIN actual
Thermal
Shock
MIL-PRF-55342
4.8.3
107G
F:F:55cycles
air,
±
0.1%
±
0.025%
Thermal
Shock
MIL-PRF-55342
4.8.3(MIL-STD-202
(MIL-STD-202
107Gcond.
cond.
cycles
air,+150
+150/in
/-65°C)
-65°C)
±
0.1%
±
0.025%
MIL-PRF-55342
4.8.3 (MIL-STD-202
107G
cond.
F: 5inincycles
air, +150
/
-65°C)
±
0.1%
Limits (max) performance (typ)
Test
Test
Thermal Shock
MIL-STD-202
107G
cond.4.8.5
F-3:
100 cycles in air, +150 / -65°C
Low
Temp.
Operation
MIL-PRF-55342
(-65°C)
±±0.1%
Low
Temp.
Operation
MIL-PRF-55342
Thermal Shock - Extended
Thermal
Shock
MIL-PRF-55342 4.8.5
4.8.3 (-65°C)
(MIL-STD-202 107G cond. F: 5 cycles in air, +150 / -65°C)
± 0.1%
0.1%
Low Temp. Operation
MIL-PRF-55342
4.8.5 (-65°C)
Short
Time
MIL-PRF-55342
4.8.6 (lesser
of 6.25 x P or 2 x LEV for 5 seconds)
±±0.1%
Short
TimeOverload
Overload
MIL-PRF-55342
Low Temp.
Operation
MIL-PRF-55342 4.8.6
4.8.5 (lesser
(-65°C) of 6.25 x P or 2 x LEV for 5 seconds)
± 0.1%
0.1%
Short Time Overload
MIL-PRF-55342
4.8.6 (lesser
of 6.25
x Pr
or 2 x LEV for 5 seconds) ±±0.1%
High
MIL-PRF-55342
for
100
High
Temp.
Exposure
MIL-PRF-55342
4.8.7
(+150°C
for
100xhours)
hours)
0.1%
ShortTemp.
Time Exposure
Overload
MIL-PRF-553424.8.7
4.8.6(+150°C
(lesser of
6.25
P or 2 x LEV for 5 seconds)
± 0.1%
High Temp. Exposure
MIL-PRF-55342
4.8.7 (+150°C for 100 hours)
Resistance
Solder
±±±0.2%
Resistance
to
SolderHeat
Heat MIL-PRF-55342
MIL-PRF-553424.8.8
4.8.8 (+150°C for 100 hours)
0.2%
High Temp.to
Exposure
MIL-PRF-55342
4.8.7
0.1%
High Temp. Exposure Extended +150°C for 1000 hours
Moisture
Resistance
±±±0.2%
Moisture
Resistance
MIL-PRF-553424.8.9
4.8.9
(MIL-STD-202106G:
106G:10
10cycles,
cycles,65±2°C,
65±2°C,95±5%
95±5%RH)
RH)
0.2%
Resistance
to Solder Heat MIL-PRF-55342
MIL-PRF-55342
4.8.8(MIL-STD-202
0.2%
Resistance to Solder Heat
MIL-PRF-55342
4.8.8
Load
Life
MIL-PRF-55342
4.8.11
(MIL-STD-202
108A:
Pr
at
70°C
for
2000
hours)
±±0.5%
Load
Life
MIL-PRF-55342
4.8.11
(MIL-STD-202
108A:
Pr
at
70°C
for
2000
hours)
0.5%
Moisture
Resistance
MIL-PRF-55342
4.8.9 (MIL-STD-202
106G: 1010
cycles,
65±2°C, 65±2°C,
95±5% RH) 95±5% ±RH)
0.2%
Moisture Resistance
MIL-PRF-55342
4.8.9 (MIL-STD-202
106G:
cycles,
Biased
Damp
85°C,
85%RH,
10%
PP bias,
for
N/A
Biased
DampHeat
Heat
85°C,
85%RH,(MIL-STD-202
10%
bias,
for2000
2000hours
hours
Load Life
4.8.11
108A:
at for
70°C
LoadMIL-PRF-55342
Life
MIL-PRF-55342
4.8.11
(MIL-STD-202
108A: Pr Pr
at 70°C
2000 for
