Microelectromagnetic Microelectromagnetic Devices Devices Group Group The The University University of of Texas Texas at at Austin Austin Compact Equivalent Circuit Models for the Skin Effect Sangwoo Kim, Beom-Taek Lee, and Dean P. Neikirk Department of Electrical and Computer Engineering The University of Texas at Austin Austin, TX 78712 for further information, please contact: Professor Dean Neikirk, phone 512-471-4669 e-mail: neikirk@mail.utexas.edu www home page: http://weewave.mer.utexas.edu/ D. D. Neikirk Neikirk Darpa Darpa Electronic Electronic Packaging Packaging and and Interconnect Interconnect Design Design and and Test Test Program Program Texas Advanced Technology Program Texas Advanced Technology Program The The University University of of Texas Texas at at Austin Austin Microelectromagnetic Microelectromagnetic Devices Devices Group Group Origin of frequency dependencies in transmission line series impedance Low frequencies Mid frequencies High frequencies Uniform Current: dc Non-Uniform: proximity Non-Uniform: skin depth & proximity Resistance: Rdc Inductance: uniform current distribution Resistance: increases Inductance: decreases Resistance: increases Inductance: constant, infinite conductivity (high frequency) limit • can frequency independent ladder circuits be synthesized to accurately model frequency dependent series impedance of line? 2 R-L ladder circuits for the skin effect • use of R-L ladders is classical technique - e.g., H. A. Wheeler, “Formulas for the skin-effect,” Proceedings of the Institute of Radio Engineers, vol. 30, pp. 412-424, 1942. • essentially an application of transverse resonance • lumping based on uniform step size tends to generate large ladders L6 R6 L5 R5 L4 R4 L3 R3 L2 R2 L1 R1 L ext C ext δz 3 skin effect model Non-Uniform "step" size for compact ladders • for lossy transmission lines and bandwidth limited signals, can use increasingly long step size as propagate along line - line acts like a low pass filter, so as you propagate along the line the effective bandwidth decreases, allowing longer steps • for a skin effect equivalent circuit of a circular wire, Yen et al. proposed use of steps such that the resistance ratio RR from one step to the next is a constant Ri Ri+1 = RR M −1 1 M − j−i Ri = ⋅ RR ( ) ∑ 2 σ π r j=0 for an M-deep ladder this leads to radii of rings: ri = r ⋅ inductances: M M − j −n+1 ∑ ∑ ( RR) j = i+1 n=1 M −1 Li = µ ⋅ (ri−1 − ri ) 2π ⋅ ri [C.-S. Yen, Z. Fazarinc, and R. L. Wheeler, “Time-Domain Skin-Effect Model for Transient Analysis of Lossy Transmission Lines,” Proceedings of the IEEE, vol. 70, pp. 750-757, 1982] 1x100 5x101 internal inductance 1x101 1x10-1 blue: exact green: Yen, 4 deep red: Yen, 10 deep resistance 1x10-2 1x10-2 1x10-1 1x100 1x101 1x100 1x102 Normalized Resistance (units of Rdc) Normalized Inductance (units of µ/8π) Yen's results for a single circular wire Normalized Angular Frequency (units of 8πRdc/µo) • selection of ladder length and RR determines accuracy: - m = 4 (i.e., 4 resistors, 3 inductors), minimum error occurs for RR = 2.31 - m = 10, minimum error for RR = 1.37 5 D. D. Neikirk Neikirk Darpa Darpa Electronic Electronic Packaging Packaging and and Interconnect Interconnect Design Design and and Test Test Program Program Texas Advanced Technology Program Texas Advanced Technology Program The The University University of of Texas Texas at at Austin Austin Microelectromagnetic Microelectromagnetic Devices Devices Group Group "Compact" ladders • problem: Yen's approach tends to underestimate both resistance and inductance 4 3 2 1 • can a "short" ladder produce a good approximation? - "de-couple" resistance and inductance in a 4-long ladder - each shell such that L3 • R i / R i+1 = RR , a constant (> 1) - R2 = RR R1 , R3 = RR R1 , R4 = RR R1 2 • L i / L i+1 = LL , a constant (< 1) - L2 = LL L1 , L3 = LL 2 L1 6 3 L2 L1 Fitting parameters for 4-long ladder • "unknowns" constrained by asymptotic behavior at low frequency - given the dc resistance Rdc, then R1 and RR are related by: ( RR)3 + ( RR)2 + RR + (1 − R1 )=0 Rdc - given the low frequency internal inductance Llfinternal, then L1 and LL are related by: 2 2 internal 2 2 L 1 1 lf 1 + 1 + 1 + 1 1 + 1 + + + 1 − = 0 LL RR LL RR RR RR RR L1 2 1 2 1 • only "free" fitting parameters are R1 and L1 (or equivalently, RR and LL) - R1 and L1 tend to dominate the high frequency response Best fit for single circular wire • "universal" fit possible over specified bandwidth (dc to ωmax) • scales in terms of radius compared to minimum skin depth (that occurs at highest frequency) δ max = R1 (and hence RR): R1 wire radius = 0. 53 Rdc δ max 8 2 ω max µ o σ L1 (and hence LL): L internal lf L1 = 0.315 ⋅ R1 R dc 9 1x100 RR = 2.5, LL = 0.290 5x101 internal inductance 1x10-1 blue: exact red: new 4-ladder 1x101 resistance 1x10-2 1x100 1x10-2 1x10-1 1x100 1x101 1x102 Normalized Angular Frequency (units of 8πRdc/µo) Normalized Resistance (units of Rdc) Normalized Inductance (units of µ/8π) Results for single circular wire Percent Resistance Error 30% 80% resistance inductance 70% 25% 20% Yen 4-ladder 15% Yen 10-ladder 60% 50% 40% 30% 10% 20% 5% 10% new 4-ladder 0% 1x10-2 1x10-1 1x100 1x101 1x102 Normalized Angular Frequency 1x10-2 1x10-1 1x100 1x101 0% 1x102 Percent Internal Inductance Error Errors for single circular wire Normalized Angular Frequency • excellent fit possible over wide range of frequencies, from low to high frequency • shorter ladders (three of less) give much larger errors • longer ladders improve accuracy very slowly 10 D. 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Neikirk Neikirk Darpa Darpa Electronic Electronic Packaging Packaging and and Interconnect Interconnect Design Design and and Test Test Program Program Texas Advanced Technology Program Texas Advanced Technology Program The The University University of of Texas Texas at at Austin Austin Microelectromagnetic Microelectromagnetic Devices Devices Group Group Results for coaxial cable 1x102 R2 in L1 in L2 out R2 out blue: exact red: circuit 1x100 L 1 out 1.5x10-7 Frequency (Hz) Lext R1 in R1 out • can account for both inner (signal) and outer (shield) conductors 11 example: inner radius a = 0.1 mm shield radius b = 0.23 mm shield thickness 0.02 mm fmax = 5 GHz Inductance (H/m) 1.7x10-7 5x109 L2 in R3 out resistance 1x109 R3 in L3 out 1x108 L 3 in R4 out 1x107 R4 in 2.1x10-7 1.9x10-7 1x101 1x106 c total inductance 1x105 a Resistance (Ohm/m) b Inclusion of proximity effects • for transmission lines with "non-circular" geometry must also account for proximity effects • use high frequency behavior to estimate current division over surfaces of conductors - subdivide external inductance (Lext) to force current redistribution 12 Twin lead with proximity effect φ inner face R4 / z L3/ z R3 / z L2/ z 2h R2 / z L1/ z • more flux coupling at inner faces - quarter from angle φ sin(φ ) = R1 / z 2Lext outer face 1 − ( r h )2 R4 /(1- z) L3/(1- z) R3 /(1- z) • two branches required • weight skin effect by ζ L2/(1- z) L1/(1- z) R2 /(1- z) ζ = φ/π 2Lext 13 R1 /(1- z) 7.5x10-9 4x101 conformal mapping approximation 3x101 conformal mapping approximation 2x101 circuit model 1x101 6.5x10-9 circuit model Lexternal 0x100 1x107 7.0x10-9 6.0x10-9 5.5x10-9 Inductaance per length (H/cm) Resistance per length (Ohm/cm) Results for closely coupled twin lead 5.0x10-9 1x108 1x109 1x1010 1x1011 Frequency (Hz) 1x106 1x107 1x108 1x109 1x1010 1x1011 Frequency (Hz) • example for 1 mil diameter Al wires on 2 mil centers - φ = 60 ˚ 14 D. 