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TPA3136D2
SLOS938B – MAY 2016 – REVISED JUNE 2016
TPA3136D2 10-W Inductor Free Stereo (BTL) Class-D Audio Amplifier with Ultra Low EMI
1 Features
3 Description
•
The TPA3136D2 device is an efficient, Class-D audio
power amplifier for driving bridged-tied stereo
speakers at up to 10 W, 6 Ω, or 8 Ω (per channel).
1
•
•
•
•
•
•
•
•
•
•
•
2 × 10 W/ch into 6-Ω Loads at 10% THD+N from
a 12-V Supply
2 × 10 W/ch into 8-Ω Loads at 10% THD+N from
a 13-V Supply
Up to 90% Efficient Class-D Operation (8 Ω)
Eliminates Need for Heat Sinks
<0.05% THD+N at 1 W/4 Ω/1 kHz
Wide Supply Voltage Range Allows Operation
from 4.5 V to 14.4 V
Inductor-Free Operation
Enhanced EMI Performance with Spread
Spectrum
SpeakerGuard™ Speaker Protection Includes
Power Limiter and DC Protection
Robust Pin-to-Pin, Pin-to-Ground, and Pin-toPower Short Circuit Protection and Thermal
Protection
26-dB Fixed Gain
Single-Ended or Differential Analog Inputs
Click and Pop Free Startup
Advanced EMI Suppression Technology with Spread
Spectrum Control scheme enables the use of
inexpensive ferrite bead filters at the outputs while
meeting EMC requirements for system cost reduction.
The TPA3136D2 device is not only fully protected
against shorts and overload, the SpeakerGuard™
speaker protection circuitry includes a power limiter
and a DC detection circuit for protection of the
connected speakers. The DC detect and Pin-to-Pin,
Pin-to-Ground, and Pin-to-Power Short Circuit
protection circuit protect the speakers from output DC
and pin shorts caused in production. The outputs are
also fully protected against shorts to GND, PVCC,
and output-to-output. The short-circuit protection and
thermal protection includes an auto recovery feature.
The TPA3136D2 device can drive stereo speakers
with as low as 4-Ω impedance. The high efficiency of
the TPA3136D2, 90% with an 8-Ω load, eliminates
the need for an external heat sink, and TPA3136D2
will be able to output full power on a 2-layer PCB.
Device Information(1)
2 Applications
•
•
•
•
•
PART NUMBER
Televisions
Bluetooth/Wireless Speakers
Mini Speakers
USB Speakers
Consumer Audio Equipment
TPA3136D2
PACKAGE
HTSSOP (28)
BODY SIZE (NOM)
9.70 mm × 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Schematic
TPA3136D2
RIGHT
Audio
Source
And Control
Ferrite
Bead
Filter
TAS5630
Ferrite
Bead
Filter
LEFT
SD
FAULT
PBTL Mode Select
Power Limiter Threshold Select
PBTL
SELECT
Power Supply
4.5V-14.4V
PLIMIT
110VAC->240VAC
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPA3136D2
SLOS938B – MAY 2016 – REVISED JUNE 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
9
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
5
7.1
7.2
7.3
7.4
7.5
7.6
7.7
5
5
6
6
6
7
7
Absolute Maximum Ratings ......................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Switching Characteristics ..........................................
Typical Characteristics ..............................................
Parameter Measurement Information ................ 10
Detailed Description ............................................ 11
9.1 Overview ................................................................. 11
9.2 Functional Block Diagram ....................................... 12
9.3 Feature Description................................................. 12
9.4 Device Functional Modes........................................ 15
10 Application and Implementation........................ 16
10.1 Application Information.......................................... 16
10.2 Typical Applications ............................................. 16
11 Power Supply Recommendations ..................... 23
11.1 Power Supply Decoupling, CS ............................. 23
12 Layout................................................................... 24
12.1 Layout Guidelines ................................................. 24
12.2 Layout Example .................................................... 25
13 Device and Documentation Support ................. 26
13.1
13.2
13.3
13.4
13.5
13.6
Device Support ....................................................
Documentation Support .......................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
26
26
26
26
26
26
14 Mechanical, Packaging, and Orderable
Information ........................................................... 27
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (June 2016) to Revision B
Page
•
Updated Thermal Characteristics .......................................................................................................................................... 6
•
Fixed Output Power characteristic to match initial description .............................................................................................. 7
•
Fixed duplicate graph issue ................................................................................................................................................... 7
Changes from Original (May 2016) to Revision A
•
2
Page
Changed data sheet from Product Preview to Production Data ............................................................................................ 3
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5 Device Comparison Table
DEVICE NAME
DESCRIPTION
TPA3110D2
15-W Filter-Free Class-D Stereo Amplifier with
SpeakerGuard™
TPA3140D2
10-W Inductor-Free Class-D Stereo Amplifier
with Ultra Low EMI and AGL
6 Pin Configuration and Functions
PWP Package
28-Pin HTSSOP
(Top View)
/SD
/FAULT
LINP
LINN
NC
NC
AVCC
GND
GVDD
PLIMIT
RINN
RINP
NC
PBTL
1
2
3
4
5
6
7
Thermal
Pad
8
9
10
11
12
13
14
28
27
26
PVCC
25
24
23
22
21
20
OUTPL
19
18
17
16
15
GND
PVCC
BSPL
GND
OUTNL
BSNL
BSNR
OUTNR
OUTPR
BSPR
PVCC
PVCC
Pin Functions
PIN
NAME
NUMBER
I/O/P (1)
DESCRIPTION
SD
1
I
Shutdown logic input for audio amp (LOW = outputs Hi-Z, HIGH = outputs enabled). TTL logic levels
with compliance to AVCC.
FAULT
2
O
Open drain output used to display short circuit or dc detect fault status. Voltage compliant to AVCC.
Short circuit faults can be set to auto-recovery by connecting FAULT pin to SD pin. Otherwise, both
short circuit faults and dc detect faults must be reset by cycling PVCC.
LINP
3
I
Positive audio input for left channel. Biased at 3 V.
LINN
4
I
Negative audio input for left channel. Biased at 3 V.
