LM2772
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SNVS486B – DECEMBER 2006 – REVISED MAY 2013
LM2772 Low-Ripple Switched Capacitor Step-Down Regulator
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FEATURES
DESCRIPTION
•
•
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•
•
•
•
•
•
•
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The LM2772 is a switched capacitor step-down
regulator that produces a 1.2V output. It is capable of
supplying loads up to 150mA with 3% output voltage
regulation over line, load, and temperature. The
LM2772 operates with an input voltage from 3.0V to
5.5V, accommodating 1-cell Li-Ion batteries and
chargers.
1
2
Low-Noise Fixed Frequency Operation
1.2V Output Voltage
3% Output Voltage Regulation
Li-Ion (3.6V) to 1.2V with 80% Efficiency
Very Low Output Ripple: 8mV @ 150mA
Output Currents up to 150mA
2.7V to 5.5V Input Voltage Range
Shutdown Disconnects Load from VIN
1.1MHz Switching Frequency
No Inductors…Small Solution Size
Short Circuit and Thermal Protection
WSON-10 Package (3mm × 3mm × 0.8mm)
APPLICATIONS
•
•
•
The LM2772 utilizes a highly efficient regulated multigain charge pump. Pre-regulated 1.1MHz fixedfrequency switching results in very low ripple and
noise on both the input and the output. When output
currents are low, the part automatically switches to a
low-ripple PFM regulation mode to maintain high
efficiency over the entire load range.
The LM2772 is available in TI’s WSON-10 Package
(WSON-10).
DSP, Memory, and Microprocessor Power
Supplies
Mobile Phones and Pagers
Portable Electronic Devices
Typical Application Circuit
VOUT: 1.2V
VIN = 3.0V to 5.5V
IOUT up to 150 mA
VIN
VOUT
CIN
COUT
1 µF
4.7 µF
C1+
GND
LM2772
C1
1 µF
High: ON
Low: Shutdown
C1C2+
EN
C3+
C3
1 µF
C2
1 µF
C3-
C2-
Capacitors: 1 µF - TDK C1005X5R0J105K
4.7 µF - TDK C1608X5R0J475K
or equivalent
Figure 1.
Figure 2. LM2772 Efficiency vs.
Low-Dropout Linear Regulator (LDO) Efficiency
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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LM2772
SNVS486B – DECEMBER 2006 – REVISED MAY 2013
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Connection Diagram
VIN
1
10
EN
EN
10
1
VIN
GND
2
9
C1+
C1+
9
2
GND
VOUT
3
8
C1-
C1-
8
3
VOUT
C3-
4
7
C2+
C2+
7
4
C3-
C3+
5
6
C2-
C2-
6
5
C3+
Die-Attach Pad: GND
Die-Attach Pad: GND
Top View
Bottom View
10-Pin WSON Package (WSON-10)
See Package Number DSC0010A
PIN DESCRIPTIONS
Pin #
Name
1
VIN
Description
2
GND
Ground
3
VOUT
Output Voltage
4
C3-
Flying Capacitor 3: Negative Terminal
5
C3+
Flying Capacitor 3: Positive Terminal
6
C2-
Flying Capacitor 2: Negative Terminal
7
C2+
Flying Capacitor 2: Positive Terminal
8
C1-
Flying Capacitor 1: Negative Terminal
9
C1+
Flying Capacitor 1: Positive Terminal
10
EN
Enable Pin Logic Input. Applying a logic HIGH voltage signal enables the part. A logic LOW
voltage signal places the the device in shutdown.
Input Voltage: Recommended VIN operating range 3.0V to 5.5V.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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Absolute Maximum Ratings (1) (2) (3)
VIN Pin Voltage
-0.3V to 6.0V
EN Pin Voltage
-0.3V to (VIN+0.3V) w/ 6.0V max
Continuous Power Dissipation (4)
Internally Limited
Junction Temperature (TJ-MAX)
150ºC
Storage Temperature Range
Maximum Lead Temperature
-65ºC to +150º C
(5)
265ºC
ESD Rating (6)
Human Body Model:
(1)
(2)
(3)
(4)
(5)
(6)
2.0kV
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits
and associated test conditions, see the Electrical Characteristics tables.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
All voltages are with respect to the potential at the GND pins.
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150ºC (typ.) and
disengages at TJ=140ºC (typ.).
For detailed information on soldering requirements and recommendations, please refer to Texas Instruments' Application Note 1187
(SNOA401): Leadless Leadframe Package (LLP).
