Power Matters
Applying a System View to Align Efficient Multi-device
Product Development
Jim Aralis
Chief Technology Officer
Microsemi
November 1, 2012
Agenda
 System view of space products
 System view driving space roadmaps
 Where these roadmaps lead?
• New at corporate Microsemi
• New products and technologies
 Summary
© 2012 Microsemi Corporation. CONFIDENTIAL
Power Matters
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Power Matters
System view of space products
System View Device Development
 System engineers always look at a satellite as a system
 Interfaces and partitioning are done at this level of engineering
 Without coordination of component development
• Difficult and limited choices in partitions
• Performance, power, weight, and cost are sacrificed
• Interoperability assurance diminished
© 2012 Microsemi Corporation. CONFIDENTIAL
Power Matters
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System View Device Development
 If the device designers look at the system design to define products
•
•
•
•
•
•
Digital interface formats aligned
Digital and analog physical interfaces aligned
Power generation optimized for load and rails
No more “level converters”, “signal dividers”, extra clock channels, …
Product introductions aligned
Reliability architected into the component systems
© 2012 Microsemi Corporation. CONFIDENTIAL
Power Matters
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System View Device Development
 To take advantage of this advanced view of product definition
• Companies can align products in their portfolio
• Companies can partner
• General standards
Size, power, cost, performance optimization
© 2012 Microsemi Corporation. CONFIDENTIAL
Power Matters
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System View Device Development
 Examples
•
•
•
•
•
•
High speed digital interfaces, standard, and custom
Analog converters (A/D, D/A) dynamic range alignment
Integrated voltage and current references
POL devices and FPGA or ASIC current and voltage load matching
Consistent cross device radiation performance (weakest link)
High temperature switching device drivers optimized to switching device
characteristics
• Serial communication width appropriate for the device technologies involved
• FPGA’s control and monitoring clock and power generation.
• Optimized device power down.
+3.3V
dc
VCC
+5V
dc
+1.5V
dc
© 2012 Microsemi Corporation. CONFIDENTIAL
Power Matters
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Power Matters
System view driving space roadmaps
Satellite Block Diagram
Bus / Platform
Solar
Array
Receive
Antenna
Transmit
Antenna
Electronic
Power System
Telemetry
Tracking &
Control
Command &
Data
Handling
Payload
Main Power Bus
Payload
Interface
Unit
Star / Sun
Sensors
Attitude &
Orbit
Control
Payload
Power
Conditioning
RF Repeater
(“Bent Pipe”)
Digital
Communications
Payload
Magnetometer
Torque Rods
© 2012 Microsemi Corporation.
Remote Sensing
Payload
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Roadmap alignment
 Next generation RT FPGA’s
• High speed communications common with our space system managers
• POL matched to load requirements, programmable and monitoring
 Space system companion devices
•
•
•
•
Analog and/or digital processing
“Custom ASIC”
High speed interfaces
Digital bus alignment
 High power switching devices
• Custom drivers for optimized performance and protection
• Device switching constraints eliminated from user
 Systems design teams needs built into roadmaps
© 2012 Microsemi Corporation.
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Power Matters
Where these roadmaps lead
MSCC: Where these roadmaps lead
New at corporate Microsemi
© 2012 Microsemi Corporation. CONFIDENTIAL
Power Matters
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About Microsemi
Focused on Providing Solutions Where Power Matters,
Security is Non-negotiable, & Reliability is Vital
Defense & Security
Space & Aerospace
Enterprise & Communications
Industrial & Alternative Energy
Industry's Most Extensive Technology Portfolio
for Targeted Markets
High-performance, High-reliability Analog Devices
Mixed-signal & RF Integrated Circuits
Customizable System on Chip Solutions (Analog + FPGA + uController)
Complete Subsystems
© 2012 Microsemi Corporation.
Power Matters
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A Global Footprint
Santa Clara, CA
Folsom, CA
Mt. View, CA
Bend, OR
Ennis & Dublin
Ireland
Ottawa, Canada
W. Lafayette, IN
Lowell, MA
Lawrence , MA
Hod Hasharon, Israel
Austin, TX
Reading, PA
Caldicott, UK
Hyderabad, India
Lake Mary, FL
Shanghai, China
Bordeaux, France
San Diego, CA
Phoenix, AZ
Aliso Viejo, CA (HQ)
Garden Grove, CA
Irvine, CA
Manila, Philippines
Singapore
Power Matters
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MSCC: Where these roadmaps lead
New products and technologies
© 2012 Microsemi Corporation. CONFIDENTIAL
Power Matters
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Efficient Solar Panel Conversion
 MSCC is enhancing system efficiency by direct conversion from the Solar Panel
•
•
Typically 100 v to 120 v
Instead of 100 v to 28 v @ 75% and then from 28 v to 3.3 v @ 75% efficiency, the SA50-120 converts from 120 v to
3.3 v @ 86%.