5, 6, 13
I
No Connect Pin. Can be shorted to PVCC or shorted to GND or left open.
AVCC
7
P
Analog supply
GND
8
P
Analog signal ground.
GVDD
9
O
High-side FET gate drive supply. Nominal voltage is 7 V.
PLIMIT
10
I
Power Limiter Control pin
RINN
11
I
Negative audio input for right channel. Biased at 3 V.
RINP
12
I
Positive audio input for right channel. Biased at 3 V.
NC
(1)
I = Input, O = Output, P = Power
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Pin Functions (continued)
PIN
I/O/P (1)
DESCRIPTION
NAME
NUMBER
PBTL
14
I
Parallel BTL mode select pin. L=Stereo BTL mode, H=Mono PBTL mode
PVCC
15, 16
P
Power supply for right channel H-bridge. Right channel and left channel power supply inputs are
connected internally.
BSPR
17
I
Bootstrap I/O for right channel, positive high-side FET.
OUTPR
18
O
Class-D H-bridge positive output for right channel.
GND
19
P
Power ground for the H-bridges.
OUTNR
20
O
Class-D H-bridge negative output for right channel.
BSNR
21
I
Bootstrap I/O for right channel, negative high-side FET.
BSNL
22
I
Bootstrap I/O for left channel, negative high-side FET.
OUTNL
23
O
Class-D H-bridge negative output for left channel.
GND
24
P
Power ground for the H-bridges.
OUTPL
25
O
Class-D H-bridge positive output for left channel.
BSPL
26
I
Bootstrap I/O for left channel, positive high-side FET.
PVCC
27, 28
P
Power supply for left channel H-bridge. Right channel and left channel power supply inputs are
connected internally.
P
Connect to GND for best thermal and electrical performance
Thermal Pad
4
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
Supply voltage
AVCC to GND, PVCC to GND
Input current
To any pin except supply pins
MIN
MAX
UNIT
–0.3
16
V
10
mA
–0.3
AVCC + 0.3
V
10
V/ms
6.3
V
Voltage
SD, FAULT to GND (2)
Voltage
RINN, RINP, LINN, LINP
–0.3
BTL, PVCC > 12 V
4.8
BTL, PVCC ≤ 12 V
3.2
PBTL, PVCC > 12 V
2.5
Minimum load resistance, RL
PBTL, PVCC ≤ 12 V
Ω
1.8
Continuous total power dissipation
See the Thermal Information Table
Operating free-air temperature range, TA (3)
–40
85
°C
Temperature range
–65
150
°C
Storage temperature range, Tstg
–65
150
°C
(1)
(2)
(3)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The voltage slew rate of these pins must be restricted to no more than 10 V/ms. For higher slew rates, use a 100 kΩ resister in series
with the pins.
The TPA3136D2 incorporates an exposed thermal pad on the underside of the chip. This acts as a heatsink, and it must be connected
to a thermally dissipating plane for proper power dissipation. Failure to do so may result in the device going into thermal protection
shutdown. See TI Technical Briefs SLMA002 for more information about using the TSSOP thermal pad.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
UNIT
±1000
Charged device model (CDM), per JEDEC specification JESD22-C101
(2)
±250
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
4.5
14.4
V
2
AVCC
V
VCC
Supply voltage
PVCC, AVCC
VIH
High-level input voltage
SD, PBTL
VIL
Low-level input voltage
SD, PBTL
0.8
V
VOL
Low-level output voltage
FAULT, RPULL-UP=100 k, PVCC=14.4 V
0.8
V
IIH
High-level input current
SD, PBTL, VI = 2 V, AVCC = 12 V
50
µA
IIL
Low-level input current
SD, PBTL, VI = 0.8 V, AVCC = 12 V
5
µA
TA
Operating free-air temperature (1)
–40
85
°C
-40
150
°C
TJ
(1)
Operating junction temperature
(1)
The TPA3136D2 incorporates an exposed thermal pad on the underside of the chip. This acts as a heatsink, and it must be connected
to a thermally dissipating plane for proper power dissipation. Failure to do so may result in the device going into thermal protection
shutdown. See TI Technical Briefs SLMA002 for more information about using the TSSOP thermal pad.
7.4 Thermal Information
TPA3136D2
THERMAL METRIC
(1)
PWP (HTSSOP)
UNIT
28 PINS
RθJA
Junction-to-ambient thermal resistance
30.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
33.5
°C/W
RθJB
Junction-to-board thermal resistance
17.5
°C/W
ψJT
Junction-to-top characterization parameter
0.9
°C/W
ψJB
Junction-to-board characterization parameter
7.2
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
0.9
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
7.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DC CHARACTERISTICS, TA = 25°C, AVCC = PVCC = 12 V, RL = 6 Ω, using the TPA3136D2 EVM which is available at ti.com. (unless otherwise noted)
| VOS |
Class-D output offset voltage (measured
differentially)
ICC
VI = 0 V, Gain = 26 dB
1.5
15
mV
Quiescent supply current
SD = 2 V, no load, 300 ohm Ferrite Bead + 1nF Output
Filter
35
40
mA
ICC(SD)
Quiescent supply current in shutdown mode
SD = 0.8 V, no load
40
60
µA
rDS(on)
Drain-source on-state resistance
IO = 500 mA, TJ = 25°C High Side
Excluding Metal and
Low side
Bond Wire Resistance
G
Gain
ton
Turn-on time
SD = 2 V
tOFF
Turn-off time
SD = 0.8 V
GVDD
Gate drive supply
IGVDD = 2 mA
DC detect time
VRINN = 3.1 V and VRINN = 2.9 V, or VRINN = 2.9 V and
VRINN = 3.1 V
tDCDET
6
240
25
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mΩ
240
26
27
14
2.5
6.4
6.9
950
dB
ms
µs
7.4
V
ms
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Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
AC CHARACTERISTICS, TA = 25°C, AVCC = PVCC = 12 V, RL = 6 Ω, using the TPA3136D2 EVM which is available at ti.com. (unless otherwise noted)
PSRR
Power supply ripple rejection
200-mVPP ripple at 1 kHz,
Gain = 26 dB, Inputs ac-coupled to GND
PO
Continuous output power
PO
Continuous output power
PO
–65
dB
THD+N = 10%, f = 1 kHz
10
W
THD+N = 10%, f = 1 kHz, PVCC = 13 V, RL = 8 Ω
10
W
Continuous output power, PBTL (mono)
THD+N = 10%, f = 1 kHz, PVCC = 13 V, RL = 4 Ω
20
W
THD+N
Total harmonic distortion + noise
f = 1 kHz, PO = 5 W (half-power)
Vn
Output integrated noise
20 Hz to 22 kHz, A-weighted filter, Gain = 26 dB
Crosstalk
SNR
Signal-to-noise ratio
OTE
Thermal trip point
0.06%
91
µV
–81
dBV
VO = 1 Vrms, Gain = 26 dB, f = 1 kHz
–75
dB
Maximum output at THD+N < 1%, f = 1 kHz,
Gain = 26 dB, A-weighted
102
dB
150
°C
15
°C
Thermal hysteresis
7.6 Switching Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
fOSC, SS
Oscillator frequency, Spread Spectrum ON
MIN
NOM
MAX
UNIT
255
315
355
kHz
7.7 Typical Characteristics
All Measurements taken at 26dB closed loop gain, 1-kHz audio, T A= 25°C unless otherwise noted. Measurements were
made with AES17 filter using the TPA3136D2 EVM, which is available at ti.com.
