< Silicon RF Power MOS FET (Discrete) >
RD07MVS1
RoHS Compliance, Silicon MOSFET Power Transistor,175MHz,520MHz,7W
OUTLINE DRAWING
DESCRIPTION
0.2+/-0.05
(0.22)
6.0+/-0.15
specifically designed for VHF/UHF RF power
2.0+/-0.05
1.0+/-0.05
4.9+/-0.15
FEATURES
2
3.5+/-0.05
1
amplifiers applications.
3
(0.25)
High power gain:
INDEX MARK
(Gate)
Pout>7W, Gp>10dB@Vdd=7.2V,f=520MHz
0.2+/-0.05
High Efficiency: 55%typ. (520MHz)
0.9+/-0.1
High Efficiency: 60%typ. (175MHz)
(0.25)
Terminal No.
1.Drain (output)
2.Source (GND)
3.Gate (input)
Note
( ):center value
UNIT:mm
APPLICATION
For output stage of high power amplifiers in
VHF/UHF band mobile radio sets.
RoHS COMPLIANT
RD07MVS1-101, T112 is a RoHS compliant product.
RoHS compliance is indicating by the letter “G” after the Lot Marking.
This product includes the lead in high melting temperature type solders.
However, it is applicable to the following exceptions of RoHS Directions.
1.Lead in high melting temperature type solders(i.e.tin-lead solder alloys containing more than85% lead.)
Publication Date : Oct．2011
1
(0.22)
RD07MVS1 is a MOS FET type transistor
4.6+/-0.05
3.3+/-0.05
0.8+/-0.05
< Silicon RF Power MOS FET (Discrete) >
RD07MVS1
RoHS Compliance, Silicon MOSFET Power Transistor,175MHz,520MHz,7W
ABSOLUTE MAXIMUM RATINGS
(Tc=25°C UNLESS OTHERWISE NOTED)
SYMBOL
PARAMETER
CONDITIONS
RATINGS
UNIT
VDSS
Drain to source voltage
Vgs=0V
30
V
VGSS
Gate to source voltage
Vds=0V
+/- 20
V
Pch
Channel dissipation
Tc=25°C
50
W
Pin
Input Power
Zg=Zl=50
1.5
W
ID
Drain Current
-
3
A
Tch
Junction Temperature
-
150
°C
Tstg
Storage temperature
-
-40 to +125
°C
Rth j-c
Thermal resistance
2.5
°C/W
Junction to case
Note: Above parameters are guaranteed independently.
ELECTRICAL CHARACTERISTICS
SYMBOL
PARAMETER
(Tc=25°C, UNLESS OTHERWISE NOTED)
CONDITIONS
LIMITS
UNIT
MIN
TYP
MAX.
IDSS
Zero gate voltage drain current
VDS=17V, VGS=0V
-
-
200
uA
IGSS
Gate to source leak current
VGS=10V, VDS=0V
-
-
1
uA
VTH
Gate threshold Voltage
VDS=12V, IDS=1mA
1.4
1.7
2.4
V
Output power
f=175MHz , VDD=7.2V
7
8
-
W
Drain efficiency
Pin=0.3W,Idq=700mA
55
60
-
%
Output power
f=520MHz , VDD=7.2V
7
8
-
W
Drain efficiency
Pin=0.7W,Idq=750mA
50
55
-
%
Pout1
D1
Pout2
D2
VDD=9.2V,Po=7W(Pin Control)
Load VSWR tolerance
f=175MHz,Idq=700mA,Zg=50
No destroy
-
No destroy
-
Load VSWR=20:1(All Phase)
VDD=9.2V,Po=7W(Pin Control)
Load VSWR tolerance
f=520MHz,Idq=750mA,Zg=50
Load VSWR=20:1(All Phase)
Note: Above parameters, ratings, limits and conditions are subject to change.
Publication Date : Oct．2011
2
< Silicon RF Power MOS FET (Discrete) >
RD07MVS1
RoHS Compliance, Silicon MOSFET Power Transistor,175MHz,520MHz,7W
TYPICAL CHARACTERISTICS
CHANNEL DISSIPATION VS.
AMBIENT TEMPERATURE
Ta=+25°C
Vds=10V
*1:The material of the PCB
Glass epoxy (t=0.6 mm)
50
8.0
40
30
On PCB(*1)
with throgh hole
and Heat-sink
20
6.0
4.0
0.0
0
0
40
80
120
160
200
AMBIENT TEMPERATURE Ta(deg:C.)
