Power Module Application Notes
Contents
1. Product application example of configuration
Examples of power supply configurations using a wide variety of
combinations of power modules and on-board power supply units
lineups will be introduced with layout sketches.
2. Power module conduction cooling design
For power modules with aluminum boards, conduction cooling design
is necessary. Conduction cooling design (including selection of heat
sink and fan setting) should be made based on the input/output conditions and temperature environment in use so that the temperature
of the power module base plate stays within the allowed range of
temperatures.
In this chapter, the conduction cooling design by forced air cooling
with heat sink will be explained.
2 - 1 Conduction cooling design
(explanation and examples)
2 - 2 Standard heat sinks
(refer also to the quick reference below.)
3. Power module mounting method
The power module with aluminum board should be fastened to the
printed circuit with screws and soldered..　Instructions on how to do
that will be described.
Power module
Application notes
3 - 1 Board mounting method
3 - 2 Heat sink mounting method
3 - 3 About vibration resistance　3 - 4 Recommended soldering conditions
3 - 5 Recommended cleaning conditions
* Our standard heat sinks -- quick reference
No.
Module type name
Heat sink type name
1.
PH50S, PH75S
HAA-041
2.
PH75F, PH100S
HAA-062
3.
PH150S
HAA-072
4.
PH100F, PH150F, PH300S, PF500A
HAA-083
5.
PH300F, PH600S, PF1000A
HAA-146
6.
PAH50S, PAH75S, PAH100S,
PAH150S, PAH200S, PAH300S,
PAH350S, PAH400S, PAH75D, CN200A110
HAH-10T, HAH-10L,
HAH-15L
7.
PAF400F, PAF450F, PAF500F,
PAF600F, PAF700F,
PFE300SA, PFE500SA, PFE700SA
HAF-10L,
HAF-15L, HAF-15T
8.
PFE500F
HAL-F12T
9.
PFE1000F, PFE1000FA
HAM-F10T
10.
CN30A110, CN50A110, CN50A24, CN100A110, CN100A24 HAQ-10T
PH50A280, PH75A280, PH100A280, PH150A280
・All specifications are subject to change without notice.
B-367
web160708
Application notes
1. Product application example of configuration
パワーモジュール／オンボード電源
アプリケーション構成例
アプリケー
ショ
ン構成例
パワーモジュール／オ
ド電源
Example
1: 500W AC/DCンボー
power
supply
NEW!
All the
DC/DC
converters referred to in this page are of insulation type.
NEW!
例1：500W AC／DC電源
Regulated
output
All the
DC/DC
converters referred
to in this
page are of insulation type.
アプリ
ケー
ショ
ン構成例
パワーモジュール／オンボード電源 NEW!
Harmonic
suppression
DC/DC
例1：500W AC／DC電源
アプリケーション構成例 12V, 28V, 48V
パワーモジュール／オ
ンボード電源
AC INPUT
AC Fuse
Regulated output
396W∼1008W
PFE-SA,
Noise
Harmonic suppression
DC/DC
All the DC/DC
converters referred to in this page are of insulation type.
＊
NEW!
PFE-F
OUT1 type.
12V,referred
28V, 48V
All
the DC/DC converters
to in this page are of insulation
NEW!
F
ilter
PFE-FA
396W∼1008W
PFE-SA,
Regulated output
Noise
Harmonic suppression DC/DC
85∼265V
＊
Regulated output
PFE-FDC/DC
OUT1
DC
Fuse
Harmonic suppression
12V,
28V, CC-E,PSS
48V
（D）
,
ilter
AC INPUT
PFE-FA
AC Fuse F
12V,
28V, 48V
OUT2
396W∼1008W
PFE-SA,
Noise
85∼265V
AC
INPUT
AC FuseSimple
396W∼1008W
PFE-SA,
PV
（D）etc.
(Harmonic suppression: Effective)
structure 385VDC
Noise
DC
Fuse
PFE-F＊
OUT1
＊
CC-E,PSS
（D）
,
PFE-F
OUT1
OUT2
Filter
Internal PFE-FA
high voltage line
OUT
2
is
an
example
of
auxiliary
output.
85∼265V
F
i
l
t
e
r
PFE-FA
PV
（D）etc.
(Harmonic
suppression: Effective) Simple structure 385VDC
DC
Fuse
85∼265V
＊PFE-F is possible output power reinforcement
(kW order)
by parallel operation.
CC-E,PSS
（D）
,
DC
Fuse
OUT2
Internal high voltage line
OUT 2 is CC-E,PSS
an example
of, auxiliary
output.
（D）
OUT2
例2：500∼1500W
AC/DC電源
（高圧給電
・多出力）
PV
（D）etc.
(Harmonic
suppression: Effective)
Simple structure
385VDC
＊PFE-F
is
possible
output
power
reinforcement
(kW
order)
by
parallel
operation.
PV
（D）
etc.
(Harmonic
suppression: Effective)
Simple
structuresupply
385VDC
Example
2: 500-1500W
AC/DC
power
(high
voltage
poweris feeding
/ multiple outputs)
Internal high
voltage
line DC/DC
AC/DC
front-end
OUT 2back-end
an example of auxiliary output.
例2：500∼1500W
AC/DC電源
（高圧給電
・多出力）
Internal
high voltage line
OUT 2 is an example of auxiliary output.
＊PFE-F
is possible output power reinforcement (kW order) by parallel operation.
Harmonic
suppression
DC/DC
back-end (kW order) by parallel operation.
＊PFE-F is possible
output power
reinforcement
High-voltage
AC/DC front-end
DC
Fuse
例2AC
：500∼1500W
AC/DC電源
（高圧給電
・
多出力）
power supply
INPUT AC Fuse
OUT1
PF500A/
PAF-F280
例2：500∼1500W
AC/DC電源
・多出力）
Harmonic
suppression360VDC
Noise （高圧給電
DC Fuse
DC/DC
back-end
AC/DC front-end
PF1000A High-voltage
power supply DC/DC back-end
AC/DC
AC INPUT AC
OUT1
PF500A/
F
ilter
Fuse front-end
DC Fuse P A F - F 2 8 0
Noise
Harmonic-360
suppression360VDC
85∼265V
DC Fuse PH-F280,
OUT2
PF1000A
Harmonic
suppression High-voltage
High-voltage
power supply
DC Fuse
Fuse PH-S280
AC INPUT AC Fuse F i l t e r
DC
OUT1
PF500A/
PAF-F280
-360
power
supply
Noise
AC
INPUT
360VDC
85∼265V
OUT1
PF500A/ 360VDC
PPH-F280,
AF-F280
AC Fuse Effective)
OUT2
(Harmonic suppression:
Noise
PF1000A
PH-S280
PF1000A
Filter
DC Fuse
-360
Filter
85∼265V
DC Fuse PH-F280,
(Harmonic
suppression: Effective)
-360
Multiple-output
configurationOUT2
is possible
85∼265V
PH-F280,
OUT2
PH-S280
within the nominal
output power
(500W
PH-S280
- 1.5kW) of theconfiguration
power supplyisline.
