Power Matters Applying a System View to Align Efficient Multi-device Product Development Jim Aralis Chief Technology Officer Microsemi November 1, 2012 Agenda System view of space products System view driving space roadmaps Where these roadmaps lead? • New at corporate Microsemi • New products and technologies Summary © 2012 Microsemi Corporation. CONFIDENTIAL Power Matters 2 Power Matters System view of space products System View Device Development System engineers always look at a satellite as a system Interfaces and partitioning are done at this level of engineering Without coordination of component development • Difficult and limited choices in partitions • Performance, power, weight, and cost are sacrificed • Interoperability assurance diminished © 2012 Microsemi Corporation. CONFIDENTIAL Power Matters 4 System View Device Development If the device designers look at the system design to define products • • • • • • Digital interface formats aligned Digital and analog physical interfaces aligned Power generation optimized for load and rails No more “level converters”, “signal dividers”, extra clock channels, … Product introductions aligned Reliability architected into the component systems © 2012 Microsemi Corporation. CONFIDENTIAL Power Matters 5 System View Device Development To take advantage of this advanced view of product definition • Companies can align products in their portfolio • Companies can partner • General standards Size, power, cost, performance optimization © 2012 Microsemi Corporation. CONFIDENTIAL Power Matters 6 System View Device Development Examples • • • • • • High speed digital interfaces, standard, and custom Analog converters (A/D, D/A) dynamic range alignment Integrated voltage and current references POL devices and FPGA or ASIC current and voltage load matching Consistent cross device radiation performance (weakest link) High temperature switching device drivers optimized to switching device characteristics • Serial communication width appropriate for the device technologies involved • FPGA’s control and monitoring clock and power generation. • Optimized device power down. +3.3V dc VCC +5V dc +1.5V dc © 2012 Microsemi Corporation. CONFIDENTIAL Power Matters 7 Power Matters System view driving space roadmaps Satellite Block Diagram Bus / Platform Solar Array Receive Antenna Transmit Antenna Electronic Power System Telemetry Tracking & Control Command & Data Handling Payload Main Power Bus Payload Interface Unit Star / Sun Sensors Attitude & Orbit Control Payload Power Conditioning RF Repeater (“Bent Pipe”) Digital Communications Payload Magnetometer Torque Rods © 2012 Microsemi Corporation. Remote Sensing Payload Power Matters 9 Roadmap alignment Next generation RT FPGA’s • High speed communications common with our space system managers • POL matched to load requirements, programmable and monitoring Space system companion devices • • • • Analog and/or digital processing “Custom ASIC” High speed interfaces Digital bus alignment High power switching devices • Custom drivers for optimized performance and protection • Device switching constraints eliminated from user Systems design teams needs built into roadmaps © 2012 Microsemi Corporation. Power Matters 10 Power Matters Where these roadmaps lead MSCC: Where these roadmaps lead New at corporate Microsemi © 2012 Microsemi Corporation. CONFIDENTIAL Power Matters 12 About Microsemi Focused on Providing Solutions Where Power Matters, Security is Non-negotiable, & Reliability is Vital Defense & Security Space & Aerospace Enterprise & Communications Industrial & Alternative Energy Industry's Most Extensive Technology Portfolio for Targeted Markets High-performance, High-reliability Analog Devices Mixed-signal & RF Integrated Circuits Customizable System on Chip Solutions (Analog + FPGA + uController) Complete Subsystems © 2012 Microsemi Corporation. Power Matters 13 A Global Footprint Santa Clara, CA Folsom, CA Mt. View, CA Bend, OR Ennis & Dublin Ireland Ottawa, Canada W. Lafayette, IN Lowell, MA