EOS/ESD Symposium for Factory Issues
October 10-11, 2016
EOS/ESD Factory Symposium in Finland-Tutorials
Simonkentta Scandic Hotel, Helsinki, Finland
October 12-14, 2016
EOS/ESD Factory Symposium in Finland
Tallink Ferry (Roundtrip Helsinki - Stockholm) Helsinki, Finland
EOS/ESD Association, Inc. and STAHA, the Finish ESD Association, are organizing the 2nd European EOS/ESD Symposium for
Manufacturing Issues on the ferry between Helsinki (Finland) and Stockholm (Sweden). This is the first time that both organizations
are cooperating to hold a Symposium that is not touching the topics of on-chip protection or device testing problems but solely
focusing on protection issues during handling, assembly, testing, and transport. Since production people often have difficulties to
get long distance travels approved this event is brought to the factories. To make it a European event, other independent ESD
associations from Europe are helping to set this event up.
•
EOS/ESD Association, Inc. develops, administers, and
maintains the EOS/ESD Association, Inc. Program
Manager Professional Certification.
•
EOS/ESD Association, Inc. instructors develop ANSI/
ESDA and IEC standards and bring you today’s current
information and developments.
https://www.esda.org/events/eosesd-factory-symposium/finland/
Co-Sponsored by:
Setting the Global Standards for Static Control!
EOS/ESD Association, Inc. 7900 Turin Rd., Bldg. 3 Rome, NY 13440-2069, USA
PH +1-315-339-6937 • Email: info@esda.org • www.esda.org
25 July 2016 9:27 AM
EOS/ESD Factory Symposium in Finland-Tutorials
Simonkentta Scandic Hotel, Helsinki, Finland
ESD Basics
OCT 10, 2016 • 9:00 AM - 12:30 PM
Instructor: Toni Viheriakoski, Cascade Metrology
This talk will discuss the Fundamental causes of ESD and its control. It includes how ESD impacts industry, with brief
explanations of charge generation, field measurement, the role of capacitance and voltage, charge measurement, and
charge decay. Device failure mechanisms, including the respective test models like Human Body Model or Charged
Device Model, will also be explained. Will discuss how to protect ESD sensitive devices and assemblies, give definitions of an Electrostatic Protected Area (EPA), and show how to assess the risk in an automated production line.
Toni Viheriaekoski began his electrostatic career while employed by Nokia Networks between 1986 and 2007. During this period, he
established calibration and electrostatics laboratory services for Nokia. He completed his technical supervisor studies in information
technology in 1994. He was a chair of measuring methods working group of Finnish STAHA Association technology program in 2001
and 2002. He received iNARTE ESD Engineer certification in 2004. Toni transferred to Nokia Siemens Networks in April 2007 where
he continued his work as an electrostatics specialist and senior sourcing engineer until he moved on to his own company, Cascade
Metrology, which was previously established in 2005. Currently, he is working in the field of electrostatics and ESD risk assessment for
electronics, automotive and chemical industries. Toni has written more than 20 publications related to electrostatics or ESD. He has been
a chair of Finnish STAHA Association since 2006. He is a member of Finnish Standardization Committee SK101 and WG5 of IEC TC101.
Process Assessment
OCT 10, 2016 • 1:30 PM - 5:00 PM
Instructor: Reinhold Gaertner, Infineon Technologies
This Tutorial describes the measurement techniques that are needed for elements of ESD control programs. This covers
measurement methods for compliance verification, product qualification, and trouble-shooting. These techniques will be
demonstrated by actual measurements on materials and products. The seminar ends with an overview of risk analysis and
trouble-shooting methodologies applied to actual field problems.
Reinhold Gaertner received his diploma in physics from the Technical University of Munich in 1987. Then he joined the Federal Armed Forces University Munich, where he was working on measurement techniques for ESD protective packaging materials. After working as an independent ESD
consultant, he joined Siemens Semiconductors in 1996; which is now Infineon Technologies. He is responsible for all problems regarding external
ESD protection at Infineon worldwide and also for problems in customer production, as well as for ESD device testing for qualification. Since 1989,
he has lectured on static control and since 1991, he has been an active member of the German ESD Association, where he has been acting as vice
president for the last couple of years. Since 1995, he has worked in the ESD standardization of IEC TC101, where he is currently convener of two
working groups (static decay and device testing). In 2009, he received the outstanding contribution award of the ESDA and in 2011 he joined the
ESDA board of directors.
