Package Diagrams
February 2003
16-Pin Plastic DIP Package
Dimensions in Inches
-BN/2
b1
1
WITH
LEAD FINISH
E
5
6
CL
E1
c1
(c)
N
SEE
DETAIL
A
BASE METAL
(b)
SECTION Z-Z
CL
BASE PLANE
c
5
-A-
D
6
eA
Z Z
4
A2 A
eB
7
-C.015
SEATING
PLANE
A1
L
b2
10
b
.010
GAGE
PLANE
-H-
e
b3
4X
D1 4x
M
C
5
eC
DETAIL A
NOTES:
1. CONTROLLING DIMENSION:
INCH.
2. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M
3. DISTANCE BETWEEN LEADS INCLUDING DAMBAR
PROTRUSIONS TO BE .005 MINIMUM.
4. DIMENSIONS A, A1 & L ARE MEASURED WITH
THE PACKAGE SEATED IN JEDEC SEATING
PLANE GAUGE GS-3.
5. DIMENSIONS D, D1 AND E1
DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010
6. E AND eA MEASURED WITH THE LEADS CONSTRAINED
TO BE PERPENDICULAR TO DATUM -C7. eB AND eC ARE MEASURED AT THE LEAD TIPS
WITH THE LEADS UNCONSTRAINED.
8. N IS THE MAXIMUM NUMBER OF LEAD
POSITIONS.
9. POINTED OR ROUNDED LEAD TIPS ARE PREFERRED
TO EASE INSERTION
10. b1 MAXIMUM DIMENSION DOES NOT
INCLUDE DAMBAR PROTRUSIONS. DAMBAR
PROTRUSIONS SHALL NOT EXCEED .010
11. DATUM PLANE -H- COINCIDENT WITH THE BOTTOM
OF LEAD , WHERE LEAD EXITS BODY
www.latticesemi.com
N = 16
1
S
Y
M
B
O
L
MIN. NOM.
MAX.
A
A1
A2
b
b1
b2
b3
c
c1
D
D1
E
E1
e
eA
eB
eC
.015
.115 .130
.014 .018
.014 .018
.045 .060
.030 .039
.008 .010
.008 .010
.735 .755
.005 .300 .310
.240 .250
.100 BSC
.300 BSC
.000
-
.210
.195
.022
.020
.070
.045
.014
.011
.775
.325
.280
INCHES
N
O
.430
.060
T
E
4
4
10
10
5
5
6
5
6
7
7
pkg_23
Lattice Semiconductor
Package Diagrams
16-Pin SOIC Package
Dimensions in Inches
D
hx45∞
3
Pin1 Identifier
2
1
hx45∞
SEE DETAIL A
C
- B -
E
H
+
.25 M B M
END VIEW
N
6
TOP VIEW
B
+
.25 M C
A M B S
e
L
C
OC
DETAIL A
A
- C -
- A -
D
MIN.
SEATING PLANE
SIDE VIEW
A1
.10
NOTES:
1. CONTROLLING DIMENSION: MILLIMETER
2. DIMENSIONING & TOLERANCES PER ANSI. Y14.5M-1982
3. DIMENSION "D" DOES NOT INCLUDE MOLD FLASH
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS AND GATE BURRS SHALL NOT EXCEED
EXCEED .15mm PER SIDE
4. DIMENSION "E" DOES NOT INCLUDE INTER LEAD FLASH
OR PROTRUSIONS. INTER-LEAD FLASH AND PROTRUSION
SHALL NOT EXCEED .25mm PER SIDE
5. THE CHAMFER ON THE BODY IS OPTIONAL , IF IT IS NOT
PRESENT , A VISUAL INDEX FEATURE MUST BE LOCATED
WITHIN THE CROSSHATCHED AREA.
6. "L" IS THE LENGTH OF THE TERMINAL FOR SOLDERING
TO A SUBSTRATE
7. "N" IS THE NUMBER OF TERMINAL POSITIONS.
8. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY
9. THE LEAD WIDTH "B" AS MEASURED .36mm OR
GREATER ABOVE THE SEATING PLANE, SHALL NOT EXCEED
A MAX VALUE OF .61mm.
A
A1
B
C
D
E
e
H
h
L
NC
OC
2
MAX.
2.65
2.35
.10
.30
.33
.51
.23
.32
10.10
10.50
7.40
7.60
1.27 BSC
10.00 10.65
.75
.25
1.27
.40
16
8∞
0∞
Lattice Semiconductor
Package Diagrams
20-Pin (300-Mil) CERDIP Package
Dimensions in Inches
(DATUM A)
B
1
N/2
4
E
E1
N
E3
e/2
E
DETAIL A
D
A
4
BASE PLANE
(DATUM B)
A2
A1
A
C
SEATING PLANE
e
b2
Z
b
.010 M
L
E2
C A B
b1
(c)
4X
WITH
LEAD FINISH
c1
BASE METAL
(b)
b3
SECTION Z-Z
DETAIL A
S
Y
M
B
O
L
NOTES:
1.
c
7
Z
A
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN INCHES.
3.
MEASUREMENTS TO BE TAKEN AT A MINIMUM OF
.060 INCHES FROM THE LEAD TIP.
4.
DIMENSIONS D AND E1 INCLUDE ALLOWANCE FOR GLASS
OVERRUN AND MENISCUS, AND LID TO BASE MISMATCH.
5.
DIMENSIONS A, A1 AND L ARE MEASURED WITH THE
PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS-003.
6.
E3 IS TO BE MEASURED AT THE LEAD TIPS.
7.
ALLOWED LEAD TIP POSITION RANGE.
3
A1
A2
b
b1
b2
b3
c
c1
D
E
E1
E2
E3
e
L
N
3
INCHES
MIN. NOM.
.015
.140
.015
.015 .018
.045
.023
.008
.008 .010
.942 .950
.308
.280 .288
.300 REF
.325
.100 BSC
.125
20
MAX.
.200
.175
.023
.021
.065
.045
.014
.012
.970
.325
.296
.410
.200
Lattice Semiconductor
Package Diagrams
20-Pin LCC Package
Dimensions in Inches
D4
D2
.010
X 45∞
.020
E2
E4
4
.030
X 45∞
.050
(3 PLACES)
A1
L (19 PLACES)
A
B
3
e
E
.030
.050
D
L1
RADIUS
(TYPICAL)
A2
3
NOTES:
S
Y
M
B
O
L
1.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5.
2.
ALL DIMENSIONS ARE IN INCHES.
3.
DIMENSIONS D AND E MAY HAVE MATERIAL PROTRUSION
OF .010 INCHES MAXIMUM ABOVE THE DIMENSION SHOWN
NOT TO EXCEED .005 INCHES MAXIMUM PER SIDE.
4.
FLATNESS TOLERANCE IS .004 INCHES PER INCH.
4
INCHES
MAX.
MIN.
A .054
.074
A1 .064
.089
A2 .007
.015
B
.022
.028
D
.342
.358
D2
.200
D4 .270
.315
.342
E
.358
E2
.200
E4 .270
.315
e
.050 BSC
L
.058
.042
L1 .075
.095
Lattice Semiconductor
Package Diagrams
20-Pin PLCC Package
Dimensions in Inches
.007 S
H
A-B
S
D S
D
D
.007 S
H A-B
.002 A-B
45∞ X
.048
.042
7
1
S D S
S
-D-
13
3
2
1
3
8
N
.150
MAX
.050
(N-4PLACES)
E
E1
-B-
.075
MAX
7
3
-A3
see
DETAIL B
.007 S
H A-B
// .002 A-B
.007 S
H
S D S
S
A-B
S
D S
9
.020 MAX 3 PLCS
.020 MAX 3 PLCS
9
DETAIL B
5
Lattice Semiconductor
Package Diagrams
20-Pin PLCC Package (cont.)
-C.045 MIN.
7
.025 MIN.
BASE PLANE
.020
MIN
.025/.045 R.
SEE
DETAIL
"A"
A2
45∞x
.056
.042
.004
C
D2
E2
SEE
DETAIL
"J"
SEE
DETAIL
"L"
4
D
E
-A-B-D-
BASE PLANE
.020 MIN.
D2
E2
.050
N-4 PLACES
4
DETAIL "A"
6
X
.032
.026
.007 MAX.
A1
.007 S
D S
Y
A
X
TO BE .007 MAX/LEAD
Y
OPTIONAL FEATURE. IF PRESENT,
MINIMUM SPACE BETWEEN
ADJACENT LEADS IS 0.08.
- C - H -
H A-B S
2
SEATING PLANE
.045 MIN.
5
.025
MIN.
SEATING PLANE
.021
.013
D
D
E
.010
MAX.
10
10
C A-B S
TYP ALL SIDES
.010
MAX.
.021
.013
10
.065
.065
.0125
.0075
A
A
.020
D2
R
D2
E2
D S
DETAIL "J"
.020
E
.020
.007 M
.045
.025
14
.018
.013
E2
SECTION A-A
DETAIL "L"
TYP ALL SIDES
6
.0105
15
.0075
Lattice Semiconductor
Package Diagrams
20-Pin PLCC Package (cont.)
-D-
S
Y
M
B
O
L
A
A1
A2
D
D1
D2
D3
E
E1
E2
E3
N
MIN. NOM. MAX.
.165
.090
.062
.385
.350
.141
.385
.350
.141
-
.172
.105
.390
.353
.155
.075
.390
.353
.155
.075
20
.180
.120
.083
.395
.356
.169
E3
-A-B12
E3
12
.395
.356
.169
-
D3
12
NOTES:
1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y14.5M-1982.
-HLOCATED AT TOP OF MOLD PARTING LINE AND
2. DATUM PLANE
CONINCIDENT WITH TOP OF LEAD WHERE LEAD EXIST PLASTIC BODY
3
DATUMS
A-B AND -D- TO BE DETERMINED WHERE CENTER LEADS
EXIT PLASTIC BODY AT DATUM PLANE
-H-
4
TO BE MEASURED AT SEATING PLANE
5
SHAPE OF TRANSITION IS OPTIONAL
6
PLASTIC BODY DETAILS BETWEEN LEADS ARE OPTI0NAL
7
DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS .010 PER SIDE. DIMENSIONS D1 AND E1 INCLUDE MOLD
MISMATCH AND ARE DETERMINED AT THE PARTING LINE; THAT IS D1 AND
E1 ARE MEASURED AT THE EXTREME MATERIAL CONDITION AT THE UPPER
OR LOWER PARTING LINE.
-H-
CONTACT POINT
8 PIN 1 IDENTIFIER MUST BE LOCATED WITHIN HE ZONE INDICATED
DETAILS OF THE IDENTIFIER ARE OPTIONAL.
9 EXACT SHAPE OF THIS FEATURE IS OPTIONAL.
10 THESE TWO DIMENSIONS DETERMINE MAXIMUM ANGLE OF THE
LEAD FOR CERTAIN SOCKET APPLICATIONS. IF UNIT IS INTENDED TO BE
SOCKETED . IT IS ADVISABLE TO REVIEW THESE DIMENSION WITH
THE SOCKET VENDOR
11 ALL DIMENSIONS IN INCHES
-H- BOTTOM POINT OF
12 TOP POINT OF MEASUREMENT IS DATUM
MEASUREMENT IS AT MAJOR FLAT AREA OF LOWER PLASTIC SURFACE
(SOCKET SEATING PLANE) DEFINED BY D3/E3
13 PIN NUMBERS ARE FOR REFERENCE ONLY
14 DIMENSION R REQUIRED FOR 120∞ MINIMUM BEND
15
D3
DIMENSION APPLIES TO BASE METAL ONLY
7
Lattice Semiconductor
Package Diagrams
20-Pin Plastic DIP Package
Dimensions in Inches
-BN/2
E
b1
1
WITH
LEAD FINISH
6
5
CL
E1
(c)
c1
SEE
DETAIL
A
N
(b)
BASE METAL
CL
SECTION Z-Z
c
BASE PLANE
6
eA
5
-A-
D
eB
Z Z
4
7
A2 A
-C.015
EATING
PLANE
A1
10
b
.010
GAGE
PLANE
-H-
e
b2
L
D1 4x
M
C
5
eC
DETAIL A
NOTES:
1. CONTROLLING DIMENSION:
INCH.
2. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M
3. DISTANCE BETWEEN LEADS INCLUDING DAMBAR
PROTRUSIONS TO BE .005 MINIMUM.
4. DIMENSIONS A, A1 & L ARE MEASURED WITH
THE PACKAGE SEATED IN JEDEC SEATING
PLANE GAUGE GS-3.
5. DIMENSIONS D, D1 AND E1
DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010
6. E AND eA MEASURED WITH THE LEADS CONSTRAINED
TO BE PERPENDICULAR TO DATUM -C7. eB AND eC ARE MEASURED AT THE LEAD TIPS
WITH THE LEADS UNCONSTRAINED.
8. N IS THE MAXIMUM NUMBER OF LEAD
POSITIONS.
9. POINTED OR ROUNDED LEAD TIPS ARE PREFERRED
TO EASE INSERTION
10. b2 MAXIMUM DIMENSION DOES NOT
INCLUDE DAMBAR PROTRUSIONS. DAMBAR
PROTRUSIONS SHALL NOT EXCEED .010
11. DATUM PLANE -H- COINCIDENT WITH THE BOTTOM
OF LEAD , WHERE LEAD EXITS BODY
N = 20
8
S
Y
M
B
O
L
MIN. NOM.
MAX.