10
10
1W
2.5W
5W
1W
2.5W
5W
1
THD + N (%)
THD + N (%)
1
0.1
0.01
0.001
20
0.1
0.01
50
100
200
500 1k
2k
Frequency (Hz)
5k
10k
20k
0.001
20
D001
AVCC=PVCC = 12 V, Load = 6 Ω + 47 µH, 1 W, 2.5 W, 5 W
Figure 1. Total Harmonic Distortion vs Frequency (BTL)
50
100
200
500 1k
2k
Frequency (Hz)
5k
10k
20k
D002
AVCC=PVCC = 13 V, Load = 8 Ω + 66 µH, 1 W, 2.5 W, 5 W
Figure 2. Total Harmonic Distortion vs Frequency (BTL)
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Typical Characteristics (continued)
All Measurements taken at 26dB closed loop gain, 1-kHz audio, T A= 25°C unless otherwise noted. Measurements were
made with AES17 filter using the TPA3136D2 EVM, which is available at ti.com.
10
10
20 Hz
1 kHz
20 Hz
1 kHz
THD + N (%)
THD + N (%)
1
0.1
0.01
10m 20m
50m 100m200m 500m 1
Output Power (W)
2
5
10
0.1
0.01
10m 20m
20
D003
AVCC=PVCC = 12 V, Load = 6 Ω + 47 µH, 20 Hz, 1 kHz
18
14
Power @ 10% THD + N (W)
16
16
14
12
10
8
6
4
0
10
20
D004
12
10
8
6
4
0
4
5
6
7
8
9
10 11
Supply Voltage (V)
12
13
14
15
4
300
100
32
240
90
28
180
80
24
120
20
60
16
0
12
-60
8
-120
20
4
Gain
-180
Phase
-240
10k 20k
10
200
500 1k
Frequency
2k
7
5k
8
9
10 11
Supply Voltage (V)
12
13
14
15
D006
Figure 6. Output Power vs Supply Voltage (BTL)
36
100
6
AVCC=PVCC = 4.5 V to 14.4 V, Load = 8 Ω + 66 µH
Figure 5. Output Power vs Supply Voltage (BTL)
50
5
D005
AVCC=PVCC = 4.5 V to 14.4 V, Load = 6 Ω + 47 µH
Efficiency (%)
70
Phase (o)
Gain (dB)
5
2
2
60
50
40
30
PVcc = 6V
PVcc = 12V
PVcc = 14.4V
0
0
2.5
D007
AVCC=PVCC = 12 V, Load = 6 Ω + 47 µH (device pins)
Figure 7. Gain/Phase vs Frequency (BTL)
8
2
Figure 4. Total Harmonic Distortion + Noise vs Output
Power (BTL)
20
0
20
50m 100m200m 500m 1
Output Power (W)
AVCC=PVCC = 13 V, Load = 8 Ω + 66 µH, 20 Hz, 1 kHz
Figure 3. Total Harmonic Distortion + Noise vs Output
Power (BTL)
Power @ 10% THD + N (W)
1
5
7.5 10 12.5 15 17.5
Total Output Power (W)
20
22.5
25
D008
AVCC=PVCC = 6 V, 12 V, 14.4 V, Load = 6 Ω + 47 µH
Figure 8. Efficiency vs Output Power (BTL)
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Typical Characteristics (continued)
All Measurements taken at 26dB closed loop gain, 1-kHz audio, T A= 25°C unless otherwise noted. Measurements were
made with AES17 filter using the TPA3136D2 EVM, which is available at ti.com.
100
0
90
-10
Ch 2 to Ch1
Ch 1 to Ch2
-20
80
-30
Crosstalk (dB)
Efficiency (%)
70
60
50
40
30
-40
-50
-60
-70
-80
-90
20
PVcc = 6V
PVcc = 13V
PVcc = 14.4V
10
-100
-110
-120
20
0
0
2.5
5
7.5
10 12.5 15 17.5
Output Power (W)
20
22.5
25
50
AVCC=PVCC= 6 V, 13 V, 14.4 V, Load = 8 Ω + 66 µH
Figure 9. Efficiency vs Output Power (BTL)
-20
-30
THD + N (%)
PVcc PSRR (dB)
500 1k
2k
Frequency (Hz)
5k
10k
20k
D010
Figure 10. Crosstalk vs Frequency (BTL)
10
5
-10
-40
-50
-60
1W
2.5 W
5W
2
1
0.5
0.2
0.1
0.05
0.02
0.01
0.005
-70
-80
-90
50
100
200
500 1k
2k
Frequency (Hz)
5k
10k
0.002
0.001
20
20k
50
100
D011
AVCC=PVCC = 12 V, Load = 4 Ω + 33 µH
200
500 1k
2k
Frequency (Hz)
5k
10k
20k
D012
AVCC=PVCC = 13 V, Load = 4 Ω + 33 µH, 1 W, 2.5 W, 5 W
Figure 11. Supply Ripple Rejection Ratio vs Frequency
(BTL)
Figure 12. Total Harmonic Distortion + Noise vs Frequency
(PBTL)
32
10
20 Hz
1 kHz
28
Power @ 10% THD + N (W)
THD + N (%)
200
AVCC=PVCC = 12 V, 1 W, Load = 6 Ω + 47 µH
0
-100
20
100
D009
1
0.1
24
20
16
12
8
4
0.01
10m 20m
0
50m 100m200m 500m 1
2
Output Power (W)
5
10
20
4
5
D013
AVCC=PVCC = 13 V, Load = 4 Ω + 33 µH, 20 Hz, 1 kHz
Figure 13. Total Harmonic Distortion + Noise vs Output
Power (PBTL)
6
7
8
9
10 11
Supply Voltage (V)
12
13
14
15
D014
AVCC=PVCC = 4.5 V to 14.4 V, Load = 4 Ω + 33 µH
Figure 14. Output Power vs Supply Voltage (PBTL)
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Typical Characteristics (continued)
All Measurements taken at 26dB closed loop gain, 1-kHz audio, T A= 25°C unless otherwise noted. Measurements were
made with AES17 filter using the TPA3136D2 EVM, which is available at ti.com.