(Harmonic suppression: Effective)
Multiple-output
possible
(Harmonic suppression: Effective)
within the nominal output power (500W
- 1.5kW) of the power supply line.
NEW!
Multiple-output configuration is possible
例3：700W∼AC/DC電源
（低圧給電・多出力）
Multiple-output
configuration
is possible
within
the nominal
output power
(500W
Semi (rough) regulation/droop
output
within
the of
nominal
output
power (500W
NEW! 57-51V/714W
- 1.5kW)
the
power
supply
(max) (When
using
one unit
of PFE)line.
例3：700W∼AC/DC電源
（低圧給電・多出力）
- 1.5kW) of the power supply line.
Harmonic
Semi (rough)
regulation/droop
output outputs)
DC
Fuse
Example 3: 700W
or over AC/DC
power suppression
supply(lowDC/DC
voltage
power
feeding
/ multiple
Low-voltage
AC INPUT
NEW!
57-51V/714W
(max) (When
using
OUT1
AC Fuse （低圧給電
P
A
F
- Fone
4 8unit of PFE)
例3：700W∼AC/DC電源
・
多出力）
NEW!
supply
Noise suppression
PFE700SA
Harmonic
DC/DC powerSemi
例3：700W∼AC/DC電源
（低圧給電
・多出力）
DC
Fuse
(rough)
regulation/droop
output
Low-voltage
AC INPUT AC Fuse
Semi (rough)
regulation/droop
-48
(max) (When
OUT1
P Ausing
Foutput
- Fone
4 8unit of PFE)
Filte r
power57-51V/714W
supply DC Fuse
Noise
57-51V/714W
(max) (WhenP
using
PFE700SA
A Hone unit of PFE)
85∼265V
Harmonic suppression
DC/DC
DC
Fuse
OUT2
-S48
AC INPUT AC Fuse Harmonic
DC
-48DC/DC Low-voltage
DC Fuse
Fuse
Filte r suppression
Low-voltage
OUT1
P
A
F
F
4
8
Simple structure/Parallel
AC INPUT AC Fuse
power
supply
Noise
OUT1
PFE700SA power supply DC Fuse
P APFA- H
F48
85∼265V
OUT2
operationNoise
is possible
PFE700SA
-PAQ
S48
OUT3
-48
DC
Fuse
Filte r
Simple structure/Parallel
DC
Fuse
-48
DC
Fuse
r
P
A
H
85∼265V AC FuseoperationFilte
is
possible
（PAQ-S48,PAQ65D48）
Noise
OUT2
DC Fuse
PFE700SA
85∼265V
OUT3
-PPAQ
SA4H8
OUT2
structure/Parallel
-PAE
S48
OUT4
AC FuseSimple
-48
DC
Fuse
Filte
r
Simple structure/Parallel
（PAQ-S48,PAQ65D48）
Noise
operation
is possible
DC Fuse
PFE700SA
（PAE-S48）
PAQ
OUT3
operation is possible
OUT4
PAE
PAQ
OUT3
-48
(Harmonic suppression:
Filte r
AC Fuse Effective)
（PAQ-S48,PAQ65D48）
Noise
AC Fuse
（PAE-S48）
DC
Fuse
PFE700SA
Noise
DC Fuse（PAQ-S48,PAQ65D48）
PFE700SA
OUT4
Multiple-output
configuration
within the
(Harmonic suppression: Effective)
PAE is possible
-48
Filte
r
Consider replacing our existing
products
(PF+PT500)
with this.
PAE
-48
Filte
r
nominal output power
(depending on OUT4
the number
（PAE-S48）
Various combinations are available in addition to this.
（PAE-S48）is possible within the
Multiple-output configuration
(Harmonic
suppression:
Consider replacing
our Effective)
existing products (PF+PT500) with this. of the units of PFE) of the power supply line.
(Harmonic
suppression:
Effective)
nominal output power (depending on the number
Various combinations are available in addition to this.
Multiple-output
configuration
is possible
of
the units of PFE)
of the power
supply within
line. the
Consider
replacing ourN
existing
products (PF+PT500)
with this.
Multiple-output
configuration
is possible
the
+1並列冗長AC/DC電源
例4
：大電力
（kWクラス）
（高圧給電
・多出力）
nominal
output power
(depending
on the within
number
Consider
replacing
our
existing
products
(PF+PT500)
with
this.
Various combinations are available in addition to this.
nominal
output
power
(depending
on
the
number
of the units of PFE) of the power supply line.
VariousAC/DC
combinations
are available in addition to this.
front-endN+1並列冗長AC/DC電源
DC/DC
back-end
of the
units of
PFE) of the power supply line.
例4：大電力
（kWクラス）
（高圧給電・多出力）
48V 48V
series
48V
series
48V
busline
series
series
busline
busline
busline
Power module
Application notes
例1：
500W
AC／DC電源
AC
INPUT
AC Fuse
例1：
500W
AC／DC電源
AC
Harmonic suppression 360VDC
AC/DC
front-endN+1並列冗長AC/DC電源
DC/DC
back-end
DCvoltage
Fuse
例4：power
大電力
（kWクラス）
（高圧給電
・多出力）
High-voltage
power
supply
Example 4: High
(kW class)
N+1
parallel Fuse
redundancy AC/DC
power supply
(high
power
feeding / multiple
outputs)
例4：大電力
（kWクラス）
N+1並列冗長AC/DC電源
（高圧給電・多出力）
OUT1
PAF-F280
suppression 360VDC
AC Harmonic
AC
PF1000A
AC INPUTAC/DC
DC Fuse
front-end
DC/DC
back-end
High-voltage power supply
Fuse
Fuse front-end
Noise
AC/DC
DC/DC
back-end
-360
DC Fuse
OUT1
PAF-F280
AC
Harmonic
suppression
360VDC
AC
PF1000A
AC INPUT
OUT2
DC
Fuse
Harmonic
suppression
Filte
r
360VDC
AC
PH-F280
Fuse Noise
Fuse
-360 High-voltage power supply DC Fuse PAF-F280
AC
OUT1
85∼265VAC
Fuse PF1000A High-voltage power supply
OUT1
PAF-F280
AC INPUT AC
OUT2
Fuse PF1000A
Filte r
PH-F280
DC
Fuse
AC INPUT Fuse Noise
AC
-360
DC Fuse
85∼265V
OUT3
Fuse
Noise
(Harmonic suppression: Effective)
PH-S280
-360
DC Fuse
Fuse PF1000A
OUT2
DC Fuse
Filte r
PH-F280
OUT2
Filte r Effective)
PH-F280
AC
* Diode
for preventing
backflow in failure
OUT3
85∼265V
(Harmonic
suppression:
PH-S280
-360
AC
85∼265V
Fuse PF1000A
DC Fuse
Fuse
Various
combinations
DC Fuse
* Diode
for preventingare
backflow in failure
PF1000A
Parallel operation
is possible.
OUT3
Multiple-output
configuration
within the
(Harmonic
suppression:
Effective)
PH-S280 is possible
-360
OUT3
available in
addition toEffective)
this.
(Harmonic
suppression:
PH-S280
-360
nominal output power
(depending on the number
Various
combinations
are
Parallel operation is possible.