A
A1
A2
b
b1
b2
c
c1
D
D1
E
E1
e
eA
eB
eC
L
.015
.115 .130
.014 .018
.014 .018
.045 .060
.008 .010
.008 .010
.980 1.030
.005 .300 .310
.240 .250
.100 BSC
.300 BSC
.000
.115 .130
.210
.195
.022
.020
.070
.014
.011
1.060
.325
.280
INCHES
N
O
.430
.060
.150
T
E
4
4
10
5
5
6
5
6
7
7
4
Lattice Semiconductor
Package Diagrams
20-Pin SOIC Package
Dimensions in Inches
D
hx45∞
3
Pin1 Identifier
2
1
hx45∞
SEE DETAIL A
C
- B -
E
H
+
.25 M B M
END VIEW
N
6
TOP VIEW
B
+
.25 M C
A M B S
e
L
C
OC
DETAIL A
A
- C -
- A -
D
MIN.
SEATING PLANE
SIDE VIEW
A1
.10
NOTES:
1. CONTROLLING DIMENSION: MILLIMETER
2. DIMENSIONING & TOLERANCES PER ANSI. Y14.5M-1982
3. DIMENSION "D" DOES NOT INCLUDE MOLD FLASH
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS AND GATE BURRS SHALL NOT EXCEED
EXCEED .15mm PER SIDE
4. DIMENSION "E" DOES NOT INCLUDE INTER LEAD FLASH
OR PROTRUSIONS. INTER-LEAD FLASH AND PROTRUSION
SHALL NOT EXCEED .25mm PER SIDE
5. THE CHAMFER ON THE BODY IS OPTIONAL , IF IT IS NOT
PRESENT , A VISUAL INDEX FEATURE MUST BE LOCATED
WITHIN THE CROSSHATCHED AREA.
6. "L" IS THE LENGTH OF THE TERMINAL FOR SOLDERING
TO A SUBSTRATE
7. "N" IS THE NUMBER OF TERMINAL POSITIONS.
8. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY
9. THE LEAD WIDTH "B" AS MEASURED .36mm OR
GREATER ABOVE THE SEATING PLANE, SHALL NOT EXCEED
A MAX VALUE OF .61mm.
A
A1
B
C
D
E
e
H
h
L
NC
OC
9
MAX.
2.65
2.35
.10
.30
.33
.51
.23
.32
12.6
13.0
7.40
7.60
1.27 BSC
10.00 10.65
.75
.25
1.27
.40
20
8∞
0∞
Lattice Semiconductor
Package Diagrams
24-Pin (300-Mil) CERDIP
Dimensions in Inches
(DATUM A)
B
N/2
1
4
E1
E
N
E3
e/2
E
D
A
4
BASE PLANE
(DATUM B)
A2
A1
A
C
SEATING PLANE
b2
e
Z
b
.010 M
L
Z
c
E2
C A B
b1
(c)
WITH
LEAD FINISH
c1
(b)
SECTION Z-Z
BASE METAL
3
S
Y
M
B
O
L
NOTES:
1.
7
A
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN INCHES.
3.
MEASUREMENTS TO BE TAKEN AT A MINIMUM OF
.060 INCHES FROM THE LEAD TIP.
4.
DIMENSIONS D AND E1 INCLUDE ALLOWANCE FOR GLASS
OVERRUN AND MENISCUS, AND LID TO BASE MISMATCH.
5.
DIMENSIONS A, A1 AND L ARE MEASURED WITH THE
PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS-003.
6.
E3 IS TO BE MEASURED AT THE LEAD TIPS.
7.
ALLOWED LEAD TIP POSITION RANGE.
10
A1
A2
b
b1
b2
c
c1
D
E
E1
E2
E3
e
L
N
INCHES
MIN. NOM. MAX.
.200
.015
.175
.140
.023
.015
.015 .018 .021
.065
.045
.014
.008
.008 .010 .012
1.242 1.250 1.270
.325
.308
.280 .288 .296
.300 REF
.410
.325
.100 BSC
.125
.200
24
Lattice Semiconductor
Package Diagrams
24-Pin Plastic DIP
Dimensions in Inches
-BN/2
b1
1
E
WITH
LEAD FINISH
6
5
CL
E1
(c)
c1
N
(b)
SEE
DETAIL
A
BASE METAL
SECTION Z-Z
CL
c
BASE PLANE
-A-
6
5
eA
D
eB
Z Z
4
A2 A
7
-C.015
SEATING
PLANE
A1
10
b
.010
GAGE
PLANE
-H-
e
b2
L
D1 4x
M
C
5
eC
DETAIL A
NOTES:
1. CONTROLLING DIMENSION:
INCH.
2. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M
3. DISTANCE BETWEEN LEADS INCLUDING DAMBAR
PROTRUSIONS TO BE .005 MINIMUM.
4. DIMENSIONS A, A1 & L ARE MEASURED WITH
THE PACKAGE SEATED IN JEDEC SEATING
PLANE GAUGE GS-3.
5. DIMENSIONS D, D1 AND E1
DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010
6. E AND eA MEASURED WITH THE LEADS CONSTRAINED
TO BE PERPENDICULAR TO DATUM -C7. eB AND eC ARE MEASURED AT THE LEAD TIPS
WITH THE LEADS UNCONSTRAINED.
8. N IS THE MAXIMUM NUMBER OF LEAD
POSITIONS.
9. POINTED OR ROUNDED LEAD TIPS ARE PREFERRED
TO EASE INSERTION
10. b2 MAXIMUM DIMENSIONS DOES NOT
INCLUDE DAMBAR PROTRUSIONS. DAMBAR
PROTRUSIONS SHALL NOT EXCEED .010
11. DATUM PLANE -H- COINCIDENT WITH THE BOTTOM
OF LEAD , WHERE LEAD EXITS BODY
N = 24
11
S
Y
M
B
O
L
MIN. NOM.
MAX.
A
A1
A2
b
b1
b2
c
c1
D
D1
E
E1
e
eA
eB
eC
L
.015
.115 .130
.014 .018
.014 .018
.045 .060
.008 .010
.008 .010
1.230 1.250
.005 .300 .310
.240 .250
.100 BSC
.300 BSC
.000
.115 .130
.210
.195
.022
.020
.070
.014
.011
1.280
.325
.280
INCHES
N
O
.430
.060
.150
T
E
4
4
10
5
5
6
5
6
7
7
Lattice Semiconductor
Package Diagrams
24-Pin SOIC Package
Dimensions in Inches
D
hx45∞
3
Pin1 Identifier
2
1
hx45∞
SEE DETAIL A
C
- B -
E
H
+
.25 M B M
END VIEW
N
6
TOP VIEW
B
+
.25 M C
A M B S
e
L
C
OC
DETAIL A
A
- C -
- A -
D
MIN.
SEATING PLANE
SIDE VIEW
A1
.10
NOTES:
1. CONTROLLING DIMENSION: MILLIMETER
2. DIMENSIONING & TOLERANCES PER ANSI. Y14.5M-1982
3. DIMENSION "D" DOES NOT INCLUDE MOLD FLASH
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS AND GATE BURRS SHALL NOT EXCEED
EXCEED .15mm PER SIDE
4. DIMENSION "E" DOES NOT INCLUDE INTER LEAD FLASH
OR PROTRUSIONS. INTER-LEAD FLASH AND PROTRUSION
SHALL NOT EXCEED .25mm PER SIDE
5. THE CHAMFER ON THE BODY IS OPTIONAL , IF IT IS NOT
PRESENT , A VISUAL INDEX FEATURE MUST BE LOCATED
WITHIN THE CROSSHATCHED AREA.
6. "L" IS THE LENGTH OF THE TERMINAL FOR SOLDERING
TO A SUBSTRATE
7. "N" IS THE NUMBER OF TERMINAL POSITIONS.
8. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY
9. THE LEAD WIDTH "B" AS MEASURED .36mm OR
GREATER ABOVE THE SEATING PLANE, SHALL NOT EXCEED
A MAX VALUE OF .61mm.
A
A1
B
C
D
E
e
H
h
L
NC
OC
12
MAX.
2.65
2.35
.10
.30
.33
.51
.23
.32
15.20
15.60
7.40
7.60
1.27 BSC
10.00 10.65
.75
.25
1.27
.40
24
8∞
0∞
Lattice Semiconductor
Package Diagrams
28-Pin LCC Package
Dimensions in Inches
D4
D2
.010
X 45∞
.020
E2
E4
4
.030
X 45∞
.050
(3 PLACES)
A1
L (27 PLACES)
A
B
e
.030
3
E
.050
D
RADIUS
(TYPICAL)
A2
L1
S
Y
M
B
O
L
3
NOTES:
1.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5.
2.
ALL DIMENSIONS ARE IN INCHES.
3.
DIMENSIONS D AND E MAY HAVE MATERIAL PROTRUSION
OF .010 INCHES MAXIMUM ABOVE THE DIMENSION SHOWN
NOT TO EXCEED .005 INCHES MAXIMUM PER SIDE.
4.
FLATNESS TOLERANCE IS .004 INCHES PER INCH.
13
INCHES
MIN.
MAX.
.074
A .054
.089
A1 .064
.015
A2 .007
.022
.028
B
.440
.460
D
D2
.300
.403
D4 .370
.440
.460
E
.300
E2
E4 .370
.403
e
.050 BSC
L
.058
.042
L1 .075
.095
Lattice Semiconductor
Package Diagrams
28-Pin PLCC Package
Dimensions in Inches
.007 S
H
A-B
S
D S
D
D
.007 S
H A-B
.002 A-B
.048
45∞ X
.042
7
1
S D S
S
-D-
13
3
2
1
3
8
N
.150
MAX
.050
(N-4PLACES)
E
E1
-B-
.075
MAX
7
3
-A3
see
DETAIL B
.007 S
H A-B
// .002 A-B
.007 S
H
S D S
S
A-B
S
D S
9
.020 MAX 3 PLCS
.020 MAX 3 PLCS
9
DETAIL B
14
Lattice Semiconductor
Package Diagrams
28-Pin PLCC Package (cont.)
-C.045 MIN.
7
.025 MIN.
BASE PLANE
.020
MIN
.025/.045 R.
SEE
DETAIL
"A"
A2
45∞x
.056
.042
.004
C
D2
E2
SEE
DETAIL
"J"
SEE
DETAIL
"L"
4
D
E
-A-B-D-
BASE PLANE
.020 MIN.
D2
E2
.050
N-4 PLACES
4
DETAIL "A"
6
X
.032
.026
.007 MAX.
A1
.007 S
A
D S
X
TO BE .007 MAX/LEAD
Y
OPTIONAL FEATURE. IF PRESENT,
MINIMUM SPACE BETWEEN
ADJACENT LEADS IS 0.08.
- C - H -
H A-B S
Y
2
SEATING PLANE
.045 MIN.
5
.025
MIN.
SEATING PLANE
.021
.013
D
D
E
.010
MAX.
10
E
.020
10
.007 M
C A-B S
DETAIL "J"
.020
TYP ALL SIDES
.010
MAX.
.021
.013
10
.065
.065
.0125
.0075
A
A
.020
D2
R
D2
E2
D S
.045
.025
14
.018
.013
E2
SECTION A-A
DETAIL "L"
TYP ALL SIDES
15
.0105
15
.0075
Lattice Semiconductor
Package Diagrams
28-Pin PLCC Package (cont.)
-D-
S
Y
M
B
O
L
A
A1
A2
D
D1
D2
D3
E
E1
E2
E3
N
MIN. NOM. MAX.
.165
.090
.062
.485
.450
.191
.485
.450
.191
-
.172
.105
.490
.453
.205
.125
.490
.453
.205
.125
28
.180
.120
.083
.495
.456
.219
E3
-A-B12
E3
12
.495
.456
.219
-
D3
12
NOTES:
1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y14.5M-1982.
-HLOCATED AT TOP OF MOLD PARTING LINE AND
2. DATUM PLANE
CONINCIDENT WITH TOP OF LEAD WHERE LEAD EXIST PLASTIC BODY
3
DATUMS
A-B AND -D- TO BE DETERMINED WHERE CENTER LEADS
EXIT PLASTIC BODY AT DATUM PLANE
-H-
4
TO BE MEASURED AT SEATING PLANE
5
SHAPE OF TRANSITION IS OPTIONAL
6
PLASTIC BODY DETAILS BETWEEN LEADS ARE OPTI0NAL
7
DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS .010 PER SIDE. DIMENSIONS D1 AND E1 INCLUDE MOLD
MISMATCH AND ARE DETERMINED AT THE PARTING LINE; THAT IS D1 AND
E1 ARE MEASURED AT THE EXTREME MATERIAL CONDITION AT THE UPPER
OR LOWER PARTING LINE.
-H-
CONTACT POINT
8 PIN 1 IDENTIFIER MUST BE LOCATED WITHIN HE ZONE INDICATED
DETAILS OF THE IDENTIFIER ARE OPTIONAL.