Lawrence , MA Hod Hasharon, Israel Austin, TX Reading, PA Caldicott, UK Hyderabad, India Lake Mary, FL Shanghai, China Bordeaux, France San Diego, CA Phoenix, AZ Aliso Viejo, CA (HQ) Garden Grove, CA Irvine, CA Manila, Philippines Singapore Power Matters 14 MSCC: Where these roadmaps lead New products and technologies © 2012 Microsemi Corporation. CONFIDENTIAL Power Matters 15 Efficient Solar Panel Conversion MSCC is enhancing system efficiency by direct conversion from the Solar Panel • • Typically 100 v to 120 v Instead of 100 v to 28 v @ 75% and then from 28 v to 3.3 v @ 75% efficiency, the SA50-120 converts from 120 v to 3.3 v @ 86%. Soon to be released SB30-100 family will provide lower power system requirements SA50 and SB30 families interface directly with switching and linear MSCC POLs to provide total system power requirements © 2012 Microsemi Corporation Power Matters 16 RH BiPolar Junction Transistors TID Characterization New JANSR RadHard Slash Sheets ELDRS Characterization Level 2 IPG 2N2222A RH1 Lot E420002 Vce Bias=60V 2N2222A Radiation Matrix Mean hFE@Vce=10V vs Ic (07-17-03) Special Photomask, Special CVD, Gamma 97RAD(Si)/s Tested 08-05-04 Lot 1775-18 Standard Nitride, RAD=57RAD(Si)/s, Vce Bias=45V 1000 1000 100 Mean hFE (10pcs) Mean hFE 100 300k 100k 10 30k 10 0k 3k 10k 30k 100k 300k 1000k Spec Min Spec Max Post R-Rad (100k) Min Post R-Rad (1000k) Min 10k 3k Control Spec Min Spec Max Post R-Rad (100k) Min 1 1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1 0.00001 0.0001 0.001 0.01 0.1 1 Collector Current (A) Ic (A) © 2012 Microsemi Corporation Power Matters 17 RH BiPolar Junction Transistors TID Characterization New JANSR RadHard Slash Sheets ELDRS Characterization RAD-Hard Part Number JANSH 2N2222A JANSF 2N2369A JANSR 2N2907A JANSR 2N2920 JANSR 2N2484 JANSR 2N3439 JANSR 2N3501 JANSR 2N3637 JANSR 2N3700 JANSR 2N5153 JANSF 2N5154 JANSR 2N3019 JANSR 2N5237 JANSR 2N5238 JANSR 2N5666 JANSR 2N5667 JANSR 2N3765 JANSF 2N5004 JANSR 2N5664 JANSR 2N2219A JANSR 2N3810 JANSF 2N7373 SS /255 /317 /291 /355 /376 /368 /366 /357 /391 /545 /544 /391 /394 /394 /455 /455 /396 /534 /455 /251 /336 /613 BVCEO IC Pol DIE (V) (A) Type SIZE 50 V 0.8 A NPN 23x23 15 V 0.1 A NPN 20x20 60 V 0.8 A PNP 23x23 60 V 0.03 A NPN 15x19 60 V 0.05 A NPN 15x19 350 V 1A NPN 49x57 150 V 0.3 A NPN 24x26 175 V 1A PNP 24x26 80 V 1A NPN 24x26 80 V 2A PNP 128x128 80 V 2A NPN 120x120 80 V 1A NPN 24x26 120 V 10 A NPN 128x128 170 V 10 A NPN 128x128 200 V 5A NPN 128x128 300 V 5A NPN 128x128 60 V 1.5 A PNP 40x40 80 V 10 A NPN 128x128 200 V 5A NPN 128x128 30 V 0.8 A NPN 23x23 60 V 0.05 A PNP 15x19 80 V 5A NPN 120x120 Redesign New "S" Add RHA RAD Qual RAD Pkg Review If Needed Qual /Sheet Submit QPL TO-18, UB, UA X X X X X X TO-18, UB, UA X N/A N/A X X X 1/ TO-18, UB, UA X X X X X 2/ TO-78, LCC6 X X X 2/ TO-18, UB, UA X X X TO-39, U4 X X X X X X TO-39, UB, U4 X X X X X X TO-39, UB X N/A N/A X X X TO-18, UB X X X X X X TO-39, U3 X N/A N/A X X X TO-39, U3 X X X X X X TO-39 X X X X X X TO-39 X X X X TO-39 X X X X 2/ TO-39, U3 X X X TO-39, U3 2/ X X X TO-46, U3 2/ X N/A X TO-59 Iso X X X X X X 2/ TO-66 X X X TO-39 X X X X X X TO-78, LCC6 X X X X X X TO-254 X N/A X X X X 1/ Redesign in-process to boost Radiation Hardness beyond Level R (100K) 2/ Redesign in-process for initial Radiation Hardened Qualification. © 2012 Microsemi Corporation Power Matters 18 RH BiPolar Junction Transistors TID Characterization New JANSR RadHard Slash Sheets ELDRS Characterization •Dose rate: .01 Rad(s)/ sec. (10 mrads) •Test facility: Umass- Lowell •Co- 60 Source •TID, Proton, ELDRS •DLA Certified Facility •Products Tested to Date (Reports available) •2N2222A •2N2907A •2N3700 •2N2369 •Custom Radiation testing © 2012 Microsemi Corporation Power Matters 19 GaN for Space and High Rel Microsemi has partnered for the development of Space and High Rel GaN products Superior alternative to today's existing hermetic MOSFETs. 