 Soon to be released SB30-100 family will provide lower power system requirements
 SA50 and SB30 families interface directly with switching and linear MSCC POLs to
provide total system power requirements
© 2012 Microsemi Corporation
Power Matters
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RH BiPolar Junction Transistors
 TID Characterization
 New JANSR RadHard Slash Sheets
 ELDRS Characterization
Level 2 IPG 2N2222A RH1 Lot E420002 Vce Bias=60V
2N2222A Radiation Matrix Mean hFE@Vce=10V vs Ic (07-17-03)
Special Photomask, Special CVD, Gamma 97RAD(Si)/s Tested 08-05-04
Lot 1775-18 Standard Nitride, RAD=57RAD(Si)/s, Vce Bias=45V
1000
1000
100
Mean hFE (10pcs)
Mean hFE
100
300k
100k
10
30k
10
0k
3k
10k
30k
100k
300k
1000k
Spec Min
Spec Max
Post R-Rad (100k) Min
Post R-Rad (1000k) Min
10k
3k
Control
Spec Min
Spec Max
Post R-Rad (100k) Min
1
1.E-06
1.E-05
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1
0.00001
0.0001
0.001
0.01
0.1
1
Collector Current (A)
Ic (A)
© 2012 Microsemi Corporation
Power Matters
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RH BiPolar Junction Transistors
 TID Characterization
 New JANSR RadHard Slash Sheets
 ELDRS Characterization
RAD-Hard
Part Number
JANSH 2N2222A
JANSF 2N2369A
JANSR 2N2907A
JANSR 2N2920
JANSR 2N2484
JANSR 2N3439
JANSR 2N3501
JANSR 2N3637
JANSR 2N3700
JANSR 2N5153
JANSF 2N5154
JANSR 2N3019
JANSR 2N5237
JANSR 2N5238
JANSR 2N5666
JANSR 2N5667
JANSR 2N3765
JANSF 2N5004
JANSR 2N5664
JANSR 2N2219A
JANSR 2N3810
JANSF 2N7373
SS
/255
/317
/291
/355
/376
/368
/366
/357
/391
/545
/544
/391
/394
/394
/455
/455
/396
/534
/455
/251
/336
/613
BVCEO
IC
Pol
DIE
(V)
(A)
Type SIZE
50 V
0.8 A NPN 23x23
15 V
0.1 A NPN 20x20
60 V
0.8 A PNP 23x23
60 V
0.03 A NPN 15x19
60 V
0.05 A NPN 15x19
350 V
1A
NPN 49x57
150 V
0.3 A NPN 24x26
175 V
1A
PNP 24x26
80 V
1A
NPN 24x26
80 V
2A
PNP 128x128
80 V
2A
NPN 120x120
80 V
1A
NPN 24x26
120 V
10 A NPN 128x128
170 V
10 A NPN 128x128
200 V
5A
NPN 128x128
300 V
5A
NPN 128x128
60 V
1.5 A PNP 40x40
80 V
10 A NPN 128x128
200 V
5A
NPN 128x128
30 V
0.8 A NPN 23x23
60 V
0.05 A PNP 15x19
80 V
5A
NPN 120x120
Redesign New "S" Add RHA RAD Qual RAD
Pkg
Review If Needed
Qual
/Sheet
Submit QPL
TO-18, UB, UA
X
X
X
X
X
X
TO-18, UB, UA
X
N/A
N/A
X
X
X
1/
TO-18, UB, UA
X
X
X
X
X
2/
TO-78, LCC6
X
X
X
2/
TO-18, UB, UA
X
X
X
TO-39, U4
X
X
X
X
X
X
TO-39, UB, U4
X
X
X
X
X
X
TO-39, UB
X
N/A
N/A
X
X
X
TO-18, UB
X
X
X
X
X
X
TO-39, U3
X
N/A
N/A
X
X
X
TO-39, U3
X
X
X
X
X
X
TO-39
X
X
X
X
X
X
TO-39
X
X
X
X
TO-39
X
X
X
X
2/
TO-39, U3
X
X
X
TO-39, U3
2/
X
X
X
TO-46, U3
2/
X
N/A
X
TO-59 Iso
X
X
X
X
X
X
2/
TO-66
X
X
X
TO-39
X
X
X
X
X
X
TO-78, LCC6
X
X
X
X
X
X
TO-254
X
N/A
X
X
X
X
1/ Redesign in-process to boost Radiation Hardness beyond Level R (100K)
2/ Redesign in-process for initial Radiation Hardened Qualification.
© 2012 Microsemi Corporation
Power Matters
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RH BiPolar Junction Transistors
 TID Characterization
 New JANSR RadHard Slash Sheets
 ELDRS Characterization
•Dose rate: .01 Rad(s)/ sec. (10 mrads)
•Test facility: Umass- Lowell
•Co- 60 Source
•TID, Proton, ELDRS
•DLA Certified Facility
•Products Tested to Date (Reports available)
•2N2222A
•2N2907A
•2N3700
•2N2369
•Custom Radiation testing
© 2012 Microsemi Corporation
Power Matters
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GaN for Space and High Rel
Microsemi has partnered for the development of Space and High Rel GaN products





Superior alternative to today's existing hermetic MOSFETs.