100
90
80
Efficiency (%)
70
60
50
40
30
20
PVcc = 6V
PVcc = 13V
PVcc = 14.4V
10
0
0
2.5
5
7.5 10 12.5 15 17.5
Total Output Power (W)
20
22.5
25
D015
AVCC=PVCC = 6 V, 13 V, 14.4 V, Load = 4 Ω + 33 µH
Figure 15. Efficiency vs Output Power (PBTL)
8 Parameter Measurement Information
All parameters are measured according to the conditions described in the Specifications .
Most audio analyzers will not give correct readings of Class-D amplifiers’ performance due to their sensitivity to
out of band noise present at the amplifier output. An AES-17 pre analyzer filter is recommended to use for ClassD amplifier measurements. In absence of such filter, a 30-kHz low-pass filter (10 Ω + 47 nF) can be used to
reduce the out of band noise remaining on the amplifier outputs.
10
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9 Detailed Description
9.1 Overview
To facilitate system design, the TPA3136D2 needs only a single power supply between 4.5 V and 14.4 V for
operation. An internal voltage regulator provides suitable voltage levels for the gate driver, digital, and lowvoltage analog circuitry. Additionally, all circuitry requiring a floating voltage supply, as in the high-side gate drive,
is accommodated by built-in bootstrap circuitry with integrated boot strap diodes requiring only an external
capacitor for each half-bridge.
The audio signal path, including the gate drive and output stage, is designed as identical, independent fullbridges. All decoupling capacitors should be placed as close to their associated pins as possible. In general, the
physical loop with the power supply pins, decoupling capacitors and GND return path to the device pins must be
kept as short as possible and with as little area as possible to minimize induction (see reference board
documentation for additional information).
For a properly functioning bootstrap circuit, a small ceramic capacitor must be connected from each bootstrap pin
(BSXX) to the power-stage output pin (OUTXX). When the power-stage output is low, the bootstrap capacitor is
charged through an internal diode connected between the gate-drive power-supply pin (GVDD) and the bootstrap
pins. When the power-stage output is high, the bootstrap capacitor potential is shifted above the output potential
and thus provides a suitable voltage supply for the high-side gate driver. In an application with PWM switching
frequencies in the range of 315 kHz, use ceramic capacitors with at least 220-nF capacitance, size 0603 or 0805,
for the bootstrap supply. These capacitors ensure sufficient energy storage, even during clipped low frequency
audio signals, to keep the high-side power stage FET (LDMOS) fully turned on during the remaining part of its
ON cycle.
Special attention should be paid to the power-stage power supply; this includes component selection, PCB
placement, and routing. For optimal electrical performance, EMI compliance, and system reliability, each PVCC
pin should be decoupled with ceramic capacitors that are placed as close as possible to each supply pin. It is
recommended to follow the PCB layout of the TPA3136D2 reference design. For additional information on
recommended power supply and required components, see the application diagrams in this data sheet.
The PVCC power supply should have low output impedance and low noise. The power-supply ramp and SD
release sequence is not critical for device reliability as facilitated by the internal power-on-reset circuit, but it is
recommended to release SD after the power supply is settled for minimum turn on audible artifacts.
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9.2 Functional Block Diagram
GVDD
PVCC
BSPL
PVCC
PBTL Select
OUTPL FB
Gate
Drive
OUTPL
OUTPL FB
LINP
GND
PWM
Logic
PLIMIT
GVDD
LINN
PVCC
BSNL
PVCC
OUTNL FB
OUTNL FB
FAULT
Gate
Drive
OUTNL
SD
TTL
Buffer
SC Detect
GND
Spread Spectrum
Control
Ramp
Generator
Biases and
References
Startup Protection
Logic
DC Detect
Thermal
Detect
UVLO/OVLO
LIMITER
Reference
PLIMIT
GVDD
AVCC
PVCC
BSNR
AVDD
PVCC
LDO
Regulator
GVDD
Gate
Drive
GVDD
OUTNR
OUTNR FB
OUTNR FB
RINN
PLIMIT
GND
PWM
Logic
GVDD
RINP
PVCC
BSPR
PVCC
OUTNR FB
Gate
Drive
OUTPR
PBTL Select
PBTL
OUTPR FB
PBTL
Control
GND
9.3 Feature Description
9.3.1 Fixed Analog Gain
The analog gain of the TPA3136D2 is fixed to 26 dB.
9.3.2
SD Operation
The TPA3136D2 device employs a shutdown mode of operation designed to reduce supply current (ICC) to the
absolute minimum level during periods of nonuse for power conservation. The SD input pin should be held high
(see specification table for trip point) during normal operation when the amplifier is in use. Pulling SD low causes
the outputs to mute and the amplifier to enter a low-current state. Never leave SD unconnected, because
amplifier operation would be unpredictable.
For the best power-off pop performance, place the amplifier in the shutdown mode prior to removing the power
supply voltage.