ANSI/ESD S20.20 - Process Design Overview
OCT 11, 2016 • 9:00 AM - 5:00 PM
Instructor: John Kinnear, IBM
This overview provides instruction on designing and implementing an ESD control program based on ANSI/ESD S20.20.
The course provides participants with the tools and techniques to help with the selection of the ESD controls that are appropriate for the devices to be handled.
The following topics are covered
• ANSI/ESD S20.20 Administrative Requirements
• Grounding/Bonding Systems
• Personal Grounding • ESD Controls for the EPA • Packaging Requirements
John Kinnear is an IBM Senior Engineer specializing in process & system technology, and facility certification in accordance with ANSI/ESD
S20.20. He has been the ESD Site Coordinator for the Poughkeepsie site since 1989 and is currently the ESD Coordinator for IBM. As a member
of the ESD Association since 1990, John has served in several Standards Development Committees. John is the appointed Technical Adviser
to the United States National Committee/IEC Technical Committee 101, where he represents the United States to the International Electrotechnical Commission (IEC). As Chair of the ESDA’s Facility Certification (ANSI/ESD S20.20) development program, John coordinated the initial
development of Lead Assessor training, ISO Registrar Certification and witness audits. John has served as ESD Association Vice President,
Senior Vice President and President. He has also served as past General Chairman of the 2004 EOS/ESD Symposium. For his contributions to
the ESD Association John was presented with the Joel Weidendorf Award for Standards in 2005, the Outstanding Contribution Award in 2006,
and the President’s Award in 2010. John has presented many papers both internal to IBM and at external conferences. He participates as an
instructor for the Program Management series and has presented tutorials in North America and Asia. John also holds patents in the industry.
https://www.esda.org/events/eosesd-factory-symposium/finland/
Setting the Global Standards for Static Control!
EOS/ESD Association, Inc. 7900 Turin Rd., Bldg. 3 Rome, NY 13440-2069, USA
PH +1-315-339-6937 • Email: info@esda.org • www.esda.org
25 July 2016 9:27 AM
EOS/ESD Factory Symposium in Finland
Tallink Ferry (Roundtrip Helsinki - Stockholm) Finland
Schedule
Wednesday, October 12, 2016 (Local Time - Finland)
10:30-11:30Registration
11:00-12:00Boarding
12:00-13:00Lunch
13:00-13:30 Opening - Welcome
13:30-13:55 Technical Presentation 1
Electrostatic Issues Case Study
David E. Swenson,
Affinity Static Control Consulting, LLC
13:55-14:20 Technical Presentation 2
Evaluation and Analysis of Results of the
PTB Ex Proficiency Testing Program
“Electrostatic Charge – Test Round 2015”
Lisa Zater, Tim Krause, Jia Wu,
Physical-Technical Insitute (PTB)
14:20-14:45 Technical Presentation 3
“What Type of Material is Inherently
Dissipative Polymer?”
Jukka Hillberg, IonPhasE Oy
14:45-15:15
BREAK - Exhibits Open
15:15-16:00
Invited Talk A
Industry Council WP4 - EOS
Reinhold Gaertner, Infineon Technologies
16:00-16:45
BREAK - Exhibits Open
16:45-17:10 Technical Presentation 4
Optimal Plastic for ESD Packaging
Does it Exist?
Eira Kärjä, Premix Oy
17:10-17:35 Technical Presentation 5
A Comparison of Surface Resistance
Test Methods
Jeremy Smallwood, Electrostatic Solutions Ltd.