* Diode for preventing backflow in failure
Multiple-output
configuration
is possible
of
the units of PFE)
of the power
supply within
line. the
* Diode
preventing
available
infor
addition
to backflow
this. in failure
nominal output power (depending on the number
Various combinations are
Parallel operation is possible.
Multiple-output
configuration
is possible
of
the units of PFE)
of the power
supply within
line. the
Various combinations
Parallel operation is possible.
available
in addition toare
this.
Multiple-output
configuration
is possible
the
nominal
output power
(depending
on the within
number
available in addition to this.
nominal
output
power
(depending
on
the
number
of the units of PFE) of the power supply line.
of the units of PFE) of the power supply line.
B-368
・All specifications are subject to change without notice.
Application notes
Example
5: Domestic
use AC/DC
power
supply
パワーモジュール／オ
ンボード電源
アプリケー
ション構成例
パワーモジュール／オンボード電源
例５
：日本国内用 AC/DC電源
パワーモジュール／オンボード電源
All the DC/DC converters referred to in this page are of insulation type.
アプリケーション構成例
約110∼180VDC
DC/DC
All the
DC/DC
converters referred to in
this page are of insulation type.
Rectifying/smoothing
アプリ
ケー
ショ
ン構成例
DC Fuse
※
※
All the DC/DC
converters referredPH-F110
to in
this page are ofOinsulation
type.
約110∼180VDC
DC/DC
U T1
Rectifying/smoothing
Inrush
current
Noise
75∼300W
例５
：
日本国内用
AC/DC電源
DC Fuse
※
AC INPUT
※
約110∼180VDCPH-F110
DC/DC
Rectifying/smoothing
O U T1
AC Fuse
Filter
protecting
circuit
Inrush current
Noise
DC Fuse
85∼132V
75∼300W
※
※
AC INPUT
2
PH-S110
OUT
T1
AC Fuse
PH-F110
Filter
∼
Inrush current
protecting
circuit
Noise
DC Fuse
50∼150W
75∼300W
85∼132V
AC INPUT
OUT2
PH-S110
Filter
protecting circuit
AC/DC
∼
DC
Fuse
85∼132V
50∼150W
* Discrete configuration
OUT2
PH-S110
∼
KS, KWS,
AC/DC
OUT3
50∼150W
KWD
5∼15W
* Discrete
(Harmonic suppression:
notconfiguration
effective) -> Power factor is about 0.5 - 0.7. AC/DC
KS, KWS,
OUT3
KWD
* Discrete configuration
5∼15W
(Harmonic suppression: not effective) -> Power factor is about 0.5 - 0.7. KS, KWS,
OUT3
KWD
5∼15W
例６
：
通信・工業用
-48Vnot
給電
DC/DC
電源
(Harmonic
suppression:
effective)
-> Power
factor is about 0.5 - 0.7.
例５
：日本国内用 AC/DC電源
AC Fuse
Example
6: Communication/industry use -- 48V DC/DC power supply
例６
：通信・工業用 -48V 給電 DC/DC 電源 Discrete configuration
DC Fuse
Parallel operation is possible.
PAF700F48,
PAF600F48,
Parallel operation is possible.
Filter
（ー）36∼（ー）76V
protecting
circuit
DC Fuse
PAF500F48
PAF700F48,
Discrete
configuration
Noise
DC INPUT
Inrush current
Parallel operation is possible.OUT 1
PAF600F48,
Filter
DC Fuse
PAF700F48,
（ー）36∼（ー）76V
protecting circuit
PAF500F48
Noise
500W∼
DC INPUT
Inrush
current
DC Fuse
PAF700F48,
PAF600F48,
Noise
OUT 1
Inrush current
Filter
（ー）36∼（ー）76V
PAF600F48,
protecting
circuit
PAF500F48
500W∼
Filter
protecting
circuit
DC
Fuse
PAF500F48
PAF700F48,
Noise
OUT 1
Noise
Inrush current
PAF600F48,
500W∼
Filter
DC Fuse
PAF700F48,
Filter
protecting circuit
PAF500F48
Noise
Noise DC Fuse
Inrush current
PAF600F48,
50∼350W
PAH
Filter
OUT 2
Filter
protecting
circuit
PAF500F48
Noise
-S48
Noise
DC Fuse
75W
50∼350W
PAH
PAH
Filter
OUT32
OUT
DC Fuse
Filter
75D48
-S48
DC Fuse
Noise
50∼350W
or65W
PAH
75W
PAH
PAQ
OUT4
OUT
OUT
32
DC Fuse
Filter
75D48
-S48
65D48
Noise
DC Fuse
75W
PAH
or65W
PAQ
OUT
3
DC Fuse
OUT 4
5
PAQ-S
Filter
75D48
Noise
65D48
50∼100W
DC FuseDC Fuse
or65W
PAQ
OUT
4
Filter
OUT
PAQ-S
OUT 5
6
PAE
65D48
Noise
DC
Fuse
50∼100W
Various combinations are
DC Fuse
（PAE-S48）
OUT
5
PAQ-S
Filter
available in addition to this. Noise
OUT 6
PAE
CC-E,
PSS(D)
50∼100W
DC Fuse
Various combinations are
OUT 7
50∼100W
Filter
（PAE-S48）
PV(D)
OUT 6
PAE 1.5∼10W
available in addition to this.
CC-E, PSS(D)
Various combinations are
50∼100W
OUT 7
（PAE-S48）
PV(D)
1.5∼10W
available in addition to this.
CC-E, PSS(D)
OUT 7
例７
：通信・工業用 24V 給電 DC/DC 電源
PV(D)
1.5∼10W
Noise
DC：
INPUT
Inrushconfiguration
current
例６
通信・工業用 -48V 給電 DC/DC
電源 Discrete
Parallel operation is possible.
Parallel operation is possible.
PAF500F24
protecting circuit
Filter
500W∼
PAF600F24,
Inrush current
18∼36V
Noise
Parallel operation is possible.OUT 1
DC INPUT
PAF500F24
DC Fuse
protecting circuit
Filter
PAF600F24,
Inrush current
Noise
500W∼
DC Fuse
18∼36V
Inrush current
Noise
DC INPUT
PAF600F24,
OUT 1
PAF500F24
protecting circuit
Filter
protecting circuit
500W∼
PAF500F24
Filter
18∼36V
DC Fuse
Inrush current
OUT 1
Noise
PAF600F24,
protecting circuit
DC Fuse
PAF500F24
Filter
Inrush current
PAF600F24,
DC Fuse Noise
300∼350W
Noise
Inrush current
PAH
protecting
circuit
PAF500F24
Filter
OUT 2
Filter
protecting
circuit
-S24
DC Fuse
300∼350W
Noise
Inrush current
PAH
OUT32
OUT
DC Fuse
PAH
Filter
protectingNoise
circuit
DC Fuse
-S24
75W
300∼350W
Noise
Inrush current
PAH
75D24
OUT4
OUT
Filter
OUT
32
DC Fuse
Discrete configuration
Filter
PAH
protectingNoise
circuit
-S24
75W
75D24
4
OUT 3
Discrete
configuration Discrete configuration FilterDC Fuse
DC Fuse
PAH
OUT5
PAE
Noise
75W
50W
75D24
Noise
OUT 4
（PAE50S24）
Discrete configuration Discrete configuration FilterDC Fuse
OUT5
Filter
PAE
CC-E, PSS(D)
50W
OUT 6
Noise
DC Fuse
Various combinationsDiscrete
configuration
PV(D)
（PAE50S24）
OUT5
PAE 1.5∼10W
Filter
are available in addition Noise
to this.
