SCOPE:
CMOS, MICROPROCESSOR-COMPATIBLE, 8-BIT A/D CONVERTER
Device Type
01
02
Generic Number
MX7574S(x)/883B
MX7574T(x)/883B
Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows:
Outline Letter
MAXIM SMD
Q
V
E
2
Mil-Std-1835
GDIP1-T18 or CDIP2-T18
CQCC1-N20
Case Outline
Package Code
18 LEAD CERDIP
20 LCC
J18
L20
Absolute Maximum Ratings:
VDD to AGND ..................................................................................................…... 0V to 7V
VDD to DGND ..................................................................................................…... 0V to 7V
AGND to DGND ........................................................................................….. -0.3V, +0.3V
Clock Input Voltage to DGND ......................................................................... -0.3V to VDD
Digital Input Voltage to DGND ...................................................................…. -0.3V to VDD
Digital Output Voltage to DGND ..................................................................... -0.3V to VDD
AIN to AGND ............................................................................................….. -20V to +20V
Digital Input Voltage to DGND ............................................................... -0.3V, (VDD+0.3V)
Digital Output Voltage to DGND ............................................................ -0.3V, (VDD+0.3V)
VREF .............................................................................................................….. -20V, +20V
VBOFS ...........................................................................................................…. -20V, +20V
VAIN ..............................................................................................................…. -20V, +20V
Lead Temperature (soldering, 10 seconds) ..................................................................... +300°C
Storage Temperature ........................................................................................ -65°C to +150°C
Continuous Power Dissipation ..........................................................................….... TA=+70°C
18 pin CERDIP(derate 10.5mW/°C above +70°C) .................................................…... 842mW
20 pin LCC(derate 9.1mW/°C above +70°C) .........................................................….... 727mW
Junction Temperature TJ ....................................................................................…….. +150°C
Thermal Resistance, Junction to Case, ΘJC
18 pin CERDIP................................................................................................……. 45°C/W
20 pin LCC .....................................................................................................…….. 20°C/W
Thermal Resistance, Junction to Ambient, ΘJA:
18 pin CERDIP................................................................................................……. 95°C/W
20 pin LCC ...................................................................................................…….. 110°C/W
Recommended Operating Conditions
Ambient Operating Range (TA) .........................................................…….. -55°C to +125°C
Supply Voltage Range (VDD) ..................................................................................……...+5V
Reference Voltage (VREF) ...................................................................................……... -10V
Ground ...........................................................................................…….. AGND=DGND=0V
Clock Resistance ...................................................................................................…….. 150k
Clock Capacitance (CCLK) ....................................................................................……. 100pF
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
----------------------------
Electrical Characteristics of MX7574/883B
for /883B and SMD 5962-89616
19-0356
Page 2 of
Rev. C
7
TABLE 1. ELECTRICAL TESTS:
TEST
Resolution
NOTE 5
Symbol
CONDITIONS
-55 °C ≤TA≤ +125°C 1/
Unless otherwise specified
Group A
Subgroup
Device
type
All
RES
Relative Accuracy
RA
External clock frequency 500kHz.
1,2,3
01
02
Differential Nonlinearity
DNL
External clock frequency 500kHz.
1,2,3
01
02
Gain Error
AE
Gain Error is measured after calibrating
out offset error.
External clock frequency 500kHz.
1
2,3
01
Resistance mismatch
between BOFS and AIN
Input Resistance
VOS
External clock frequency 500kHz.
RM
RIN
Digital Input High Level
Voltage
Digital Input Low Level
Voltage
Digital Input Current
VIH
VIL
IIN
At AIN
___ __
RD, CS