17:35-18:00 Technical Presentation 6
Electrostatic Field Decay and Charge
Decay of Slowly Dissipative Materials
Toni Viheriäkoski, Cascade Metrology;
Eira Kärjä, Premix Oy; Jukka Hillberg,
Ion PhasE; Pasi Tamminen, Tampere
University of Technology
18:00-19:30 End of Day Networking
19:30-21:00DINNER
Thursday, October 13, 2016 (Local Time - Sweden)
7:00-9:15Breakfast
9:15-9:30 Opening
9:30-9:55
Technical Presentation 7
Comparative Measurements of Two ESD
Swivel Chairs with Different Castors and
Glides Used on Different ESD-Flooring
Systems
Jürgen Speicher, Wolfgang Warmbier,
GmbH & Co. KG
Thursday, October 13, 2016 continued
9:55-10:35
Invited Talk B
Practical Current and Charge Measurements
of CDM Type Discharges in Electrostatic
Discharge Protected Area
Pasi Tamminen, Tampere University of
Technology; Jeremy Smallwood,
Electrostatic Solutions Ltd.
10:35-11:00
BREAK - Exhibits Open
11:00-12:00
Technical Presentation 8
Conducted EMI Measurements in
Manufacturing Environment and EMI
Caused EOS Sources in Automated
Equipment
Vladimir Kraz, OnFILTER, INC.
12:00-13:00LUNCH
13:00-13:25 Technical Presentation 9
Measuring Electrostatics Inside Production
Machines in Operation
Thomas Sebald, ESTION Technologies GmbH
13:25-13:50 Technical Presentation 10
EOS Damage During Wafer Cleaning –
a Case Study
Stefan Seidl, Reinhold Gaertner,
Friedrich zur Nieden, KK Ng, KP Yan,
Infineon Technologies
13:50-14:15 Technical Presentation 11
Electrostatic Shock Risks in Assembly of
Large Wind Turbine Blades
Jörg Thürmer, EPA Design & Control;
Jeremy Smallwood, Electrostatic Solutions Ltd.
14:15-14:45
BREAK - Exhibits Open
14:45-15:10 Technical Presentation 12
ESD in Industry – Past, Present, and Future
Jeremy Smallwood, Electrostatic Solutions Ltd.
15:10-15:35 Technical Presentation 13
The Innovative Use of Humid Air in Static
Control Applications
Albert Kow, Kek Hing, ESD Consultancy Sdn. Bhd.
15:35-16:15 Invited Talk C
EOS in Automotive Industry
Reinhold Gaertner, Infineon Technologies
16:15-16:45BREAK
16:45-18:15Workshop Ultra ESD Sensitive Electronics
- How to Implement an Efficient ESD
Protection
18:15-18:30
Wrap up
18:30-19:30
End of Day Networking
19:30-21:00DINNER
Friday, October 14, 2016 (Local Time - Finland)
7:00-9:30Breakfast
9:55
Dock at harbor
10:30
Checkout
EOS/ESD Factory Symposium in Finland
Tallink Ferry (Roundtrip Helsinki - Stockholm) Finland
Invited Talks
Technical Presentations
Industry Council WP4 - EOS
Reinhold Gaertner, Infineon Technologies
Electrical Overstress (EOS) is one of the main issues with respect to electrical failures in the field. In the past the solution of
EOS problems has been hindered by misinterpretations of the issues due to vague use of terms EOS, EOS event, or EOS failure,
etc., resulting in insufficient supplier-to-customer and customerto-supplier communication. There was no common understanding of responsibilities between IC supplier and customer on who
should do what to improve the situation. The Industry Council
on ESD Target levels has published a White Paper on this topic
where they defined an EOS event as an excess of a specified
absolute maximum rating (AMR) and where they demanded a
clear communication between all parties involved based on accurate definition of terms. The presentation will summarize the
most important facts of the White Paper and describe an EOS
analysis procedure with contributions by supplier and customer.
Electrostatic Issues Case Study
David E. Swenson, Affinity Static Control Consulting, LLC
In the past several years, a number of interesting electrostatic issues
have been addressed including: an unintentional creation of 100,000+
Leyden Jars, excessive charging in a paper towel dispenser (enough
to shut off dispensing motor), and fire/explosion investigation in a pyrotechnics facility. Each of the case studies will be presented in a general
overview form along with the results of the investigations that led to
mitigation or at least an understanding of the electrostatic issues to
avoid repeating the problems.