The Human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. MIL-STD-883 3015.7
Operating Ratings (1) (2)
Input Voltage Range
2.7V to 5.5V
Recommended Load Current Range
0mA to 150mA
Junction Temperature (TJ) Range
-30°C to +110°C
Ambient Temperature (TA) Range (3)
(1)
(2)
(3)
-30°C to +85°C
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits
and associated test conditions, see the Electrical Characteristics tables.
All voltages are with respect to the potential at the GND pins.
Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 110ºC), the
maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package
in the application (θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).
Thermal Properties
Junction-to-Ambient Thermal
Resistance (θJA), WSON-10 Package (1)
(1)
55°C/W
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues.
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LM2772
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Electrical Characteristics (1) (2)
Limits in standard typeface are for TJ = 25ºC. Limits in boldface type apply over the full operating junction temperature range
(-30°C ≤ TJ ≤ +110°C) . Unless otherwise noted, specifications apply to the LM2772 Typical Application Circuit (pg. 1) with:
VIN = 3.6V; V(EN) = 1.8V, CIN = C1 = C2 = C3 = 1.0µF, COUT = 4.7µF. (3)
Symbol
VOUT
Parameter
1.2V Output Voltage Regulation
Typ
Max
3.0V ≤ VIN ≤ 5.5V
0mA ≤ IOUT ≤ 150mA
Condition
1.164
(−3%)
Min
1.2
1.236
(+3%)
0mA ≤ IOUT ≤ 150mA
1.178
(−1.8%)
1.2
1.236
(+3.0%)
0mA ≤ IOUT ≤ 150mA
Units
V
VOUT/IOUT
Output Load Regulation
VOUT/VIN
Output Line Regulation
E
Power Efficiency
IOUT = 150mA
80
IQ
Quiescent Supply Current
IOUT = 0mA (4)
47
VR
Fixed Frequency Output Ripple
40mA ≤ IOUT ≤ 150mA
8
VR–PFM
PFM–Mode Output Ripple
IOUT < 40mA
12
ISD
Shutdown Current
V(EN) = 0V
0.01
0.3
µA
FSW
Switching Frequency
3.0V ≤ VIN ≤ 5.5V
1.15
1.50
MHz
ICL
Output Current Limit
VIN = 5.5V
0V ≤ VOUT ≤ 0.2V
tON
Turn-on Time
VIL
Logic-low Input Voltage
3.0V ≤ VIN ≤ 5.5V
0
VIH
Logic-high Input Voltage
3.0V ≤ VIN ≤ 5.5V
1.1
IIH
Logic-high Input Current
V(EN) = 1.8V (5)
5
µA
IIL
Logic-low Input Current
Logic Input = 0V
0.01
µA
(1)
(2)
(3)
(4)
(5)
4
0.80
0.15
mV/mA
0.2
%/V
%
50
µA
mV
mV
500
mA
150
µs
0.63
VIN
V
V
All voltages are with respect to the potential at the GND pins.
Min and Max limits are specified by design, test, or statistical analysis. Typical numbers are not ensured, but do represent the most
likely norm.
CIN, COUT, C1, C2, C3: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics.
VOUT is set to 1.3V during this test (Device is not switching).
There is a 350kΩ pull-down resistor connected internally between the EN pin and GND.
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BLOCK DIAGRAM
LM2772
VIN
C1+
C11.04M
SWITCH
ARRAY
GAIN
CONTROL
950k
SWITCH
CONTROL
1
2
C2+
1
G =2, 5,3
C2C3+
C3-
775k
PFM
Control
GND
VOUT
Current
sense
1.1 MHz
OSC.
1.25V
Ref.
EN
Enable/
Shutdown
Control
EN
Soft-Start
Ramp
0.8V
Ref.
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Typical Performance Characteristics
Unless otherwise specified: VIN = 3.6V, CIN = C1 = C2 = C3 = 1.0µF, COUT = 4.7µF, TA = 25ºC. Capacitors are low-ESR multilayer ceramic capacitors (MLCC's).
Output Voltage
vs.
Input Voltage
Output Voltage
vs.
Output Current
Figure 3.
Figure 4.
Efficiency
vs.
Input Voltage
Operating Supply Current
Figure 5.
Figure 6.
Input and Output Voltage Ripple, Load = 150mA
Load Step 10mA to 150mA, VIN = 3.6V
CH1: VIN, Scale: 50mV/Div, AC Coupled
CH3: VOUT, Scale: 10mV/Div, AC Coupled
Time scale: 1µs/Div
Figure 7.
6
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CH3: VOUT; Scale: 50mV/Div, AC Coupled
CH4: IOUT; Scale: 100mA/Div
Time scale: 40µs/Div
Figure 8.