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Neikirk Neikirk Darpa Darpa Electronic Electronic Packaging Packaging and and Interconnect Interconnect Design Design and and Test Test Program Program Texas Advanced Technology Program Texas Advanced Technology Program The The University University of of Texas Texas at at Austin Austin Microelectromagnetic Microelectromagnetic Devices Devices Group Group • observation: - regardless of geometry of transmission line, for frequencies greater than about 3Rdc/Llf, resistance increases as √ω • can force single 4-long ladder circuit response to pass through a given high frequency point with √ω dependence - should work for noncircular geometries, even with strong proximity effects 15 Normalized Resistance (units of R/Rdc) Generalized circuit generation 1x102 ωmax 1x101 Rmax R ≈ Rmax ⋅ 1x100 5x10-1 1x10-1 3 Rdc 1x100 ω ω max L total lf 1x101 1x102 1x103 Normalized angular frequency (units of Rdc/Llfinternal ) General fitting procedure • Objective: force high frequency circuit response to pass through Rmax at ωmax - high frequency asymptotic behavior of 4-ladder is circuit Z hf ≈ ( ) R1 ⋅ ( 1 + RR−1 ) + j ω L1 R1 R1 ⋅ RR−1 + j ω L1 (eq. 1) • for a given choice of RR, from dc requirements find R1: ( ) R1 = Rdc RR3 + RR2 + RR + 1 • require that Rcircuit = Rmax at ωmax: Rmax = R1 ( ) ω L RR−1 ⋅ 1 + RR−1 + max 1 R1 ( 1 + RR ) −1 2 ω L + max 1 R1 2 (eq. 2) 2 (eq. 3) Generalized fitting procedure •so L1 is given by: L1 = ( ) Rdc RR3 + RR2 + RR + 1 (1 + 1 RR) ω max ( ( Rmax − Rdc 1 + RR2 ) ) Rdc RR3 + RR2 + RR + 1 − Rmax (eq. 4) •and finally by LL is found using the dc requirement: ( ) ( LL−2 + LL−1 RR−1 + 1 2 ) + RR−2 + RR−1 + 1 2 − Linternal lf L1 ( ) RR−3 + RR−2 + RR−1 + 1 2 (eq. 5) where external Llfinternal = Llftotal − Lhf (eq. 6) = 0 Summary of procedure • find low and high frequency behavior - Rdc, Llftotal, Lhfexternal, Rmax at single high frequency ωmax - could be determined by either calculation or measurement • iterate to find optimum RR - since R1 > Rmax, RR is bounded below such that: Rmax ≤ ( RR)3 + ( RR)2 + RR + 1 Rdc - constraint on real value for L1 produces an upper bound RR2 +1 < Rmax Rdc - hence RR must satisfy the inequality 1 + RR2 < 18 Rmax < RR3 + RR2 + RR + 1 Rdc (eq. 7) Summary of procedure • start with RR at lower bound (eq. 7) • calculate R1 from eq. 2 • calculate L1 from eq. 4 • calculate LL from eq. 5 • use resulting 4-ladder to calculate circuit response over interval from 3Rdc/Llf to ωmax (interval over which √ω behavior holds) - find error between circuit and assumed R ≈ Rmax ⋅ response ω ω max • increment RR, find new error - continue until error is minimized 19 D. 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Neikirk Neikirk Darpa Darpa Electronic Electronic Packaging Packaging and and Interconnect Interconnect Design Design and and Test Test Program Program Texas Advanced Technology Program Texas Advanced Technology Program The The University University of of Texas Texas at at Austin Austin Microelectromagnetic Microelectromagnetic Devices Devices Group Group Examples for generalized fitting • series equivalent per unit length circuit for transmission line is R4 L3 R3 L2 R2 L1 R1 Lhfexternal • verification of circuit model using: - experimental results for closely coupled twin lead • experimentally measured resistance and inductance data • fit to experimental resistance, calculation for Llftotal, Lhfexternal - full volume filament calculations for wide range of rectangular geometries • parallel thick plates • coplanar lines • parallel square bars 20 Closely coupled twin lead 2 mm 5x10-9 1x106 1x105 1x104 1x103 0 1x10-9 