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Feature Description (continued)
9.3.3 PLIMIT
The PLIMIT operation will, if selected, limit the output voltage level to a voltage level below the supply rail. In this
case the amplifier operates as if it was powered by a lower supply voltage, and thereby limiting the output power
by voltage clipping. PLIMIT threshold is set by the PLIMIT pin voltage.
Figure 16. PLIMIT Circuit Operation
9.3.4 Spread Spectrum and De-Phase Control
The TPA3136D2 device has built-in spread spectrum control of the oscillator frequency and de-phase of the
PWM outputs to improve EMI performance. The spread spectrum schemes is internally fixed is always turned on.
De-phase inverts the phase of the output PWM such that the idle output PWM waveforms of the two audio
channels are inverted. De-phase does not affect the audio signal, or its polarity.
9.3.5 GVDD Supply
The GVDD Supply is used to power the gates of the output full bridge transistors. Add a 1-μF capacitor to ground
at this pin.
9.3.6 DC Detect
The TPA3136D2 device has circuitry which will protect the speakers from DC current which might occur due to
defective capacitors on the input or shorts on the printed circuit board at the inputs. A DC detect fault will be
reported on the FAULT pin as a low state. The DC Detect fault will also cause the amplifier to shutdown by
changing the state of the outputs to Hi-Z.
A DC Detect Fault is issued when the output differential duty-cycle of either channel exceeds 14% (for example,
+57%, –43%) for more than 950 msec at the same polarity. This feature protects the speaker from large DC
currents or AC currents less than 2 Hz. To avoid nuisance faults due to the DC detect circuit, hold the SD pin low
at power-up until the signals at the inputs are stable. Also, take care to match the impedance seen at the positive
and negative inputs to avoid nuisance DC detect faults.
The minimum differential input voltage required to trigger the DC detect is 130 mV. The inputs must remain at or
above the voltage listed in the table for more than 950 msec to trigger the DC detect.
9.3.7 PBTL Select
The TPA3136D2 device offers the feature of parallel BTL operation with two outputs of each channel connected
directly. If the PBTL (pin 14) is tied high, the positive and negative outputs of each channel (left and right) are
synchronized and in phase. To operate in this PBTL (mono) mode, tie PBTL pin to VCC and apply the input
signal to the RINP and RINN inputs and place the speaker between the LEFT and RIGHT outputs with OUTPL
connected to OUTNL and OUTPR connected to OUTNR to parallel the output half bridges for highest power
efficiency. For an example of the PBTL connection, see the schematic in the Typical Applications section.
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Feature Description (continued)
9.3.8 Short-Circuit Protection and Automatic Recovery Feature
The TPA3136D2 device has protection from overcurrent conditions caused by a short circuit on the output stage.
The short circuit protection fault is reported on the FAULT pin as a low state. The amplifier outputs are switched
to a Hi-Z state when the short circuit protection latch is engaged. The latch can be cleared by cycling the SD pin
through the low state.
If automatic recovery from the short circuit protection latch is desired, connect the FAULT pin directly to the SD
pin. This allows the FAULT pin function to automatically drive the SD pin low which clears the short-circuit
protection latch.
9.3.9 Thermal Protection
Thermal protection on the TPA3136D2 device prevents damage to the device when the internal die temperature
exceeds 150°C. There is a ±15°C tolerance on this trip point from device to device. Once the die temperature
exceeds the thermal trip point, the device enters into the shutdown state and the outputs are disabled. This is a
latched fault.
Thermal protection faults are reported on the FAULT pin.
If automatic recovery from the thermal protection latch is desired, connect the FAULT pin directly to the SD pin.
This allows the FAULT pin function to automatically drive the SD pin low which clears the thermal protection
latch.
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9.4 Device Functional Modes
The TPA3136D2 device is running in BD-modulation.
This is a modulation scheme that allows operation without the classic LC reconstruction filter when the amp is
driving an inductive load with short speaker wires. Each output is switching from 0 volts to the supply voltage.
The OUTPx and OUTNx are in phase with each other with no input so that there is little or no current in the
speaker. The duty cycle of OUTPx is greater than 50% and OUTNx is less than 50% for positive output voltages.
The duty cycle of OUTPx is less than 50% and OUTNx is greater than 50% for negative output voltages. The
voltage across the load sits at 0 V throughout most of the switching period, reducing the switching current, which
reduces any I2R losses in the load.
OUTP
OUTN
No Output
OUTP- OUTN
0V
Speaker
Current
OUTP
OUTN
Positive Output
PVCC
OUTP-OUTN
0V
Speaker
Current
0A
OUTP
Negative Output
OUTN
OUTP - OUTN
0V
- PVCC
Speaker
Current
0A
Figure 17. BD Mode Modulation
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10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
The TPA3136D2 device is designed for use in inductor free applications with limited distance wire length)
between amplifier and speakers like in TV sets, sound docks and Bluetooth speakers. The TPA3136D2 device
can either be configured in stereo or mono mode, depending on output power conditions. Depending on output
power requirements and necessity for (speaker) load protection, the built in PLIMIT circuit can be used to control
system power, see functional description of these features.