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Typical Performance Characteristics (continued)
Unless otherwise specified: VIN = 3.6V, CIN = C1 = C2 = C3 = 1.0µF, COUT = 4.7µF, TA = 25ºC. Capacitors are low-ESR multilayer ceramic capacitors (MLCC's).
Load Step 10mA to 150mA, VIN = 4.7V
CH3: VOUT; Scale: 50mV/Div, AC Coupled
CH4: IOUT; Scale: 100mA/Div
Time scale: 40µs/Div
Figure 9.
Line Step 3.5V to 4.0V with Load = 150mA
CH2: VIN; Scale: 1V/Div, DC Coupled
CH3: VOUT; Scale: 20mV/Div, AC Coupled
Time scale: 400µs/Div
Figure 10.
Line Step 4.0V to 3.5V with Load = 150mA
CH2: VIN; Scale: 1V/Div, DC Coupled
CH3: VOUT; Scale: 20mV/Div, AC Coupled
Time scale: 400µs/Div
Figure 11.
Oscillator Frequency
vs.
Input Voltage
Figure 12.
Startup Behavior, Load = 150mA
CH1: VOUT; Scale: 200mV/Div, DC Coupled
Time scale: 20µs/Div
Figure 13.
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LM2772
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OPERATION DESCRIPTION
Overview
The LM2772 is a switched capacitor converter that produces a regulated, low voltage output. The core of the part
is a highly efficient charge pump that utilizes fixed frequency pre-regulation and Pulse Frequency Modulation to
minimize ripple and power losses over wide input voltage and output current ranges. A description of the
principal operational characteristics of the LM2772 is detailed in the Circuit Description, and Efficiency
Performance sections. These sections refer to details in the Block Diagram.
Circuit Description
The core of the LM2772 is a two-phase charge pump controlled by an internally generated non-overlapping
clock. The charge pump operates by using external flying capacitors C1, C2, and C3 to transfer charge from the
input to the output. At input voltages below 3.5V (typ.) the LM2772 operates in a 1/2x Gain, with the input current
being equal to 1/2 of the load current. At input voltages between 3.5V to 4.6V(typ.) the part utilizes a gain of 2/5x,
resulting in an input current equal to 2/5 times the load current. At input voltages above 4.6V (typ.), the part is in
a gain of 1/3, with the input current being 1/3 of the load current.
The two phases of the switched capacitor switching cycle will be referred to as the "charge phase" and the
"discharge phase". During the charge phase, the flying capacitor is charged by the input supply. After half of the
switching cycle [ t = 1/(2×FSW) ], the LM2772 switches to the discharge phase. In this configuration, the charge
that was stored on the flying capacitors in the charge phase is transferred to the output.
The LM2772 uses fixed frequency pre-regulation to regulate the output voltage to 1.2V during moderate to high
load currents. The input and output connections of the flying capacitors are made with internal MOS switches.
Pre-regulation limits the gate drive of the MOS switch connected between the voltage input and the flying
capacitors. Controlling the on resistance of this switch limits the amount of charge transferred into and out of
each flying capacitor during the charge and discharge phases, and in turn helps to keep the output ripple very
low.
When output currents are low (<40mA typ.), the LM2772 automatically switches to a low-ripple Pulse Frequency
Modulation (PFM) form of regulation. In PFM mode, the flying capacitors stay in the discharge phase until the
output voltage drops below a predetermined trip point. When this occurs, the flying capacitors switch back to the
charge phase. After being charged, the flying capacitors repeat the process of staying in the discharge phase
and switching to the charge phase when necessary.
Efficiency Performance
Charge-pump efficiency is derived in the following two ideal equations (supply current and other losses are
neglected for simplicity):
IIN = G × IOUT
E = (VOUT × IOUT) ÷ (VIN × IIN) = VOUT ÷ (G × VIN)
(1)
(2)
In the equations, G represents the charge pump gain. Efficiency is at its highest as G×VIN approaches VOUT.
Refer to the efficiency graph in the Typical Performance Characteristics section for detailed efficiency data. The
transition between gains of 1/2, 2/5, and 1/3 are clearly distinguished by the sharp discontinuity in the efficiency
curve.
Shutdown
The LM2772 is in shutdown mode when the voltage on the enable pin (EN) is logic-low. In shutdown, the
LM2772 draws virtually no supply current. When in shutdown, the output of the LM2772 is completely
disconnected from the input. Internal feedback resistors pull the output voltage down to 0V during shutdown.
Soft Start
The LM2772 employs soft start circuitry to prevent excessive input inrush currents during startup. At startup, the
output voltage gradually rises from 0V to the nominal output voltage. This occurs in 150µs (typ.). Soft-start is
engaged when the part is enabled, including situations where voltage is established simultaneously on the VIN
and EN pins.
