Product Specification IXD5118 Voltage Detector with Sense Input and Adjustable Delay FEATURES DESCRIPTION Accuracy ± 2% at VDF ≥ 1.5 V or ±0.03 V Low Power Consumption 0.4 μA (Detect at VIN = 1.0 V) 0.6 µA (Release at VIN = 1.0 V) Detect Voltage Range 0.8 V – 5.0 V in 0.1 V increments Operating Voltage Range 1.0 V – 6.0 V 0 Detect Voltage Temperature Drift ±100 ppm/ C Output Configuration CMOS (Version C) or Nchannel Open Drain (N Version) Adjustable Release Time 0 Operating Ambient Temperature - 40 + 85 C Packages : USP-4 and SOT-25 EU RoHS Compliant, Pb Free The IXD5118 are highly precise, low power consumption, CMOS voltage detectors, manufactured using laser trimming technology. Separated sense input allows the IXD5118 to monitor other voltage source and maintain the state of detection even if sense voltage falls to zero. The external capacitor connected to the CD pin allows adjusting of release delay time in a wide range. With low power consumption and high accuracy, this series is suitable for precision mobile equipment. The IXD5118 in ultra small packages are ideally suited for high-density PC boards. The IXD5118 is available in both CMOS and Nchannel open drain output configurations. This detector is available in USP-4 and SOT-25 packages. APPLICATIONS Microprocessor reset circuitry Memory battery back-up circuits Power-on reset circuits Power failure detection System battery life and charge voltage monitors TYPICAL APPLICATION CIRCUIT TYPICAL PERFORMANCE CHARACTERISTIC Output Voltage vs. Sense Voltage IXD5118C25AGR Ta = 250C Pull-up PS037301-0615 Resistor RPL used with N-channel output configuaration only PRELIMINARY 1 Product Specification IXD5118 ABSOLUTE MAXIMUM RATINGS PARAMETER Input Voltage Output Current CMOS Output Output Voltage N-channel Open Drain Sense Pin Voltage CD Pin Voltage CD Pin Current USP-4 Power Dissipation SOT-25 Operating Temperature Range Storage Temperature Range SYMBOL VIN IOUT RATINGS – 0.3 ~ +7.0 10 – 0.3 ~ VIN + 0.3 – 0.3 ~ +7.0 – 0.3 ~ +7.0 – 0.3 ~ VIN + 0.3 5.0 120 250 – 40 ~ + 85 – 55 ~ +125 VOUT VSEN VCD ICD PD TOPR TSTG UNITS V mA V V V mA mW 0 C C 0 All voltages are in respect to VSS ELECTRICAL OPERATING CHARACTERISTICS Ta = 25 0C PARAMETER SYMBOL Operating Voltage Detect Voltage VIN VDF Hysteresis Width VHYS Detect Voltage Line Regulation CONDITIONS ISS1 VSEN = VDF x 0.9 Supply Current23) ISS2 VSEN = VDF x 1.1 IOUT1 Output Current IOUT24) Detect Voltage Temperature Characteristics Sense Pin Resistance Delay Pin Resistance CD Pin Sink Current CD Pin Threshold Voltage Undefined Operation Detect Delay Time8) Release Delay Time9) ILEAK VSEN = 0 V, VDS = 0.5 V N-channel MOSFET VSEN = 6.0 V, VDS = 0.5 V P-channel MOSFET IXD5118Cxxx (P-channel) IXD5118Nxxx (N-channel) VTCD VUND4, 7) tDF0 tDR0 MAX. UNIT CIRCUIT 6.0 V V V %/V µA µA mA mA µA ppm/0C MΩ MΩ µA V V µs µs E-12) E-22) E-3 ±0.1 VIN = 1.0 V, VIN = 6.0 V VIN = 1.0 V, VIN = 6.0 V VIN = 1.0 V VIN = 2.0 V VIN = 3.0 V VIN = 4.0 V VIN = 5.0 V VIN = 6.0 V VIN = 1.0 V VIN = 6.0 V VSEN = VOUT = 0 V, VIN = 6.0 V, CD - open VSEN = VOUT = 6.0 V, VIN = 6.0 V, CD - open 0.1 0.8 1.2 1.6 1.8 1.9 0.4 0.4 0.8 0.9 0.7 1.6 2.0 2.3 2.4 2.5 -0.30 -1.0 1.0 1.0 1.6 1.8 -0.08 -0.70 -0.20 0.20 - 40 0C ≤ TOPR ≤ 85 0C RSEN5) RDEL6) ICD TYP. 1.0 VIN = 1.0 – 6.0 V Supply Current13) Leakage