10.2 Typical Applications
PVCC
1nF
100nF
100µF
GND
FB
10k
/
SHUTDOWN
IN_LEFT
/SD
/FAULT
1µF
1µF
GND
1
28
PVCC
27
BSPL
26
2
LINP
3
LINN
4
NC
5
56k
1µF
6
AVCC
7
GND
GVDD
8
9
BSNL
TPA3136D2
PLIMIT
GND
1µF
10
RINN
11
RINP
IN_RIGHT
1µF
NC
PBTL
GND
1nF
220nF
OUTPL
25
GND
24
OUTNL
23
NC
1µF
39k
PVCC
12
13
14
22
BSNR
21
20
19
18
17
16
15
OUTNR
GND
GND
GND
1nF
FB
220nF
220nF
FB
GND
OUTPR
1nF
BSPR
PVCC
220nF
GND
PVCC
1nF
FB
GND
10R
PVCC
1nF
100nF
100µF
GND
Figure 18. Stereo Class-D Amplifier with BTL Output and Single-Ended Inputs with Spread Spectrum
Modulation
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Typical Applications (continued)
PVCC
1nF
10k
/SD
/
SHUTDOWN
/FAULT
PVCC
1
2
LINP
3
4
NC
5
GND
NC
AVCC
1µF
39k
56k
1µF
GND
8
GVDD
9
PLIMIT
GND
1µF
IN
1µF
GND
6
7
TPA3136D2
10
RINN
11
RINP
12
NC
13
PBTL
14
25
24
23
22
21
20
19
18
17
16
15
100µF
GND
28
PVCC
27
BSPL
26
LINN
100nF
470nF
OUTPL
FB
GND
GND
OUTNL
BSNL
1nF
BSNR
OUTNR
GND
GND
GND
1nF
OUTPR
FB
BSPR
PVCC
470nF
PVCC
10R
PVCC
1nF
100nF
100µF
GND
Figure 19. Stereo Class-D Amplifier with PBTL Output and Single-Ended Input with Spread Spectrum
Modulation
10.2.1 Design Requirements
10.2.1.1 PCB Material Recommendation
FR-4 Glass Epoxy material with 1 oz. (35 µm) is recommended for use with the TPA3136D2. The use of this
material can provide for higher power output, improved thermal performance, and better EMI margin (due to
lower PCB trace inductance). It is recommended to use several GND underneath the device thermal pad for
thermal coupling to a bottom side copper GND plane for best thermal performance.
10.2.1.2 PVCC Capacitor Recommendation
The large capacitors used in conjunction with each full-bridge, are referred to as the PVCC Capacitors. These
capacitors should be selected for proper voltage margin and adequate capacitance to support the power
requirements. In practice, with a well designed system power supply, 100 μF, 16 V will support most applications
with 12-V power supply. 25-V capacitor rating is recommended for power supply voltage higher than 12 V. For
The PVCC capacitors should be low ESR type because they are used in a circuit associated with high-speed
switching.
10.2.1.3 Decoupling Capacitor Recommendations
In order to design an amplifier that has robust performance, passes regulatory requirements, and exhibits good
audio performance, good quality decoupling capacitors should be used. In practice, X7R should be used in this
application.
The voltage of the decoupling capacitors should be selected in accordance with good design practices.
Temperature, ripple current, and voltage overshoot must be considered. This fact is particularly true in the
selection of the ceramic capacitors that are placed on the power supply to each full-bridge. They must withstand
the voltage overshoot of the PWM switching, the heat generated by the amplifier during high power output, and
the ripple current created by high power output. A minimum voltage rating of 16 V is required for use with a 12-V
power supply.
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Typical Applications (continued)
10.2.2 Detailed Design Procedure
A rising-edge transition on SD input allows the device to start switching. It is recommended to ramp the PVCC
voltage to its desired value before releasing SD for minimum audible artifacts.
The device is non-inverting the audio signal from input to output.
The GVDD pin is not recommended to be used as a voltage source for external circuitry.
10.2.2.1 Ferrite Bead Filter Considerations
Using the Advanced Emissions Suppression Technology in the TPA3136D2 amplifier it is possible to design a
high efficiency Class-D audio amplifier while minimizing interference to surrounding circuits. It is also possible to
accomplish this with only a low-cost ferrite bead filter. In this case it is necessary to carefully select the ferrite
bead used in the filter.
One important aspect of the ferrite bead selection is the type of material used in the ferrite bead. Not all ferrite
material is alike, so it is important to select a material that is effective in the 10 to 100 MHz range which is key to
the operation of the Class-D amplifier. Many of the specifications regulating consumer electronics have
emissions limits as low as 30 MHz. It is important to use the ferrite bead filter to block radiation in the 30-MHz
and above range from appearing on the speaker wires and the power supply lines which are good antennas for
these signals. The impedance of the ferrite bead can be used along with a small capacitor with a value in the
range of 1000 pF to reduce the frequency spectrum of the signal to an acceptable level. For best performance,
the resonant frequency of the ferrite bead/ capacitor filter should be less than 10 MHz.
Also, it is important that the ferrite bead is large enough to maintain its impedance at the peak currents expected
for the amplifier. Some ferrite bead manufacturers specify the bead impedance at a variety of current levels. In
this case it is possible to make sure the ferrite bead maintains an adequate amount of impedance at the peak
current the amplifier will see. If these specifications are not available, it is also possible to estimate the bead's
current handling capability by measuring the resonant frequency of the filter output at low power and at maximum
power. A change of resonant frequency of less than fifty percent under this condition is desirable. Examples of
ferrite beads which have been tested and work well with the TPA3136D2 device include NFZ2MSM series from
Murata.
A high quality ceramic capacitor is also needed for the ferrite bead filter. A low ESR capacitor with good
temperature and voltage characteristics will work best.
Additional EMC improvements may be obtained by adding snubber networks from each of the class-D outputs to
ground. Suggested values for a simple RC series snubber network would be 68 Ω in series with a 100-pF
capacitor although design of the snubber network is specific to every application and must be designed taking
into account the parasitic reactance of the printed circuit board as well as the audio amp. Take care to evaluate
the stress on the component in the snubber network especially if the amp is running at high PVCC. Also, make
sure the layout of the snubber network is tight and returns directly to the GND or the thermal pad beneath the
chip.
10.2.2.2 Efficiency: LC Filter Required with the Traditional Class-D Modulation Scheme
The main reason that the traditional class-D amplifier needs an output filter is that the switching waveform results
in maximum current flow. This causes more loss in the load, which causes lower efficiency. The ripple current is
large for the traditional modulation scheme, because the ripple current is proportional to voltage multiplied by the
time at that voltage. The differential voltage swing is 2 × VCC, and the time at each voltage is half the period for
the traditional modulation scheme. An ideal LC filter is needed to store the ripple current from each half cycle for
the next half cycle, while any resistance causes power dissipation. The speaker is both resistive and reactive,
whereas an LC filter is almost purely reactive.
The TPA3136D2 modulation scheme has little loss in the load without a filter because the pulses are short and
the change in voltage is VCC instead of 2 × VCC. As the output power increases, the pulses widen, making the
ripple current larger. Ripple current could be filtered with an LC filter for increased efficiency, but for most
applications the filter is not needed.