9 EXACT SHAPE OF THIS FEATURE IS OPTIONAL.
10 THESE TWO DIMENSIONS DETERMINE MAXIMUM ANGLE OF THE
LEAD FOR CERTAIN SOCKET APPLICATIONS. IF UNIT IS INTENDED TO BE
SOCKETED . IT IS ADVISABLE TO REVIEW THESE DIMENSION WITH
THE SOCKET VENDOR
11 ALL DIMENSIONS IN INCHES
-H- BOTTOM POINT OF
12 TOP POINT OF MEASUREMENT IS DATUM
MEASUREMENT IS AT MAJOR FLAT AREA OF LOWER PLASTIC SURFACE
(SOCKET SEATING PLANE) DEFINED BY D3/E3
13 PIN NUMBERS ARE FOR REFERENCE ONLY
14 DIMENSION R REQUIRED FOR 120∞ MINIMUM BEND
15
D3
DIMENSION APPLIES TO BASE METAL ONLY
16
Lattice Semiconductor
Package Diagrams
28-Pin Plastic DIP Package
Dimensions in Inches
1
N/2
NOTE:
1 CONTROLLING DIMENSION: INCHES
2 DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M-1982
3 ALL END LEADS IN THIS FAMILY ARE 1/2 LEADS
4 DIMENSION A, A1, AND L ARE MEASURED WITH THE
PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS-3
5 D AND E1 DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR PROTRUSION. MOLD FLASH AND
PROTRUSION SHALL NOT EXCEED 0.010
6 E AND eA MEASURED WITH THE LEADS
CONSTRAINED TO BE PERPENDICULAR TO PLANE A
7 eB AND eC ARE MEASURED AT THE LEAD TIPS
WITH THE LEADS UNCONSTRAINED. eC MUST BE
ZERO OR GREATER
8 N IS THE NUMBER OF TERMINAL POSITIONS
9 B1 AND B2 MAXIMUM DIMENSIONS DO NOT INCLUDE
DAMBAR PROTRUSIONS. DAMBAR PROTRUSIONS
SHALL NOT EXCEED 0.010
-C-
E1
N
E
S
Y
M
B
O
L
CL
eA
eC
A
A1
A2
B
B1
B2
C
D
D1
E
E1
e
eA
eB
eC
L
N
C
eB
-B-
D
D1
L
SEATING PLANE
A2
-AA1
B2
4x
A
e
B
+
B1
17
0.015 M
0.010 M
A B
A
C
INCHES
MIN. NOM.
MAX.
.180
.015
.150
.120 .135
.022
.014 .018
.060
.045 .050
.030 .040 .045
.008 .010 .015
1.345 1.365 1.385
1.300 BSC
.300 .310 .325
.275 .285
.295
.100 BSC
.300 BSC
.430
.060
.000
.110 .130 .150
28
Lattice Semiconductor
Package Diagrams
28-Pin SOIC Package
Dimensions in Millimeters
D
hx45∞
3
Pin1 Identifier
2
1
hx45∞
SEE DETAIL A
C
- B -
E
H
+
.25 M B M
END VIEW
N
6
TOP VIEW
B
+
.25 M C
A M B S
e
L
C
OC
DETAIL A
A
- C -
- A -
D
MIN.
SEATING PLANE
SIDE VIEW
A1
.10
NOTES:
1. CONTROLLING DIMENSION: MILLIMETER
2. DIMENSIONING & TOLERANCES PER ANSI. Y14.5M-1982
3. DIMENSION "D" DOES NOT INCLUDE MOLD FLASH
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS AND GATE BURRS SHALL NOT EXCEED
EXCEED .15mm PER SIDE
4. DIMENSION "E" DOES NOT INCLUDE INTER LEAD FLASH
OR PROTRUSIONS. INTER-LEAD FLASH AND PROTRUSION
SHALL NOT EXCEED .25mm PER SIDE
5. THE CHAMFER ON THE BODY IS OPTIONAL , IF IT IS NOT
PRESENT , A VISUAL INDEX FEATURE MUST BE LOCATED
WITHIN THE CROSSHATCHED AREA.
6. "L" IS THE LENGTH OF THE TERMINAL FOR SOLDERING
TO A SUBSTRATE
7. "N" IS THE NUMBER OF TERMINAL POSITIONS.
8. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY
9. THE LEAD WIDTH "B" AS MEASURED .36mm OR
GREATER ABOVE THE SEATING PLANE, SHALL NOT EXCEED
A MAX VALUE OF .61mm.
A
A1
B
C
D
E
e
H
h
L
NC
OC
18
MAX.
2.65
2.35
.10
.30
.33
.51
.23
.32
18.10
17.70
7.60
7.40
1.27 BSC
10.00 10.65
.75
.25
1.27
.40
28
8∞
0∞
Lattice Semiconductor
Package Diagrams
28-Pin SSOP Package
Dimensions in Millimeters
+
3
D
0.15 M C
A S
B S
5
e
b
-AA
Pin 1 Identifier
3
2
- C -
1
0.10
A1
SEATING
PLANE
E
C
SIDE VIEW
-BE1
A2
3
N
+
0.20 M
C
A S
B S
PARTING LINE
TOP VIEW
SEE
DETAIL "A"
S
Y
M
B
O
L
COMMON
DIMENSIONS
MIN.
NOM.
MAX.
A
A1
A2
b
b1
c
c1
D
E1
-0.05
1.65
0.22
0.22
0.09
0.09
9.90
5.00
e
E
L
L1
N
OC
R1
7.40
0.55
0∞
0.09
2 NX R R1
GAUGE PLANE
OC
-2.0
--1.85
1.75
0.38
0.30
0.33
0.25
-0.21
0.15
10.20
10.50
5.60
5.30
0.65 BSC
8.20
7.80
0.75
0.95
1.25 REF.
28
4∞
--
END VIEW
A
0.25 BSC
A
L
4
SEATING PLANE
L1
DETAIL 'A'
WITH LEAD FINISH
b1
8∞
--
c
c1
(b)
5
SECTION A-A
BASE METAL
6
NOTES:
1. CONTROLLING DIMENSION: MILLIMETERS.
2. DIMENSIONING & TOLERANCES PER ANSI.Y14.5M-1982.
3. "D" & "E1" DO NOT INCLUDE MOLD FLASH OR
PROTRUSIONS, BUT DO INCLUDE MOLD MISMATCH
AND ARE MEASURED AT THE PARTING LINE.
MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.20mm PER SIDE.
5. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION/INTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13mm TOTAL IN
EXCESS OF b DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR INTRUSION SHALL NOT REDUCE DIMENSION b BY MORE
THAN 0.07mm AT LEAST MATERIAL CONDITION.
6. THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD
BETWEEN 0.10 & 0.25mm FROM THE LEAD TIP
4. TO BE DETERMINED AT THE SEATING PLANE
7. "N" IS THE NUMBER OF TERMINAL POSITIONS
19
Lattice Semiconductor
Package Diagrams
32-Pin QFN Package
Dimensions in Millimeters
2X
0.25 C
A
4
5.00
A
b
4.75
0.10
M
C A B
D2
PIN #1 ID FIDUCIAL
LOCATED IN THIS AREA
2X
0.25 C
N
N
B
1
3
1
PIN 1 ID
4.75
E2
5.00
L
0.20 C
32X
B
2X
e
B
3
TOP VIEW
0.20 C
A
3.5
2X
4X
0
BOTTOM VIEW
A2
A
5
C
0.08 C
SIDE VIEW
A3
A1
SEATING
PLANE
SYMBOL
NOTES: UNLESS OTHERWISE SPECIFIED
1.
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
MIN.
3
4
5
A
-
0.85
1.00
0.00
0.01
0.05
A2
0.00
0.65
1.00
0.20 REF
D2
1.25
E2
1.25
DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.20 AND 0.25 mm FROM TERMINAL TIP.
L
0.30
APPLIES TO EXPOSED PORTION OF TERMINALS.
0
-
e
20
MAX.
A1
A3
EXACT SHAPE AND SIZE OF THIS
FEATURE IS OPTIONAL.
NOM.
2.70
3.25
2.70
3.25
0.50 BSC
0.40
-
0.50
12
Lattice Semiconductor
Package Diagrams
44-Pin JLCC Package
Dimensions in Inches
(N PLACES)
D
.011 M
D1
A
B
L
B2
D2
E2
C
L1
Q
L2
B
B
R
E1
E
DETAIL A
B1
C1
C
BASE METAL
B
DETAIL A
A1
SECTION B-B
A
-A.004
SEATING
PLANE
WITH
LEAD FINISH
.050
.020 MIN.
D4
E4
S
Y
INCHES
M
B
O
L
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN INCHES.
3.
CORNER CHAMFERS AND/OR NOTCHES ARE OPTIONAL.
21
A
A1
B
B1
B2
C
C1
D/E
D1/E1
D2/E2
D4/E4
L
L1
L2
Q
R
N
MIN.
MAX.
.115
.190
.065 REF
.013
.023
.013
.020
.022
.035
.007
.013
.007
.010
.675 .690 .700
.620
.660
.500 BSC
.630 BSC
.005
.020
.025
.003
.020
.040
44
Lattice Semiconductor
Package Diagrams
44-Pin PLCC Package
Dimensions in Inches
.007 S
H
A-B
S
D S
D
D
.007 S
H A-B
.002 A-B
45∞ X
.048
.042
7
1
S D S
S
-D-
13
3
2
1
3
8
N
.150
MAX
.050
(N-4PLACES)
E
E1
-B-
.075
MAX
7
3
-A3
see
DETAIL B
.007 S
H A-B
// .002 A-B
.007 S
H
S D S
S
A-B
S
D S
9
.020 MAX 3 PLCS
.020 MAX 3 PLCS
9
DETAIL B
22
Lattice Semiconductor
Package Diagrams
44-Pin PLCC Package (cont.)
-C.045 MIN.
7
.025 MIN.
BASE PLANE
.020
MIN
.025/.045 R.
SEE
DETAIL
"A"
A2
45∞x
.056
.042
.004
C
D2
E2
SEE
DETAIL
"J"
SEE
DETAIL
"L"
4
D
E
-A-B-D-
BASE PLANE
.020 MIN.
D2
E2
.050
N-4 PLACES
4
DETAIL "A"
6
X
.032
.026
.007 MAX.
A1
.007 S
A
D S
X
TO BE .007 MAX/LEAD
Y
OPTIONAL FEATURE. IF PRESENT,
MINIMUM SPACE BETWEEN
ADJACENT LEADS IS 0.08.
- C - H -
H A-B S
Y
2
SEATING PLANE
.045 MIN.
5
.025
MIN.
SEATING PLANE
.021
.013
D
D
E
.010
MAX.
10
E
.020
10
.007 M
C A-B S
DETAIL "J"
.020
TYP ALL SIDES
.010
MAX.
.021
.013
10
.065
.065
.0125
.0075
A
A
.020
D2
R
D2
E2
D S
.045
.025
14
.018
.013
E2
SECTION A-A
DETAIL "L"
TYP ALL SIDES
23
.0105
15
.0075
Lattice Semiconductor
Package Diagrams
44-Pin PLCC Package (cont.)
-D-
S
Y
M
B
O
L
A
A1
A2
D
D1
D2
D3
E
E1
E2
E3
N
MIN. NOM. MAX.
.165
.090
.062
.685
.650
.291
.685
.650
.291
-
.172
.105
.690
.653
.305
.225
.690
.653
.305
.225
44
.180
.120
.083
.695
.656
.319
E3
-A-B12
E3
12
.695
.656
.319
-
D3
12
NOTES:
1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y14.5M-1982.
-H2. DATUM PLANE
LOCATED AT TOP OF MOLD PARTING LINE AND
CONINCIDENT WITH TOP OF LEAD WHERE LEAD EXIST PLASTIC BODY
3
DATUMS
A-B AND -D- TO BE DETERMINED WHERE CENTER LEADS
EXIT PLASTIC BODY AT DATUM PLANE
-H-
4
TO BE MEASURED AT SEATING PLANE
5
SHAPE OF TRANSITION IS OPTIONAL
6
PLASTIC BODY DETAILS BETWEEN LEADS ARE OPTI0NAL
7
DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS .010 PER SIDE. DIMENSIONS D1 AND E1 INCLUDE MOLD
MISMATCH AND ARE DETERMINED AT THE PARTING LINE; THAT IS D1 AND
E1 ARE MEASURED AT THE EXTREME MATERIAL CONDITION AT THE UPPER
OR LOWER PARTING LINE.
-H-
CONTACT POINT
8 PIN 1 IDENTIFIER MUST BE LOCATED WITHIN HE ZONE INDICATED
DETAILS OF THE IDENTIFIER ARE OPTIONAL.
9 EXACT SHAPE OF THIS FEATURE IS OPTIONAL.
10 THESE TWO DIMENSIONS DETERMINE MAXIMUM ANGLE OF THE
LEAD FOR CERTAIN SOCKET APPLICATIONS. IF UNIT IS INTENDED TO BE
SOCKETED . IT IS ADVISABLE TO REVIEW THESE DIMENSION WITH
THE SOCKET VENDOR
11 ALL DIMENSIONS IN INCHES
-H- BOTTOM POINT OF
12 TOP POINT OF MEASUREMENT IS DATUM
MEASUREMENT IS AT MAJOR FLAT AREA OF LOWER PLASTIC SURFACE
(SOCKET SEATING PLANE) DEFINED BY D3/E3
13 PIN NUMBERS ARE FOR REFERENCE ONLY
14 DIMENSION R REQUIRED FOR 120∞ MINIMUM BEND
15
D3
DIMENSION APPLIES TO BASE METAL ONLY
24
Lattice Semiconductor
Package Diagrams
44-Pin TQFP Package (1.0mm thick)
Dimensions in Millimeters
PIN 1 INDICATOR
0.20 C A-B
D 44X
D
3
A
E1
E
B
e
3
D
8
D1
3
TOP VIEW
4X
0.20 H A-B
D
BOTTOM VIEW
SIDE VIEW
SEE DETAIL 'A'
b
0.20 M C A-B
SEATING PLANE
C
GAUGE PLANE
H
D
A
A2
0.25
B
LEAD FINISH
b
0.10 C
B
0.20 MIN.
A1
c1
c
0-7∞
L
1.00 REF.
b
DETAIL 'A'
1
BASE METAL
SECTION B-B
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
4.
DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DIMENSIONS.
7.
8.
MIN.
NOM.
MAX.
A
-
-
1.20
A1
0.05
-
0.15
A2
.95
1.00
1.05
D
12.00 BSC
D1
10.00 BSC
E
12.00 BSC
E1
10.00 BSC
L
5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
OF THE PACKAGE BY 0.15 MM.
6.
SYMBOL
SECTION B-B:
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
TO THE LOWEST POINT ON THE PACKAGE BODY.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
25
0.45
0.60
N
44
e
0.80 BSC
b
0.30
b1
c
c1
0.75
0.37
0.45
0.30
0.35
0.40
0.09
0.15
0.20
0.09
0.13
0.16
Lattice Semiconductor
Package Diagrams
44-Pin TQFP Package (1.4mm thick)
Dimensions in Millimeters
PIN 1 INDICATOR
0.20 C A-B
D 44X
D
3
A
E1
E
B
e
3
D
8
D1
3
TOP VIEW
4X
0.20 H A-B
D
BOTTOM VIEW
SIDE VIEW
SEE DETAIL 'A'
b
0.20 M C A-B
SEATING PLANE
C
GAUGE PLANE
H
D
A
A2
0.25
B
LEAD FINISH
b
0.10 C
c
B
0.20 MIN.
A1
c1
0-7∞
L
1.00 REF.
b
DETAIL 'A'
1
BASE METAL
SECTION B-B
NOTES:
1.
SYMBOL
MIN.
NOM.
MAX.
A
-
-
1.60
A1
0.05
-
0.15
A2
1.35
1.40
1.45
DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
4.
DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DIMENSIONS.
5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
OF THE PACKAGE BY 0.15 MM.
D
12.00 BSC
D1
10.00 BSC
E
12.00 BSC
E1
10.00 BSC
L
0.45
0.60
0.75
N
44
SECTION B-B:
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
e
0.80 BSC
b
0.30
0.37
0.45
7.
A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
TO THE LOWEST POINT ON THE PACKAGE BODY.
b1
0.30
0.35
0.40
c
0.09
0.15
0.20
8.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
c1
0.09
0.13
0.16
6.
26
Lattice Semiconductor
Package Diagrams
48-Pin TQFP Package (1.0mm thick)
Dimensions in Millimeters
PIN 1 INDICATOR
0.20 C A-B
D 48X
D
3
A
E1
E
B
e
3
D
8
D1
3
TOP VIEW
4X
0.20 H A-B
D
BOTTOM VIEW
SEE DETAIL 'A'
SEATING PLANE
b
C
0.08 M C A-B
D
GAUGE PLANE
H
A
A2
0.25
B
LEAD FINISH
b
0.08 C
B
A1
0.20 MIN.
0-7°
c1
c
L
1.00 REF.
b
DETAIL 'A'
1
BASE METAL
SECTION B-B
SYMBOL
MIN.
NOM.
MAX.
A
-
-
1.20
NOTES:
A1
0.05
-
0.15
1.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
A2
.95
1.00
1.05
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
D
9.00 BSC
3.
DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
D1
7.00 BSC
4.
DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DIMENSIONS.
E
9.00 BSC
E1
7.00 BSC
L
5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
OF THE PACKAGE BY 0.15 MM.
6.
0.45
N
SECTION B-B:
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
0.60
0.75
48
e
0.50 BSC
b
0.17
0.22
0.27
7.
A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
TO THE LOWEST POINT ON THE PACKAGE BODY.
b1
0.17
0.20
0.23
c
0.09
0.15
0.20
8.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
c1
0.09
0.13
0.16
27
Lattice Semiconductor
Package Diagrams
48-Pin TQFP Package (1.4mm thick)
Dimensions in Millimeters
PIN 1 INDICATOR
0.20 H A-B D
0.20 C A-B D
D1
D
N
3. A
1
E1
E
B
e
D
3.
3.
8. 4X
SEE DETAIL "A"
H
A
b
0.08
C
GAUGE PLANE
0.25
A2
SEATING PLANE
B
M C A -B D
0.08 C
LEAD FINISH
B
A1
0.20 MIN.
0-7∞
b
L
1.00 REF.
c
c1
b
DETAIL "A"
1
BASE METAL
SECTION B - B
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
4.
DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DIMENSIONS.
SECTION B-B:
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
7.
A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
TO THE LOWEST POINT ON THE PACKAGE BODY.
8.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
MIN.
NOM.
MAX.
A
-
-
1.60
A1
0.05
-
0.15
A2
1.35
1.40
1.45
D
9.00 BSC
D1
7.00 BSC
E
9.00 BSC
E1
7.00 BSC
L
5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
OF THE PACKAGE BY 0.15 MM.
6.
SYMBOL
28
0.45
0.60
N
48
e
0.50 BSC
0.22
0.75
b
0.17
0.27
b1
0.17
0.20
0.23
c
0.09
0.15
0.20
c1
0.09
0.13
0.16
Lattice Semiconductor
Package Diagrams
49-Ball caBGA Package
Dimensions in Millimeters
5
(4X)
aaa
A1 BALL I.D.
IDENTIFIER
M
A
D
B
7
6
5
4
3
2
1
A
B
S
C
D
E
N
E
F
G
e
e
S
6
4X
3
A2
A
b
.15 M C A B
.08 M C
bbb
ddd
C
C
4
C
A1
SYMBOL
NOTES: UNLESS OTHERWISE SPECIFIED
1.
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3
DIMENSION "b" IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C
4
PRIMARY DATUM C AND SEATING
PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
5
BILATERAL TOLERANCE ZONE IS APPLIED
TO EACH SIDE OF THE PACKAGE BODY.
6
EXACT SHAPE AND SIZE OF THIS FEATURE
IS OPTIONAL.
MIN.
MAX.
A
1.30
1.40
1.50
A1
0.31
0.36
0.41
A2
0.99
1.04
1.09
D/E
7.00 BSC
M/N
4.80 BSC
S
0 BSC
b
0.40
e
29
NOM.
0.46
0.52
0.80 BSC
aaa
-
-
0.10
bbb
-
-
0.10
ddd
-
-
0.12
Lattice Semiconductor
Package Diagrams
68-Pin JLCC Package
Dimensions in Inches
D
(N PLACES)
D1
.011 M
D2
E2
A
B
B2
L
C
L1
Q
L2
B
B
R
DETAIL A
E1
E
B1
WITH
LEAD FINISH
C
C1
BASE METAL
B
SECTION B-B
DETAIL A
A1
S
Y
INCHES
M
A
-A.004
B
O
L
SEATING
PLANE
.050
.020 MIN.
D4
E4
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN INCHES.
3.
CORNER CHAMFERS AND/OR NOTCHES ARE OPTIONAL.
30
A
A1
B
B1
B2
C
C1
D/E
D1/E1
D2/E2
D4/E4
L
L1
L2
Q
R
N
MIN.
MAX.
.115
.190
.080 REF
.013
.023
.013
.020
.022
.035
.007
.013
.007
.010
.975 .990 1.000
.920
.960
.800 BSC
.930 BSC
.005
.020
.025
.003
.020
.040
68
Lattice Semiconductor
Package Diagrams
68-Pin PLCC Package
Dimensions in Inches
.007 S
H
A-B
S
D S
D
D
.007 S
H A-B
.002 A-B
45∞ X
.048
.042
7
1
S D S
S
-D-
13
3
2
1
3
8
N
.150
MAX
.050
(N-4PLACES)
E
E1
-B-
.075
MAX
7
3
-A3
see
DETAIL B
.007 S
H A-B
// .002 A-B
.007 S
H
S D S
S
A-B
S
D S
9
.020 MAX 3 PLCS
.020 MAX 3 PLCS
9
DETAIL B
31
Lattice Semiconductor
Package Diagrams
68-Pin PLCC Package (cont.)
-C.045 MIN.
7
.025 MIN.
BASE PLANE
.020
MIN
.025/.045 R.
SEE
DETAIL
"A"
A2
45∞x
.056
.042
.004
C
D2
E2
SEE
DETAIL
"J"
SEE
DETAIL
"L"
4
D
E
-A-B-D-
BASE PLANE
.020 MIN.
D2
E2
.050
N-4 PLACES
4
DETAIL "A"
6
X
.032
.026
.007 MAX.
A1
.007 S
D S
Y
A
X
TO BE .007 MAX/LEAD
Y
OPTIONAL FEATURE. IF PRESENT,
MINIMUM SPACE BETWEEN
ADJACENT LEADS IS 0.08.
- C - H -
H A-B S
2
SEATING PLANE
.045 MIN.
5
.025
MIN.
SEATING PLANE
.021
.013
D
D
E
.010
MAX.
10
E
.020
10
.007 M
C A-B S
DETAIL "J"
.020
TYP ALL SIDES
.010
MAX.
.021
.013
10
.065
.065
.0125
.0075
A
A
.020
D2
R
D2
E2
D S
.045
.025
14
.018
.013
E2
SECTION A-A
DETAIL "L"
TYP ALL SIDES
32
.0105
15
.0075
Lattice Semiconductor
Package Diagrams
68-Pin PLCC Package (cont.)
-D-
S
Y
M
B
O
L
A
A1
A2
D
D1
D2
D3
E
E1
E2
E3
N
MIN. NOM. MAX.
.165
.090
.062
.985
.950
.441
.985
.950
.441
-
.172
.105
.990
.954
.455
.375
.990
.954
.455
.375
68
.180
.120
.083
.995
.958
.469
E3
-A-B12
E3
12
.995
.958
.469
-
D3
12
NOTES:
1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y14.5M-1982.
-HLOCATED AT TOP OF MOLD PARTING LINE AND
2. DATUM PLANE
CONINCIDENT WITH TOP OF LEAD WHERE LEAD EXIST PLASTIC BODY
3
DATUMS
A-B AND -D- TO BE DETERMINED WHERE CENTER LEADS
EXIT PLASTIC BODY AT DATUM PLANE
-H-
4
TO BE MEASURED AT SEATING PLANE
5
SHAPE OF TRANSITION IS OPTIONAL
6
PLASTIC BODY DETAILS BETWEEN LEADS ARE OPTI0NAL
7
DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS .010 PER SIDE. DIMENSIONS D1 AND E1 INCLUDE MOLD
MISMATCH AND ARE DETERMINED AT THE PARTING LINE; THAT IS D1 AND
E1 ARE MEASURED AT THE EXTREME MATERIAL CONDITION AT THE UPPER
OR LOWER PARTING LINE.
-H-
CONTACT POINT
8 PIN 1 IDENTIFIER MUST BE LOCATED WITHIN HE ZONE INDICATED
DETAILS OF THE IDENTIFIER ARE OPTIONAL.
9 EXACT SHAPE OF THIS FEATURE IS OPTIONAL.
10 THESE TWO DIMENSIONS DETERMINE MAXIMUM ANGLE OF THE
LEAD FOR CERTAIN SOCKET APPLICATIONS. IF UNIT IS INTENDED TO BE
SOCKETED . IT IS ADVISABLE TO REVIEW THESE DIMENSION WITH
THE SOCKET VENDOR
11 ALL DIMENSIONS IN INCHES
-H- BOTTOM POINT OF
12 TOP POINT OF MEASUREMENT IS DATUM
MEASUREMENT IS AT MAJOR FLAT AREA OF LOWER PLASTIC SURFACE
(SOCKET SEATING PLANE) DEFINED BY D3/E3
13 PIN NUMBERS ARE FOR REFERENCE ONLY
14 DIMENSION R REQUIRED FOR 120∞ MINIMUM BEND
15
D3
DIMENSION APPLIES TO BASE METAL ONLY
33
Lattice Semiconductor
Package Diagrams
84-Pin CPGA Package
Dimensions in Inches
.145
.070
-AD
1.180
1.140
.008
3
.30 M C A M B M
.10 M C
E
1.180
1.140
3
X
X
.100
.200
.100
-B-
.100
.075
.045
.080 MAX.
-C-
.020
.016
BASE METAL
.0215
.0165
SECTION X-X
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN INCHES.
3.
DIMENSIONS D AND E MAY HAVE MATERIAL PROTRUSION OF
.006 INCHES MAXIMUM ABOVE THE DIMENSION SHOWN
NOT TO EXCEED .003 INCHES MAXIMUM PER SIDE.
34
SEATING PLANE
Lattice Semiconductor
Package Diagrams
84-Pin PLCC Package
Dimensions in Inches
.007 S
H
A-B
S
D S
D
D
.007 S
H A-B
.002 A-B
45∞ X
.048
.042
7
1
S D S
S
-D-
13
3
2
1
3
8
N
.150
MAX
.050
(N-4PLACES)
E
E1
-B-
.075
MAX
7
3
-A3
see
DETAIL B
.007 S
H A-B
// .002 A-B
.007 S
H
S D S
S
A-B
S
D S
9
.020 MAX 3 PLCS
.020 MAX 3 PLCS
9
DETAIL B
35
Lattice Semiconductor
Package Diagrams
84-Pin PLCC Package (cont.)
-C.045 MIN.
7
.025 MIN.
BASE PLANE
.020
MIN
.025/.045 R.
SEE
DETAIL
"A"
A2
45∞x
.056
.042
.004
C
D2
E2
SEE
DETAIL
"J"
SEE
DETAIL
"L"
4
D
E
-A-B-D-
BASE PLANE
.020 MIN.
D2
E2
.050
N-4 PLACES
4
DETAIL "A"
6
X
.032
.026
.007 MAX.