hours)2000 hours)
± N/A
0.5%
Flower
of
ASTM
B-809
(modified)
105°C
Dry,
1000
Hours
Flower
ofSulfur
Sulfur
ASTM
B-809
(modified)
105°C
Dry,hours
1000
Biased Damp Heat
85°C,
85%RH, 10%
Pr bias,
2000
Biased
Damp
Heat
85°C, 85%RH,
10% Pfor
bias,
for 2000
hoursHours
N/A
Flower of Sulfur
ASTM
B-809
(modified)
105°C
Dry,
1000
Hours
Flower of Sulfur
ASTM B-809 (modified) 105°C Dry, 1000 Hours
±±0.02%
0.02%±
± 0.025%
r
rr
r
0.1%
0.1%
±
0.1%
±±±0.05%
0.05%
0.02%
± 0.1%
±±±0.02%
0.02%
0.05%
N/A
±±±0.01%
0.01%
0.02%
± 0.2%
±±0.08%
± 0.08%
0.01% ± 0.2%
±±0.08%
± 0.08%
0.08% ± 0.5%
± 0.08% N/A
±
±±0.02%
± 0.02%
0.02%
rr
Pass
Pass
Pass
WIN actual
performance (typ)
± 0.01%
± 0.02%
± 0.02%
± 0.02%
± 0.02%
±0.1%
± 0.02%
± 0.01%
± 0.08%
± 0.08%
Pass
Temperature
Temperature Derating
Derating
Temperature Derating
Proportion
of Pr
Pr
Proportion
Proportion
of Pr of
100%
100%
80%
80%
100%
60%
60%
80%
40%
40%
60%
20%
20%
40%
0%
0%
20% 0
0
0%
0
50
50
100
100
150
150
Ambient
Temperature
(°C)
Ambient
Temperature
(°C) 150
50
100
Ambient Temperature (°C)
Load
Load Life
Life Stability
Stability
Biased
Biased Damp
Damp Heat
Heat Stability
Stability
Typical
TypicalLoad
LoadLife
Lifeper
perMIL-STD-202
MIL-STD-202108A
108A
Typical
Typical@
@85°C,
85°C,85%RH,
85%RH,10%
10%PPr rbias
bias
Biased Damp Heat Stability
0.06%
0.06%
0.10%
0.06%
0.05%
0.05%
70kΩ
70kΩ
0.05%
0.04%
0.04%
70kΩ
25kΩ
25kΩ
0.05%
0.05%
0.05%
0.00%
0.00%
70kΩ
70kΩ
0.00%
70kΩ
-0.05%
-0.05%
100Ω
100Ω
-0.05%
-0.10%
-0.10%
100Ω
00
-0.10%
0
500
500
1000
1000
1500
1500
Time
Timeon
onTest
Test(hours)
(hours)
500
1000
1500
2000
2000
Resistance
Change
Resistance
Resistance
Change
Change
Resistance
Change
Resistance
Resistance
Change
Change
Load Life Stability
0.10%
0.10%
Typical Load Life per MIL-STD-202 108A
Typical @ 85°C, 85%RH, 10% Pr bias
0.04%
0.03%
0.03%
500Ω
500Ω
25kΩ
0.03%
0.02%
0.02%
500Ω
100Ω
100Ω
0.02%
0.01%
0.01%
0.01%
0.00%
0.00%
100Ω
00
0.00%
2000
Time on Test (hours)
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
0
500
500
1000
1000
1500
1500
Time
Timeon
onTest
Test(hours)
(hours)
500
1000
1500
2000
2000
2000
Time on Test (hours)
www.ttelectronicsresistors.com
www.ttelectronicsresistors.com
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www.ttelectronicsresistors.com
© TT Electronics plc
02.16
Resistors
Water Insoluble Nitride Thin Film Precision Chip Resistors
Make Possible
WIN
SeriesInsoluble Nitride Thin Film Precision Chip Resistors
