Chip on board – Wire Bonding
Design Rules
Design Rules for
Aluminium (Al) wire bonding
Chip pad to substrate pad
orientation is parallel.
Chip Pad x/y: > 80 µm
Die
(Chip)
solder mask
space ≥ 100 μm
substrate pad width ≥ 150 μm
substrate pad length
300 μm
chip to substrate pad
1.5 x chip thickness
Design Rules for
Gold (Au) wire bonding
Al wires can be bonded at any angle
between chip pad to substrate pad.
Chip pad to substrate pad
must be aligned in the same
direction.
Chip Pad x/y: > 80 µm
Die
(Chip)
solder mask
space ≥ 100 μm
substrate pad width ≥ 150 μm
chip to substrate pad
1.5 x chip thickness
substrate pad length
300 μm
The solder mask must be
released as block in the area
of the bond pads
www.we-online.com
DIENECK ARPRINZEN 0215.FLY
Chip pad and substrate pad have the same alignment with gold wire bonding
Würth Elektronik Schopfheim
GmbH & Co. KG
Circuit Board Technology
An der Wiese 1
79650 Schopfheim · Germany
Tel. +49 7622 397-0
Fax +49 7622 397-122
cbt@we-online.de
Version 1.1