Vds-Ids CHARACTERISTICS
1
2
3
Vgs(V)
4
5
Vds VS. Ciss CHARACTERISTICS
10
160
9
Vgs=5V
Ta=+25°C
120
Vgs=4.5V
7
Ciss(pF)
6
Vgs=4V
5
Ta=+25°C
f=1MHz
140
8
Ids(A)
GM
2.0
10
0
4
100
80
60
Vgs=3.5V
3
40
2
20
Vgs=3V
1
0
0
0
2
4
6
Vds(V)
8
0
10
Vds VS. Coss CHARACTERISTICS
5
10
Vds(V)
15
20
Vds VS. Crss CHARACTERISTICS
120
20
Ta=+25°C
f=1MHz
18
Ta=+25°C
f=1MHz
100
16
14
Crss(pF)
80
Coss(pF)
Ids
On PCB(*1) with Heat-sink
Ids(A),GM(S)
CHANNEL DISSIPATION Pch(W)
...
60
Vgs-Ids CHARACTERISTICS
10.0
60
40
12
10
8
6
4
20
2
0
0
0
5
10
Vds(V)
15
0
20
Publication Date : Oct．2011
3
5
10
Vds(V)
15
20
< Silicon RF Power MOS FET (Discrete) >
RD07MVS1
RoHS Compliance, Silicon MOSFET Power Transistor,175MHz,520MHz,7W
TYPICAL CHARACTERISTICS
Pin-Po CHARACTERISTICS
@f=175MHz
Pin-Po CHARACTERISTICS
@f=175MHz
12.0
10.0
Gp
20
40
10
20
0
0
5
6.0
4.0
Idd
Ta=25°C
f=175MHz
Vdd=7.2V
Idq=700mA
60
40
0.0
10 15 20 25 30
Pin(dBm)
0
Pin-Po CHARACTERISTICS
@f=520MHz
20
1000
500
Pin(mW)
Pin-Po CHARACTERISTICS
@f=520MHz
14.0
60
ηｄ
Gp
20
40
10
20
Ｉｄｄ
0
0
0
5
100
Po
12.0
Pout(W) , Idd(A)
Po(dBm) , Gp(dB) ,
Idd(A)
30
80
Po
ηd(%)
Ta=+25°C
f=520MHz
Vdd=7.2V
Idq=750mA
40
10.0
70
6.0
4.0
Idd
0.0
30
5
10
2
5
0
Po(W)
3
12
0.5
1.0
1.5 2.0
Pin(W)
2.5 3.0
5
Ta=25°C
f=520MHz
Pin=0.7W
Icq=750mA
Zg=ZI=50 ohm
20
4
Idd
8
10
Vdd(V)
25
Idd(A)
Po(W)
Po
15
6
50
40
0.0
6
4
60
Vdd-Po CHARACTERISTICS
@f=520MHz
30
20
Ta=25°C
f=520MHz
Vdd=7.2V
Idq=750mA
2.0
Vdd-Po CHARACTERISTICS
@f=175MHz
25
80
ηd
8.0
10 15 20 25 30 35
Pin(dBm)
Ta=25°C
f=175MHz
Pin=0.3W
Icq=700mA
Zg=ZI=50 ohm
90
ηd(%)
-5
80
ηd
8.0
2.0
Ｉｄｄ
0
Po
ηd(%)
60
ηｄ
100
15
Po
4
Idd
3
10
2
1
5
1
0
0
14
0
4
Publication Date : Oct．2011
4
6
8
10
Vdd(V)
12
14
Idd(A)
30
80
Po
Pout(W) , Idd(A)
Po(dBm) , Gp(dB) ,
Idd(A)
40
ηd(%)
Ta=+25°C
f=175MHz
Vdd=7.2V
Idq=700mA
< Silicon RF Power MOS FET (Discrete) >
RD07MVS1
RoHS Compliance, Silicon MOSFET Power Transistor,175MHz,520MHz,7W
TYPICAL CHARACTERISTICS
Vgs-Ids CHARACTERISTICS 2
10
+25°C
Vds=10V
Tc=-25~+75°C
8
Ids(A)
-25°C
+75°C
6
4
2
0
0
1
2
3
Vgs(V)
4
5
Publication Date : Oct．2011
5
< Silicon RF Power MOS FET (Discrete) >
RD07MVS1
RoHS Compliance, Silicon MOSFET Power Transistor,175MHz,520MHz,7W
TEST CIRCUIT(f=175MHz)
Vgg
Vdd
C2
C1
10μF,50V
15mm
19mm
RD07MVS1
175MHz
4.7K ohm
L
3.5mm
5mm
19.5m
m
24.5mm
62pF
RF-in
6.5mm
140pF
100pF
11.5m
m
22pF
11.5mm
6.5mm
28.5mm
16pF
56pF
3mm
22pF
680 ohm
180pF
L:Enameled wire 7 Turns,D:0.43mm,2.46mmm O.D
C1,C2:1000pF,0.0022μF in parallel
Note:Board material PTFE substrate
Micro strip line width=2.2mm/50 ohm,er:2.7,t=0.8mm
W:line width=1.0mm
TEST CIRCUIT(f=520MHz)
Vgg
Vdd
C2
10μF,50V
C1
19mm
19mm
RD07MVS1
520MHz
4.7K ohm
46mm
RF-in
68pF
9mm
3.5mm
L
3.5mm
20pF
6.5mm
44.5mm
3.5mm
20pF
37pF
6.5mm
6pF
18pF
RF-OUT
62pF
10pF
L:Enameled wire 5 Turns,D:0.43mm,2.46mmm O.D