Invited Talk A
Invited Talk B
Practical Current and Charge Measurements of CDM
Type Discharges in Electrostatic Discharge Protected
Area
Pasi Tamminen, Tampere University of Technology; Jeremy
Smallwood, Electrostatic Solutions Ltd.
Charged device model (CDM) withstand voltages obtained
in CDM qualification testers cannot be linked directly to real
ESD risks in ESD protected areas. This presentation shows
selected results of the ERC project where the target is to
seek practical evaluation and measurement methods for
correlation with CDM and charged device ESD events in
manufacturing environment.
Invited Talk C
EOS in Automotive Industry
Reinhold Gaertner, Infineon Technologies
The most numerous source of returns of parts sent back to suppliers for failure analysis are those that eventually are closed with
Electrical Overstress (EOS) as a root cause. The process to determine the underlying root cause and owner for the EOS event
is very challenging and time consuming. The success rate finding
a possible event depends on information sharing and a close cooperation between the different tier levels and OEM. A common
expectation and misperception in the industry is to determine the
exact EOS event based on the observed damage signature on
silicon chip level.
During the last couple of months 3 companies from each of 3 tier
levels (OEM, TIER1 and Semiconductor supplier) have met at
USCAR and reviewed their struggling points and how to improve
them.
This presentation shows the actual status of this initiative that
introduces a two-step process to cover an improved up and down
information sharing within the value stream. Together with a systematic approach using applicable branches of the Fault Tree,
published in the Industry Council white paper 4, A working group
of the ESD Association and USCAR wants to provide a holistic
approach to focus on the right things and therefore be more efficient in the EOS root cause finding process.
Technical Presentation 1
Technical Presentation 2
Evaluation and Analysis of Results of the PTB Ex Proficiency
Testing Program “Electrostatic Charge – Test Round 2015”
Lisa Zater, Tim Krause, Jia Wu, Physical-Technical Insitute (PTB)
The IECEx System is a worldwide uniform testing and certification
scheme in the field of explosion protection. It is approved by numerous countries and is in steady growth. To ensure worldwide quality and
homogeneity in the field of explosion protection, not only uniform rules
in the form of IEC standards but also the active participation in interlaboratory comparisons is necessary.
The presentation will show the evaluation and analysis of the participant’s results as well as the overall outcome of the program “Electrostatic Charge - Test Round 2015”.
Technical Presentation 3
What Type of Material is Inherently Dissipative Polymer?
Jukka Hillberg, IonPhasE Oy
• Terminology
• How IDP works?
• Differences to other static control materials
• Applications and benefits
• How to be cost effective with IDP’s?
• How to evaluate static control properties?
• Environmental aspects
Technical Presentation 4
Optimal Plastic for ESD Packaging-Does it Exist?
Eira Kärjä, Premix Oy
• Adding electrical conductivity into polymers
• The optimal plastic material for ESD packaging
• Comparison of different conductive fillers. Case: PP-compounds
for ESD boxes
• Electrostatic discharge attenuation of electrically conductive and
static dissipative carbon black compounds
• Other characteristics of carbon black compounds
Technical Presentation 5
A Comparison of Surface Resistance Test Methods
Jeremy Smallwood, Electrostatic Solutions Ltd.
Surface resistance test methods are used for a variety of purposes in
industry including evaluation of resistive materials for electrostatic ignition risk, ATEX qualification and characterization of materials for use in
electronic manufacturing electrostatic Protected Areas. Several standard test methods exist for these purposes. These include conductive
rubber faced concentric ring electrodes (IEC61340-2-3 and ANSI/ESD
STM11.11), a miniature point-to-point electrode (IEC 61340-2-3 and
ANSI/ESD STM11-13) and painted lines or conductive rubber strips
applied to the surface (IEC 60079-32-2). Many of these should in principle give similar results.
