Ericsson Saves Board Space with Surface

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NEWS
May 2013
Ericsson Saves Board Space with
Surface-Mount Advanced Bus
Converter
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Ericsson introduces a new surface-mounted version of its second generation of digital
Advanced Bus Converter (ABC) products, called the BMR456-SI.
High-efficiency, digitally controlled DC/DC converter compliant to full surface-mount
manufacturing processes; high-precision tooled pins guarantee high co-planarity and
robustness
Highly advanced firmware integrated in the BMR456-SI contributes towards significant
reduction in energy consumption
Tightly regulated output voltage (±2%) over the full operational range of 36V to 75V
Output power up to 468W for datacom applications
BMR456-SI is based upon the FRIDA II platform, which was announced last year, both the
surface-mount BMR456-SI and the through-hole BMR456-PI quarter-brick 3E* Advanced
Bus Converters deliver unprecedented performance to system architects that are developing
equipment for ICT (Information and Communication Technology) applications. These
applications require fast response time, tightly regulated intermediate bus voltages and high
efficiency at any point of operation to reduce power consumption.
Since the shipment of the first surface-mount version of the company’s FRIDA platform in
2010, the platform has enjoyed significant adoption with the growing demand for high-power
DC/DC modules to power highly integrated surface-mount boards. “Ericsson is the only
company in the industry to offer high-power DC/DC modules that are digitally controlled and
also offer a surface-mount option,” said Patrick Le Fèvre, Marketing and Communication
Director, Ericsson Power Modules. “The addition of a surface-mount version to the PMBus
compliant FRIDA II BMR456 DC/DC converter family is an indication of the strong market
demand for highly integrated power technology that can also make a significant contribution
to reducing energy consumption.”
Board density is increasing and to simplify manufacturing processes, power module
suppliers need to offer surface-mount alternatives to conventional through-hole versions.
Although it is not necessarily an issue at low- and mid-power levels, it can be a significant
challenge for high power modules and even more so when these modules require additional
I/O.
NEWS
May 2013
Ericsson’s advanced mechanical surface-mount technology is based on highly accurately
tooled pins that are inserted and aligned during the original assembly process. The same
hardware is used for through-hole and surface-mount versions of the BMR456, which
increases the flexibility and speed of manufacturing and contributes to smaller lead times.
The surface-mount pins are manufactured with very tight tolerances, guaranteeing coplanarity and mechanical accuracy. This process ensures high reliability and host equipment
availability.
In addition to input and output power connections, additional I/O (+/– output remote sense,
address pin, PMBus clock and data, power good and user configurable I/O, PMBus ground,
PMBus alert signal and PMBus remote control or current sharing) is made available through
a micro-interface. This connector has been designed to comply with Ericsson’s advanced
high-precision surface-mount technology and to guarantee full alignment and co-planarity
during different soldering processes.
The FRIDA II generation of fully regulated digital DC/DC converters is based on a 32-bit
ARM microcontroller that embeds the family’s most advanced firmware to date, called the
‘Ericsson DC/DC Energy Optimizer’. This combines advanced Ericsson Intellectual Property
(IP) together with a series of industry-first functionalities to continually optimize switching
parameters and reduce energy consumption to an absolute minimum. The firmware has
been developed to guarantee the highest possible performance at any point of operation
from low load to high load, and to handle line transients, such as those occurring in ATCA
(Advanced Telecommunications Computing Architecture) applications when, for example,
switching from Feed A to Feed B.
Designed to power telecom and datacom applications, the BRM456-SI is available in two
input voltages ranges: 36V to 75V (telecom), delivering output power of 420W; and 40V to
60V (datacom), delivering output power up to 468W. Output voltage can be adjusted across
a range from 4.0V to 13.2V via PMBus commands, making the module suitable for Dynamic
Bus Voltage operation resulting in the reduction of energy consumption when
communication data traffic is low.
In addition, taking full advantage of a highly optimized layout and firmware-optimized
parameter switching to reduce power losses, the BMR456-SI delivers a typical efficiency of
96.5% and exhibits flat curve behavior from 14% to 100% load, positioning the product as
the most efficient Advanced Bus Converter in its category.
NEWS
May 2013
The BMR456-SI meets the insulation requirements of EN60950, sustains an I/O isolation
voltage of 2250 VDC, and also offers an extensive set of capabilities and features such as:
remote sensing; PMBus-configurable protection (over-temperature, over-current and overvoltage); configurable start/stop; precision delay ramp-up; voltage margining; configurable
fault response; power good; and extensive power management programmability.
* 3E stands for: Enhanced Performance, Energy Management, and End-user Value.
FOR FURTHER INFORMATION, PLEASE CONTACT
Patrick Le Fèvre, Marketing and Communication Director, Ericsson Power Modules
Phone:
+46-10-716 95 07
Reader Inquiry reference:
Reference:
E0176(A)
If printing an Internet address please use Power Modules homepage and/or phone number
to our International sales office:
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Asia Pacific:
Japan:
Americas:
About Ericsson Power Modules
www.ericsson.com/powermodules
+46-10-716 96 20
+ 86-21-5990 3258
+81 80 3363 3987
+1-972-583 6910 or +1-972-583 5254
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