A1
.007 S
A
D S
X
TO BE .007 MAX/LEAD
Y
OPTIONAL FEATURE. IF PRESENT,
MINIMUM SPACE BETWEEN
ADJACENT LEADS IS 0.08.
- C - H -
H A-B S
Y
2
SEATING PLANE
.045 MIN.
5
.025
MIN.
SEATING PLANE
.021
.013
D
D
E
.010
MAX.
10
E
.020
10
.007 M
C A-B S
DETAIL "J"
.020
TYP ALL SIDES
.010
MAX.
.021
.013
10
.065
.065
.0125
.0075
A
A
.020
D2
R
D2
E2
D S
.045
.025
14
.018
.013
E2
SECTION A-A
DETAIL "L"
TYP ALL SIDES
36
.0105
15
.0075
Lattice Semiconductor
Package Diagrams
84-Pin PLCC Package (cont.)
-D-
S
Y
M
B
O
L
MIN. NOM. MAX.
A
A1
A2
D
D1
D2
D3
E
E1
E2
E3
N
.172
.180
.105
.120
.080
1.190 1.195
1.154 1.158
.569
.555
.475
1.185 1.190 1.195
1.150 1.154 1.158
.541 .555
.569
.475
84
.165
.090
.059
1.185
1.150
.541
E3
-A-B12
E3
12
D3
12
NOTES:
1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y14.5M-1982.
-HLOCATED AT TOP OF MOLD PARTING LINE AND
2. DATUM PLANE
CONINCIDENT WITH TOP OF LEAD WHERE LEAD EXIST PLASTIC BODY
3
DATUMS
A-B AND -D- TO BE DETERMINED WHERE CENTER LEADS
EXIT PLASTIC BODY AT DATUM PLANE
-H-
4
TO BE MEASURED AT SEATING PLANE
5
SHAPE OF TRANSITION IS OPTIONAL
6
PLASTIC BODY DETAILS BETWEEN LEADS ARE OPTI0NAL
7
DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS .010 PER SIDE. DIMENSIONS D1 AND E1 INCLUDE MOLD
MISMATCH AND ARE DETERMINED AT THE PARTING LINE; THAT IS D1 AND
E1 ARE MEASURED AT THE EXTREME MATERIAL CONDITION AT THE UPPER
OR LOWER PARTING LINE.
-H-
CONTACT POINT
8 PIN 1 IDENTIFIER MUST BE LOCATED WITHIN HE ZONE INDICATED
DETAILS OF THE IDENTIFIER ARE OPTIONAL.
9 EXACT SHAPE OF THIS FEATURE IS OPTIONAL.
10 THESE TWO DIMENSIONS DETERMINE MAXIMUM ANGLE OF THE
LEAD FOR CERTAIN SOCKET APPLICATIONS. IF UNIT IS INTENDED TO BE
SOCKETED . IT IS ADVISABLE TO REVIEW THESE DIMENSION WITH
THE SOCKET VENDOR
11 ALL DIMENSIONS IN INCHES
-H- BOTTOM POINT OF
12 TOP POINT OF MEASUREMENT IS DATUM
MEASUREMENT IS AT MAJOR FLAT AREA OF LOWER PLASTIC SURFACE
(SOCKET SEATING PLANE) DEFINED BY D3/E3
13 PIN NUMBERS ARE FOR REFERENCE ONLY
14 DIMENSION R REQUIRED FOR 120∞ MINIMUM BEND
15
D3
DIMENSION APPLIES TO BASE METAL ONLY
37
Lattice Semiconductor
Package Diagrams
100-Ball caBGA Package
Dimensions in Millimeters
5
(4X)
aaa
A
D
M
A1 BALL I.D.
IDENTIFIER
10
9
8
7
6
5
4
3
2
B
1
A
B
C
S
D
E
F
e
E
N
G
H
J
K
e
S
4X
b
6
A2
A
3
.15 M C A B
.08 M C
A1
bbb
ddd
C
4
C
SYMBOL
NOTES: UNLESS OTHERWISE SPECIFIED
1.
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3
DIMENSION "b" IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C
4
PRIMARY DATUM C AND SEATING
PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
5
BILATERAL TOLERANCE ZONE IS APPLIED
TO EACH SIDE OF THE PACKAGE BODY.
6
EXACT SHAPE AND SIZE OF THIS FEATURE
IS OPTIONAL.
C
MIN.
MAX.
A
1.30
1.40
1.50
A1
0.31
0.36
0.41
A2
0.99
1.04
1.09
D/E
10.00 BSC
M/N
7.20 BSC
S
0.40 BSC
b
0.40
0.46
0.52
0.80 BSC
e
38
NOM.
aaa
-
-
0.10
bbb
-
-
0.10
ddd
-
-
0.12
Lattice Semiconductor
Package Diagrams
100-Pin PQFP Package
Dimensions in Millimeters
PIN 1 INDICATOR
0.25 C A-B
D 4X
E
E1
-A-
3
N
1
3
-D-
TOP VIEW
BOTTOM VIEW
D
OPTIONAL FEATURE
(HEAT SINK)
D1
9
0.20 H A-B
D 4X
8
3
-B-
SEE DETAIL "A"
0.40 MIN.
e
(N-4)X
0∞ MIN.
SEATING
PLANE
DETAIL "A"
-H-CA
0.12 M
C A-B
D
A2
0.13/0.30 R.
b
0.13
R. MIN.
GAGE PLANE
B
0.25
b
0.10 C
LEAD FINISH
B
A1
0-7∞
L
SECTION B - B
c
1.60 REF.
c1
b1
BASE METAL
NOTES:
1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
2.0 ALL DIMENSIONS ARE IN MILLIMETERS.
3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
4.0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DIMENSIONS.
SYMBOL
MIN.
NOM.
MAX.
A
-
-
3.40
A1
0.25
-
0.50
A2
2.50
2.70
2.90
D
23.20 BSC
D1
20.00 BSC
E
17.20 BSC
E1
5.0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
OF THE PACKAGE BY 0.15 MM.
L
14.00 BSC
0.73
N
6.0 SECTION B-B:
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
8. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
9. EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL.
39
1.03
100
e
7.0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
TO THE LOWEST POINT ON THE PACKAGE BODY.
0.88
0.65 BSC
b
0.22
-
0.40
b1
0.22
0.30
0.36
c
0.11
-
0.23
c1
0.11
0.15
0.19
Lattice Semiconductor
Package Diagrams
100-Pin TQFP Package
Dimensions in Millimeters
0.20 C A-B
PIN 1 INDICATOR
D 100X
D
3
A
E
E1
B
3
e
D
8
D1
3
TOP VIEW
4X
0.20 H A-B
D
BOTTOM VIEW
SIDE VIEW
SEE DETAIL 'A'
b
0.20 M C A-B
SEATING PLANE
C
D
GAUGE PLANE
H
A
A2
0.25
B
LEAD FINISH
b
0.10 C
c1
c
B
0.20 MIN.
A1
0-7∞
L
1.00 REF.
b
DETAIL 'A'
1
BASE METAL
SECTION B-B
SYMBOL
MIN.
NOM.
MAX.
A
-
-
1.60
A1
0.05
-
0.15
1.35
1.40
1.45
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
A2
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
D
16.00 BSC
3.
DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
D1
14.00 BSC
4.
DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DIMENSIONS.
E
16.00 BSC
E1
14.00 BSC
5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
OF THE PACKAGE BY 0.15 MM.
L
N
100
6.
SECTION B-B:
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
e
0.50 BSC
b
0.17
0.22
0.27
7.
A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
TO THE LOWEST POINT ON THE PACKAGE BODY.
b1
0.17
0.20
0.23
c
0.09
0.15
0.20
8.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
c1
0.09
0.13
0.16
40
0.45
0.60
0.75
Lattice Semiconductor
Package Diagrams
120-Pin PQFP Package
Dimensions in Millimeters
PIN 1 INDICATOR
0.25 C A-B
D 4X
D
D1
N
1
TOP VIEW
3
3
A
BOTTOM VIEW
B
E
E1
OPTIONAL FEATURE
9 (HEAT SINK)
0.20 H A-B
D
8
3
SEE DETAIL "A"
0.20 MIN.
SEATING
PLANE
0∞ MIN.
e
(N-4)X
C
DETAIL "A"
H
A
A2
0.13/0.30 R.
b
0.20 M
C A-B
D
0.13
R. MIN.
GAGE PLANE
B
0.25
b
LEAD FINISH
0.10 C
B
A1
0-7∞
L
SECTION B - B
D 4X
c
1.60 REF.
c1
b1
BASE METAL
NOTES:
1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
2.0 ALL DIMENSIONS ARE IN MILLIMETERS.
3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
4.0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DIMENSIONS.
SYMBOL
MIN.
NOM.
MAX.
A
-
-
4.10
A1
0.25
-
0.50
A2
3.20
3.40
3.60
D
31.20 BSC
D1
28.00 BSC
E
31.20 BSC
E1
5.0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
OF THE PACKAGE BY 0.15 MM.
L
6.0 SECTION B-B:
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
7.0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
TO THE LOWEST POINT ON THE PACKAGE BODY.
8. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
9. EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL.
41
28.00 BSC
0.73
0.88
N
120
e
0.80 BSC
1.03
b
0.29
-
0.45
b1
0.29
0.35
0.41
c
0.11
-
0.23
c1
0.11
0.15
0.19
Lattice Semiconductor
Package Diagrams
128-Pin PQFP Package
Dimensions in Millimeters
PIN 1 INDICATOR
D 4X
0.25 C A-B
D
D1
N
1
TOP VIEW
3
3
A
BOTTOM VIEW
B
E
E1
OPTIONAL FEATURE
9 (HEAT SINK)
0.20 H A-B
D
8
3
SEE DETAIL "A"
0.20 MIN.
SEATING
PLANE
0∞ MIN.
e
(N-4)X
C
DETAIL "A"
H
A
A2
0.13/0.30 R.
b
0.20 M
C A-B
D
0.13
R. MIN.
GAGE PLANE
B
0.25
b
LEAD FINISH
0.10 C
B
A1
0-7∞
L
SECTION B - B
D 4X
c
1.60 REF.
c1
b1
BASE METAL
NOTES:
1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
2.0 ALL DIMENSIONS ARE IN MILLIMETERS.
3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
4.0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DIMENSIONS.
SYMBOL
MIN.
NOM.
MAX.
A
-
-
4.10
A1
0.25
-
0.50
A2
3.20
3.40
3.60
D
31.20 BSC
D1
28.00 BSC
E
31.20 BSC
E1
5.0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
OF THE PACKAGE BY 0.15 MM.
L
28.00 BSC
0.73
N
6.0 SECTION B-B:
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
8. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
9. EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL.
42
1.03
128
e
7.0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
TO THE LOWEST POINT ON THE PACKAGE BODY.
0.88
0.80 BSC
b
0.29
-
0.45
b1
0.29
0.35
0.41
c
0.11
-
0.23
c1
0.11
0.15
0.19
Lattice Semiconductor
Package Diagrams
128-Pin TQFP Package
Dimensions in Millimeters
PIN 1 INDICATOR
0.20 C A-B
D
D1
0.20 H A-B D
D
N
1
3. A
E1
E
e
B
D
3.
3.
8. 4X
SEE DETAIL "A"
H
b
0.07
C
A
SEATING PLANE
GAUGE PLANE
0.25
A2
B
M C A -B D
0.08 C
B
A1
LEAD FINISH
0.20 MIN.
0-7∞
b
L
1.00 REF.
c
c1
DETAIL "A"
b
1
BASE METAL
SECTION B - B
SYMBOL
MIN.
NOM.
MAX.
A
-
-
1.60
NOTES:
A1
0.05
-
0.15
1.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
A2
1.35
1.40
1.45
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
D
16.00 BSC
3.
DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
D1
14.00 BSC
4.
DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DIMENSIONS.
E
16.00 BSC
E1
14.00 BSC
L
5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
OF THE PACKAGE BY 0.15 MM.
6.
SECTION B-B:
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
7.
A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
TO THE LOWEST POINT ON THE PACKAGE BODY.
8.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
43
0.45
0.60
N
128
e
0.40 BSC
0.18
0.75
b
0.13
b1
0.13
0.16
0.23
0.19
c
0.09
0.15
0.20
c1
0.09
0.13
0.16
Lattice Semiconductor
Package Diagrams
133-Pin CPGA Package
Dimensions in Inches
.145
.070
-A-
D
1.480
1.440
.008
3
.30 M C A M B M
.10 M C
.050
E
1.480
1.440
3
X
X
.100
.200
.100
.050
-B.100
.075
.045
.080 MAX.
SEATING PLANE
-C-
.020
.016
BASE METAL
.0215
.0165
SECTION X-X
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN INCHES.
3.
DIMENSIONS D AND E MAY HAVE MATERIAL PROTRUSION OF
.006 INCHES MAXIMUM ABOVE THE DIMENSION SHOWN
NOT TO EXCEED .003 INCHES MAXIMUM PER SIDE.
44
Lattice Semiconductor
Package Diagrams
144-Ball fpBGA Package
Dimensions in Millimeters
A1 BALL I.D.
IDENTIFIER
5
aaa
(4X)
A
D
M
B
B
12 11 10
9
8
7
6
5
4
3
2
1
A
B
S
C
D
E
F
N
G
E
C
H
J
K
L
M
e
e
S
4X
b
3
A
.25 M C A B
.10 M C
A2
A1
ccc
bbb
ddd
C
C
C
4
C
SYMBOL
NOTES: UNLESS OTHERWISE SPECIFIED
1.