CC-E, PSS(D)
50W
OUT 6
Various combinations
（PAE50S24）
PV(D)
1.5∼10W
Filter
CC-E,
PSS(D)
are available in addition to this.
OUT 6
Various combinations
PV(D)
1.5∼10W
are available in addition to this.
DC INPUT
DC Fuse
・All specifications are subject to change without notice.
Power module
Application notes
例７
：通信・工業用 24V 給電 DC/DC 電源
DC Fuse
Example
7:・工業用
Communication/industry
use -24V
DC/DC power supply
PAF600F24,
Inrush current
Noise 電源
例７
：通信
24V 給電 DC/DC
B-369
Application notes
パワーモジュール／オンボード電源
アプリケーション構成例
アプリケーション構成例 power supply
パワーモジュール／オ
ンボー
ド電源
Example
8:
Usage
of insulated/non-insulated
例８
：絶縁
・非絶縁型電源の使い分け
例８
：絶縁・非絶縁型電源の使い分け
IN
Insulation type power supplies
IN
unit/substrate/power
Insulation
type power supplies
module/on-board
type
unit/substrate/power
module/on-board type
OUT
Non-insulated DC/DC
OUT
Non-insulated
DC/DC
IN
OUT
PMH
IN
PMH
CE
OUT
OUT1
OUT2
OUT2
OUT3
OUT3
CE
例９
：絶縁型DC/DCコンバータの入出力接続
OUT1
In this section, conceptual diagrams of the use of insulation type DC/DC converters will be introduced.
例９
：絶縁型DC/DCコ
ンバータの入出力接続
Example
9:
Input/output
connections for insulated DC/DC converter
Refer to the respective pages for each product, because some external parts may be needed or some
In this section,
conceptual
diagrams
of the
insulation type DC/DC converters will be introduced.
names
of terminals
may differ
depending
onuse
the of
product.
Refer to the respective pages for each product, because some external parts may be needed or some
(1) Location names
for fuse
to be inserted
of terminals
may differ depending on the product.
1) Positive power supply (for general/industrial use) 2) Negative power supply (for communication)
(1) Location for fuse to be inserted
+V（in）
+V（in） +V（out）
+V（out）
1) Positive power supply (for general/industrial use) 2) Negative power supply (for communication)
DC/DC
DC/DC
IN
IN
OUT
OUT
+V in
+V（in）
+V（in） +V（out）
+V（out）
ーV（in） ーV（out）
ーV（in） ーV（out）
ーV in
DC/DC
DC/DC
IN
IN
OUT
OUT
+V in
Decisions should be made with consideration to safety in the connection conditions
ーV（in） ーV（out）
ーV
ーV
（in）
（out）
ーV
in occurred.
after the fuse is blown out when a problem has
Decisions
shouldofbeeach
made
with consideration
to safety
in power
the connection
The explanation
product
is based on the
positive
supply. conditions
after the fuse is blown out when a problem has occurred.
of each
product
is based on the positive power supply.
(2) Application as The
the explanation
non-insulated
power
supply
1) Voltage conversion with homopolarity
2) Reversal of polarity (an example is getting negative voltage)
(2) Application as the non-insulated power supply
0V
+Vo + V in
+ V in
+V（in） +V（out）
+V（in） +V（out）
1) Voltage conversion with homopolarity
2) Reversal of polarity (an example is getting negative voltage)
DC/DC
DC/DC
OUT
OUT 0V
IN
IN
+Vo + V in
+ V in
+V（in） +V（out）
+V（in） +V（out）
ーV（in） ーV（out）
ーV
ーV（out）
（in）
0V
DC/DC
DC/DC
OUT
OUTーVo
IN
IN
0V
0V
ーV（in） ーV（out）
ーV
ーV（out）
（in）
0V
3) Use of output
ーVo
0V
0V voltage for input line in series
+V（in）
+V（out）
DC/DC
+V（in）
+V（out）
ーV
ーV
（in）
（out）
IN
DC/DC
ーV
ーV
（in）
（out）
+V inline in series
3) Use of output voltage for input
A. Layering to positive power supply
IN
Power module
Application notes
+V in
A. Layering to positive power supply
0V
0V
B. Layering to negative power supply
+
（V in + Vo ）
OUT
OUT
+
（V in + Vo ）
0V
0V
0V
+V（in）
+V（out）
B. Layering to negative power supply
DC/DC
OUT
IN
0V
0V
+V（in）
+V（out）
ーV in
ーV（in） ーV（out）
ー（V in + Vo ）
DC/DC
OUT
IN
ーV in by connecting ーV
In the insulation type DC/DC converter,
the（in）
input and
output
mutually
like above,
ーV（out）
ー（V in + Vo ）
0V
application as the non-insulated power supply is possible. Other connections are also possible in addition to this.
In the insulation type DC/DC converter, by connecting the input and output mutually like above,
the non-insulated
power supply is possible. Other connections are also possible in addition to this.
(3) Useapplication
of bipolarasvoltage
in dual outputs
+12V
+V（in）
+V（out）
(3) Use of bipolar
voltage in
dual outputs
IN
+V（in）
COM
DC/DC+V（out）
IN
COM
DC/DCーV（out）
ーV（in）
ーV（in）
B-370
ーV（out）
+12V
OUT
OUTOpen
ー 12VOpen
ー 12V
Applicable products
KWD, CC-DxE, PSD, PVD
Applicable products
※ Combination with (1) / (2) above are also possible.
CC-DxE,
PSD,isPVD
24V
（30V） KWD,
* Variability
function
to be used for some products.
Combination
with
(1) / (2) above are also possible.
※
24V
（30V）
* Variability
functionisisnot
to available
be used for
products.
Note)
This application
for some
the following
products: CE, PAH75D, PAQ65D
Note) This application is not available for the following
products: CE, PAH75D, PAQ65D
・All specifications are subject to change without notice.
Application notes
2. Power module conduction cooling design
2 - 1 Conduction cooling design
The power modules become usable under the condition
that the temperature of the base plate in use is kept under
the allowed temperature value. The system reliability is
dominated by the temperature of the base plate in use.
We will explain about the power module conduction
cooling designing process by using an example with
"PAF600F280-48". Figure 1-1 is the flow chart of the conduction cooling design.
Radiation design
STEP1
Output power Pout?
Ambient temperature Ta?
STEP2
Reliability?
STEP3
Deciding base plate temperature
STEP4
Deciding thermal resistance necessary for radiation
●STEP 2
Decide the base plate temperature with consideration of
the required reliability.
Use the table 1-1 (Temperature and usage of base plates)
as a measuring stick.