Current MIN. VDF(T) = 0.8 – 5.0 V1) VIN = 1.0 – 6.0 V IXD5118xxxA VIN = 1.0 – 6.0 V IXD5118xxxB 0.40 ± 100 VSEN = 6.0 V, VIN = 0 V VSEN = 6.0 V, VIN = 5.0 V, VCD = 0 V VIN = 1.0 V, VCD = 0.5 V VSEN = 6.0 V, VIN = 1.0 V VSEN = 6.0 V, VIN = 6.0 V VSEN = VIN = 0 1.0 V VIN = 6.0 V, VSEN = 6.0 0 V, CD - open VIN = 6.0 V, VSEN = 0 6.0 V, CD - open 1.6 0.4 2.9 E-4 2.0 200 0.5 3.0 0.3 30 30 2.4 0.6 3.1 0.4 230 200 NOTE: 1) 2) 3) 4) 5) 6) VDF(T) is a nominal detect voltage Please refer to the table named Voltage Chart Current to the sense resistor is not included IXD5118C version only It is calculated from the voltage value and the current value of the VSEN It is calculated from the voltage value of the VIN and the current value of the CD pin PS037301-0615 PRELIMINARY 7) 8) 9) Maximum VOUT voltage at VIN rising from 0V to 1.0V with the VIN pin connected to the VSEN pin Delay time from the moment, when VSEN = VDF to the moment, when VOUT = 0.6 V, at VSEN falling Delay time from the moment, when VSEN = VDF + VHYS to the moment, when VOUT = 5.4 V at VSEN rising 2 Product Specification IXD5118 ELECTRICAL OPERATING CHARACTERISTICS (CONTINUED) Voltage Chart SYMBOL NOMINAL VOLTAGE VDF(T) (V) 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5.0 E-11) E-2 E-3 E-4 DETECT VOLTAGE (V) HYSTERESIS RANGE (V) HYSTERESIS RANGE (V) SENSE RESISTANCE (MΩ) VDF VHYS VHYS MIN. 0.770 0.870 0.970 1.070 1.170 1.270 1.370 1.470 1.568 1.666 1.764 1.862 1.960 2.058 2.156 2.254 2.352 2.450 2.548 2.646 2.744 2.842 2.940 3.038 3.136 3.234 3.332 3.430 3.528 3.626 3.724 3.822 3.920 4.018 4.116 4.214 4.312 4.410 4.508 4.606 4.704 4.802 4.900 MAX. 0.830 0.930 1.030 1.130 1.230 1.330 1.430 1.530 1.632 1.734 1.836 1.938 2.040 2.142 2.244 2.346 2.448 2.550 2.652 2.754 2.856 2.958 3.060 3.162 3.264 3.366 3.468 3.570 3.672 3.774 3.876 3.978 4.080 4.182 4.284 4.386 4.488 4.590 4.692 4.794 4.896 4.998 5.100 MIN. 0.015 0.017 0.019 0.021 0.023 0.025 0.027 0.029 0.031 0.033 0.035 0.037 0.039 0.041 0.043 0.045 0.047 0.049 0.051 0.053 0.055 0.057 0.059 0.061 0.063 0.065 0.067 0.069 0.071 0.073 0.074 0.076 0.078 0.080 0.082 0.084 0.086 0.088 0.090 0.092 0.094 0.096 0.098 MAX. 0.066 0.074 0.082 0.090 0.098 0.106 0.114 0.122 0.131 0.085 0.147 0.155 0.163 0.171 0.180 0.188 0.196 0.204 0.212 0.220 0.228 0.237 0.245 0.253 0.261 0.269 0.277 0.286 0.294 0.302 0.310 0.318 0.326 0.335 0.343 0.351 0.359 0.367 0.375 0.384 0.392 0.400 0.408 MIN. 0 RSEN MAX. 0.008 0.009 0.010 0.011 0.012 0.013 0.014 0.015 0.016 0.017 0.018 0.019 0.020 0.021 0.022 0.023 0.024 0.026 0.027 0.028 0.029 0.030 0.031 0.032 0.033 0.034 0.035 0.036 0.037 0.038 0.039 0.040 0.041 0.042 0.043 0.044 0.045 0.046 0.047 0.048 0.049 0.050 0.051 MIN. TYP. 10 20 13 24 15 28 NOTE: 1) When VDF(T) ≤ 1.4 V, the detection accuracy is ±30mV; when VDF(T) ≥ 1.5 V, the detection accuracy is ±2%. PS037301-0615 PRELIMINARY 3 Product Specification IXD5118 PIN CONFIGURATION USP-4 (BOTTOM VIEW) SOT-25 (TOP VIEW) PIN ASSIGNMENT PIN NUMBER SSOT-24 USP-4 1 1 5 2 4 3 3 4 2 5 PIN NAME VOUT CD VSEN VIN VSS FUNCTIONS Output Voltage (Detect “LOW”) Delay Capacitor Connection Sense Voltage Input Power Input Ground (USP-4 uses power dissipation pin as a Ground pin) BLOCK DIAGRAMS IXD5118CxxA IXD5118NxxA IXD5118CxxB IXD5118NxxB Diodes inside the circuits are ESD protection