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3
6
DIMENSION "b" IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C
4
PRIMARY DATUM C AND SEATING
PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
5
BILATERAL TOLERANCE ZONE IS APPLIED
TO EACH SIDE OF THE PACKAGE BODY.
6
EXACT SHAPE AND SIZE OF THIS FEATURE
IS OPTIONAL.
MIN.
MAX.
A
1.30
1.70
2.10
A1
0.30
0.50
0.70
A2
0.30
0.50
0.70
B/C
11.00
11.60
12.20
D/E
13.00 BSC
M/N
11.00 BSC
S
b
0.50 BSC
0.40
0.55
0.70
1.00 BSC
e
45
NOM.
aaa
-
-
0.20
bbb
-
-
0.25
ccc
-
-
0.35
ddd
-
-
0.20
Lattice Semiconductor
Package Diagrams
144-Pin PQFP Package
Dimensions in Millimeters
PIN 1 INDICATOR
0.25 C A-B
D 4X
D
D1
N
1
TOP VIEW
3
3
BOTTOM VIEW
B
A
E
E1
OPTIONAL FEATURE
9 (HEAT SINK)
0.20 H A-B
D
8
3
SEE DETAIL "A"
0.20 MIN.
SEATING
PLANE
0∞ MIN.
e
(N-4)X
C
DETAIL "A"
H
A
A2
0.13/0.30 R.
b
0.13 M
C A-B
D
0.13
R. MIN.
GAGE PLANE
B
0.25
b
LEAD FINISH
0.10 C
B
A1
0-7∞
L
SECTION B - B
D 4X
c
1.60 REF.
c1
b1
BASE METAL
NOTES:
1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
2.0 ALL DIMENSIONS ARE IN MILLIMETERS.
3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
4.0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DIMENSIONS.
SYMBOL
MIN.
NOM.
MAX.
A
-
-
4.10
A1
0.25
-
0.50
A2
3.20
3.40
3.60
D
31.20 BSC
D1
28.00 BSC
E
31.20 BSC
28.00 BSC
E1
5.0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
OF THE PACKAGE BY 0.15 MM.
L
0.73
N
6.0 SECTION B-B:
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
8. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
9. EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL.
46
1.03
144
e
7.0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
TO THE LOWEST POINT ON THE PACKAGE BODY.
0.88
0.65 BSC
b
0.22
-
0.40
b1
0.22
0.30
0.36
c
0.11
-
0.23
c1
0.11
0.15
0.19
Lattice Semiconductor
Package Diagrams
144-Pin TQFP Package
Dimensions in Millimeters
PIN 1 INDICATOR
0.20 C A-B
D
D1
0.20 H A-B D
D
N
1
3. A
E1
E
e
B
D
3.
3.
8. 4X
SEE DETAIL "A"
H
b
0.08
C
A
SEATING PLANE
GAUGE PLANE
0.25
A2
B
M C A -B D
0.08 C
B
A1
LEAD FINISH
0.20 MIN.
0-7∞
b
L
1.00 REF.
c
c1
DETAIL "A"
b
1
BASE METAL
SECTION B - B
SYMBOL
MIN.
NOM.
MAX.
A
-
-
1.60
A1
0.05
-
0.15
A2
1.35
1.40
1.45
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
4.
D
22.00 BSC
DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
D1
20.00 BSC
DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DIMENSIONS.
E
22.00 BSC
E1
20.00 BSC
L
5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
OF THE PACKAGE BY 0.15 MM.
6.
SECTION B-B:
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
7.
A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
TO THE LOWEST POINT ON THE PACKAGE BODY.
8.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
0.45
N
0.75
144
e
47
0.60
0.50 BSC
b
0.17
0.22
0.27
b1
0.17
0.20
0.23
c
0.09
0.15
0.20
c1
0.09
0.13
0.16
Lattice Semiconductor
Package Diagrams
160-Pin PQFP Package
Dimensions in Millimeters
PIN 1 INDICATOR
0.25 C A-B
D 4X
D
D1
N
1
TOP VIEW
3
3
A
BOTTOM VIEW
B
E
E1
OPTIONAL FEATURE
9 (HEAT SINK)
0.20 H A-B
D
8
3
SEE DETAIL "A"
0.20 MIN.
SEATING
PLANE
0∞ MIN.
e
(N-4)X
C
DETAIL "A"
H
A
A2
0.13/0.30 R.
b
0.13 M
C A-B
D
0.13
R. MIN.
GAGE PLANE
B
0.25
b
LEAD FINISH
0.10 C
B
A1
0-7∞
L
SECTION B - B
D 4X
c
1.60 REF.
c1
b1
BASE METAL
MIN.
NOM.
MAX.
A
-
-
4.10
A1
0.25
-
0.50
A2
3.20
3.40
3.60
SYMBOL
NOTES:
1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
2.0 ALL DIMENSIONS ARE IN MILLIMETERS.
3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
4.0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DIMENSIONS.
D
31.20 BSC
D1
28.00 BSC
E
31.20 BSC
28.00 BSC
E1
5.0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
OF THE PACKAGE BY 0.15 MM.
L
0.73
6.0 SECTION B-B:
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
8. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
9. EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL.
48
1.03
0.65 BSC
e
7.0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
TO THE LOWEST POINT ON THE PACKAGE BODY.
0.88
160
N
b
0.22
-
0.40
b1
0.22
0.30
0.36
c
0.11
-
0.23
c1
0.11
0.15
0.19
Lattice Semiconductor
Package Diagrams
176-Pin TQFP Package
Dimensions in Millimeters
PIN 1 INDICATOR
0.20 C A-B
D
D1
0.20 H A-B D
D
N
1
3. A
E1
E
e
B
D
3.
3.
8. 4X
SEE DETAIL "A"
H
b
C
0.08
A
SEATING PLANE
GAUGE PLANE
0.25
A2
M C A -B D
B
0.08 C
B
A1
LEAD FINISH
0.20 MIN.
0-7∞
b
L
1.00 REF.
c
c1
DETAIL "A"
b
1
BASE METAL
SECTION B - B
SYMBOL
MIN.
NOM.
MAX.
A
-
-
1.60
A1
0.05
-
0.15
1.35
1.40
1.45
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
A2
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
D
26.00 BSC
3.
DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
D1
24.00 BSC
4.
DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DIMENSIONS.
E
26.00 BSC
E1
L
5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
OF THE PACKAGE BY 0.15 MM.
6.
7.
8.
SECTION B-B:
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
TO THE LOWEST POINT ON THE PACKAGE BODY.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
49
24.00 BSC
0.45
0.60
N
176
e
0.50 BSC
0.22
0.75
b
0.17
0.27
b1
0.17
0.20
0.23
c
0.09
0.15
0.20
c1
0.09
0.13
0.16
Lattice Semiconductor
Package Diagrams
208-Ball fpBGA Package
Dimensions in Millimeters
A1 BALL I.D.
IDENTIFIER
5
aaa
(4X)
A
D
M
B
B
16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
A
B
C
D
S
E
F
G
H
E
C
N
J
K
L
M
N
P
R
T
e
e
S
3
A
.25 M C A B
.10 M C
A2
A1
ccc
bbb
ddd
C
C
C
4
C
SYMBOL
NOTES: UNLESS OTHERWISE SPECIFIED
1.
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3
6
4X
b
DIMENSION "b" IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C
4
PRIMARY DATUM C AND SEATING
PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
5
BILATERAL TOLERANCE ZONE IS APPLIED
TO EACH SIDE OF THE PACKAGE BODY.
6
EXACT SHAPE AND SIZE OF THIS FEATURE
IS OPTIONAL.
MIN.
MAX.
A
1.30
1.70
2.10
A1
0.30
0.50
0.70
A2
0.30
0.50
0.70
B/C
14.80
15.30
15.80
D/E
17.00 BSC
M/N
15.00 BSC
S
b
0.50 BSC
0.40
e
50
NOM.
0.55
0.70
1.00 BSC
aaa
-
-
0.20
bbb
-
-
0.25
ccc
-
-
0.35
ddd
-
-
0.20
Lattice Semiconductor
Package Diagrams
208-Pin PQFP Package
(with or without Internal Heat Spreader)
Dimensions in Millimeters
PIN 1 INDICATOR
D 4X
0.25 C A-B
D
D1
N
1
TOP VIEW
3
3
A
BOTTOM VIEW
B
E
E1
OPTIONAL FEATURE
9 (HEAT SINK)
0.20 H A-B
D
8
3
SEE DETAIL "A"
0.20 MIN.
SEATING
PLANE
0∞ MIN.
e
(N-4)X
C
DETAIL "A"
H
A
A2
0.08/0.25 R.
b
0.08 M
C A-B
D
0.08
R. MIN.
GAGE PLANE
B
0.25
b
LEAD FINISH
0.08 C
B
A1
0-8∞
L
SECTION B - B
D 4X
c
1.30 REF.
c1
b1
BASE METAL
NOTES:
1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
2.0 ALL DIMENSIONS ARE IN MILLIMETERS.
3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
4.0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DIMENSIONS.
SYMBOL
MIN.
NOM.
MAX.
A
-
-
4.10
A1
0.25
-
0.50
A2
3.20
3.40
3.60
D
30.60 BSC
D1
28.00 BSC
E
30.60 BSC
E1
5.0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
OF THE PACKAGE BY 0.15 MM.
L
28.00 BSC
0.45
N
6.0 SECTION B-B:
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
8. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
9. EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL.
51
0.75
208
e
7.0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
TO THE LOWEST POINT ON THE PACKAGE BODY.
0.60
0.50 BSC
b
0.17
-
0.27
b1
0.17
0.20
0.23
c
0.09
-
0.20
c1
0.09
0.12
0.16
Lattice Semiconductor
Package Diagrams
240-Pin MQFP Package
Dimensions in Millimeters
PIN 1 INDICATOR
D1
D
N
1
TOP VIEW
BOTTOM VIEW
E
E1
2.54 TYP.
SEE DETAIL "A"
0.35 MIN.
SEATING
PLANE
0∞ MIN.
e
(N-4)X
C
DETAIL "A"
A
A2
0.08/0.25 R.
b
0.08 M
C
0.16R
TYP.
GAGE PLANE
B
0.25
b
0.08 C
LEAD FINISH
B
A1
0-8∞
L
SECTION B - B
c
c1
b1
BASE METAL
SYMBOL
MIN.
NOM.
MAX.
A
-
-
4.15
A1
0.25
-
0.65
NOTES:
1.0
DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
A2
3.10
3.35
3.60
2.0
ALL DIMENSIONS ARE IN MILLIMETERS.
D
34.40
34.60
34.80
3.0
SECTION B-B:
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD
BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
D1
31.60
31.70
31.80
E
34.40
34.60
34.80
E1
31.60
31.70
31.80
L
0.45
0.60
0.75
N
240
e
52
0.50 BSC
b
0.17
-
0.27
b1
0.17
0.20
0.23
c
0.09
-
0.20
c1
0.09
0.12
0.16
Lattice Semiconductor
Package Diagrams
240-Pin PQFP Package
Dimensions in Millimeters
PIN 1 INDICATOR
0.25 C A-B
D 4X
D
D1
N
1
TOP VIEW
3
3
BOTTOM VIEW
B
A
E
E1
OPTIONAL FEATURE
9 (HEAT SINK)
0.20 H A-B
D
8
3
SEE DETAIL "A"
0.20 MIN.
SEATING
PLANE
0∞ MIN.
e
(N-4)X
C
DETAIL "A"
H
A
A2
0.08/0.25 R.
b
0.08 M
C A-B
D
0.08
R. MIN.
GAGE PLANE
B
0.25
b
LEAD FINISH
0.08 C
B
A1
0-8∞
L
SECTION B - B
D 4X
c
1.30 REF.
c1
b1
BASE METAL
NOTES:
1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
2.0 ALL DIMENSIONS ARE IN MILLIMETERS.
3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
4.0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DIMENSIONS.
SYMBOL
MIN.
NOM.
MAX.
A
-
-
4.10
A1
0.25
-
0.50
A2
3.20
3.40
3.60
D
34.60 BSC
D1
32.00 BSC
E
34.60 BSC
E1
5.0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
OF THE PACKAGE BY 0.15 MM.
L
32.00 BSC
0.45
N
6.0 SECTION B-B:
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
8. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
9. EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL.
53
0.75
240
e
7.0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
TO THE LOWEST POINT ON THE PACKAGE BODY.
0.60
0.50 BSC
b
0.17
-
0.27
b1
0.17
0.20
0.23
c
0.09
-
0.20
c1
0.09
0.12
0.16
Lattice Semiconductor
Package Diagrams
256-Ball fpBGA Package
Dimensions in Millimeters
A1 BALL I.D.
IDENTIFIER
5
aaa
(4X)
A
D
M
B
B
16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
A
B
C
D
S
E
F
G
H
E
C
N
J
K
L
M
N
P
R
T
e
e
S
3
A
.25 M C A B
.10 M C
A2
A1
ccc
bbb
ddd
C
C
C
4
C
SYMBOL
NOTES: UNLESS OTHERWISE SPECIFIED
1.
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3
6
4X
b
DIMENSION "b" IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C
4
PRIMARY DATUM C AND SEATING
PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
5
BILATERAL TOLERANCE ZONE IS APPLIED
TO EACH SIDE OF THE PACKAGE BODY.
6
EXACT SHAPE AND SIZE OF THIS FEATURE
IS OPTIONAL.
MIN.
MAX.
A
1.30
1.70
2.10
A1
0.30
0.50
0.70
A2
0.30
0.50
0.70
B/C
14.80
15.30
15.80
D/E
17.00 BSC
M/N
15.00 BSC
S
b
0.50 BSC
0.40
e
54
NOM.