8
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Thermal Shutdown
Protection from damage related to overheating is achieved with a thermal shutdown feature. When the junction
temperature rises to 150ºC (typ.), the part switches into shutdown mode. The LM2772 disengages thermal
shutdown when the junction temperature of the part is reduced to 140ºC (typ.). Due to the high efficiency of the
LM2772, thermal shutdown and/or thermal cycling should not be encountered when the part is operated within
specified input voltage, output current, and ambient temperature operating ratings. If thermal cycling is seen
under these conditions, the most likely cause is an inadequate PCB layout that does not allow heat to be
sufficiently dissipated out of the WSON package.
Current Limit Protection
The LM2772 charge pump contains current limit protection circuitry that protects the device during VOUT fault
conditions where excessive current is drawn. Output current is limited to 500mA (typ).
APPLICATION INFORMATION
Recommended Capacitor Types
The LM2772 requires 5 external capacitors for proper operation. Surface-mount multi-layer ceramic capacitors
are recommended. These capacitors are small, inexpensive and have very low equivalent series resistance
(ESR, ≤ 15mΩ typ.). Tantalum capacitors, OS-CON capacitors, and aluminum electrolytic capacitors generally
are not recommended for use with the LM2772 due to their high ESR, as compared to ceramic capacitors.
For most applications, ceramic capacitors with an X7R or X5R temperature characteristic are preferred for use
with the LM2772. These capacitors have tight capacitance tolerance (as good as ±10%) and hold their value over
temperature (X7R: ±15% over -55ºC to 125ºC; X5R: ±15% over -55ºC to 85ºC).
Capacitors with a Y5V or Z5U temperature characteristic are generally not recommended for use with the
LM2772. These types of capacitors typically have wide capacitance tolerance (+80%, -20%) and vary
significantly over temperature (Y5V: +22%, -82% over -30ºC to +85ºC range; Z5U: +22%, -56% over +10ºC to
+85ºC range). Under some conditions, a 1µF-rated Y5V or Z5U capacitor could have a capacitance as low as
0.1µF. Such detrimental deviation is likely to cause Y5V and Z5U capacitors to fail to meet the minimum
capacitance requirements of the LM2772.
Net capacitance of a ceramic capacitor decreases with increased DC bias. This degradation can result in lower
capacitance than expected on the input and/or output, resulting in higher ripple voltages and currents. Using
capacitors at DC bias voltages significantly below the capacitor voltage rating will usually minimize DC bias
effects. Consult capacitor manufacturers for information on capacitor DC bias characteristics.
Capacitance characteristics can vary quite dramatically with different application conditions, capacitor types, and
capacitor manufacturers. It is strongly recommended that the LM2772 circuit be thoroughly evaluated early in the
design-in process with the mass-production capacitors of choice. This will help ensure that any such variability in
capacitance does not negatively impact circuit performance.
The table below lists some leading ceramic capacitor manufacturers.
Manufacturer
Contact Information
AVX
www.avx.com
Murata
www.murata.com
Taiyo-Yuden
www.t-yuden.com
TDK
www.component.tdk.com
Vishay-Vitramon
www.vishay.com
Output Capacitor and Output Voltage Ripple
The output capacitor in the LM2772 circuit (COUT) directly impacts the magnitude of output voltage ripple. Other
prominent factors also affecting output voltage ripple include input voltage, output current and flying capacitance.
Due to the complexity of the regulation topology, providing equations or models to approximate the magnitude of
the ripple can not be easily accomplished. But one important generalization can be made: increasing
(decreasing) the output capacitance will result in a proportional decrease (increase) in output voltage ripple.
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In typical high-current applications, a 4.7µF low-ESR ceramic output capacitor is recommended. Different output
capacitance values can be used to reduce ripple, shrink the solution size, and/or cut the cost of the solution. But
changing the output capacitor may also require changing the flying capacitor and/or input capacitor to maintain
good overall circuit performance. Performance of the LM2772 with different capacitor setups in discussed in the
section Recommended Capacitor Configurations.
High ESR in the output capacitor increases output voltage ripple. If a ceramic capacitor is used at the output, this
is usually not a concern because the ESR of a ceramic capacitor is typically very low and has only a minimal
impact on ripple magnitudes. If a different capacitor type with higher ESR is used (tantalum, for example), the
ESR could result in high ripple. To eliminate this effect, the net output ESR can be significantly reduced by
placing a low-ESR ceramic capacitor in parallel with the primary output capacitor. The low ESR of the ceramic
capacitor will be in parallel with the higher ESR, resulting in a low net ESR based on the principles of parallel
resistance reduction.