40V to 200V Surface Mount Packages Leaded Packages “Flip Chip” Bumped Die • Ultra small footprint • Ultra efficient PART NO. VOLTAGE CURRENT PEAK RDS(ON) (mΩ) MGN2915U4A 40V 33A 150A 4 MGN2905U4A MGN2901U4A MGN2911U4A MGN2910U4A 60V 100V 150V 200V 25A 25A 12A 12A 100A 100A 40A 40A 7 7 25 25 U4A U4A © 2012 Microsemi Corporation S S D S D S D D G Date available MidOctober-’12 TBD Nov- ‘12 TBD TBD - Honored with an Electronics Products Magazine Product of the Year Award Power Matters 20 GaN for Space and High Rel Normalized Rds(on) is lower than Si: 1.47 vs. 1.7 Natural Logic- Level drive • • +5V gate drive- fully enhanced at +4.5V Vgsmax= 6.5V!!! Small die size will result in much smaller packages • • Custom packages in development Standard HiRel packages also will be available Radiation resistant HiRel products in Development • • Heavy Ion testing in progress TID, ELDRS characterization Extremely low parasitic capacitance • • Cuts switching losses by at least 50% High frequency operation results in higher density power designs © 2012 Microsemi Corporation Power Matters 21 Solid- State Relays Features • • • • • • MIL-PRF- 38534 Accepts Logic Level inputs, (+3.0V- +5.5V) 1A, 5A & 10A Max Current Class H & K Screening levels Surface Mount & Thru- Hole packages Normally open or Normally closed operation Applications Heater controls Launch Systems- explosive bolts Solar panel power control Part # Description Rated Switch Voltage Status MHS2005 Dual, 5A Relay 200V Protos in assy. Flight material ordered MHS1005 Dual, 5A Relay 100V Proto material in- house Protos: ; Flight: MHS1010 Dual, 10A 100V Proto material in- house Protos: ; Flight: MHS0620 Single 20A 60V In design MHS2010 Dual 20A 200V In design © 2012 Microsemi Corporation. 22 Power Matters 22 RTAX-DSP: Architecture Overview •Builds upon established RTAX-S/SL architecture •QML qualification expected 2012 •Hardened by Design •SET Hardened •R-Cell 16X improvement •Math BLock < 5E-9 Error/DSP bit/day © 2012 Microsemi Corporation.. Power Matters 23 Next Generation Space-Flight FPGAs µRAM (1Kb) Mathblocks Block RAM (18Kb) SERDES Fracturable Logic Module with SEU-protected Flip Flop, 300 MHz operation Logic SDRAM DDR Controller ADD_SUB A[17:0] X PLL OVFL / CO + B[17:0] D SN[43:0] EN C[43:0] High performance, low power 65nm process Radiation hardened by design 300MHz in-system performance Embedded hardened SERDES, LVDS, SRAM, PLL, Spacewire, . . . Flight units qualified in 2015 © 2011 Microsemi Corporation. D[43:0] SHIFT17 >> 17 SEL_CASC SN-1[43:0] Multiply-Accumulate Block with SEU and SET protection, 300 MHz operation Power Matters 24 AAHS298B – 8 Channel Source Driver Features: • • • • • • • • • • 700mA per output source current 3.5X the current of the IS-2981RH so no need to parallel outputs for higher current capability Fully isolated channels with DI process 100krad TID, SEL immune 80V minimum output breakdown Low quiescent current consumption Internal ground clamp diodes Internal thermal shutdown TTL, 5V, and 12V logic compatible AAHS298A with Over-current protection will be available in Q4 Target Markets: • • Aerospace satellite manufacturers Military power electronics control Applications: • • • • • Can be used as High-Voltage drivers for Lamps, Relays, Solenoids and Motors Recommended for high-side switching applications that benefit from separate logic and load grounds. Reliable Replacement of Discrete Solutions Interfacing Between Low-Level Logic and High-Current Loads For high reliability application, it can be used for Redundant Power Distribution © 2012 Microsemi Corporation. Power Matters 25 Summary Microsemi remains Focused on Space We are investing in new processes, devices, and products driven by system partitioning and interoperability. (System Look) We do this both in internal R&D and in our acquisition strategy. We continue to have one of broadest and most diverse product and capabilities space portfolios in the world. Recent additions to our space offering is significant in many areas. We will be here when you need us in twenty years and more … © 2012 Microsemi Corporation. Power Matters 26 Power Matters Thank you !