0.55
0.70
1.00 BSC
aaa
-
-
0.20
bbb
-
-
0.25
ccc
-
-
0.35
ddd
-
-
0.20
Lattice Semiconductor
Package Diagrams
256-Ball SBGA Package
Dimensions in Millimeters
(4X)
aaa
A1 BALL I.D.
IDENTIFIER
M
5
A
D
B
20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
S
A
A
N
E
e
e
S
b
4X
6
.30 M C A B
.15 M C
3
A1
A4
bbb
C
ddd
Q
A2 A
4
C
C
A-A SECTION VIEW
SYMBOL
NOTES: UNLESS OTHERWISE SPECIFIED
1.
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3
DIMENSION "b" IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C
4
PRIMARY DATUM C AND SEATING
PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
5
BILATERAL TOLERANCE ZONE IS APPLIED
TO EACH SIDE OF THE PACKAGE BODY.
6
EXACT SHAPE AND SIZE OF THIS FEATURE
IS OPTIONAL.
MIN.
NOM.
A
-
-
1.70
A1
0.50
0.65
0.80
A2
0.80
0.90
1.00
D/E
27.00 BSC
M/N
24.13 BSC
S
0.635 BSC
b
0.60
e
55
0.75
MAX.
0.90
1.27 BSC
Q
0.25
-
-
A4
0.10
-
-
aaa
-
-
0.20
bbb
-
-
0.25
ddd
-
-
0.20
Lattice Semiconductor
Package Diagrams
272-Ball BGA Package
Dimensions in Millimeters
5
(4X)
aaa
A
D
M
20
16
18
19
17
14
15
12
13
A1 BALL I.D.
IDENTIFIER
10
11
6
8
9
7
4
5
B
B
2
1
3
A
B
C
D
E
F
G
S
H
J
K
N
L
C
E
M
N
P
R
T
U
V
W
Y
e
e
S
b
6
4X
3
.30 M C A B
.15 M C
A
A2
A1
ccc
bbb
ddd
4
C
C
SYMBOL
NOTES: UNLESS OTHERWISE SPECIFIED
1.
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3
DIMENSION "b" IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C
4
PRIMARY DATUM C AND SEATING
PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
5
BILATERAL TOLERANCE ZONE IS APPLIED
TO EACH SIDE OF THE PACKAGE BODY.
6
EXACT SHAPE AND SIZE OF THIS FEATURE
IS OPTIONAL.
C
C
MIN.
MAX.
A
1.90
2.25
2.80
A1
0.50
0.65
0.80
A2
0.28
0.54
0.80
B/C
23.80
24.30
24.80
D/E
27.00 BSC
M/N
24.13 BSC
S
0.635 BSC
b
0.60
0.75
0.90
1.27 BSC
e
56
NOM.
aaa
-
-
0.20
bbb
-
-
0.25
ccc
-
-
0.35
ddd
-
-
0.20
Lattice Semiconductor
Package Diagrams
304-Pin MQFP Package
Dimensions in Millimeters
PIN 1 INDICATOR
D1
D
N
1
TOP VIEW
BOTTOM VIEW
E
E1
2.54 TYP.
SEE DETAIL "A"
0.35 MIN.
SEATING
PLANE
0∞ MIN.
e
(N-4)X
C
DETAIL "A"
A
A2
0.08/0.25 R.
b
0.08 M
C
0.16R
TYP.
GAGE PLANE
B
0.25
b
0.08 C
LEAD FINISH
B
A1
0-8∞
L
SECTION B - B
c
c1
b1
BASE METAL
NOTES:
1.0
SYMBOL
MIN.
NOM.
MAX.
A
-
-
4.55
A1
0.25
-
0.65
A2
3.60
3.80
4.00
D
42.40
42.60
42.80
D1
39.60
39.70
39.80
E
42.40
42.60
42.80
E1
39.60
39.70
39.80
L
0.45
0.60
0.75
DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
2.0
ALL DIMENSIONS ARE IN MILLIMETERS.
3.0
SECTION B-B:
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD
BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
N
304
e
57
0.50 BSC
b
0.17
-
0.27
b1
0.17
0.20
0.23
c
0.09
-
0.20
c1
0.09
0.12
0.16
Lattice Semiconductor
Package Diagrams
304-Pin PQFP Package
Dimensions in Millimeters
PIN 1 INDICATOR
D 4X
0.25 C A-B
D
D1
N
1
TOP VIEW
3
3
A
BOTTOM VIEW
B
E
E1
OPTIONAL FEATURE
9 (HEAT SINK)
0.20 H A-B
D
8
3
SEE DETAIL "A"
0.20 MIN.
SEATING
PLANE
0∞ MIN.
e
(N-4)X
C
DETAIL "A"
H
A
A2
0.08/0.25 R.
b
0.08 M
C A-B
D
0.08
R. MIN.
GAGE PLANE
B
0.25
b
LEAD FINISH
0.08 C
B
A1
0-8∞
L
SECTION B - B
D 4X
c
1.30 REF.
c1
b1
BASE METAL
NOTES:
1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
2.0 ALL DIMENSIONS ARE IN MILLIMETERS.
3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
4.0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DIMENSIONS.
SYMBOL
MIN.
NOM.
MAX.
A
-
-
4.50
A1
0.25
-
0.50
A2
3.55
3.80
4.05
D
42.60 BSC
D1
40.00 BSC
E
42.60 BSC
40.00 BSC
E1
5.0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
OF THE PACKAGE BY 0.15 MM.
L
0.45
6.0 SECTION B-B:
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
8. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
9. EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL.
58
0.75
0.50 BSC
e
7.0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
TO THE LOWEST POINT ON THE PACKAGE BODY.
0.60
304
N
b
0.17
-
0.27
b1
0.17
0.20
0.23
c
0.09
-
0.20
c1
0.09
0.12
0.16
Lattice Semiconductor
Package Diagrams
320-Ball SBGA Package
Dimensions in Millimeters
5
(4X)
aaa
A
D
A1 BALL I.D.
IDENTIFIER
M
B
23
24
21
22
19
20
17
18
13
15
16
14
9
11
12
10
7
8
5
6
3
4
1
2
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
S
A
A
N
E
e
e
S
b
4X
6
.30 M C A B
.15 M C
3
A1
A2 A
A4
bbb
ddd
Q
C
C
4
C
A-A SECTION VIEW
SYMBOL
NOTES: UNLESS OTHERWISE SPECIFIED
1.
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3
DIMENSION "b" IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C
4
PRIMARY DATUM C AND SEATING
PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
5
BILATERAL TOLERANCE ZONE IS APPLIED
TO EACH SIDE OF THE PACKAGE BODY.
6
EXACT SHAPE AND SIZE OF THIS FEATURE
IS OPTIONAL.
MIN.
MAX.
A
-
-
1.70
A1
0.50
0.65
0.80
A2
0.80
0.90
1.00
D/E
31.00 BSC
M/N
29.21 BSC
S
0.635 BSC
b
0.60
e
59
NOM.
0.75
0.90
1.27 BSC
Q
0.25
-
-
A4
0.10
-
-
aaa
-
-
0.20
bbb
-
-
0.25
ddd
-
-
0.20
Lattice Semiconductor
Package Diagrams
352-Ball SBGA Package
Dimensions in Millimeters
5
(4X)
aaa
A
D
A1 BALL I.D.
IDENTIFIER
M
B
26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
S
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
A
e
A
N
E
e
S
6
4X
b
.30 M C A B
.15 M C
3
A1
A2 A
A4
bbb
ddd
Q
C
C
4
C
A-A SECTION VIEW
1.
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3
DIMENSION "b" IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C
4
PRIMARY DATUM C AND SEATING
PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
5
BILATERAL TOLERANCE ZONE IS APPLIED
TO EACH SIDE OF THE PACKAGE BODY.
6
EXACT SHAPE AND SIZE OF THIS FEATURE
IS OPTIONAL.
MIN.
NOM.
A
-
-
1.70
A1
0.50
0.65
0.80
A2
0.80
0.90
1.00
SYMBOL
NOTES: UNLESS OTHERWISE SPECIFIED
D/E
35.00 BSC
M/N
31.75 BSC
S
0.635 BSC
b
0.60
e
60
0.75
MAX.
0.90
1.27 BSC
Q
0.25
-
-
A4
0.10
-
-
aaa
-
-
0.20
bbb
-
-
0.25
ddd
-
-
0.20
Lattice Semiconductor
Package Diagrams
388-Ball BGA Package
Dimensions in Millimeters
5
(4X)
aaa
A
D
A1 BALL I.D.
IDENTIFIER
M
26
24
25
22
23
20
21
18
19
16
17
12
14
15
13
10
11
8
9
6
7
4
5
B
B
2
3
1
A
B
C
D
E
F
G
H
J
S
K
L
M
N
N
P
C
E
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
e
e
S
3
A2
A
.30 M C A B
.15 M C
A1
ccc
bbb
ddd
C
C
C
4
C
SYMBOL
NOTES: UNLESS OTHERWISE SPECIFIED
1.
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3
6
4X
b
DIMENSION "b" IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C
4
PRIMARY DATUM C AND SEATING
PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
5
BILATERAL TOLERANCE ZONE IS APPLIED
TO EACH SIDE OF THE PACKAGE BODY.
6
EXACT SHAPE AND SIZE OF THIS FEATURE
IS OPTIONAL.
MIN.
MAX.
1.90
2.80
3.25
A1
0.50
0.65
0.80
A2
0.28
0.54
0.80
B/C
29.80
31.80
33.80
D/E
35.00 BSC
M/N
31.75 BSC
S
0.635 BSC
b
0.60
e
61
NOM.
A
0.75
0.90
1.27 BSC
aaa
-
-
0.20
bbb
-
-
0.25
ccc
-
-
0.35
ddd
-
-
0.20
Lattice Semiconductor
Package Diagrams
388-Ball fpBGA Package
Dimensions in Millimeters
5
A1 BALL I.D.
IDENTIFIER
(4X)
aaa
A
D
M
B
B
22 21 20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
S
H
J
K
L
N
M
C
E
N
P
R
T
U
V
W
Y
AA
AB
e
e
S
6
4X
b
A
3
.25 M C A B
.10 M C
ccc
bbb
ddd
4
C
C
C
C
SYMBOL
NOTES: UNLESS OTHERWISE SPECIFIED
1.
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3
A2
A1
DIMENSION "b" IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C
4
PRIMARY DATUM C AND SEATING
PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
5
BILATERAL TOLERANCE ZONE IS APPLIED
TO EACH SIDE OF THE PACKAGE BODY.
6
EXACT SHAPE AND SIZE OF THIS FEATURE
IS OPTIONAL.
MIN.
MAX.
A
1.70
2.15
2.60
A1
0.30
0.50
0.70
A2
0.30
0.50
0.70
B/C
19.30
19.80
20.30
D/E
23.00 BSC
M/N
21.00 BSC
S
b
0.50 BSC
0.40
e
62
NOM.
0.55
0.70
1.00 BSC
aaa
-
-
0.20
bbb
-
-
0.25
ccc
-
-
0.35
ddd
-
-
0.20
Lattice Semiconductor
Package Diagrams
416-Ball fpBGA Package
Dimensions in Millimeters
5
A1 BALL I.D.
IDENTIFIER
aaa
(4X)
26
24
25
20
22
23
21
18
19
16
17
14
15
A
D
M
10
12
13
11
8
9
6
7
4
5
B
2
3
B
1
A
B
C
D
E
F
G
H
J
S
K
L
M
N
P
N
C
E
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
e
e
S
6
4X
b
A
3
.25 M C A B
.10 M C
A1
ccc
C
bbb
ddd
C
4
C
SYMBOL
NOTES: UNLESS OTHERWISE SPECIFIED
1.
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3
C
DIMENSION "b" IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C
4
PRIMARY DATUM C AND SEATING
PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
5
BILATERAL TOLERANCE ZONE IS APPLIED
TO EACH SIDE OF THE PACKAGE BODY.
6
EXACT SHAPE AND SIZE OF THIS FEATURE
IS OPTIONAL.
MIN.
MAX.
1.70
2.15
2.60
A1
0.30
0.50
0.70
A2
0.30
0.50
0.70
B/C
23.80
24.80
25.80
D/E
27.00 BSC
M/N
25.00 BSC
S
b
0.50 BSC
0.40
e
63
NOM.
A
0.55
0.70
1.00 BSC
aaa
-
-
0.20
bbb
-
-
0.25
ccc
-
-
0.35
ddd
-
-
0.20
A2
Lattice Semiconductor
Package Diagrams
432-Ball SBGA Package
Dimensions in Millimeters
5
(4X)
aaa
A1 BALL I.D.
IDENTIFIER
A
D
M
B
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
S
A
N
E
e
e
S
6
4X
b
.30 M C A B
.15 M C
3
A1
bbb
A4
ddd
A2 A
C
C
4
C
Q
A-A SECTION VIEW
SYMBOL
NOTES: UNLESS OTHERWISE SPECIFIED
1.
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3
DIMENSION "b" IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C
4
PRIMARY DATUM C AND SEATING
PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
5
BILATERAL TOLERANCE ZONE IS APPLIED
TO EACH SIDE OF THE PACKAGE BODY.
6
EXACT SHAPE AND SIZE OF THIS FEATURE
IS OPTIONAL.
MIN.
MAX.
A
-
-
1.70
A1
0.50
0.65
0.80
A2
0.80
0.90
1.00
D/E
40.00 BSC
M/N
38.10 BSC
S
b
0.00 BSC
0.60
e
64
NOM.
