Integration of Passive Devices into Electronic Circuits
By
Nitin Sharma
Junior Undergraduate
Department of Electrical Engineering
IIT-Kanpur
The topic of the talk “Integration of Passive Devices into Electronic
Devices” aimed to discuss the possibilities of obtaining Integrated Passive
Devices thereby eliminating the need and use of the discrete passive
components prevalent today.
A passive component is a one that doesn’t require a power supply to handle
the signals that pass through them. An Integrated Passive consists of
multiple passive components sharing a single substrate and a single
packaging. The different integrated passives are distinguished by either the
nature of component (R, C, L) it consists or its structure. Presently structure
such as array and networks of similar and non-similar passive components
exist.
The talk discussed the various reasons that led to the conceptualization of
Integrated Passive Devices. This was discussed in light of the existing
surface mount technology and the thin film technology present dominantly
today. The major reasons outlined were reduction obtained in mass, volume
along with improvements in electrical performance and design flexibility
and lower costs.
The fabrication technology underlying the manufacturing of Integrated
passive components was discussed at length. In this methods and materials
used to fabricate the passive components(R, L, C) were presented. The state
of use of the integrated passives in modern industry was presented and
problems related to the wide spread use was then discussed. For example,
the problems of the lack of standardization of materials and appropriate
process are a major issue in the Integrated passive fabrication. Moreover we
have problems related to the reliability, tolerance which requires proper
attention.
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Applications, Future Outlook and Conclusion
The major areas of application of Integrated Passive Components
• Replacement of SMT devices
• Decoupling capacitors for high frequency uses
• Passive replacement in high density interconnect
were presented. In fact, integrated decoupling capacitors owing to their very
less parasitic inductance are one major application which hastened the
development in the Integrated Passive Technology.
The future of the Integrated Passives can be viewed under the following
points
• Presently Integrated Passives cover only 8% of industry, so there’s a
vast scope of improvisation.
• Major issue dealing with development of Integrated Passives is the
standardization of materials and process used for fabrication.
• In future we would like to have versatile materials, which can be used
for a good range of any passive component type.
The present technology dominant in passive components is the Surface
mount technology. Reduction in component sizes for compactness and the
improvements in electrical performance are the pillars of development of the
Integrated Passive Components. The idea with Integrated Passives is make
better suited passives for the demands in the high frequency ( > 5Ghz)
domain. The ultimate aim of integrate passive is integrate them with the
active devices to achieve total unification of all electrical devices present on
the circuit board. But we will have to wait for that.!