diodes and parasitic diodes. PS037301-0615 PRELIMINARY 4 Product Specification IXD5118 BASIC OPERATION Operation of the IXD5118 in a typical application circuit is exlained by the timing diagram shown below. At initial state, the sufficiently high voltage (6.0 V MAX.) applies to the sense pin, and the delay capacitor CD is charged to the power supply input voltage (1.0V ≤ VIN ≤ 6.0 V). While the sense pin voltage (VSEN) starts dropping, the output voltage VOUT remains at “High” level equal VIN as long, as the detect voltage VSEN > VDF . (Output voltage “High” level is equal pull-up voltage for IXD518N version.) The sense pin voltage keeps dropping and becomes equal to the detect voltage (V SEN =VDF), Comparator (see Block Diagram) trips, a N-channel transistor M1 turns ON, discharging the delay capacitor CD, and the output voltage changes state to the “Low” level, equal VSS. The detect delay time tDF is defined as time from the moment, when VSEN = VDF to the moment, when VOUT changes state to “Low” level (tDF0, when the CD pin is open). The output voltage maintains at the “Low” level as long as the sense pin voltage is below the release voltage (VSEN< VDF +VHYS), and the delay capacitor CD remains discharged to the ground voltage level. When the sense pin voltage increases to the release voltage level (VSEN = VDF + VHYS), the N-channel transistor M1 turns OFF, and the delay capacitor CD start charging via a delay resistor RDEL. The CD pin voltage (VCD) continues rising up to the CD pin threshold voltage (VTCD), because the sense pin voltage is higher than the release voltage. The time constant of the CD pin voltage is = RDELCD, so the Release Delay Time (tDR) can be determined as tDR = -RDEL × CD × ln(1-VTCD/VIN) …(1) The Release Delay time can also be calculated with the formula (2), because RDEL = 2.0 MΩ (TYP.) and the delay CD pin threshold voltage is VIN /2 (TYP.) tDR = RDEL × CD × 0.69 …(2) As an example, presuming that the delay capacitance is 0.68 μF, tDR is : 6 -6 tDR =2.0 ×10 ×0.68 ×10 ×0.69 = 938 (ms) Note that the release delay time may be remarkably short, if the delay capacitor CD did not discharge to the ground (VSS) level, because of short time in state . When the CD pin voltage reaches threshold level (VCD = VTCD), the inverter will change state of the output. As a result, the output voltage changes into the “High” (VIN) state. While the sense voltage is higher than the detect voltage (VSEN > VDF), the delay capacitor charges up to the input voltage level. The output voltage maintains the “High” level equal VIN. PS037301-0615 PRELIMINARY 5 Product Specification IXD5118 Function Chart VSEN STATE L H CD STATE Any State L H Any State Release Delay Time Chart 1) VOUT TRANSITION Any L State L L H H 1) VOUT state is a function of VSEN and CD pins state. VIN should be above minimum operating value. DELAY CAPACITANCE RELEASE DELAY CD, μF TIME tDR (TYP.), ms 0.010 13.8 0.022 30.4 0.047 64.9 0.100 138 0.220 304 0.470 649 1.000 1380 Delay time is calculated using equation (2) TYPICAL CIRCUIT RELEASE DELAY TIME tDR (MIN. ~ MAX.), ms 11.0 ~ 16.6 24.3 ~ 36.4 51.9 ~ 77.8 110 ~ 166 243 ~ 364 519 ~ 778 1100 ~ 1660 APPLICATION IXD5118C IXD5118N LAYOUT AND USE CONSIDERATIONS 1. The IC may malfunction if absolute maximum ratings are exceeded. 2. 3. 4. 5. 