Usage
Base plate temperature Reliability level
Devices for public use
Devices with drone control systems
70℃ or lower
Highest
General industrial devices
Devices in production facilities
80℃ or lower
Relatively
high
General electronic devices
85℃ or lower
Ordinary
Table 1-1 Temperature and usage of base plates
●STEP 3
Here, the base plate temperature is supposed to be set
to“Ta = 80℃ or lower”, assuming that the device is for
general industrial use.
●STEP 4
Decide the necessary thermal resistance of the heat sink.
STEP5
Space for mounting?
STEP6
Cooling method?
（1）Find the internal power consumption.
Pd＝
Natural cooling
STEP7
Forced cooling
Checking by experiment
（
Pd ：Internal power consumption
（W）
Pout：Output power
（W）
η ：Efficiency
Then, the efficiency can be found by the expression below.
Figure 1-1 Flow chart of conduction cooling design
●STEP 1
Decide the output power (Pout) and the ambient temperature (Ta) of the power module to be used.
Model: PAF600F280-48
Pout = 500(W) (80% load)
Ta = 50(℃ )
（Hereinafter, a designing example with an actual device
will be indicated inside the frame.）
・All specifications are subject to change without notice.
）
Pout
Pin
η＝
η ：Efficiency
（％）
Pout：Output power
（W）
Pin ：Input power
（W）
×100 … ………………（Expression1-2）
Power module
Application notes
Complete
1 ーη
1
×Pout＝Pout× 1 ー
……（Expression 1-1）
η
η
Efficiency differs depending on the input voltage and
output current. As well, efficiency differs by the type of
power module. Refer to the data of each type of module. Figure 1-2 shows a typical example of the case in
"PAF600F280-48".
Note that the internal power consumption should be decided with 1-2% allowance against the efficiency value
calculated using the characteristic of efficiency in output
current.
B-371
Application notes
The recommended screw-tightening torque in fastening the
power module is 0.54Nm.
5.0
100
Ta (ambient temperature)
4.0
90
3.0
80
Input current
2.0
70
1.0
0
Efficiency ratio (%)
Input current (A)
Efficiency ratio
60
0
20
40
Vin＝ 200V
60
80
Output current (%)
Vin＝ 280V
100
50
Vin＝ 400V
Figure 1-2 PAF600F280-48 efficiency characteristics
Efficiency is found by using Figure
1-2. In this example, efficiency is to
be found in the condition of operating
PAF600F280-48 with 280VDC nominal voltage. The efficiency achieved by
280VDC input voltage and 100% output
current is found to be 91% from Figure
1-2. By adding an allowance of 1% to
this value,
Efficiency η = 90%
By this, the internal power consumption
is found to be
（
Pd＝500×
＝56（W）
）
1
−1
0.9
Power module
Application notes
（2）Find the necessary thermal resistance of the heat sink.
θbp-a＝（Tp ー Ta）／ Pd
（Expression 1-4）
θbp-a：Thermal resistance（℃ /W）
(between base plate and air)
Pd　：Internal power consumption（W）
Ta　：Ambient temperature（℃）
Tp　：Base plate temperature（℃）　Heat sink
Base plate
Base plate
Contact thermal
resistance
（θbp-hs）
Figure 1-4 Contact thermal resistance
●STEP 5
In this example, the thermal resistance between
the base plate and air is
θbp-a = (80-50)/56
= 0.54(℃ /W)
And, the thermal resistance of the heat sink in the
condition of 0.2 ℃/W contact thermal resistance
(θbp-hs), is found to be
θhs-a = 0.54-0.2
= 0.34 (℃ /W)
Next, check the size of the physically available heat sink
space when mounting the power module.
In this example, assume that the available
mounting space of the module is 70(W) x 60(H)
x 125(D) mm.
As the size of the main unit of PAF600F is
61(W) x 12.7(H) x 117(D) mm,
a space of approximately 70(W) x 47(H) x
125(D) mm (approximately 4.1x105mm3) can be
assigned for the heat sink.
The thermal resistance of the heat sink can be found by
the expression below.
θhs-a＝θbp-a−θbp-hs
（Expression 1-5）
θhs-a：Thermal resistance between heat sink and air
（℃ /W）
θbp-hs：Contact thermal resistance（℃ /W）
(between base plate and heat sink)
Contact thermal resistance means the thermal resistance
of the contact surface between the power module base
plate and the heat sink. Use silicone grease or others to
reduce the contact thermal resistance.
Fasten the heat sink to the power module by using screws,
as indicated in a separate section.
B-372
・All specifications are subject to change without notice.
Application notes
●STEP 6
Here, the method of measuring wind speed in a mock-up
Study the cooling method appropriate for the mounting
of the case and estimating the thermal resistance will be
space.
introduced.
First, create a mock-up of the case with consideration
to the shape of the case, number of fans and their loca-
（1）Natural air cooling
Find the approximate value of the heat sink volume which
ensures the thermal resistance found in Step 4, to be required in natural air cooling, based on Figure 1-5 (Relationship between envelope volume of heat sink and thermal
resistance). The characteristics shown in Figure 1-5 are
for typical aluminum heat sinks with proper fin spacing (if
the spaces are too narrow, ventilation resistance becomes
large, reducing the amount of heat discharge). The envelope volume means the volume enclosed by the outline of
the heat sink. The envelope volume value to be found here
should be the approximate volume of the heat sink required
in natural air cooling. Note that the thermal resistance value differs depending on the shape of the heat sink, so refer
to data provided by heat sink manufacturers for details to
make decisions.
10
5
□
041 ●
3
062
2
AIR
HAH-15L
●□
●●
072
□
HAF-10L
□
□
1
Heat sink
HAF-15L
●
HAA- 083 146
HAF-15T
□
平均風速＝
Thermal resistance in the
“example”here
●
HAM-F10T
Figure 1-6 Measurement point of wind speed
0.34℃／W
0.1
5×104
Envelope volume required
in natural air cooling
105
2
3
5
7
2
106
Envelope volume
［ mm3 ］
3
●
5
7
2.5
107
Also, the thermal resistance data provided by heat sink
manufactures is, in most cases, the one in the condition
with vertical mounting. Be aware that the cooling efficiency
will be considerably reduced in the condition with horizontal mounting. If the selected heat sink can be accommodated by the mounting space, go to Step 7.
If not, study the forced air cooling.
（2）Forced air cooling
When forced air cooling is employed, the heat discharge
ability of the heat sink improves and becomes several
times higher than with natural air cooling.
The heat discharge design by forced air cooling is not easy
because the air flow in the case cannot be even.
The uneven air flow is caused by the disturbance in air
flow generated by the fan due to the complicated shape/
structure of the case and mounted components located in
the case. The calculation methods are introduced in various literature, but they are not practically usable because
of too many conditions to be applied.
* Standard heat sink for [HAF-15T]
Power module
Application notes
Figure 1-5 Relationship between envelope volume of
heat sink and thermal resistance (in natural air cooling)
・All specifications are subject to change without notice.