0x100 Frequency (Hz) Frequency (Hz) • Rdc = 0.01 Ω/m , Llftotal = 4.1 x 10-7 H/m , Lhfexternal = 1.77 x 10-7 H/m • fmax = 9.33 x 105 Hz , Rmax = 0.193 Ω/m → 21 RR = 2.34 , LL = 0.782 3x106 1x10-4 8x10-5 2x10-9 1x106 5 3x10-9 1x105 10 4x10-9 1x104 15 Error(%) 1x10-3 20 blue: experimental red: circuit 1x103 blue: experimental red: circuit green: error Inductance (H/cm) 25 3x106 Resistance (Ohm/cm) 3x10-3 0.2 mm 4 µm 4 µm Parallel thick plates 20 µm 2.8 blue: volume filament red: circuit green: error 4 3 10 2 1 2 1x10-2 1x10-1 1x100 1x101 Frequency (GHz) 0 1x102 Total Inductance (nH/cm) 5 Error(%) Resistance (Ohm/cm) 100 2.6 2.4 2.2 blue: volume filament red: circuit 2 1x10-2 1x10-1 1x100 1x101 Frequency(GHz) • Rdc = 431 Ω/m , Llftotal = 2.7 x 10-7 H/m , Lhfexternal = 2 x 10-7 H/m • fmax = 1 x 1010 Hz , Rmax = 1650 Ω/m → 22 RR = 1.54 , LL = 0.523 1x102 4 µm Coplanar lines 6 5 4 3 1x101 2 1 3x100 1x10-2 1x10-1 1x100 1x101 Frequency (GHz) 0 1x102 Total Inductance (nH/cm) blue: volume filament red: circuit green: error 20 µm 6 Error(%) Resistance (Ohm/cm) 1x102 4 µm 5.5 5 4.5 4 blue: volume filament red: circuit 3.5 1x10-2 1x10-1 1x100 1x101 Frequency (GHz) • Rdc = 431 Ω/m , Llftotal = 5.7 x 10-7 H/m , Lhfexternal = 4 x 10-7 H/m • fmax = 1 x 1010 Hz , Rmax = 2460 Ω/m → 23 RR = 2.07 , LL = 0.351 1x102 5 µm 10 µm Parallel square bars 10 µm 10 8 1x103 6 4 2 1x102 1x107 0 1x108 1x109 1x1010 1x1011 Frequency (Hz) Inductance (H/m) blue: volume filament red: circuit green: error 5x10-7 12 Error (%) Resistance (Ohm/m) 1x104 5x10-7 4x10-7 4x10-7 blue: volume filament red: circuit 3x10-7 1x107 1x108 1x109 1x1010 1x1011 Frequency (Hz) • Rdc = 350 Ω/m , Llftotal = 4.8 x 10-7 H/m , Lhfexternal = 3.22 x 10-7 H/m • fmax = 5 x 1010 Hz , Rmax = 5160 Ω/m → 24 D. D. Neikirk Neikirk RR = 2.36 , LL = 0.448 Darpa Darpa Electronic Electronic Packaging Packaging and and Interconnect Interconnect Design Design and and Test Test Program Program Texas Advanced Technology Program Texas Advanced Technology Program Microelectromagnetic Microelectromagnetic Devices Devices Group Group The The University University of of Texas Texas at at Austin Austin Compact Equivalent Circuit Models for the Skin Effect • small R-L ladders (four resistors, three inductors) can provide excellent equivalent circuit for circular conductors - good fit from dc to high frequency - simple, analytic equations have been established that allow fast calculation of circuit element values for a specified maximum frequency, wire radius, and wire conductivity • can be used directly to model transmission lines using coupled circular conductors with "weak" proximity effects - excellent fit for coaxial cable - analytic result for twin lead as a function of wire separation 25 Compact Equivalent Circuit Models for Skin and Proximity Effects in General Transmission Lines • for arbitrary cross-section conductors or in the presence of strong proximity effects generalized procedure has been established - only one fitting parameter, easily determined via simple error minimization - requires knowledge of only Rdc, Llftotal, Lhfexternal, and Rmax at single high frequency ωmax • can be determined by calculation or measurement • excellent fit to detailed calculations for wide range of geometries - closely coupled twin lead - square to thick, narrow to wide plates - also tested for microstrip and strip line, similar excellent agreement • should provide efficient technique for circuit simulation of lossy transmission lines 26 D. D. Neikirk Neikirk Darpa Darpa Electronic Electronic Packaging Packaging and and Interconnect Interconnect Design Design and and Test Test Program Program Texas Advanced Technology Program Texas Advanced Technology Program