6. 7. High impedance VIN power supply may cause IC malfunction, if VIN voltage falls below minimum operating level due current consumption, when IC output changes state. In addition, V OUT voltage at “High” state reflects every variations of VIN voltage. High impedance VIN power supply may cause IC oscillations, if VIN and VSEN pins are tied together and voltage drop at power supply’s internal resistance exceeds IC hysteresis. If VSEN threshold voltage is less than 1.0 V, VIN and VSEN pins should be separated, and VIN pin powered from power supply with voltage equal or above 1.0 V Note that a rapid and high amplitude fluctuation of the VIN pin voltage, as well as a power supply noise, may cause a wrong IC operation. The capacitor between VIN and GND pins should be used to minimize noise impact. When there is a possibility that VIN pin voltage may fall faster than CD capacitor’s discharge time, a Schottky barrier diode connected between the VIN and the CD pins should be used to prevent IC damage (see the Typical Application Schematic above). VOUT voltage In N channel open drain configuration depends on pull-up resistance, as well as on/off resistance of the M3 MOSFET (see block diagrams above). During detection, VOUT = VPULL / (1 + RPULL / RON), where VPULL is a pull up voltage and RON is a M3 on-resistance, which can be calculated as VDS / IOUT1 from electrical characteristics. For example: -3 To get VOUT ≤ 0.1V at detect state, with RON = 0.5/0.8×10 = 625 Ω (max) at VIN = 2.0 V and VPULL = 3.0 V, pull-up resistor value should be RPULL = (VPULL /VOUT - 1) × RON= (3 / 0.1-1) × 625 ≥ 18 kΩ . Note that decreasing VIN voltage increases RON resistance, so minimum expected VIN voltage should be used for calculations.. At releasing state VOUT = VPULL/(1 + RPULL / ROFF), where ROFF = VOUT/ILEAK = 15 MΩ (min) for M3 in off state. Therefore, in this case, pull-up resistor should be 6 RPULL = (VPULL/VOUT-1) × ROFF = (3/2.99 - 1) × 15 × 10 ≤ 50 kΩ to get VOUT ≥ 2.99 V at VPULL = 3.0 V. PS037301-0615 PRELIMINARY 6 Product Specification IXD5118 TEST CIRCUITS Circuit Circuit Circuit Circuit Circuit Circuit Circuit Circuit Circuit Pull-up Resistor RPL = 100 kΩ is used for IXD5118N version only PS037301-0615 PRELIMINARY 7 Product Specification IXD5118 TYPICAL PERFORMANCE CHARACTERISTICS (1) Supply Current vs. Input Voltage IXD5118C25Ax IXD5118C25Ax VSEN = 2.25 V VSEN = 2.75 V (2) Supply Current vs. Sense Voltage (3) Detect Voltage vs. Ambient Temperature IXD5118C25Ax IXD5118C25Ax VIN = 3.0 V VIN = 4.0 V (4) Detect Voltage vs. Input Voltage IXD5118C25Ax (5) Hysteresis Voltage vs. Ambient Temperature IXD5118C25Ax VIN = 4.0 V PS037301-0615 PRELIMINARY 8 Product Specification IXD5118 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (6) CD Pin Sink Current vs Input Voltage IXD5118C25Ax VSEN = 0 V, VDS = 0.5 V (8) Output Voltage vs. Input Voltage (7) Output Voltage vs. Sense Voltage IXD5118C25Ax Ta = 250C (9) Delay Resistance vs. Ambient Temperature IXD5118C25Ax IXD5118C25Ax VIN = VSEN = VPULL, RPULL = 100 kΩ VSEN = 6.0 V, VCD = 0 V, VIN = 5.0 V (10) Output Current vs. Input Voltage IXD5118C25Ax IXD5118C25Ax VDS = 0.5 V (N-channel) VDS = 0.5 V (P-channel) PS037301-0615 PRELIMINARY 9 Product Specification IXD5118 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (11) Release