0.75
0.90
1.27 BSC
Q
0.25
-
-
A4
0.10
-
-
aaa
-
-
0.20
bbb
-
-
0.25
ddd
-
-
0.20
Lattice Semiconductor
Package Diagrams
484-Ball fpBGA Package
Dimensions in Millimeters
A1 BALL I.D.
IDENTIFIER
(4X)
5
aaa
A
D
M
B
B
22 21 20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
S
H
J
K
L
N
M
C
E
N
P
R
T
U
V
W
Y
AA
AB
e
e
S
6
4X
b
A
3
.25 M C A B
.10 M C
ccc
bbb
ddd
4
C
C
C
C
SYMBOL
NOTES: UNLESS OTHERWISE SPECIFIED
1.
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3
A2
A1
DIMENSION "b" IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C
4
PRIMARY DATUM C AND SEATING
PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
5
BILATERAL TOLERANCE ZONE IS APPLIED
TO EACH SIDE OF THE PACKAGE BODY.
6
EXACT SHAPE AND SIZE OF THIS FEATURE
IS OPTIONAL.
MIN.
MAX.
A
1.70
2.15
2.60
A1
0.30
0.50
0.70
A2
0.30
0.50
0.70
B/C
19.30
19.80
20.30
D/E
23.00 BSC
M/N
21.00 BSC
0.50 BSC
S
b
0.40
e
65
NOM.
0.55
0.70
1.00 BSC
aaa
-
-
0.20
bbb
-
-
0.25
ccc
-
-
0.35
ddd
-
-
0.20
Lattice Semiconductor
Package Diagrams
492-Ball BGA Package
Dimensions in Millimeters
5
(4X)
aaa
A
D
A1 BALL I.D.
IDENTIFIER
M
24
26
25
22
23
20
21
16
18
19
17
14
15
12
13
10
11
8
9
6
7
4
5
B
B
2
3
1
A
B
C
D
E
F
G
H
J
S
K
L
M
N
N
P
C
E
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
e
e
S
6
4X
b
A2
A
3
A1
.30 M C A B
.15 M C
ccc
bbb
ddd
C
C
4
C
SYMBOL
NOTES: UNLESS OTHERWISE SPECIFIED
1.
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3
C
DIMENSION "b" IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C
4
PRIMARY DATUM C AND SEATING
PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
5
BILATERAL TOLERANCE ZONE IS APPLIED
TO EACH SIDE OF THE PACKAGE BODY.
6
EXACT SHAPE AND SIZE OF THIS FEATURE
IS OPTIONAL.
MIN.
MAX.
A
1.90
2.80
3.25
A1
0.50
0.65
0.80
A2
0.28
0.54
0.80
B/C
29.80
30.30
30.80
D/E
35.00 BSC
M/N
31.75 BSC
0.635 BSC
S
b
0.60
e
66
NOM.
0.75
0.90
1.27 BSC
aaa
-
-
0.20
bbb
-
-
0.25
ccc
-
-
0.35
ddd
-
-
0.20
Lattice Semiconductor
Package Diagrams
516-Ball fpBGA Package
Dimensions in Millimeters
5
A1 BALL I.D.
IDENTIFIER
aaa
(4X)
A
D
M
30
28
29
26
27
24
25
20
22
23
21
18
19
16
17
14
15
10
12
13
11
8
9
6
7
4
5
2
3
B
B
1
A
B
C
D
E
F
G
H
J
K
L
S
M
N
P
R
OPTIONAL FEATURE
(HEAT SINK)
N
T
E
C
U
6
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
e
AK
b
e
S
4X
.25 M C A B
.10 M C
3
6
A
A1
ccc
C
bbb
ddd
C
4
C
SYMBOL
NOTES: UNLESS OTHERWISE SPECIFIED
1.
2.
3
C
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
MIN.
MAX.
1.70
2.15
2.60
A1
0.30
0.50
0.70
A2
0.30
0.50
0.70
B/C
25.80
27.55
29.30
ALL DIMENSIONS ARE IN MILLIMETERS.
DIMENSION "b" IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C
4
PRIMARY DATUM C AND SEATING
PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
5
BILATERAL TOLERANCE ZONE IS APPLIED
TO EACH SIDE OF THE PACKAGE BODY.
D/E
31.00 BSC
M/N
29.00 BSC
S
b
0.50 BSC
0.40
e
6
NOM.
A
EXACT SHAPE AND SIZE OF THIS FEATURE
IS OPTIONAL.
67
0.55
0.70
1.00 BSC
aaa
-
-
0.20
bbb
-
-
0.25
ccc
-
-
0.35
ddd
-
-
0.20
A2
Lattice Semiconductor
Package Diagrams
600-Ball SBGA Package
Dimensions in Millimeters
A1 BALL I.D.
IDENTIFIER
5
aaa
(4X)
A
D
M
B
35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
AR
S
A
e
A
N
E
S
e
6
4X
b
.30 M C A B
.15 M C
3
A1
bbb
A4
ddd
C
C
4
C
Q
A-A SECTION VIEW
SYMBOL
NOTES: UNLESS OTHERWISE SPECIFIED
1.
2.
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
ALL DIMENSIONS ARE IN MILLIMETERS.
3
DIMENSION "b" IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C
4
PRIMARY DATUM C AND SEATING
PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
5
6
MIN.
A
-
-
1.70
0.50
0.65
0.80
A2
0.80
0.90
1.00
D/E
45.00 BSC
M/N
43.18 BSC
b
0.00 BSC
0.60
e
EXACT SHAPE AND SIZE OF THIS FEATURE
IS OPTIONAL.
68
MAX.
A1
S
BILATERAL TOLERANCE ZONE IS APPLIED
TO EACH SIDE OF THE PACKAGE BODY.
NOM.
0.75
0.90
1.27 BSC
Q
0.25
-
A4
-
0.10
-
-
aaa
-
-
0.20
bbb
-
-
0.25
ddd
-
-
0.20
A2 A
Lattice Semiconductor
Package Diagrams
672-Ball fpBGA Package
Dimensions in Millimeters
5
A1 BALL I.D.
IDENTIFIER
aaa
(4X)
24
25
20
22
23
21
16
18
19
17
14
15
A
D
M
26
13
8
10
12
11
9
6
7
4
5
B
2
3
B
1
A
B
C
D
E
F
G
H
J
S
K
L
M
N
P
OPTIONAL FEATURE
(HEAT SINK)
N
C
E
R
6
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
e
e
S
6
4X
b
A
3
.25 M C A B
.10 M C
A1
ccc
C
bbb
ddd
C
4
C
SYMBOL
NOTES: UNLESS OTHERWISE SPECIFIED
1.
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3
C
DIMENSION "b" IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C
4
PRIMARY DATUM C AND SEATING
PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
5
BILATERAL TOLERANCE ZONE IS APPLIED
TO EACH SIDE OF THE PACKAGE BODY.
6
EXACT SHAPE AND SIZE OF THIS FEATURE
IS OPTIONAL.
MIN.
MAX.
A
1.70
2.15
2.60
A1
0.30
0.50
0.70
A2
0.30
0.50
0.70
B/C
23.80
24.80
25.80
D/E
27.00 BSC
M/N
25.00 BSC
S
b
0.50 BSC
0.40
0.55
0.70
1.00 BSC
e
69
NOM.
aaa
-
-
0.20
bbb
-
-
0.25
ccc
-
-
0.35
ddd
-
-
0.20
A2
Lattice Semiconductor
Package Diagrams
676-Ball fpBGA Package
Dimensions in Millimeters
5
A1 BALL I.D.
IDENTIFIER
aaa
(4X)
A
D
M
30
28
29
26
27
24
25
20
22
23
21
18
19
16
17
14
15
10
12
13
11
8
9
6
7
4
5
2
3
B
B
1
A
B
C
D
E
F
G
H
J
K
L
S
M
N
P
R
N
T
E
C
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
e
AK
b
e
S
4X
.25 M C A B
.10 M C
3
6
A
A1
ccc
C
bbb
ddd
C
4
C
SYMBOL
NOTES: UNLESS OTHERWISE SPECIFIED
1.
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3
C
DIMENSION "b" IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C
4
PRIMARY DATUM C AND SEATING
PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
5
BILATERAL TOLERANCE ZONE IS APPLIED
TO EACH SIDE OF THE PACKAGE BODY.
6
EXACT SHAPE AND SIZE OF THIS FEATURE
IS OPTIONAL.
MIN.
MAX.
A
1.70
2.15
2.60
A1
0.30
0.50
0.70
A2
0.30
0.50
0.70
B/C
25.80
27.30
28.80
D/E
31.00 BSC
M/N
29.00 BSC
S
b
0.50 BSC
0.40
e
70
NOM.
0.55
0.70
1.00 BSC
aaa
-
-
0.20
bbb
-
-
0.25
ccc
-
-
0.35
ddd
-
-
0.20
A2
Lattice Semiconductor
Package Diagrams
680-Ball fpBGA Package
(with or without Internal Heat Spreader)
Dimensions in Millimeters
5
(4X)
aaa
A
D
A1 BALL I.D.
IDENTIFIER
M
B
B
34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2
33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1
A
B
C
D
E
F
G
H
J
K
L
M
S
N
P
R
T
U
OPTIONAL FEATURE
(HEAT SINK)
N
V
W
C
E
6
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
e
e
S
6
4X
b
A2
A
3
A1
.30 M C A B
.15 M C
ccc
bbb
ddd
C
C
4
C
SYMBOL
NOTES: UNLESS OTHERWISE SPECIFIED
1.
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3
C
DIMENSION "b" IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C
4
PRIMARY DATUM C AND SEATING
PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
5
BILATERAL TOLERANCE ZONE IS APPLIED
TO EACH SIDE OF THE PACKAGE BODY.
6
EXACT SHAPE AND SIZE OF THIS FEATURE
IS OPTIONAL.
MIN.
MAX.
A
1.90
2.25
2.60
A1
0.30
0.50
0.70
A2
0.40
0.60
0.80
B/C
29.80
30.30
30.80
D/E
35.00 BSC
M/N
33.00 BSC
S
b
0.50 BSC
0.40
e
71
NOM.
0.55
0.70
1.00 BSC
aaa
-
-
0.20
bbb
-
-
0.25
ccc
-
-
0.35
ddd
-
-
0.20
Lattice Semiconductor
Package Diagrams
680-Ball fpSBGA Package
Dimensions in Millimeters
A1 BALL I.D.
IDENTIFIER
aaa
5
(4X)
M
38
39
36
37
34
35
32
33
30
31
28
29
26
27
24
25
18
19
21
A
D
20
22
23
16
14
15
17
10
12
13
11
8
9
6
7
4
5
B
2
3
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
S
U
V
W
Y
N
E
AA
AB
AC
A
AD
AE
e
AF
AG
AH
AJ
AK
AL
AM
AN
AP
AR
AT
AU
AV
AW
S
e
b
3
4X
.25 M C A B
.10 M C
6
A
A
A2
bbb
A4
C
C
Q
A1
4
A-A SECTION VIEW
SYMBOL
NOTES: UNLESS OTHERWISE SPECIFIED
1.
2.
3
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
NOM.
-
-
MAX.
A1
0.45
0.53
0.60
A2
0.90
0.98
1.05
1.70
ALL DIMENSIONS ARE IN MILLIMETERS.
DIMENSION "b" IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C
4
PRIMARY DATUM C AND SEATING
PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
5
BILATERAL TOLERANCE ZONE IS APPLIED
TO EACH SIDE OF THE PACKAGE BODY.
6
MIN.
A
D/E
40.00 BSC
M/N
38.00 BSC
S
b
0.00 BSC
0.50
e
EXACT SHAPE AND SIZE OF THIS FEATURE
IS OPTIONAL.
72
0.65
0.80
1.00 BSC
Q
0.25
-
A4
0.10
-
aaa
-
-
0.20
bbb
-
-
0.25
ddd
-
-
0.20
-
SEATING PLANE
ddd
Lattice Semiconductor
Package Diagrams
900-Ball fpBGA Package
Dimensions in Millimeters
5
A1 BALL I.D.
IDENTIFIER
aaa
(4X)
A
D
M
30
28
29
26
27
24
25
20
22
23
21
18
19
16
17
14
15
8
10
12
13
11
9
6
7
4
5
2
3
B
B
1
A
B
C
D
E
F
G
H
J
K
L
S
M
N
P
R
N
T
E
C
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
e
AK
b
e
S
4X
.25 M C A B
.10 M C
3
6
A
A1
ccc
C
bbb
ddd
C
C
4
C
SYMBOL
NOTES: UNLESS OTHERWISE SPECIFIED
A
1.
2.
3
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
MIN.
1.70
MAX.
2.60
A1
0.30
0.50
0.70
A2
0.30
0.50
0.70
B/C
25.80
27.55
29.30
ALL DIMENSIONS ARE IN MILLIMETERS.
DIMENSION "b" IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C
4
PRIMARY DATUM C AND SEATING
PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
5
BILATERAL TOLERANCE ZONE IS APPLIED
TO EACH SIDE OF THE PACKAGE BODY.
D/E
31.00 BSC
M/N
29.00 BSC
0.50 BSC
S
b
0.40
e
6
NOM.
2.15
EXACT SHAPE AND SIZE OF THIS FEATURE
IS OPTIONAL.
73
0.55
0.70
1.00 BSC
aaa
-
-
0.20
bbb
-
-
0.25
ccc
-
-
0.35
ddd
-
-
0.20
A2