TQP3M6005
1700 – 2000 MHz Mid-Band Dual LNA
RFMD + TriQuint = Qorvo
Applications
 Base Station receivers
 Tower-mounted amplifiers
16-pin 4 x 4 mm Leadless SMT Package
Product Features






Functional Block Diagram
0.36 dB Noise Figure (Single Channel)
1700 – 2000 MHz
17.9 dB Gain (Single Channel)
+13.4 dBm IIP3 (Single Channel)
Compact 4 x 4 mm Package
RoHS Compliant, Pb-free
Pin 1 Reference Mark
VDA
GND
GND
VDB
16
15
14
13
NC
1
12 NC
NC
2
11 NC
NC
3
10 NC
NC
4
9
5
6
7
8
VGA
GND
GND
VGB
NC
Backside Paddle - RF/DC GND
General Description
Pin Configuration
The TQP3M6005 is a low noise dual pHEMT discrete
device operating from 1700 – 2000 MHz. Noise figure is
typically 0.36 dB per channel and 0.54 dB when used in a
balanced configuration with a balun.
The TQP3M6005 consists of a single monolithic GaAs die
mounted in a compact 4 x 4 QFN package. This device is
a dual discrete LNA intended to be used as a balanced
pair in wireless networks applications. The TQP3M6005
is packaged in a Pb-free / RoHS-compliant, compact
4 x 4 mm surface-mount leadless package.
Pin No.
Label
1, 2, 3, 4, 9, 10, 11, 12
6, 7, 14, 15
5
8
13
16
Backside Paddle
NC (No Connect)
GND (Ground)
VGA
VGB
VDB
VDA
RF / DC Ground
The TQP3M6005 is useful in a number of different
applications, and is particularly well suited for cellular
base station or tower-mounted amplifier products.
Ordering Information
Part No.
Description
TQP3M6005
Mid Band Dual LNA
Standard T/ R size = 2500 pieces on a 13” reel
Datasheet Rev. D 06-26-15
© 2015 TriQuint Semiconductor, Inc
- 1 of 7 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
TQP3M6005
1700 – 2000 MHz Mid-Band Dual LNA
RFMD + TriQuint = Qorvo
Absolute Maximum Ratings
Parameter
Storage Temperature
Drain Voltage
Gate Voltage
Drain Current (Per Channel)
Gate Current (Per Channel)
RF Input Power (Balanced)
Power Dissipation
Operating Channel Temperature
Mounting Temperature (10 Seconds)
Recommended Operating Conditions
Rating
−65 to 150 °C
+5 V
−1.0 to +0.5 V
330 mA
5 mA
+10 dBm
1.1 W
150 °C
260 °C
Parameter
Min Typ Max Units
VD
ID (Per Channel)
Operating Temp. Range
+4.5
50
−35
+105
V
mA
°C
Electrical specifications are measured at specified test
conditions. Specifications are not guaranteed over all
recommended operating conditions.
Operation of this device outside the parameter ranges
given above may cause permanent damage.
Electrical Specifications
Test conditions unless otherwise noted: VD= +4.5 V, Freq.= 1850 MHz, ID= 50 mA per channel, TA= 25 °C
Parameter
Operational Frequency Range
Drain Voltage(1), VD
Gain dual channel(2)
Noise Figure Dual Channel(2)
Noise Figure Per Channel
Reverse Isolation
Output P1dB Dual Channel(2)
Input IP3 Dual Channel(2,3)
Input IP3 Dual Channel(2,3)
Input IP3 Per Channel(3)
Input IP3 Per Channel(3)
Isolation Between Gate 1 and Gate 2
Isolation Between Drain 1 and Drain 2
Thermal Resistance (jnc. to case) θjc
Conditions
Min
1700
+2
16.0
20
F=1700 MHz
F=1850 MHz
F=1700 MHz
F=1850 MHz
12
Typ
+4.5
17.7
0.54
0.36
22
+21.6
+14
+15
+9.5
+13.4
26
24
Max
Units
2000
+5
MHz
V
dB
dB
dB
dB
dBm
dBm
dBm
dBm
dBm
dB
dB
°C / W
0.72
0.50
146
Notes:
1. VD is set based on a 1.5 Ω resistor in the drain path. See test diagram or schematic.
2. Balanced pair, with baluns
3. Pin / tone = -13 dBm, 8 MHz tone spacing
Datasheet Rev. D 06-26-15
© 2015 TriQuint Semiconductor, Inc
- 2 of 7 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
TQP3M6005
1700 – 2000 MHz Mid-Band Dual LNA
RFMD + TriQuint = Qorvo
J3
C8
J5
L4
R4
C6
C2
L2
R2
L5
R1
L15
C4
L6
4
R1
3
2
L5
1
5
16
RF
Input
6
15
7
14
8
13
R2
C5
C11
R11
R15
9
C15
10
L12
R14
11
L14
C15
L15
J2
R12
RF
Output
12
Backside
Paddle
L11
R5
X2
X1
4
L16
C16
L14
J4 Vd1
L4
C14
L16
C19
R14
C13
C17
C18
R4
J1
C1
R11
C12
C13
L13
L2
C1
X2
J4 Vd2
J4 Vg2
C12
J1
C7
J3 Vg1
L1
2
R13
C5
R1
R15
C6
C9
U1
L12
C11
C1 L11
1
C2
C9
C19
C8
C3
R5
C3
C2
L3
C7
C4
C1 L1
R3
R3
J4
L6
R3
L3
TQP3M6005-PCB Evaluation Board (1700 – 2000 MHz)
C16
C18
C17
L13
J2
R13
Notes:
1. See PC Board Layout, page 4 for more information.
2. Zero ohm jumpers may be replaced with copper traces in the target application layout.
3. Though not shown on reference design, grounding recommended on pins 6, 7, 14 & 15 for optimal isolation between amp A
and B.
Bill of Material – TQP3M6005-PCB
Reference Des.
Value
Description
Manuf.
Part Number
U1
C1, C10
C2, C12
C3, C13
C4, C14
C5, C15
C6, C16
C7, C17
C8, C18
C9, C19
R1, R2, R11, R12
R3, R13
R4, R14
R5, R15
L1, L11
L2, L12
L3, L13
L4, L14
N/A
2.4 pF
10 pF
22 pF
1.2 pF
12 pF
2.2 pF
1 μF
10 μF
0.01 μF
0 Ω
8.2 Ω
1.5 Ω
50 Ω
10 nH
3.6 nH
2.2 nH
33 nH
Mid Band Dual LNA
Capacitor, 0603, ±0.1 pF NPO
Capacitor, 0603, 5%, NPO
Capacitor, 0603, 5%, NPO
Capacitor, 0603, ±0.1 pF NPO
Capacitor, 0603, 5%, NPO
Capacitor, 0603, ±0.1 pF NPO
Capacitor, 0603, 10%, X5R
Capacitor, 0603, 20%, X5R
Capacitor, 0603, 10%, X7R
Resistor, 0603, 5%, 1/16W
Resistor, 0603, 5%, 1/16W
Resistor, 0603, 5%, 1/16W
Resistor, 0603, 5%, 1/16W
Inductor, 0603, 5%
Inductor, 0603, 5%
Inductor, 0603, 5%
Inductor, 0603, 5%
TriQuint
Various
Various
Various
Various
Various
Various
Various
Various
Various
Various
Various
Various
Various
Coilcraft
Coilcraft
Coilcraft
Coilcraft
TQP3M6005
L5, L15
1.2 nH
Inductor, 0402, 5%
Coilcraft
L6, L16
43 nH
Inductor, 0603, 5%
Coilcraft
0402CS‐1N2XJLW
0603CS-43NXJLW
X1
X2
N/A
N/A
Hybrid Coupler, 3 dB, 90°
Hybrid Coupler, 3 dB, 90° 0805
Anaren
Anaren
XC1900A-03
C1720J5003A00
Datasheet Rev. D 06-26-15
© 2015 TriQuint Semiconductor, Inc
- 3 of 7 -
0603CS-10NXJLW
0603CS-3N6XJLW
0603CS-2N2XJLW
0603CS-33NXJLW
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
TQP3M6005
1700 – 2000 MHz Mid-Band Dual LNA
RFMD + TriQuint = Qorvo
Typical Performance (Balanced Configuration)
Test conditions unless otherwise noted: Vd = +4.35 V, Id =57 mA, Temp.=+25°C
Parameter
Units
Typical Value
Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Input IP3 at PIN / Tone=−13 dBm, 8 MHz tone spacing
Noise Figure
1700
18.7
−18
−23
+21.5
+14
0.5
1850
17.7
−20
−26
+21.6
+15
0.54
2000
16.8
−18
−38
+21.7
+15.9
0.58
MHz
dB
dB
dB
dBm
dBm
dB
Performance Plots (Balanced Configuration)
Gain vs. Frequency
20
Return Loss vs. Frequency
0
Temp. = +25C
Temp. = +25C
|S11|, |S22| (dB)
Gain (dB)
18
17
16
15
1.70
|S22|
-10
19
|S11|
-20
-30
-40
1.75
1.80
1.85
1.90
1.95
-50
1.70
2.00
1.75
Noise Figure vs. Frequency
1.0
1.80
1.85
1.90
1.95
2.00
Frequency (GHz)
Frequency (GHz)
0.7
Noise Figure vs. Frequency
+100°C
Temp.=+25°C
0.8
0.6
NF (dB)
NF (dB)
+85°C
0.6
0.4
+22°C
−35°C
0.2
0.0
1.70
1.75
1.80
1.85
1.90
1.95
0.5
Vd=4.5 V
Vd=3.5 V
0.4
0.3
0.2
1.70
2.00
1.75
IIP3 vs. Frequency
20
1.80
1.85
1.90
1.95
2.00
Frequency (GHz)
Frequency (GHz)
Output P1dB vs. Frequency
23
8 MHz Tone Spacing
Pin/Tone = -13 dBm
Output P1dB (dBm)
18
IIP3 (dBm)
+100°C
+85°C
+22°C
16
−35°C
14
12
1.70
1.75
1.80
1.85
1.90
1.95
+100°C
+85°C
21
20
1.70
2.00
+22°C
−35°C
1.75
1.80
1.85
1.90
1.95
2.00
Frequency (GHz)
Frequency (GHz)
Datasheet Rev. D 06-26-15
© 2015 TriQuint Semiconductor, Inc
22
- 4 of 7 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
TQP3M6005
1700 – 2000 MHz Mid-Band Dual LNA
RFMD + TriQuint = Qorvo
Pin Configuration and Description
Pin 1 Reference Mark
VDA
16
GND GND
15
14
VDB
13
NC
1
12 NC
NC
2
11 NC
NC
3
10 NC
NC
4
9 NC
5
VGA
6
7
GND GND
8
VGB
Backside Paddle - RF/DC GND
Pin No.
