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COMPONENT IDENTIFICATION
TRAINING CERTIFICATION TEST (DVD-64C) v.2a
This test consists of fifty multiple-choice questions. All questions are from the video:
Component Identification (DVD-64C).
Each question has only one most correct answer. Use the Answer Sheet and circle the
letter corresponding to your selection for each test item. If you wish to change an
answer, erase your choice completely.
You should read through the questions and answer those you are sure of first. After
your first pass through the test, then go back and answer the questions that you were
not sure of. If two answers appear to be correct, pick the answer that seems to be the
most correct response.
When you are finished, check to make sure you have answered all of the questions.
Turn in the test materials to the instructor.
The passing grade for this test is 70% (35 correct answers or better).
Good luck!
1
COMPONENT IDENTIFICATION
TRAINING CERTIFICATION TEST (DVD-64C) v.2a
ANSWER SHEET
Name: _____________________________ Date: _________________
1
A
B
C
D
A
B
C
3
A
B
4
A
5
26
A
B
C
D
D
27
A
B
C
D
C
D
28
A
B
C
D
B
C
D
29
A
B
C
D
A
B
C
D
30
A
B
C
D
6
A
B
C
D
31
A
B
C
D
7
A
B
C
D
32
A
B
C
D
8
A
B
C
D
33
A
B
C
D
9
A
B
C
D
34
A
B
C
D
10
A
B
C
D
35
A
B
C
D
11
A
B
C
D
36
A
B
C
D
12
A
B
C
D
37
A
B
C
D
13
A
B
C
D
38
A
B
C
D
14
A
B
C
D
39
A
B
C
D
15
A
B
C
D
40
A
B
C
D
16
A
B
C
D
41
A
B
C
D
17
A
B
C
D
42
A
B
C
D
18
A
B
C
D
43
A
B
C
D
19
A
B
C
D
44
A
B
C
D
20
A
B
C
D
45
A
B
C
D
21
A
B
C
D
46
A
B
C
D
22
A
B
C
D
47
A
B
C
D
23
A
B
C
D
48
A
B
C
D
24
A
B
C
D
49
A
B
C
D
25
A
B
C
D
50
A
B
C
D
2
2
COMPONENT IDENTIFICATION
TRAINING CERTIFICATION TEST (DVD-64C) v.2a
1. Through-hole components
a. have leads that are soldered directly onto lands on the surface of a circuit board
b. have leads that are inserted through mounting holes in the circuit board
c. are always semiconductors
d. all of the above
2. Components that can amplify or interpret a signal are called
a. active components
b. discrete components
c. passive components
d. metallized components
3. Resistors and capacitors
a. always have axial leads
b. always have radial leads
c. interpret signals
d. cannot change an electrical signal except to reduce it in size or delay it
4. A group of interconnected elements assembled into a single package is
a. a surface mount component
b. a discrete component
c. an integrated circuit
d. a through-hole component
5. A listing of the components, their values and quantities for an electronic assembly is
found on the
a. assembly drawing
b. router
c. assembly instructions
d. bill of materials
6. The assembly drawing
a. lists component part numbers and quantities
b. shows the components and their locations on the circuit board
c. details the exact process steps in assembly
d. provides an engineering drawing of each component
7. The letters and numbers used to identify components on circuit boards are called
a. reference designators
b. manufacturer’s part numbers
c. numerical values
d. color bands
3
COMPONENT IDENTIFICATION
TRAINING CERTIFICATION TEST (DVD-64C) v.2a
8. Components requiring negative and positive connections have
a. terminations
b. capacitance
c. polarity
d. resistance
9. The positive lead of a component is called the
a. anode
b. cathode
c. diode
d. electrode
10. Proper
orientation means
a. the component is placed next to the proper reference designator
b. pin 1 of the component is in the same position as the pin 1 hole on the circuit
board
c. components have correct negative and positive connections
d. components are placed far enough away from magnetic fields
11. Identify this component type:
a. Dual-In-line Package (DIP)
b. Pin Grid Array (PGA)
c. capacitor
d. Single-In-line Package (SIP)
4
COMPONENT IDENTIFICATION
TRAINING CERTIFICATION TEST (DVD-64C) v.2a
12. Identify this component:
a. DIP
b. PGA
c. capacitor
d. SIP
13. On this component, identify the location of pin 1:
a. the first pin clockwise from the notch
b. the first pin counter-clockwise from the notch
c. lower right hand corner
d. lower left hand corner
14.