40V to 200V
Surface Mount Packages
Leaded Packages
“Flip Chip” Bumped Die
• Ultra small footprint
• Ultra efficient
PART NO.
VOLTAGE
CURRENT
PEAK
RDS(ON)
(mΩ)
MGN2915U4A
40V
33A
150A
4
MGN2905U4A
MGN2901U4A
MGN2911U4A
MGN2910U4A
60V
100V
150V
200V
25A
25A
12A
12A
100A
100A
40A
40A
7
7
25
25
U4A
U4A
© 2012 Microsemi Corporation
S
S
D
S
D
S
D
D
G
Date
available
MidOctober-’12
TBD
Nov- ‘12
TBD
TBD
- Honored with an Electronics Products
Magazine Product of the Year Award
Power Matters
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GaN for Space and High Rel
 Normalized Rds(on) is lower than Si: 1.47 vs. 1.7
 Natural Logic- Level drive
•
•
+5V gate drive- fully enhanced at +4.5V
Vgsmax= 6.5V!!!
 Small die size will result in much smaller packages
•
•
Custom packages in development
Standard HiRel packages also will be available
 Radiation resistant HiRel products in Development
•
•
Heavy Ion testing in progress
TID, ELDRS characterization
 Extremely low parasitic capacitance
•
•
Cuts switching losses by at least 50%
High frequency operation results in higher density power designs
© 2012 Microsemi Corporation
Power Matters
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Solid- State Relays
 Features
•
•
•
•
•
•
MIL-PRF- 38534
Accepts Logic Level inputs, (+3.0V- +5.5V)
1A, 5A & 10A Max Current
Class H & K Screening levels
Surface Mount & Thru- Hole packages
Normally open or Normally closed operation
 Applications



Heater controls
Launch Systems- explosive bolts
Solar panel power control
Part #
Description
Rated Switch
Voltage
Status
MHS2005
Dual, 5A Relay
200V
Protos in assy. Flight material ordered
MHS1005
Dual, 5A Relay
100V
Proto material in- house
Protos: ; Flight:
MHS1010
Dual, 10A
100V
Proto material in- house
Protos: ; Flight:
MHS0620
Single 20A
60V
In design
MHS2010
Dual 20A
200V
In design
© 2012 Microsemi Corporation.
22
Power Matters
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RTAX-DSP: Architecture Overview
•Builds upon established RTAX-S/SL architecture
•QML qualification expected 2012
•Hardened by Design
•SET Hardened
•R-Cell 16X improvement
•Math BLock < 5E-9 Error/DSP bit/day
© 2012 Microsemi Corporation..
Power Matters
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Next Generation Space-Flight FPGAs
µRAM (1Kb)
Mathblocks
Block RAM
(18Kb)
SERDES
Fracturable Logic Module with
SEU-protected Flip Flop,
300 MHz operation
Logic
SDRAM DDR
Controller
ADD_SUB
A[17:0]
X
PLL
OVFL / CO
+
B[17:0]
D
SN[43:0]
EN
C[43:0]




High performance, low power 65nm process
Radiation hardened by design
300MHz in-system performance
Embedded hardened SERDES, LVDS,
SRAM, PLL, Spacewire, . . .
 Flight units qualified in 2015
© 2011 Microsemi Corporation.
D[43:0]
SHIFT17
>> 17
SEL_CASC
SN-1[43:0]
Multiply-Accumulate Block
with SEU and SET protection,
300 MHz operation
Power Matters
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AAHS298B – 8 Channel Source Driver
Features:
•
•
•
•
•
•
•
•
•
•
700mA per output source current
3.5X the current of the IS-2981RH so no need to parallel outputs for higher current capability
Fully isolated channels with DI process
100krad TID, SEL immune
80V minimum output breakdown
Low quiescent current consumption
Internal ground clamp diodes
Internal thermal shutdown
TTL, 5V, and 12V logic compatible
AAHS298A with Over-current protection will be available in Q4
Target Markets:
•
•
Aerospace satellite manufacturers
Military power electronics control
Applications:
•
•
•
•
•
Can be used as High-Voltage drivers for Lamps, Relays, Solenoids and Motors
Recommended for high-side switching applications that benefit from separate logic and load grounds.
Reliable Replacement of Discrete Solutions
Interfacing Between Low-Level Logic and High-Current Loads
For high reliability application, it can be used for Redundant Power Distribution
© 2012 Microsemi Corporation.
Power Matters
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Summary
 Microsemi remains Focused on Space
 We are investing in new processes, devices, and products driven
by system partitioning and interoperability. (System Look) We do
this both in internal R&D and in our acquisition strategy.
 We continue to have one of broadest and most diverse product
and capabilities space portfolios in the world.
 Recent additions to our space offering is significant in many areas.
 We will be here when you need us in twenty years and more …
© 2012 Microsemi Corporation.
Power Matters
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Power Matters
Thank you !