1, 2, 3, 4, 9, 10, 11, 12
6, 7, 14, 15
Label
NC (No Connect)
GND (Ground)
Description
No electrical connection. Land pads should be provided for PCB mounting integrity.
Grounding recommended for optimal isolation between amp A and B
5
VGA
RF Input – Channel A
8
VGB
RF Input – Channel B
13
VDB
RF Output – Channel B
16
VDA
RF Output – Channel A
RF/DC ground. Provide recommended via pattern and ensure good solder attach for
best thermal and electrical performance.
Backside Paddle
RF/DC Ground
Evaluation Board PCB Information
PCB Material (stackup)
Single-layer, 20 mil thick Rogers RO4350B
2.8 mil copper top and bottom
Datasheet Rev. D 06-26-15
© 2015 TriQuint Semiconductor, Inc
- 5 of 7 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
TQP3M6005
1700 – 2000 MHz Mid-Band Dual LNA
RFMD + TriQuint = Qorvo
Mechanical Information
Package Marking and Dimensions
Marking: Part number – 6005
Year, week - YYWW CCCC
Assembly code - AaXXXX
6005
XXXX
YYWW
PCB Mounting Pattern
3
0.65 PITCH
PACKAGE
OUTLINE
12X
16X 0.40
R.19
0.27
1
16X 0.80
1
2.30
0.64
0.55
2.30
COMPONENT SIDE
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. Use 1 oz. copper minimum for top and bottom layer metal.
3. We recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”).
4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.
Datasheet Rev. D 06-26-15
© 2015 TriQuint Semiconductor, Inc
- 6 of 7 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
TQP3M6005
1700 – 2000 MHz Mid-Band Dual LNA
RFMD + TriQuint = Qorvo
Product Compliance Information
ESD Sensitivity Ratings
Solderability
Compatible with both lead-free (260°C max. reflow
temperature) and tin/lead (245°C max. reflow temperature)
soldering processes.
Caution! ESD-Sensitive Device
Package contact plating: Matte Tin
ESD Rating:
Value:
Test:
Standard:
Class 1A
≥ 250 V to < 500 V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ESD Rating:
Value:
Test:
Standard:
Class C2
≥ 500 V to < 1000 V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
RoHs Compliance
This part is compliant with EU 2002/95/EC RoHS directive
(Restrictions on the Use of Certain Hazardous Substances
in Electrical and Electronic Equipment).
This product also has the following attributes:
 Lead Free
 Halogen Free (Chlorine, Bromine)
 Antimony Free
 TBBP-A (C15H12Br402) Free
 PFOS Free
 SVHC Free
MSL Rating
MSL Rating: Level 3
Test:
260°C convection reflow
Standard:
JEDEC Standard IPC/JEDEC J-STD-020
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations:
Web: www.triquint.com
Email: customer.support@qorvo.com
Tel: 877-800-8584
For information about the merger of RFMD and TriQuint as Qorvo:
Web:
www.qorvo.com
For technical questions and application information:
Email: sjcapplications.engineering@qorvo.com
Important Notice
The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information
contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein.
TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information
contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information
is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain
and verify the latest relevant information before placing orders for TriQuint products. The information contained herein
or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other
intellectual property rights, whether with regard to such information itself or anything described by such information.
TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining
applications, or other applications where a failure would reasonably be expected to cause severe personal injury or
death.
Datasheet Rev. D 06-26-15
© 2015 TriQuint Semiconductor, Inc
- 7 of 7 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com