___ __
RD, CS
VIN=0V or VDD
8
Units
Bits
±0.75
±0.50
±0.875
±0.75
±5.0
±6.5
1
2,3
±3.0
±4.5
±60
±80
02
01
1
2,3
02
1,2,3
All
At VREF
AT BOFS
Limits
Max
LSB
LSB
LSB
1
2,3
Offset Error
Limits
Min
±30
±50
±1.5
5
15
LSB
%
kΩ
1,2,3
All
10
30
All
10
2.4
30
1,2,3
1,2,3
All
0.8
V
1
2,3
1,2,3
1,2,3
1,2,3
1,2,3
All
±1.0
±10
5.0
µA
All
V
NOTE 3
NOTE 3
NOTE 2
NOTE 3
NOTE 3
All
All
All
All
Digital Input Capacitance
Clock Input High
Clock Input Low
Clock Input High
Current
Clock Input Low Current
CID
VIH
VIL
IIH
Digital Output High
Voltage
Digital Output Low Level
Voltage
Floating State Leakage
Current (DB7-DB0)
Floating State Output
Capacitance (DB7-DB0)
VOH
ISOURCE=40µA
1
2,3
1,2,3
VOL
ISINK=1.6mA
1,2,3
All
0.4
V
ILKG
VOUT=0V or VDD
All
NOTE 2
±1.0
±10
7.0
µA
COUT
1
2,3
1,2,3
IIL
----------------------------
Electrical Characteristics of MX7574/883B
for /883B and SMD 5962-89616
All
3.0
0.4
±2.0
±1.0
±10
4.0
All
19-0356
Page 3 of
Rev. C
7
pF
V
V
mA
µA
V
pF
TEST
Symbol
Supply Current
ICC
__
CS Pulse Width
__
__
RD to CS Setup Time
__
_____
CS to BUSY Propagation
Delay
tCS
CONDITIONS
-55 °C ≤TA≤ +125°C 1/
Unless otherwise specified
Subgroup
_____
___
BUSY and RD= HIGH, AIN=0V
NOTE 4
tWSCS
tCBPD
Group A
_____
BUSY Load=100pF
Limits
Min
Limits
Max
Units
1,2,3
All
9,10,11
All
150
ns
All
0
ns
NOTE 5
_____
BUSY Load=20pF
Device
type
5.0
mA
180
NOTE 5
All
ns
____
__
BUSY to RD Setup Time
_____ ___
BUSY to CS Setup Time
Data Valid Access Time
tBSR
NOTE 5
NOTE 4
9,10,11
All
0
ns
tBSCS
NOTE 4
9,10,11
All
0
ns
Data Valid Hold Time
__
CS to RD Hold Time
Reset Time Requirement
___ _____
RD to BUSY
Conversion Time
tRHD
tRHS
NOTE 1:
NOTE 2:
NOTE 3:
NOTE 4:
NOTE 5:
tRAD
tRESET
tWBPD
tCONVERT
Load=20pF
Load=100pF
_____
BUSY Load=20pF
Ext CLK 500kHz
200
All
NOTE 4
NOTE 5
NOTE 4
NOTE 4
9,10,11
9,10,11
All
All
80
NOTE 4
NOTE 4
9,10,11
9,10,11
All
All
3
NOTE 5
All
----------------------------
MAXIM PART #
MX7574SQ/883B
MX7574SE/883B
MX7574TQ/883B
MX7574TE/883B
Electrical Characteristics of MX7574/883B
for /883B and 5962-89616
SMD Number
5962-8961604VA
5962-89616042C
5962-8961603VA
5962-89616032C
19-0356
Page 4 of
ns
ns
2
µs
µs
15
VDD=+5.0V, VREF=-10V. Unipolar Configuration, RCLK=180kΩ. CCLK=100pF.
Guaranteed at 25°C if not tested to the limits specified in Table 1.
Guaranteed by functional pattern testing in external clock RAM, ROM, and SLOW modes.
Static RAM interface mode.
Guaranteed at 25°C, +125°C, -55°C, if not tested to the limits specified in Table 1.
ORDERING INFORMATION:
Package
Pkg. Code
01
18 pin CERDIP
J18
01
20 pin LCC
L20
02
18 pin CERDIP
J18
02
20 pin LCC
L20
200
400
180
500
Rev. C
7
ns
TERMINAL CONNECTIONS:
J18
L20
Pin
1
VDD
NC
2
VREF
VDD
3
BOFS
VREF
4
AIN
BOFS
5
AGND
AIN
6
D7(MSB)
AGND
7
D6
D7(MSB)
8
D5
D6
9
D4
D5
10
D3
D4
11
D2
NC
12
D1
D3
13
D0(LSB)
D2
14
_____
D1
BUSY
15
___
D0(LSB)
RD
16
___
_____
CS
BUSY
17
CLK
___
RD
18
DGND
___
CS
19
CLK
20
DGND
----------------------------
Electrical Characteristics of MX7574/883B
for /883B and SMD 5962-89616
19-0356
Page 5 of
Rev. C
7
QUALITY ASSURANCE
Sampling and inspection procedures shall be in accordance with MIL-Prf-38535, Appendix A as specified in MilStd-883.
Screening shall be in accordance with Method 5004 of Mil-Std-883. Burn-in test Method 1015:
1. Test Condition, A, B, C, or D.
2. TA = +125°C minimum.
3. Interim and final electrical test requirements shall be specified in Table 2.
Quality conformance inspection shall be in accordance with Method 5005 of Mil-Std-883, including Groups A, B,
C, and D inspection.
Group A inspection:
1. Tests as specified in Table 2.
2. Selected subgroups in Table 1, Method 5005 of Mil-Std-883 shall be omitted.
Group C and D inspections:
a. End-point electrical parameters shall be specified in Table 1.
b. Steady-state life test, Method 1005 of Mil-Std-883:
1. Test condition A, B, C, D.
2. TA = +125°C, minimum.
3. Test duration, 1000 hours, except as permitted by Method 1005 of Mil-Std-883.
TABLE 2.
ELECTRICAL TEST REQUIREMENTS
Mil-Std-883 Test Requirements
Interim Electric Parameters
Method 5004
Final Electrical Parameters
Method 5005
Group A Test Requirements
Method 5005
Group C and D End-Point Electrical Parameters
Method 5005
Subgroups
per Method 5005, Table 1
1
1*, 2, 3, 4**, 9, 10, 11***
1, 2, 3, 4** , 9, 10, 11***
1
* PDA applies to Subgroup 1 only.
** Subgroups 4, capacitance tests shall be tested at initial qualification and upon redesign.
*** Subgroups 10 and 11 if not tested, are guaranteed to the limits in Table 1.
----------------------------
Electrical Characteristics of MX7574/883B
for /883B and SMD 5962-89616
19-0356
Page 6 of
Rev. C
7