流入風速＋流出風速
inflow wind speed
+ outflow wind speed
2
Average wind speed ＝
2
HAL-F12T
□
0.5
Measurement point of
outflow wind speed
HAH-10L/H
Thermal resistance between heat sink and air
θ hs-a（℃ /W）
Thermal resistance
［℃／W］
(approximate figure) θhs−a
Measurement point
of inflow wind speed
HAQ-10T
□
0.3
0.2
tions to be attached, how the wind blows to the heat sink,
mounted components around the heat sink, and other factors of mechanical design. Then, activate fans and measure the inflow and outflow speed of wind into/from the
heat sink by using a wind meter. The measurement points
should be the center of the heat sink as shown in Figure
1-6 (Measurement point of wind speed). Estimate the thermal resistance value by using the average value of the
inflow and outflow speed of wind as the heat sink's thermal
resistance characteristic in * Standard heat sink for
2.0
1.5
1.0
0.5
0.0
0.34℃／ W
0.1
1.0
3.0
Average wind speed [m/s]
10.0
Figure 1-7 Heat sink's thermal resistance
characteristic in wind speed
Estimate the thermal resistance value by using the heat
sink's thermal resistance characteristic in wind speed,
based on the measured wind speed value.
Check if this thermal resistance value comes under the
thermal resistance value found in Step 4. If necessary thermal resistance is not ensured, change the characteristics
of fans or modify the mechanism of the case so that the
B-373
Application notes
necessary thermal resistance value is ensured.
The envelope volume required in the case of using
natural air cooling should be calculated. It is found to
be 5.2 x 106mm3 or over based on Figure 1-5.
The mounting space cannot accommodate this volume, as the available space for the heat sink is approximately 4.1 x 105mm3. Consequently, forced air
cooling should be adopted. In this case, one of our
standard heat sinks (HAF-15T) should be adopted to
fit the available mounting space.
Based on Figure 1-7“Heat sink's thermal resistance
characteristic in wind speed”, a wind speed of approximately 3m/s or over is necessary to attain
0.34℃ /W or lower thermal resistance value. Confirm
that the necessary wind speed value is ensured by
measuring the wind speed using a mock-up.
Power module
Application notes
B-374
・All specifications are subject to change without notice.
Application notes
●STEP 7
Conduct experiments to check if the designed performance
2 - 2 Standard heat sinks
is actually attained. The base plate temperature can be es-
We have prepared standard heat sinks for each package of
timated by the expression below.
our power modules.
Note that the indicated thermal resistance values are those
（1）Heat sink for [T41] (HAA-041)
Dimensions：86
（W）
×41
（Ｄ）
×22.5
（Ｈ）
mm
Modules to be applied to: PH50S/75S
［A ppearance diagram]］Material：Alminium (black
alumite treatment)
86
76
In the experiment, confirm that the base plate temperature
value is under that decided in Step 3. If there are no problems, the design is complete. If the performances in the
experiment do not satisfy the designed values, re-design
the device.
For PAF600F280-48, measure the base plate temperature
at the center of the base plate. If it is impossible due to
the structure of the heat sink or other factors, measure the
base plate temperature at the nearest point from the center
of the base plate as possible. (The measurement point may
differ depending on the model.)
3-φ3.5
3.9
HAA-041
31
41
Tp：Base plate temperature（℃）
Ta：Ambient temperature（℃）
Pd：Internal power consumption（W）
θbp-a：Thermal resistance（℃ /W）
(between base plate and air)
θbp-hs：Contact thermal resistance（℃ /W）
(between base plate and heat sink)
θhs-a：Thermal resistance of the heat sink
（℃ /W）
(between heat sink and air)
in the condition where silicone grease is applied. Refer to
the page F-1 for standard prices and weight.
φ8 peel-off
of alumite
7.8 × 8 = 62.4
R0.75
R0.5
3.5
Measurement point
of base plate temperature
22.5
Tp＝Ta＋Pd×θbp-a
＝Ta＋Pd（θbp-hs＋θhs-a）　(Expression 1-6)
3
Implement an experiment with an actual device in
which PAF600F280-48 is mounted. Measure the
base plate temperature in the same conditions as in
actual use (Pout=500W, Ta=50℃). Confirm that the
measured base plate temperature is kept at 80℃ or
lower.
This completes the design.
〈Forced air cooling〉
Thermal resistance between heat sink and air
θhs-a
（℃/W）
Figure 1-7 Measurement point of base plate temperature
2
Power module
Application notes
［Cooling characteristics］
〈Natural air cooling〉Thermal resistance: Approximately
3.9（℃ /W）
1.5
1
0.5
0
0.1
0.2 0.3 0.5
1
2
3
5
10
Average wind speed V(m/s)
Figure 2-1 Thermal resistance characteristic in wind
speed for the heat sink prepared for [T41]
・All specifications are subject to change without notice.
B-375
Application notes
(2) Heat sink for [T62] (HAA-062)
(3) Heat sink for [T72] (HAA-072)
Dimensions: 86(W) x 72(D) x 22.5(H) mm
Modules to be applied to: PH150S
Dimensions: 86(W) x 62(D) x 22.5(H) mm
Modules to be applied to: PH75F/100S
[Appearance diagram] Material: Alminium (black alumite
treatment)
[Appearance diagram] Material: Alminium (black alumite
treatment)
86
86
76
3-φ3.5
76
3.9
5-φ3.5
62
72
52
62
φ8 peel-off of alumite
7.8 × 8 = 62.4
φ8 peel-off of alumite
R0.75
7.8 × 8 = 62.4
R0.5
3.5
22.5
3.5
R0.5
R0.75
3
3
[Cooling characteristics]
(Natural air cooling) Thermal resistance: Approximately 3.2 (℃ /W)
[Cooling characteristics]
(Natural air cooling) Thermal resistance: 3.0 (℃ /W)
(Forced air cooling)
(Forced air cooling)
2
Thermal resistance between heat sink and air
θ hs-a
（℃/W）
Thermal resistance between heat sink and air
θ hs-a
（℃/W）
Power module
Application notes
2
1.5
1
0.5
0
0.1
0.2 0.3 0.5
1
2
3
Average wind speed V(m/s)
5
10
Figure 2-2 Thermal resistance cahracteristc in relation to
wind speed for the heat sink prepared for [T62]
B-376
22.5
HAA-062
HAA-072
3.9
1.5
1
0.5
0
0.1
0.2 0.3 0.5
1
2
3
5
10
Average wind speed V(m/s)
Figure 2-3 Thermal resistance cahracteristc in relation to
wind speed for the heat sink prepared for [T72]
・All specifications are subject to change without notice.