An LC filter with a cutoff frequency less than the class-D switching frequency allows the switching current to flow
through the filter instead of the load. The filter has less resistance but higher impedance at the switching
frequency than the speaker, which results in less power dissipation, therefore increasing efficiency.
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Typical Applications (continued)
10.2.2.3 When to Use an Output Filter for EMI Suppression
The TPA3136D2 device has been tested with a simple ferrite bead filter for a variety of applications including
long speaker wires up to 100 cm and high power. The TPA3136D2 EVM passes FCC Class B specifications
under these conditions using twisted speaker wires. The size and type of ferrite bead can be selected to meet
application requirements. Also, the filter capacitor can be increased if necessary with some impact on efficiency.
There may be a few circuit instances where it is necessary to add a complete LC reconstruction filter. These
circumstances might occur if there are nearby circuits which are sensitive to noise. In these cases a classic
second order Butterworth filter similar to those shown in the figures below can be used.
Some systems have little power supply decoupling from the AC line but are also subject to line conducted
interference (LCI) regulations. These include systems powered by "wall warts" and "power bricks." In these
cases, LC reconstruction filters can be the lowest cost means to pass LCI tests. Common mode chokes using
low frequency ferrite material can also be effective at preventing line conducted interference.
Ferrite
Chip Bead
OUTP
1 nF
Ferrite
Chip Bead
OUTN
1 nF
Figure 20. Typical Ferrite Chip Bead Filter (Chip Bead Example: NFZ2MSM series from Murata)
33 mH
OUTP
L1
C2
1 mF
33 mH
OUTN
L2
C3
1 mF
Figure 21. Typical LC Output Filter, Cutoff Frequency of 27 kHz, Speaker Impedance = 8 Ω
15 mH
OUTP
L1
C2
2.2 mF
15 mH
OUTN
L2
C3
2.2 mF
Figure 22. Typical LC Output Filter, Cutoff Frequency of 27 kHz, Speaker Impedance = 6 Ω
10.2.2.4 Input Resistance
The typical input resistance of the amplifier is fixed to 30 kΩ ±20%.
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Typical Applications (continued)
Zf
Ci
IN
Input
Signal
Zi
10.2.2.5 Input Capacitor, Ci
In the typical application, an input capacitor (Ci) is required to allow the amplifier to bias the input signal to the
proper dc level for optimum operation. In this case, Ci and the input impedance of the amplifier (Zi) form a highpass filter with the corner frequency determined in Equation 1.
-3 dB
fc =
1
2p Zi Ci
fc
(1)
The value of Ci is important, as it directly affects the bass (low-frequency) performance of the circuit. Consider
the example where Zi is 30 kΩ and the specification calls for a flat bass response down to 20 Hz. Equation 1 is
reconfigured as Equation 2.
Ci =
1
2p Zi fc
(2)
In this example, Ci is 0.27 µF; so, one would likely choose a value of 0.33 μF as this value is commonly used. A
further consideration for this capacitor is the leakage path from the input source through the input network (Ci)
and the feedback network to the load. This leakage current creates a dc offset voltage at the input to the
amplifier that reduces useful headroom. For this reason, a low-leakage tantalum or ceramic capacitor is the best
choice. When polarized capacitors are used, the positive side of the capacitor should face the amplifier input in
most applications as the dc level there is held at 3 V, which is likely higher than the source dc level. Note that it
is important to confirm the capacitor polarity in the application. Additionally, lead-free solder can create dc offset
voltages and it is important to ensure that boards are cleaned properly.
10.2.2.6 BSN and BSP Capacitors
The full H-bridge output stages use only NMOS transistors. Therefore, they require bootstrap capacitors for the
high side of each output to turn on correctly. A 0.22-μF ceramic capacitor, rated for at least 25 V, must be
connected from each output to its corresponding bootstrap input. Specifically, one 0.22-μF capacitor must be
connected from OUTPx to BSPx, and one 0.22-μF capacitor must be connected from OUTNx to BSNx. (See the
application circuit diagram in Figure 18.)
The bootstrap capacitors connected between the BSxx pins and corresponding output function as a floating
power supply for the high-side N-channel power MOSFET gate drive circuitry. During each high-side switching
cycle, the bootstrap capacitors hold the gate-to-source voltage high enough to keep the high-side MOSFETs
turned on.
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Typical Applications (continued)
10.2.2.7 Differential Inputs
The differential input stage of the amplifier cancels any noise that appears on both input lines of the channel. To
use the TPA3136D2 device with a differential source, connect the positive lead of the audio source to the INP
input and the negative lead from the audio source to the INN input. To use the TPA3136D2 with a single-ended
source, ac ground the INP or INN input through a capacitor equal in value to the input capacitor on INN or INP
and apply the audio source to either input. In a single-ended input application, the unused input should be ac
grounded at the audio source instead of at the device input for best noise performance. For good transient
performance, the impedance seen at each of the two differential inputs should be the same.
The impedance seen at the inputs should be limited to an RC time constant of 1 ms or less if possible. This is to
allow the input dc blocking capacitors to become completely charged during the 14-ms power-up time. If the input
capacitors are not allowed to completely charge, there will be some additional sensitivity to component matching
which can result in pop if the input components are not well matched.
10.2.2.8 Using Low-ESR Capacitors
Low-ESR capacitors are recommended throughout this application section. A real (as opposed to ideal) capacitor
can be modeled simply as a resistor in series with an ideal capacitor. The voltage drop across this resistor
minimizes the beneficial effects of the capacitor in the circuit. The lower the equivalent value of this resistance,
the more the real capacitor behaves like an ideal capacitor.