C1,C2:1000pF,0.0022μF in parallel
Note:Board material PTFE substrate
Micro strip line width=2.2mm/50 ohm,er:2.7,t=0.8mm
W:line width=1.0mm
Publication Date : Oct．2011
6
10mm
5mm
62pF
RF-OUT
< Silicon RF Power MOS FET (Discrete) >
RD07MVS1
RoHS Compliance, Silicon MOSFET Power Transistor,175MHz,520MHz,7W
INPUT/OUTPUT IMPEDANCE VS. FREQUENCY CHARACTERISTICS
175MHz Zin* Zout*
Zo=10
Vdd=7.2V, Idq=700mA(Vgg adj.),Pin=0.28W
Zin*=1.55+j5.53
Zout*=3.24-j0.26
175MHz Zin*
Zin*: Complex conjugate of input impedance
Zout*: Complex conjugate of output
input impedance
impedance
175MHz Zout*
520MHz Zin* Zout*
Zo=10
Vdd=7.2V, Idq=750mA(Vgg adj.),Pin=0.7W
Zin*=0.76+j0.06
Zout*=1.61-j0.52
Zin*: Complex conjugate of input impedance
Zout*: Complex conjugate of input impedance
520MHz Zin*
520MHz Zout*
Publication Date : Oct．2011
7
< Silicon RF Power MOS FET (Discrete) >
RD07MVS1
RoHS Compliance, Silicon MOSFET Power Transistor,175MHz,520MHz,7W
RD07MVS1 S-PARAMETER DATA (@Vdd=7.2V, Id=750mA)
Freq.
[MHz]
100
150
175
200
250
300
350
400
450
500
520
550
600
650
700
750
800
850
900
950
1000
1050
1100
S11
(mag)
0.890
0.897
0.899
0.901
0.907
0.913
0.918
0.924
0.928
0.933
0.935
0.937
0.940
0.942
0.944
0.947
0.948
0.949
0.951
0.951
0.952
0.950
0.952
S21
(ang)
-174.1
-175.6
-176.0
-176.3
-176.7
-177.0
-177.3
-177.8
-178.0
-178.3
-178.5
-178.8
-179.2
-179.4
-179.8
179.8
179.4
179.0
178.6
178.2
177.9
177.4
176.9
(mag)
5.508
3.613
3.028
2.604
2.019
1.614
1.308
1.102
0.929
0.790
0.753
0.692
0.595
0.529
0.467
0.416
0.374
0.343
0.304
0.284
0.262
0.234
0.226
S12
(ang)
82.1
75.0
72.4
70.1
65.6
60.7
57.1
54.1
50.1
48.6
47.6
45.3
43.6
42.4
40.2
39.4
38.6
37.6
36.5
37.6
35.1
36.0
35.8
Publication Date : Oct．2011
8
(mag)
0.016
0.015
0.015
0.014
0.014
0.012
0.011
0.010
0.009
0.008
0.007
0.007
0.006
0.006
0.005
0.005
0.004
0.005
0.005
0.006
0.007
0.008
0.009
S22
(ang)
-3.6
-8.5
-9.6
-10.9
-12.7
-15.3
-15.8
-14.2
-14.8
-9.6
-7.7
-5.6
0.4
17.1
21.8
40.9
52.0
67.1
72.6
85.8
85.1
89.8
93.4
(mag)
0.790
0.801
0.802
0.815
0.844
0.843
0.860
0.879
0.882
0.895
0.901
0.906
0.907
0.916
0.923
0.921
0.930
0.933
0.932
0.937
0.938
0.938
0.940
(ang)
-172.8
-174.0
-174.1
-174.0
-174.1
-174.1
-174.4
-175.0
-175.1
-175.5
-175.8
-176.2
-176.6
-177.2
-177.6
-178.0
-178.8
-178.9
-179.3
179.8
179.7
179.3
178.2
< Silicon RF Power MOS FET (Discrete) >
RD07MVS1
RoHS Compliance, Silicon MOSFET Power Transistor,175MHz,520MHz,7W
ATTENTION:
1.High Temperature ; This product might have a heat generation while operation,Please take notice that have
a possibility to receive a burn to touch the operating product directly or touch the product until cold after switch
off. At the near the product,do not place the combustible material that have possibilities to arise the fire.
