TENTATIVE AGENDA for
IPC’s PCB ADVANCED DESIGNER CERTIFICATION
Workshop and Exam
Day 1-Workshop
8:00 a.m.
REGISTRATION AND PRESESSION COFFEE BREAK
8:30 a.m.
INTRODUCTION TO DESIGNER CERTIFICATION
DESIGN CONSIDERATIONS
Sect-Pg#
1.1 - 4
1.2 - 19
1.3 - 23
1.4 - 29
2.7 - 118
Board Material Properties
Plating Characteristics for Conductors and Holes
Surface Finish Characteristics and Usage
Solder Mask/Coating Material Properties and Compatibility
Homogeneous Material Performance Capability
Refreshment Break
1.6 1.7 1.8 1.9 1.10 -
43
56
63
70
77
Assembly Test Implementation (Self Test, Functional, Nodal)
Test Point/Land Pattern Feature Differentiation
In-Process Test Coupons
Highly Accelerated Stress Testing Evaluations
Management Tools and Techniques for Product Quality Life Cycle Tracking
Lunch
PRINTED BOARD CHARACTERISTICS
4.2 2.1 2.2 2.3 2.4 2.5 -
193
86
90
93
98
107
Design Standards to meet Manufacturing and Assembly Goals
Fabrication Equipment Board Size Limitations
Printed Board Length to Width Relationships
Board from Panel Excising Requirements
Copper Balancing Effects on Printed Board Fabrication
Printed Board Thermal Management Requirements
Refreshment Break
2.6 2.8 3.3 4.3 4.4 4.8 4:30 p.m.
5:00 p.m.
114
123
149
199
205
230
Controlled Expansion Constructions Using Special Cores
Physical Board Dielectric Parameters
Non-Standard Mechanical Outline (Case) Integration
Individual Board Tooling Considerations
Panelization Strategy for Manufacturing Processes
Blind and Buried Via Strategy Development
QUESTIONS AND ANSWERS
ADJOURN
Day 2-Workshop
8:00 a.m.
PRESESSION COFFFEE BREAK
8:30 a.m.
RECAP OF FIRST DAY
LAYOUT PRINCIPLES
Sect-Pg#
4.5 - 209
4.6 - 215
4.7 - 222
4.9 - 237
Electrical Clearance and Dielectric Spacing
Power and Ground Routing Techniques
Conductor Carrying Capacity vs. Temperature Rise
Layout Approaches for Cross Talk Minimization
Refreshment Break
LAYOUT PRINCIPLES (Continued)
4.10
1.5
4.11
4.12
-
244
37
250
260
Shielding Requirements to Prevent Signal Emissions
Test Evaluations for EMI Emission/Susceptibility
General Principles of Impedance Control
Signal Integrity Analysis
Lunch
COMPONENT AND ASSEMBLY ISSUES
3.1 3.2 3.4 3.5 3.6 -
131
139
156
163
170
Component Comparison Between Area Array and Peripherals
Component Mounting Strategies
Component Mounting Shock and Vibration Requirements
Evaluation of Attachment Methods (Solder, Adhesive, etc.)
Component Assembly Strategy and Sequence Analysis
DIMENSIONING AND DOCUMENTATION
4.1 5.1 5.2 5.3 3.7 4:30 p.m.
5:00 p.m.
189
268
280
288
179
Material List Development
Printed Board Tolerance Analysis (Manual vs. Automation Evaluation)
Document Segmentation to Facilitate Design to Fabrication Interface
Standardization of Data Formats for Printed Board & Assembly
Tools and Techniques for Assembly, Repair & Modification
QUESTIONS AND ANSWERS
ADJOURN
Day 3-Exam
8:30 a.m.
CERTIFICATION TESTING – Test Booklet (120 questions)
11:00 a.m.
ALOTTED EXAM TIME ENDS
12:00 p.m.
REVIEW OF EXAMINATION
1:00 p.m.
ADJOURNMENT
TIMES ARE APPROXIMATE
Please note that this agenda is tentative and time spent on topics may vary.
*Coffee/Refreshment Breaks at approximately 10:00 a.m. and 3:15 p.m. on first two days.
*Break for lunch 12:30 p.m. to 1:30 p.m. (Reminder: You will be on your own for lunch).
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