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Typical Applications (continued)
10.2.3 Application Performance Curves
10.2.3.1 EN55013 Radiated Emissions Results
TPA3136D2 EVM, PVCC = 12 V, 8-Ω speakers, PO = 4 W
Figure 23. Radiated Emission - Horizontal
Figure 24. Radiated Emission - Vertical
10.2.3.2 EN55022 Conducted Emissions Results
TPA3136D2 EVM, PVCC = 12 V, 8-Ω speakers, PO = 4 W
EN55022 Class B
EN55022 Class B
80
80
QP readings
QP limit
60
50
40
30
20
0.15
60
50
40
30
0.3
0.5
1
2
3
5
Frequency (MHz)
10
Figure 25. Conducted Emission - Line
22
70
Level (dBPV)
Level (dBPV)
70
QP readings
QP limit
20 30
20
0.15
0.3
0.5
1
2
3
5
Frequency (MHz)
10
20 30
Figure 26. Conducted Emission - Neutral
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11 Power Supply Recommendations
11.1 Power Supply Decoupling, CS
The TPA3136D2 device is a high-performance CMOS audio amplifier that requires adequate power supply
decoupling to ensure that the output total harmonic distortion (THD) is as low as possible. Power supply
decoupling also prevents oscillations for long lead lengths between the amplifier and the speaker. Optimum
decoupling is achieved by using a network of capacitors of different types that target specific types of noise on
the power supply leads. For higher frequency transients due to parasitic circuit elements such as bond wire and
copper trace inductances as well as lead frame capacitance, a good quality low equivalent-series-resistance
(ESR) ceramic capacitor of value between 220 pF and 1000 pF works well. This capacitor should be placed as
close to the device PVCC pins and system ground (either GND pins or thermal pad) as possible. For midfrequency noise due to filter resonances or PWM switching transients as well as digital hash on the line, another
good quality capacitor typically 0.1 μF to 1 µF placed as close as possible to the device PVCC leads works best.
For filtering lower frequency noise signals, a larger aluminum electrolytic capacitor of 100 μF or greater placed
near the audio power amplifier is recommended. The 100-μF capacitor also serves as a local storage capacitor
for supplying current during large signal transients on the amplifier outputs. The PVCC pins provide the power to
the output transistors, so a 100-µF or larger capacitor should be placed on each PVCC pin. A 1-µF capacitor on
the AVCC pin is adequate. Also, a small decoupling resistor between AVCC and PVCC can be used to keep high
frequency class-D noise from entering the linear input amplifiers.
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12 Layout
12.1 Layout Guidelines
The TPA3136D2 device can be used with a small, inexpensive ferrite bead output filter for most applications.
However, since the Class-D switching edges are fast, it is necessary to take care when planning the layout of the
printed circuit board. The following suggestions will help to meet EMC requirements.
• Decoupling capacitors—The high-frequency decoupling capacitors should be placed as close to the PVCC
and AVCC pins as possible. Large (100-µF or greater) bulk power supply decoupling capacitors should be
placed near the TPA3136D2 device on the PVCC supplies. Local, high-frequency bypass capacitors should
be placed as close to the PVCC pins as possible. These caps can be connected to the thermal pad directly
for an excellent ground connection. Consider adding a small, good quality low ESR ceramic capacitor
between 220 pF and 1000 pF and a larger mid-frequency cap of value between 0.1 μF and 1 μF also of good
quality to the PVCC connections at each end of the chip.
• Keep the current loop from each of the outputs through the ferrite bead and the small filter cap and back to
GND as small and tight as possible. The size of this current loop determines its effectiveness as an antenna.
• Grounding—The AVCC (pin 14) decoupling capacitor should be connected to ground (GND). The PVCC
decoupling capacitors should connect to GND. Analog ground and power ground should be connected at the
thermal pad, which should be used as a central ground connection or star ground for the TPA3136D2.
• Output filter—The ferrite EMI filter (Figure 20) should be placed as close to the output pins as possible for the
best EMI performance. The capacitors used in the ferrite should be grounded to power ground.
• Thermal Pad—The thermal pad must be soldered to the PCB for proper thermal performance and optimal
reliability. The dimensions of the thermal pad and thermal land should be 6.46 mm × 2.35 mm. Six rows of
solid vias (three vias per row, 0.3302 mm or 13 mils diameter) should be equally spaced underneath the
thermal land. The vias should connect to a solid copper plane, either on an internal layer or on the bottom
layer of the PCB. The vias must be solid vias, not thermal relief or webbed vias. See the TI Application
Report SLMA002 for more information about using the TSSOP thermal pad. For recommended PCB
footprints, see figures at the end of this data sheet.
For an example layout, see the TPA3136D2 Evaluation Module (TPA3136D2EVM) User Manual. Both the EVM
user manual and the thermal pad application report are available on the TI Web site at http://www.ti.com.
24
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SLOS938B – MAY 2016 – REVISED JUNE 2016
12.2 Layout Example
100PF
100nF
1
28
2
27
3
26
4
25
5
24
6
23
7
22
8
2118
9
20
10
19
11
18
12
17
13
16
14
15
FB
1nF
1nF
0.22PF
1nF
FB
0.22PF
1PF
1PF
0.22PF
FB
1nF
0.22PF
1nF
1nF
FB
100nF
100PF
Top Layer Ground and Thermal Pad
Via to Bottom Ground Plane
Pad to Top Layer Ground Pour
Top Layer Signal Traces
Figure 27. BTL Layout Example
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25
TPA3136D2
SLOS938B – MAY 2016 – REVISED JUNE 2016
www.ti.com
13 Device and Documentation Support
13.1 Device Support
13.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
13.2 Documentation Support
13.2.1 Related Documentation
PowerPAD™ Thermally Enhanced Package Application Report (SLMA002)
13.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
13.4 Trademarks
SpeakerGuard, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
13.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
26
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14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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Product Folder Links: TPA3136D2
27
PACKAGE OPTION ADDENDUM
www.ti.com
30-Jun-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TPA3136D2PWP
ACTIVE
HTSSOP
PWP
28
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
TPA3136D2
TPA3136D2PWPR
ACTIVE
HTSSOP
PWP
28
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
TPA3136D2
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
30-Jun-2016
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Jun-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TPA3136D2PWPR
Package Package Pins
Type Drawing
SPQ
HTSSOP
2000
PWP
28
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
330.0
16.4
Pack Materials-Page 1
6.9
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
10.2
1.8
12.0
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Jun-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPA3136D2PWPR
HTSSOP
PWP
28
2000
367.0
367.0
38.0
Pack Materials-Page 2
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