Delay Time vs Delay Capacitance (12) Detect Delay Time vs. Delay Capacitance IXD5118C25Ax IXD5118C25Ax Ta = 250C Ta = 250C (13) Leakage Current vs. Ambient Temperature (14) Leakage Current vs. Supply Voltage IXD5118C25Ax IXD5118C25Ax VIN = VSEN = 6.0 V, VOUT = 6.0 V VIN = VSEN = 6.0 V ORDERING INFORMATION IXD5118- DESIGNATOR DESCRIPTION Output Configuration Detect Voltage (VDF) Options -(*) Packages (Order Unit) SYMBOL C N 08 - 50 DESCRIPTION CMOS output N-channel open drain output Detect Voltage Range: 1.0 V~5.0 V, e.g. 1.2 V - = 1, = 2 A Hysteresis 5% B Hysteresis < 1% GR-G USP-4 (3000/Reel) MR-G SOT-25 (3000/Reel) NOTE: The “-G” suffix denotes Halogen and Antimony free as well as being fully RoHS compliant. PS037301-0615 PRELIMINARY 10 Product Specification IXD5118 PACKAGE DRAWING AND DIMENSIONS USP-4, Units: mm SOT-25, Units: mm USP-4 Reference Pattern Layout, Units: mm USP-4 Reference Metal Mask Design PS037301-0615 PRELIMINARY 11 Product Specification IXD5118 MARKING SOT-25, USP-4 Represents output configuration and integer number of the detect MARK L M N P R S IXD5118C VOLTAGE (V) 0.X 1.X 2.X 3.X 4.X 5.X MARK T U V X Y Z voltage range IXD5118N VOLTAGE (V) 0.X 1.X 2.X 3.X 4.X 5.X SOT-25 (Top View) Represents decimal number of the detect voltage MARK DETECT VOLTAGE (V) PRODUCT SERIES 3 0 x.3 x.0 IXD5118xx3xxx IXD5118xx0xxx USP-4 (Top View) Represents options MARK OPTIONS A B Built-in delay capacitance pin with hysteresis 5% (TYP.) Built-in delay capacitance pin with hysteresis less than 1% PRODUCT SERIES IXD5118xxAxx IXD5118xxBxx Represents production lot number 01 to 09, 10, 11, …, 99, 0A, …, 0Z, 1A, …repeated.(G, I, J, O, Q, W excluded) PS037301-0615 PRELIMINARY 12 Product Specification IXD5118 Customer Support To share comments, get your technical questions answered, or report issues you may be experiencing with our products, please visit Zilog’s Technical Support page at http://support.zilog.com. To learn more about this product, find additional documentation, or to discover other fac-ets about Zilog product offerings, please visit the Zilog Knowledge Base at http:// zilog.com/kb or consider participating in the Zilog Forum at http://zilog.com/forum. This publication is subject to replacement by a later edition. To determine whether a later edition exists, please visit the Zilog website at http://www.zilog.com. Warning: DO NOT USE THIS PRODUCT IN LIFE SUPPORT SYSTEMS. LIFE SUPPORT POLICY ZILOG’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF ZILOG CORPORATION. As used herein Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness. Document Disclaimer ©2015 Zilog, Inc. All rights reserved. Information in this publication concerning the devices, applications, or technology described is intended to suggest possible uses and may be superseded. ZILOG, INC. DOES NOT ASSUME LIABILITY FOR OR PROVIDE A REPRESENTATION OF ACCURACY OF THE INFORMATION, DEVICES, OR TECHNOLOGY DESCRIBED IN THIS DOCUMENT. ZILOG ALSO DOES NOT ASSUME LIABILITY FOR INTELLECTUAL PROPERTY INFRINGEMENT RELATED IN ANY MANNER TO USE OF INFORMATION, DEVICES, OR TECHNOLOGY DESCRIBED HEREIN OR OTHERWISE. The information contained within this document has been verified according to the general principles of electrical and mechanical engineering. PS037301-0615 PRELIMINARY 13