EOS/ESD Factory Symposium in Finland
Tallink Ferry (Roundtrip Helsinki - Stockholm) Finland
Technical Presentation 6
Electrostatic Field Decay and Charge Decay of Slowly Dissipative Materials
Toni Viheriäkoski, Cascade Metrology; Eira Kärjä, Premix Oy;
Jukka Hillberg, Ion PhasE; Pasi Tamminen, Tampere University of
Technology
The presentation will be based on the technical paper of symposium
2016 “Charge Relaxation of Slowly Dissipative Polymers”. However,
the focus of the factory symposium presentation will be more on the
measurement techniques.
Technical Presentation 7
Technical Presentation 11
Electrostatic Shock Risks in Assembly of large Wind Turbine
Blades
Jörg Thürmer, EPA Design & Control; Jeremy Smallwood, Electrostatic Solutions Ltd.
Electrostatic shocks were reported by personnel manufacturing
large fibre reinforced plastic wind turbine blades. Inspection and
measurements confirmed these reports. We have estimated the
possible discharge energy and likelihood of hazardous ESD in
some production steps. Administrative and technical recommendations are given to control static to an acceptable level.
Comparative Measurements of Two ESD-Swivel Chairs with Different Castors and Glides Used on Different ESD-Flooring Systems
Jürgen Speicher, Wolfgang Warmbier, GmbH & Co. KG
In the revision of the current IEC 61340-5-1 Edition 1.0 (2007-08),
the limit value of the resistance to ground for “seating” shall be reduced for the “product qualification” and in the “compliance verification” from 1010 ohm to 109 ohm. Due to these circumstances problematic situations during the process of “compliance verification” in
order to comply with this new limit of 1 GΩ might occur. The paper documents the measurement results of two typical ESD swivel
chairs with different castors and glides on different flooring systems.
Based on these test results, there are conclusions and recommendations in order to ensure an optimal function of ESD swivel chairs
on ESD flooring.
Technical Presentation 12
Technical Presentation 8
The Innovative Use of Humid Air in Static Control Applications
Albert Kow Kek Hing, ESD Consultancy Sdn. Bhd.
This paper presents the four (4) levels of uses of the Humidity Control Device (HCD) to achieve targeted ESD control objectives. The
innovative use of humid air described herewith is a further technical disclosure to the papers presented in the Singapore (2012),
Germany (2013) and Korea (2015) ESD Symposiums.
Conducted EMI Measurements in Manufacturing Environment
and EMI-Caused EOS Sources in Automated Equipment
Vladimir Kraz, OnFILTER, INC.
This paper describes basics of measurement of conducted EMI in
manufacturing environment and EMI diagnostics
Due to limitations of time the focus is made on practical aspects of
measurements, not on theoretical foundation.
• What is EOS and its importance
• EMI as a significant cause of EOS
• How does EMI turn into EOS
• EMI sources in automated equipment
• Acceptable EMI limits
• Mitigation of EMI-caused EOS
Technical Presentation 9
Measuring Electrostatics Inside Production Machines in Operation
Thomas Sebald, ESTION Technologies GmbH
• Challenges on testing electrostatics in process tools
• Example of an in situ electrostatic monitoring photomask
• Different kind of electrostatic monitoring systems along the
value chain of the electronics industry
Technical Presentation 10
EOS Damage During Wafer Cleaning – a Case Study
Stefan Seidl, Reinhold Gaertner, Friedrich zur Nieden, KK Ng, KP
Yan, Infineon Technologies
An investigation was carried out on the charging voltage of deionized (DI) water during wafer cleaning after the wafer sawing process,
since it was supposed to be the root cause for EOS failures during semiconductor production. The charging voltage was measured
using a non-contact electrostatic field meter. It was found that the
positioning of the water filter influenced the charging voltage of the
DI water.
ESD in Industry – Past, Present and Future
Jeremy Smallwood, Electrostatic Solutions Ltd.
ElectroStatic Discharge (ESD) has been a recognized source of
damage to unprotected electronic components and assemblies
in electronic system manufacture since around 1980. Since then,
manufacturers handling ESD Sensitive components (ESDS)
have set up ESD Protected Areas (EPAs) for the purpose, and
a whole industry has grown around the provision of ESD control
equipment. Several generations of development have culminated
in internationally recognized ESD control standards supported by
standard test methods and procedures. At the same time, development of ESDS device on-chip protection has continued apace.