Application notes
(4) Heat sink for [T83] (HAA-083)
Dimensions: 86(W) x 83(D) x 22.5(H) mm
Modules to be applied to: PH150F/PH100F/
PF500A/PR500/PH300S
[Appearance diagram] Material: Alminium (black alumite
treatment)
(5) Heat sink for [T146] (HAA-146)
Dimensions: 86(W) x 146(D) x 22.5(H) mm
Modules to be applied to: PH300F/PF1000A/
PH600S/PT500
[Appearance diagram] Material: Alminium (black alumite
treatment)
86
3.9
5-φ3.5
5-φ3.5
3.9
136
146
HAA-146
73
83
HAA-083
76
86
76
φ8 peel-off of alumite
7.8 × 8 = 62.4
3.5
R0.5
22.5
R0.75
φ8 peel-off of alumite
7.8 × 8 = 62.4
R0.5
3.5
[Cooling characteristics]
(Natural air cooling) Thermal resistance: 2.7 (℃ /W)
22.5
R0.75
3
(Forced air cooling)
[Cooling characteristics]
(Natural air cooling) Thermal resistance:
Approximately 1.7 (℃ /W)
1
0.5
0.2 0.3 0.5
1
2
3
5
10
Average wind speed V(m/s)
Figure 2-4 Thermal resistance characteristic in relation to
wind speed for the heat sink prepared for [T83]
Thermal resistance between heat sink and air
θ hs-a
（℃/W）
(Forced air cooling)
1.5
0
0.1
Power module
Application notes
Thermal resistance between heat sink and air
θ hs-a
（℃/W）
2
2
1.5
1
0.5
0
0.1
0.2 0.3 0.5
1
2
3
5
10
Average wind speed V(m/s)
Figure 2-5 Thermal resistance characteristic in relation to
wind speed for the heat sink prepared for [T146]
・All specifications are subject to change without notice.
B-377
Application notes
(6) Heat sink for Half Brick ①
（HAH-10L）
Dimensions: 57.9(W) x 61(D) x 25.4(H) mm
Modules to be applied to: PAH/PAH75D series
CN200A110
[Appearance diagram] Material: Alminium (black alumite
treatment)
Dimensions: 57.9(W) x 61(D) x 25.4(H) mm
Modules to be applied to: PAH/PAH75D series
CN200A110
[Appearance diagram] Material: Alminium (black alumite
treatment)
φ8 peel-off of alumite
φ8 peel-off of alumite
[Cooling characteristics]
(Natural air cooling) Thermal resistance: Approximately 4.5 (℃ /W)
[Cooling characteristics]
(Natural air cooling) Thermal resistance: Approximately 4.6 (℃ /W)
(Forced air cooling)
(Forced air cooling)
2.5
Thermal resistance between heat sink and air
θ hs - a (℃ /W)
2.5
Thermal resistance between heat sink and air
θ hs - a (℃ /W)
Power module
Application notes
(7) Heat sink for Half Brick ②
（HAH-10T）
2.0
1.5
1.0
0.5
0.0
0.1
1.0
Average wind speed [m/s]
10.0
Figure 2-6 Thermal resistance characteristic in relation to
wind speed for the heat sink prepared for [HAH-10L]
B-378
2.0
1.5
1.0
0.5
0.0
0.1
1.0
Average wind speed [m/s]
10.0
Figure 2-7 Thermal resistance characteristic in relation to
wind speed for the heat sink prepared for [HAH-10T]
・All specifications are subject to change without notice.
Application notes
(8) Heat sink for Half Brick ③
（HAH-15L）
Dimensions: 57.9(W) x 61(D) x 38.1(H) mm
Modules to be applied to: PAH/PAH75D series
CN200A110
[Appearance diagram] Material: Alminium (black alumite
treatment)
φ8 peel-off of alumite
(9) Heat sink for Full Brick ①
（HAF-10L）
Dimensions: 116.8(W) x 61(D) x 25.4(H) mm
Modules to be applied to: PAF series, PFE-SA series
[Appearance diagram] Material: Alminium (black alumite
treatment)
φ8 peel-off of alumite
[Cooling characteristics]
(Natural air cooling) Thermal resistance: Approximately 2.2 (℃ /W)
[Cooling characteristics]
(Natural air cooling) Thermal resistance: Approximately 3.4 (℃ /W)
(Forced air cooling)
Thermal resistance between heat sink and air
θ hs - a (℃ /W)
Thermal resistance between heat sink and air
θ hs - a (℃ /W)
2.5
2.0
1.5
1.0
0.5
0.0
0.1
Power module
Application notes
(Forced air cooling)
2.5
1.0
Average wind speed [m/s]
10.0
Figure 2-8 Thermal resistance cahracteristc in relation to
wind speed for the heat sink prepared for [HAH-15L]
・All specifications are subject to change without notice.
2.0
1.5
1.0
0.5
0.0
0.1
1.0
Average wind speed [m/s]
10.0
Figure 2-9 Thermal resistance characteristic in relation to
wind speed for the heat sink prepared for [HAF-10L]
B-379
Application notes
(10) Heat sink for Full Brick ②
（HAF-15L）
(11) Heat sink for Full Brick ③
（HAF-15T）
[Appearance diagram] Material: Alminium (black alumite
treatment)
[Appearance diagram] Material: Alminium (black alumite
treatment)
Dimensions: 116.8(W) x 61(D) x 38.1(H) mm
Modules to be applied to: PAF series, PFE-SA series
Dimensions: 116.8(W) x 61( Ｄ ) x 38.1( Ｈ ) mm
Modules to be applied to: P
AF series, PFE-SA series
φ8 peel-off of alumite
φ8 peel-off of alumite
[Cooling characteristics]
(Natural air cooling) Thermal resistance: Approximately 1.5 (℃ /W)
(Forced air cooling)
(Forced air cooling)
2.5
2.5
Thermal resistance between heat sink and air
θ hs - a (℃ /W)
Thermal resistance between heat sink and air
θ hs - a (℃ /W)
Power module
Application notes
[Cooling characteristics]
(Natural air cooling) Thermal resistance: Approximately 1.9 (℃ /W)
2.0
1.5
1.0
0.5
0.0
0.1
1.0
10.0
Average wind speed [m/s]
Figure 2-10 Thermal resistance cahracteristc in relation to
wind speed for the heat sink prepared for [HAF-15L]
B-380
2.0
1.5
1.0
0.5
0.0
0.1
1.0
Average wind speed [m/s]
10.0
Figure 2-11 Thermal resistance cahracteristc in relation to
wind speed for the heat sink prepared for [HAF-15T]
・All specifications are subject to change without notice.
Application notes
（12）Heat sink for PFE500F（HAL-F12T）
Dimensions：122（W）× 35（Ｈ）× 69.9（Ｄ）mm
Modules to be applied to：PFE500F
（13）Heat sink for PFE1000F（A）
（HAM-F10T）
Dimensions：160（W）× 33.4（Ｈ）× 100（Ｄ）mm
Modules to be applied to：PFE1000F, PFE1000FA
［Appearance diagram］Material：Alminiuum（Non-surface treatment）
［Appearance diagram］Material：Alminiuum（Non-surface treatment）
CL
CL
160.0
4-
148.5
Ø
122.0
5
3.
4Ø
100.0
88.5
59.7
69.9
5
3.
111.8
R0
.5
P3.5x28= 98.0
P4x34= 136.0
R0
.5
8.0
33.4
R0
.5
4.5
5
0.
35.0
R
1.2
1.8
［Cooling characteristics］
〈Natural air cooling〉Thermal resistance：0.78（℃ /W）
〈Forced air cooling〉Refer to chart below.