2.Generation of High Frequency Power ; This product generate a high frequency power. Please take notice
that do not leakage the unnecessary electric wave and use this products without cause damage for human and
property per normal operation.
3.Before use; Before use the product,Please design the equipment in consideration of the risk for human and
electric wave obstacle for equipment.
PRECAUTIONS FOR THE USE OF MITSUBISHI SILICON RF POWER DEVICES:
1. The specifications of mention are not guarantee values in this data sheet. Please confirm additional details
regarding operation of these products from the formal specification sheet. For copies of the formal
specification sheets, please contact one of our sales offices.
2.RA series products (RF power amplifier modules) and RD series products (RF power transistors) are designed
for consumer mobile communication terminals and were not specifically designed for use in other applications.
In particular, while these products are highly reliable for their designed purpose, they are not manufactured
under a quality assurance testing protocol that is sufficient to guarantee the level of reliability typically deemed
necessary for critical communications elements and In the application, which is base station applications and
fixed station applications that operate with long term continuous transmission and a higher on-off frequency
during transmitting, please consider the derating, the redundancy system, appropriate setting of the maintain
period and others as needed. For the reliability report which is described about predicted operating life time of
Mitsubishi Silicon RF Products , please contact Mitsubishi Electric Corporation or an authorized Mitsubishi
Semiconductor product distributor.
3. RD series products use MOSFET semiconductor technology. They are sensitive to ESD voltage therefore
appropriate ESD precautions are required.
4. In the case of use in below than recommended frequency, there is possibility to occur that the device is
deteriorated or destroyed due to the RF-swing exceed the breakdown voltage.
5. In order to maximize reliability of the equipment, it is better to keep the devices temperature low. It is
recommended to utilize a sufficient sized heat-sink in conjunction with other cooling methods as needed (fan,
etc.) to keep the channel temperature for RD series products lower than 120deg/C(in case of
Tchmax=150deg/C) ,140deg/C(in case of Tchmax=175deg/C) under standard conditions.
6. Do not use the device at the exceeded the maximum rating condition. In case of plastic molded devices, the
exceeded maximum rating condition may cause blowout, smoldering or catch fire of the molding resin due to
extreme short current flow between the drain and the source of the device. These results causes in fire or
injury.
7. For specific precautions regarding assembly of these products into the equipment, please refer to the
supplementary items in the specification sheet.
8. Warranty for the product is void if the products protective cap (lid) is removed or if the product is modified in
any way from it’s original form.
9. For additional “Safety first” in your circuit design and notes regarding the materials, please refer the last page
of this data sheet.
10. Please refer to the additional precautions in the formal specification sheet.
Publication Date : Oct．2011
9
< Silicon RF Power MOS FET (Discrete) >
RD07MVS1
RoHS Compliance, Silicon MOSFET Power Transistor,175MHz,520MHz,7W
Keep safety first in your circuit designs!
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more
reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead
to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit
designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of
non-flammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
•These materials are intended as a reference to assist our customers in the selection of the Mitsubishi
semiconductor product best suited to the customer’s application; they do not convey any license under any
intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party.
•Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any third-party’s
rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application
examples contained in these materials.
•All information contained in these materials, including product data, diagrams, charts, programs and algorithms
represents information on products at the time of publication of these materials, and are subject to change by
Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is therefore
recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor
product distributor for the latest product information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors. Mitsubishi Electric
Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or
errors.
Please also pay attention to information published by Mitsubishi Electric Corporation by various means, including
the Mitsubishi Semiconductor home page (http://www.MitsubishiElectric.com/).
•When using any or all of the information contained in these materials, including product data, diagrams, charts,
programs, and algorithms, please be sure to evaluate all information as a total system before making a final
decision on the applicability of the information and products. Mitsubishi Electric Corporation assumes no
responsibility for any damage, liability or other loss resulting from the information contained herein.
•Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or system
that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi Electric
Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product
contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical,
aerospace, nuclear, or undersea repeater use.
•The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part
these materials.
•If these products or technologies are subject to the Japanese export control restrictions, they must be exported
under a license from the Japanese government and cannot be imported into a country other than the approved
destination.
Any diversion or re-export contrary to the export control laws and regulations of Japan and/or the country of
destination is prohibited.
•Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for
further details on these materials or the products contained therein.
© 2011 MITSUBISHI ELECTRIC CORPORATION. ALL RIGHTS RESERVED.
Publication Date : Oct．2011
10