Water
WIN Series
Water
Insoluble Nitride Thin Film Precision Chip Resistors
WIN Series
10/700µs Pulse Performance
1.2/50µs Pulse Performance
IEC60 115-1,
pulses, |ΔR|<0.1%
Pulse performance
data5 1.2/50
IEC60 115-1,
pulses, |ΔR|<0.1%
Pulse performance
data1010/700
10,000
1206
0805
0603
1,000
Peak Voltage (V)
Peak Voltage (V)
10,000
100
1206
0805
0603
1,000
100
10
10
0.01
0.1
1
10
100
0.01
1000
0.1
1
10
100
1000
Value (kilohms)
Value (kilohms)
Ordering Procedure
This product has two
valid part numbers:
Ordering
Procedure
Ordering
Procedure
European (Welwyn) Part Number: WINT1206LF031001B (1206, ±25ppm/°C, 1 kilohm ±0.1%, Pb-free)
This product has two valid part numbers:
European (Welwyn) Part Number: WINT1206LF031001B3 (1206, ±25ppm/°C, 1 kilohm ±0.1%, Pb-free)
W
I
N
I 1 N
W
T
T
1
0
22 0
1
1
1
2
2
6
6
L
F
3F
L
2
3
3
4
0
3
43
0
1
0
1
50
0
4
0
1
B
B6 3
1
5
6
5
7
6
Series Type Termination
TCR
Value
Tolerance
Packing
1
2
3
4
5
6
7
WIN T0603 LF = Pb free 03 = ±25ppm/°C 3 digits + multiplier B = ±0.1%
Tape & reel
Series Type Termination
TCR
Value
Tolerance
Packing
T0805
R = ohms for
All sizes 1000/reel
WIN T0603 PB = SnPb
Tape & reel
A = ±0.05%
11 = ±15ppm/°C 3 digits
+
multiplier
values
<100
ohms
T1206
T0805 LF = Pb free 03 = ±25ppm/°C
R = ohms for
3 3000/reel Standard
B = ±0.1%
T1206
02 = ±50ppm/°C values <100 ohms D = ±0.5% Blank 1000/reel
F = 1%
USA (IRC) Part Number: WIN-T1206LF-03-1001-B (1206, ±25ppm/°C, 1 kilohm ±0.1%, Pb-free)
USA (IRC) Part Number: WIN -T1206LF-03-1001-B3 (1206, ±25ppm/°C, 1 kilohm ±0.1%, Pb-free)
W
W
I
N
I 1 N
-
-
T
T
1
1
1
1
2
22 0
0
6
6
3
3
4
F
3F
L
2
2
L
-
-
0
3
43
0
-
-
1
1
0
5
50
0
4
0
5
1
1
-
-
B
B6 3
6
7
6
Series Type Termination
TCR
Value
Tolerance
Packing
1
2
3
4
5
6
7
WIN T0603 LF = Pb free 03 = ±25ppm/°C 3 digits + multiplier B = ±0.1%
Tape & reel
Series Type Termination
TCR
Value
Tolerance
Packing
R = ohms for
T0805
All sizes 1000/reel
WIN T0603 PB = SnPb
Tape & reel
11 = ±15ppm/°C 3 digits
A = ±0.05%
+
multiplier
values
<100
ohms
T1206
T0805 LF = Pb free 03 = ±25ppm/°C
R = ohms for
B = ±0.1%
3 3000/reel Standard
T1206
02 = ±50ppm/°C values <100 ohms D = ±0.5% Blank 1000/reel
F = 1%
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
© TT Electronics plc
www.ttelectronicsresistors.com
www.ttelectronicsresistors.com
02.16
www. electronicsresistors.com
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