The most common reference designator for an IC is the letter
a. I
b. C
c. U
d. L
5
COMPONENT IDENTIFICATION
TRAINING CERTIFICATION TEST (DVD-64C) v.2a
15. Identify this component:
a. IC can
b. resistor network
c. SIP
d. polarized capacitor
16. Identify
this component:
a. IC can
b. DIP
c. SIP
d. PGA
6
COMPONENT IDENTIFICATION
TRAINING CERTIFICATION TEST (DVD-64C) v.2a
17. Identify these components:
a. transistors
b. DIPs
c. resistors
d. capacitors
18. A unit of electrical capacitance is called a
a. henry
b. volt
c. watt
d. farad
19. Resistors are measured in
a. microfarads
b. amps
c. ohms
d. megahertz
7
COMPONENT IDENTIFICATION
TRAINING CERTIFICATION TEST (DVD-64C) v.2a
20. Identify this component:
a. radial capacitor
b. axial capacitor
c. diode
d. inductor
21. Identify this component:
a. transistor
b. inductor
c. diode
d. resistor
8
COMPONENT IDENTIFICATION
TRAINING CERTIFICATION TEST (DVD-64C) v.2a
22. Identify this component:
a. transistor
b. LED
c. resistor
d. polarized capacitor
23. Identify this component:
a. transistor
b. LED
c. resistor
d. polarized capacitor
9
COMPONENT IDENTIFICATION
TRAINING CERTIFICATION TEST (DVD-64C) v.2a
24. An example of a coiled component is a
a. transformer
b. torroid
c. inductor
d. all of the above
25. Identify this component:
a. inductor
b. connector
c. filter
d. diode
26. Crystals are measured in
a. farads
b. hertz
c. henries
d. watts
10
COMPONENT IDENTIFICATION
TRAINING CERTIFICATION TEST (DVD-64C) v.2a
27. Identify this component:
a. diode array
b. torroid
c. resistor network
d. crystal
28. Sockets, headers and jumpers are examples of
a. polarized components
b. front panel switches
c. connecting hardware
d. resistor networks
29. Surface mount components
a. are larger than their through-hole counterparts
b. are smaller than their through-hole counterparts
c. have fewer electronic functions than their through-hole counterparts
d. are inserted through mounting holes on the surface of the circuit board
30. Surface mount components come from the manufacturer
a. on tape and reel
b. in tubes
c. in waffle trays
d. all of the above
11
COMPONENT IDENTIFICATION
TRAINING CERTIFICATION TEST (DVD-64C) v.2a
31. Identify this surface mount lead type:
a. J-lead
b. I-lead
c. Gull wing
d. L-lead
32. Identify this surface mount lead type:
a. J-lead
b. I-lead
c. Gull wing
d. L-lead
12
COMPONENT IDENTIFICATION
TRAINING CERTIFICATION TEST (DVD-64C) v.2a
33. Lead pitch is the
a. angle of the lead
b. shape of the lead
c. termination point of the lead
d. distance between the center of one lead to the center of the next lead
34. Name the type of leadless connections on these components:
a. castellations
b. terminations
c. columns
d. balls
35. Identify this component:
a. QFP
b. PLCC
c. BGA
d. PGA
13
COMPONENT IDENTIFICATION
TRAINING CERTIFICATION TEST (DVD-64C) v.2a
36. Identify this component:
a. QFP
b. PLCC
c. BGA
d. flat pack
37. The solder connections on a leadless chip carrier are called
a. terminations
b. L-leads
c. flat leads
d. castellations
38. Identify this component:
a. QFN
b. PLCC
c. LGA
d. QFP
14
COMPONENT IDENTIFICATION
TRAINING CERTIFICATION TEST (DVD-64C) v.2a
39. Identify this component:
a. QFP
b. BGA
c. LCC
d. LGA
40. Identify this component:
a. QFN
b. LGA
c. BGA
d. CCGA
15
COMPONENT IDENTIFICATION
TRAINING CERTIFICATION TEST (DVD-64C) v.2a
41. Identify this component:
a. LGA
b. BGA
c. CCGA
d. LCC
42. Identify this component:
a. BGA
b. VSOP
c. SOJ
d. TSOP
16
COMPONENT IDENTIFICATION
TRAINING CERTIFICATION TEST (DVD-64C) v.2a
43. Identify this component:
a. SOIC
b. VSOP
c. SOJ
d. PGA
44. Identify this component:
a. SOIC
b. RFN
c. QFN
d. DFN
45. Part numbers for chip components are usually marked on the
a. body of the component
b. tape reel
c. circuit board
d. all of the above
17
COMPONENT IDENTIFICATION
TRAINING CERTIFICATION TEST (DVD-64C) v.2a
46. Identify these components:
a. crystals
b. MELF resistors
c. chip resistors
d. molded tantalum capacitors
47. Identify this component:
a. crystal
b. MELF resistor
c. chip resistor
d. molded tantalum capacitor
18
COMPONENT IDENTIFICATION
TRAINING CERTIFICATION TEST (DVD-64C) v.2a
48. Identify these components:
a. chip components
b. MELFs
c. molded tantalum capacitors
d. none of the above
49. Identify these components:
a. MELFs
b. molded tantalum capacitors
c. SOTs
d. chip resistors
50. DPAKs house
a. small transistors or diodes
b. higher powered transistors or diodes
c. light emitting diodes
d. All of the above
19
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