FEATURES PACKAGE High Power Gain Excellent Ruggedness 50V Supply Voltage Operation from 24v- 50v high Power Gain Extremely Rugged Internal Input and Output Matching Pb-free and RoHS Compliant TYPICAL PERFORMANCE DESCRIPTION ORDERING INFORMATION REV. B THERMAL/RUGGEDNESS PERFORMANCE ABSOLUTE MAXIMUM RATING (IEC 134) Symbol Parameter Value Unit VDSS Drain-Source Voltage 95 V VGSS Gate-Source Voltage -10, 10 V IDS(max) PD1 Pin TS TJ Drain Current Power Dissipation Input Power Storage Temperature Junction Temperature 20 875 7.5 -40 to +150 200 A W W °C °C Symbol Parameter Max Unit 0JC2 Thermal Resistance 0.20 °C/W Symbol Parameter Test Condition Max Units LMT2 F = 1090 MHz 20:1 VSWR Load Mismatch Tolerance ELECTRICAL CHARACTERISTICS Symbol Parameter Conditions VBR(DSS) Drain-Source Breakdown VGS=0V,ID=5mA IDSS Drain Leakage Current VGS=0V,VDS=50V IGSS G P2 IRL2 Gate Leakage Current Power Gain Input Return Loss VGS=5V,VDS=0V F=1090MHz F=1090MHz F=1090MHz VDD=50V,IDQ=100mA VDD=5V, ID=300 A 2 D VGS(Q)3 VTH Gate Quiescent Voltage Threshold Voltage Min Max Unit 95 Typical 102 - V - 50 200 A 17.5 47 1.1 0.7 1 19.0 -15 49 1.45 1.2 5 -10 1.8 1.7 A dB dB % V V PULSE CHARACTERISTICS Symbol Parameter Conditions Min Typical Max Unit tr Rise Time F=1090MHz - <35 50 nS tf PD4 Fall Time F=1090MHz - <15 50 nS Pulse Droop F=1090MHz - 0.3 0.5 dB 4 4 NOTES: 1) Rated at TCASE = 25°C 2) All parameters measured under pulsed conditions at 275W output power measured at the 10% point of the pulse with pulse width = 50µsec, duty cycle = 5% and VDD = 50V, IDQ = 100mA in a broadband matched test xture. 3) Amount of gate voltage required to attain nominal quiescent current. 4) Guaranteed by design HVV1011-300 HIGH VOLTAGE, HIGH RUGGEDNESS (((((((((((((( !!!!!!!!!!!! !!!!!!!!!!!! ! ! - Zo = 10 ZIN* 1030MHz ZOUT* 1030MHz Test Circuit Impedances Frequency Zin* (ohms) Zout* (ohms) 1030MHz 2.01-j2.26 2.2-j4.48 1060MHz 1.99-j1.82 2.0-j3.90 1090MHz 2.0-j1.43 1.9-j3.46 Zin* Zout* Input Output Impedance Matching Network Impedance Matching Network ! ! ! ! ! ! ! ! ! ! !!!!!!!!!!!!!!!"#$ %&'()*(+%&!,%*)-!./(0+&#!!!!!! Demonstration Board Outline Demonstration Circuit Board Picture Part Description C1, C2: C3,C4: C5: C6,C9: C7,C8: C10: C11: C12: C13, C14: C15, C16: C17, C18: C19: C20, C21: R1: R2: RF Connectors DC Drain Conn DC Ground Conn. DC Gate Conn. PCB Board Device Clamp Heat Sink S.S. Screws (4) Alloy Screws (4) Metal Washer (6) Alloy Screws (2) 100 pF ATC 100B Chip Capacitor 100B101JP500X 3.9 pF ATC 100B Chip Capacitor 100B3R9JP500X 5.6 pF ATC 100B Chip Capacitor 100B5R6JP500X 4.7 pF ATC 100B Chip Capacitor 100B4R7JP500X 2.0 pF ATC 100B Chip Capacitor 100B2R0JP500X 2.4 pF ATC 100B Chip Capacitor 100B2R4JP500X 15 pF ATC 100B Chip Capacitor 100B150JP500X 100B270JP500X 27 pF ATC 100B Chip Capacitor 47 pF ATC 100B Chip Capacitor 100B470JP500X 10K pF 100V Chip Capacitor (X7R 1206) C1206C103K1RACTU 1K pF 100V Chip Capacitor (X7R 1206) C1206C102K1RACTU 10 uF 63V Elect FK SMD PCE3479CT-ND 100 uF 63V Elect FK SMD PCE3483CT-ND 10 Ohms Chip Resistor (1206) ERJ8GEYJ100V ERJ8GEYJ102V 1.0 K Ohms Chip Resistor (1206) Type "N" RF connectors 5919CC-TB-7 Connector Jack Banana Nylon Red J151-ND Connector Jack Banana Nylon Black J152-ND Connector Jack Banana Nylon Green J153-ND PCB: Arlon, 30 mils thick, 2.55 Dielectric, 2 oz Copper ATC ATC ATC ATC ATC ATC ATC ATC ATC Kemet Kemet Digi Key Digi Key Panasonic Panasonic Coaxicom DIGI-KEY DIGI-KEY DIGI-KEY Cool Innovation Nylon Clamp Foot Cool Innovations Aluminum Heat Sink FXT000158 Cool Innovation 3-252510RS3394 Cool Innovation 4-40 X 1/4 Stainless Steel Socket Hex Head Part Number P242393 4-40 X 1/2 Alloy Socket Cap screw Hex He SCAS-0440-08C #4 Washer Zinc PLTD Steel Lock ZSLW-004-M 4-40 X 3/4 Alloy Socket Cap Screw Head SCAS-0440-12M Manufacturer DS Electronics Copper State Bolt Small Parts Inc Small Parts Inc Small Parts Inc PACKAGE DIMENSIONS DRAIN GATE ASI PART NUMBER JDATE CODE inches mm SOURCE Note: Drawing is not actual size. ASI Semiconductor, Inc. (ASI) reserves the right to make changes to information published in this document at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Information in this document is believed to be accurate and reliable. However, ASI does not give any representations or warranties, either express or implied, as to the accuracy or completeness of such information and shall have no liability no liability for conse-quences resulting from the use of such information. No license, either expressed or implied, is conveyed under any ASI intellectual property rights, including any patent rights.