Input Capacitor and Input Voltage Ripple
The input capacitor (CIN) is a reservoir of charge that aids a quick transfer of charge from the supply to the flying
capacitors during the charge phase of operation. The input capacitor helps to keep the input voltage from
drooping at the start of the charge phase when the flying capacitors are connected to the input. It also filters
noise on the input pin, keeping this noise out of sensitive internal analog circuitry that is biased off the input line.
Much like the relationship between the output capacitance and output voltage ripple, input capacitance has a
dominant and first-order effect on input ripple magnitude. Increasing (decreasing) the input capacitance will result
in a proportional decrease (increase) in input voltage ripple. Input voltage, output current, and flying capacitance
also will affect input ripple levels to some degree.
In typical high-current applications, a 1µF low-ESR ceramic capacitor is recommended on the input. Different
input capacitance values can be used to reduce ripple, shrink the solution size, and/or cut the cost of the
solution. But changing the input capacitor may also require changing the flying capacitor and/or output capacitor
to maintain good overall circuit performance. Performance of the LM2772 with different capacitor setups is
discussed below in Recommended Capacitor Configurations.
Flying Capacitors
The flying capacitors (C1, C2, C3) transfer charge from the input to the output. Flying capacitance can impact both
output current capability and ripple magnitudes. If flying capacitance is too small, the LM2772 may not be able to
regulate the output voltage when load currents are high. On the other hand, if the flying capacitance is too large,
the flying capacitor might overwhelm the input and output capacitors, resulting in increased input and output
ripple.
In typical high-current applications, 1µF low-ESR ceramic capacitors are recommended for the flying capacitors.
Polarized capacitors (tantalum, aluminum electrolytic, etc.) must not be used for the flying capacitor, as they
could become reverse-biased during LM2772 operation.
Recommended Capacitor Configurations
The data in Table 1 can be used to assist in the selection of a capacitor configuration that best balances solution
size and cost with the electrical requirements of the application.
As previously discussed, input and output ripple voltages will vary with output current and input voltage. The
numbers provided show expected ripple voltage with VIN = 3.6V and a load current of 150mA. The table offers a
first look at approximate ripple levels and provides a comparison of different capacitor configurations, but is not
intended to ensure performance. With any capacitance configuration chosen, always verify that the performance
of the ripple waveforms are suitable for the intended application. The same capacitance value must be used for
all the flying capacitors.
10
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Table 1. LM2772 Performance with Different Capacitor Configurations
CAPACITOR
CONFIGURATION
(VIN = 3.6V)
(1)
TYPICAL
INPUT
RIPPLE
TYPICAL
OUTPUT
RIPPLE
CIN = 1µF,
COUT = 4.7µF,
C1, C2, C3 = 1µF
54mV
4mV
CIN = 1µF,
COUT = 2.2µF,
C1, C2, C3 = 1µF
48mV
6mV
CIN = 0.47µF,
COUT = 4.7µF,
C1, C2, C3 = 1µF
83mV
5mV
CIN = 0.47µF,
COUT = 3.3µF,
C1, C2, C3 = 1µF
82mV
4mV
CIN = 0.47µF,
COUT = 3.3µF,
C1, C2, C3 = 0.47µF
83mV
5mV
(1)
Refer to the text in the Recommended Capacitor Configurations section for detailed information on the data in this table
Layout Guidelines
Proper board layout will help to ensure optimal performance of the LM2772 circuit. The following guidelines are
recommended:
• Place capacitors as close to the LM2772 as possible, and preferably on the same side of the board as the IC.
• Use short, wide traces to connect the external capacitors to the LM2772 to minimize trace resistance and
inductance.
• Use a low resistance connection between ground and the GND pin of the LM2772. Using wide traces and/or
multiple vias to connect GND to a ground plane on the board is most advantageous.
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REVISION HISTORY
Changes from Revision A (May 2013) to Revision B
•
12
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 11
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PACKAGE OPTION ADDENDUM
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7-Oct-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
LM2772SD/NOPB
ACTIVE
WSON
DSC
10
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-30 to 85
L2772
LM2772SDX/NOPB
ACTIVE
WSON
DSC
10
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-30 to 85
L2772
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM2772SD/NOPB
WSON
DSC
10
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LM2772SDX/NOPB
WSON
DSC
10
4500
330.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM2772SD/NOPB
WSON
DSC
10
1000
210.0
185.0
35.0
LM2772SDX/NOPB
WSON
DSC
10
4500
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
DSC0010A
SDA10A (Rev A)
www.ti.com
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