Technical Presentation 13
Workshop
Ultra ESD Sensitive Electronics - How to Implement an
Efficient ESD Protection
Electrical manufacturing has to handle electrical components, PCB assemblies and subassemblies with varying
ESD sensitivity. Some of the electronic components can be
classified as an ultra ESD sensitive with a low voltage, current, charge, power, or energy failure threshold. Establishing
an ESD control program based on the most sensitive electronics would lead to overkill with preventive actions, and
alternatively, using the same generic control methods could
increase ESD failure risks. Additional challenges origin from
poor knowledge of the real ESD sensitivity of electronics
during handling and limited accuracy of the measurement
instrumentation with a low level E-field, potential, EMI, and
charge measurements. Implementing an efficient ESD protection requires tailored control methods. Therefore, in this
workshop it shall be discussed what different process qualification methods, challenges, and best practices to build up
ESD safe processes are existing and whether they are necessary at all.
EOS/ESD Factory Symposium in Finland
October 12-14, 2016
EOS/ESD Factory Symposium in Finland
Tallink Ferry (Roundtrip Helsinki - Stockholm) Helsinki, Finland
EXHIBITORS
Estion Technologies GmbH
Booth 5
Griesheim, 64347 GERMANY
Web Site: www.estion-tech.com
HANS KOLB Wellpappe GmbH & Co. KG
Booth 7
Memmingen, 87700 GERMANY
Web Site: www.kolb-wellpappe.com
Wolfgang Warmbier GmbH & Co. KG
Booth 1
Hilsingen, 78247 GERMANY
Web Site: www.warmbier.com
Eurostat Group
Booth 6
SE-136 40 HANDEN, SWEDEN
Web Site: www.eurostatgroup.com
Promote your company by exhibiting at the EOS/ESD Symposium for Factory Issues in Finland.
Table Top Exhibit Space Rental:
Exhibitor (one person): $1500 USD includes symposium/cabin/ferry/meals
Additional booth staff $500 USD each, includes exhibition access/cabin/ferry/meals (Admission to
Symposium is additional)
For more information visit
www.esda.org/events/eosesd-factory-symposium/exhibits
https://www.esda.org/events/eosesd-factory-symposium/finland/
Co-Sponsored by:
Setting the Global Standards for Static Control!
EOS/ESD Association, Inc. 7900 Turin Rd., Bldg. 3 Rome, NY 13440-2069, USA
PH +1-315-339-6937 • Email: info@esda.org • www.esda.org
25 July 2016 9:27 AM
EOS/ESD Factory Symposium in Finland
October 10-11, 2016
EOS/ESD Factory Symposium in Finland-Tutorials
Simonkentta Scandic Hotel, Helsinki, Finland
ESD Basics Oct 10, 2016 • 9:00 AM - 12:30 PM
Process Assessment Oct 10, 2016 • 1:30 PM - 5:00 PM
ANSI/ESD S20.20 - Process Design Overview Oct 11, 2016 • 9:00 AM - 5:00 PM
October 12-14, 2016
EOS/ESD Factory Symposium in Finland
Tallink Ferry (Roundtrip Helsinki - Stockholm) Helsinki, Finland
ESD Tutorials October 10-11, 2016 $
Symposium Only October 12-14, 2016 $ 1,050 USD
Symposium Bundle October 10-14, 2016
$ 1,730 USD
(at Simonkentta Scandic Hotel, lunch included)
Technical Sessions, Invited Talks, and Workshops
(aboard the Tallink Ferry, ferry, cabin, and meals included)
680 USD
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Symposium plus two-day ESD Tutorial Program
(Simonkentta Scandic Hotel tutorials and Tallink Ferry Symposium)
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Setting the Global Standards for Static Control!
EOS/ESD Association, Inc. 7900 Turin Rd., Bldg. 3 Rome, NY 13440-2069, USA
PH +1-315-339-6937 • Email: info@esda.org • www.esda.org
25 July 2016 9:27 AM