（Forced air cooling）
1.2
Power module
Application notes
Thermal resistance
（℃/W）
between heat sink and air θ hs-a
［Cooling characteristics］
〈Natural air cooling〉Thermal resistance：0.97（℃ /W）
〈Forced air cooling〉Refer to chart below.
1.0
0.8
HAL-F12T
0.6
0.4
HAM-F10T
0.2
0.0
0.1
0.2 0.3 0.5 0.7 1
2
3
5
7 10
Air Velocity（ m / s ）
When using, please make a hole in the center of a heatsink, and confirm base plate temperature of PFEs.
・All specifications are subject to change without notice.
B-381
Application notes
（14）Heat sink For 1/4 Brick（HAQ-10T）
Dimensions : 57.9
（W）
×25.4
（H）
×36.8
（D）
mm
Module to be applied to : CN30A110, CN50A110, CN100A110, CN50A24, CN100A24
PH50A280, PH75A280, PH100A280, PH150A280
±0.3
±0.2
±0.2
±1.0
36.8
57.9
49.7
φ8 peel-off of almite
28.0
［Appearance diagram］Material：Alminium（black alumite treatment）
φ
33.
6.9×5=34.5
5
25.4 ±1.0
6-R0.75
3.5
12-R0.5
2.0
0.1
［Cooling characteristics］
（Natural air cooling）Thermal resistance : Approximately 7.5（℃ /W）
（Forced air cooling）
6
Thermal resistance between heat sink and air
θhs-a（℃/W）
Power module
Application notes
7
5
4
3
2
1
0
0.1
B-382
1.0
Average wind speed［m/s］
10.0
・All specifications are subject to change without notice.
Application notes
3. Power module mounting method
Mount the power module onto the printed circuit by
following the instructions in Figure 1-1.
M3 screw
Spring washer
Plain washer
Heat sink
Grease for discharging heat
Power module
M3 mounting tap
Printed circuit board
Plain washer
Spring washer
M3 screw
Figure 1-1 Mounting printed circuit board and heat sink
(1) Fastening method
Use the M3 mounting taps on the side of the plastic case (the side with input/output terminal pins)
to mount the power module to the printed circuit.
(The number of the mounting taps is either 2 or 4,
which depends on the package size.) The recommended screw-tightening torque is 0.54Nm.
(3) Mounting holes on printed circuit board
Decide the diameters of holes/lands on the printed circuit board by referring to the respective sizes
shown below.
Types
PH50 PAH/PAF
CN30PH300S PH600S
PAH75D
CN200A
PH300F
/PFE
CN100A
Input terminal pin φ 2.0mm
←
←
φ 1.0mm
←
φ 1.0mm
←
Hole diameter φ 2.5mm
←
←
φ 1.5mm
←
φ 1.5mm
←
Land diameter φ 5.0mm
←
←
φ 3.5mm
←
φ 2.5mm
←
Output terminal pin φ 2.0mm
←
□ 0.08in φ 2.0mm φ 1.0mmφ 1.5mmφ 2.0mm
Hole diameter φ 2.5mm
←
□ 2.8mm φ 2.5mm φ 1.5mmφ 2.0mmφ 2.5mm
Land diameter φ 5.0mm
←
□ 5.0mm φ 5.0mm φ 3.5mmφ 3.5mmφ 5.0mm
Signal terminal pin φ 0.6mmφ 0.8mm
←
φ 1.0mm
←
φ 1.0mm
←
Hole diameter φ 1.0mmφ 1.2mm
←
φ 1.5mm
←
φ 1.5mm
←
Land diameter φ 2.0mmφ 2.4mm
←
φ 3.5mm
←
φ 2.5mm
←
Mounting tap (FG)
←
←
←
←
←
←
Hole diameter φ 3.5mm
←
←
←
←
←
←
Land diameter φ 7.0mm
←
←
←
←
←
←
M3
For locations of holes, refer to the appearance diagram of each module.
・All specifications are subject to change without notice.
(5) Output pattern width
Regarding the output pattern, when a current of
from several to dozens of amperes flows here, if
the board pattern width is too thin, the voltagae
drops and this causes the board to be heated. The
relationship between current and pattern width varies depending on the board material, thickness of
conductor, and increase of allowed temperature of
pattern, etc. An example in the case with the glass
epoxy board and 35 μ m copper foil thisckness is
shown in Figure 1-2.
For example, to assure the condition that 5A of current flows while the rise in temperature is kept within 10℃ , the pattern width should be 4.2mm or over
for 35 μ m copper foil thickness. (In general, "1mm/
A" can be noted as a reference.)
Also note that the characteristics shown in Figure
1-2 are merely an example and differ depending on
the board manufacturer. Be sure to check for each
case in designing.
14
60℃
12
40℃
10
8
20℃
6
10℃
Power module
Application notes
(2) M3 mounting taps
The M3 mounting taps on the power module are
connected to the base plate. Connection to FG
(frame ground) should be made by using the M3
mounting taps.
(4) Recommended material of printed circuit board
Regarding material of board, the double-sided
through hole glass epoxy board is recommended
(thickness to be 1.6mm or more, copper foil thickness to be 35 μ m or more).
Current (A)
3 - 1 Board mounting method
4
2
0
1
2
3
4
5
Width of conductor
Figure 1-2 Characteristics of the relationship between current capacity and width of conductor, for 35 μ m copper
foil thickness
3 - 2 Heat sink mounting method
(1) Fastening method
Use the M3 mounting taps on the base plate side
to mount the heat sink to the power module. (The
number of the mounting taps is either 2 or 4, which
depends on the package size.)
The recommended screw-tightening torque is
0.54Nm.
When mounting the heat sink, be sure to use
grease or sheet for discharging heat between the
heat sink and the base plate, in order to reduce
contact thermal resistance and enhance efficiency
in discharging heat. Also, be sure to use a heat sink
B-383
Application notes
which does not have warpage, so that the base
plate and the heat sink make contact firmly.
(2) Mounting holes on heat sink
Decide the diameter of the mounting holes on the
heat sink by referring to the sizes shown below.
Hole diameter: φ 3.5mm
3 - 3 About vibration resistance
The specification value of vibration resistance for
the power module is the one in the condition where
only the power module is mounted onto the printed
circuit board.
If a large-size heat sink should be used, fasten the
heat sink not only to the power module but also to
the case of the device, in order for overload not to
be applied to the power module and the printed circuit board.
3 - 4 Recommended soldering conditions
Soldering should be conducted under the conditions shown below.
(1) Dip soldering
…………………260℃ , within 10 seconds
Pre-heat conditions
…………………110℃ , 30-40 seconds or less
(2) Soldering iron
…………………350℃ , within 3 seconds
3 - 5 Recommended cleaning conditions
Recommended cleaning conditions after soldering
are shown below. Consult us for cleaning methods
in conditions other than shown below.
Power module
Application notes
(1) Recommended cleaning fluid
- IPA (isopropyl alcohol)
(2) Cleaning method
Clean the unit with a brush so that the cleaning fluid does not intrude into inside of the power supply
unit. Also, be sure to dry the cleaning fluid.
B-384
web160708
・All specifications are subject to change without notice.