Customer Guidelines for
Visual/Mechanical Inspection, Packing,
Shipping, Storage & Handling of
AMD Athlon™ 64 and AMD Opteron™
Processors
AMD Athlon™ 64 and AMD Opteron™ processor returns that are Out-ofWarranty or have any of the following types of severe visual-mechanical
damage may not be returned. These include:
1. Bent or Damaged Pins
Careful handling procedures must be observed in order to prevent irreparable
damage to the pins.Catastrophic damage is most often caused by forcing the unit
into the socket incorrectly, incorrectly uninstalling the heatsink fan while the
processor is attached, by dropping the unit, or by pushing the unit with the pins
against a hard surface. AMD considers any processor with five or more of pins
that have been bent greater than the width of two pins to be user induced
damage. AMD does not recommend straightening any pin that has been bent
more than the width of one pin.
2. Package Chips and Cracks
Chips or cracks in the package may be caused by dropping the processor, or by hitting the processor with a
hard object or surface. All package chips or cracks are considered user-induced damage.
4/2/04_rev5.4
3. Pin Contamination Due to Improper Handling of the Processor
The proper procedure for holding the processor is to grasp it by the
edge of the package with two fingers, paying careful attention not to
touch the pins. As a direct result of the high pin count of this processor,
the pitch of the pins is quite fine, and minute amounts of contaminant
can adversely affect continuity. Pay particular attention not to get
thermal grease on your fingers as this contaminant may be easily
transferred to the pins if they are touched accidentally. If thermal
grease IS accidentally transferred to the pins, DO NOT insert the
processor into the socket, as it may render the socket non-functional.
Thermal grease should be applied in a 34 to 35 mm square, 0.06 to
0.08 mm thick. This quantity of grease provides adequate, but not
excessive, coverage of the processor lid. Thermal grease may flow
over the edges of the processor and reach the socket if an excessive
quantity is applied. Contaminant on the processor pins is considered
user-induced, and processors exhibiting signs of contamination are
unacceptable returns.
Notes on Thermal Interface Material
For lidded AMD Athlon™ 64 and AMD Opteron™ processors, AMD recommends using a high-performance thermal grease
between the processor lid and the heatsink. AMD DOES NOT recommend using a phase-change material for lidded AMD Athlon
64 and AMD Opteron processors . Phase-change materials develop high adhesion forces between the heatsink and processor
when the material is in the solid phase, which may cause the processor to stick to the heatsink. During heatsink removal, this
strong adhesive force may cause the processor to be removed from the socket while it is locked, and this action may result in
damage to the socket or to the processor pins.
A list of recommended thermal grease suppliers can be found on AMD’s online technical support service site: http://ask.amd.com
4/2/04_rev5.4
Handling, Storage and Packing Guidelines
Grounding
When removed from the AMD approved shipping box, processors must be protected from ESD damage by
placing the trays on a grounded, anti-static surface.
Handling DOs and DON’Ts
Keep processors in their
individual tray pockets .
!
DO NOT stack processors
on top of one another.
"
Hold the processor by the
edge of the package, with two
fingers.
!
DO NOT touch the pins
when transporting the
processor.
"
Carry the tray via the side tabs,
without touching the processors.
!
DO NOT touch the processor
lid when carrying the tray.
"
Carry the tray via the side tabs
without touching the processors
!
DO NOT touch the processor
pins when carrying the tray.
"
4/2/04_rev5.4
Tray Identification
AMD Opteron Tray
The AMD Opteron™ (940 pin ceramic package) tray is different from the
AMD Athlon™ 64 (754 pin organic package) tray. The two trays ARE NOT
interchangeable. Use of the wrong tray for either package type may cause
damage to the pins.
|AMD Opteron trays are readily distinguishable by: 1.) the slots in the
middle section of the tray, and 2.) the UCPGA designator on the top tab of
the tray. AMD Athlon 64 trays are readily distinguishable by: 1.) the dots in
the middle section of the tray and, 2.) the UOPGA designator on the top tab
of the tray.
The markings on the tabs of the tray should always be “face up”. In this
position, the processor rests in the tray in “live-bug” position, i.e., with pins
pointing downward.
TAB (UCPGA)
SLOTS
AMD Athlon 64 Tray
TAB (UOPGA)
DOTS
Transporting Trays
When multiple processors are to be transported, use trays provided by AMD and
ensure the following:
•
•
Trays are stacked without gaps in-between individual trays, and are strapped
together.
Secure trays with a minimum of 2 straps for transportation. (One at each end.)
Trays without straps, or with loose straps, are not acceptable for transportation.
Straps are considered loose if one is able to slide a finger under them.
•
Adequate packing material is used in the shipping box (see photo to the right).
•
Do not use thin rubber bands, or adhesive tape. If a strapping machine is not
available, use thick, ESD-safe bands.
4/2/04_rev5.4
Proper Transfer of the Processor into a Plastic Clamshell
AMD-Approved Clamshell: When individual processors are to be transported, ensure that the unit is
packed in an AMD-approved clamshell. Do not use unapproved clamshells, as they may not meet the
required ESD material properties, or physical dimensions, required to protect the package and pins.
(Contact your AMD salesperson for information on approved clamshells.)
Clamshell Alternative: If an AMD-approved clamshell is not available, care must be taken to protect the
pins from physical damage, and the processor from ESD damage, during transit. Conductive ESD foam
should be used to prevent physical damage to the pins, and anti-static bags should be used to protect the
processor from ESD damage.
Proper grounding should be observed when handling the processor.
1. Hold the processor
horizontal to the cavity of
the clamshell.
2. Place the processor gently
in the cavity. Do not apply
force to the processor.
3. Close the lid, and
press down on the two
corners to lock the
clamshell.
4/2/04_rev5.4
PIB Features
AMD Athlon™ 64, 64 FX and AMD Opteron™
The 64-bit PIBs have the features of the earlier 32-bit
versions, including:
– An AMD-approved, low noise heatsink fan (less than 34 dBA)
– An AMD-recommended thermal interface material
– A heat-sealed package to alleviate tampering
– A 3-year limited warranty
– A certificate of authenticity
– An installation guide
– A bezel sticker with processor logo for authenticity
– Individual Serialization and Bar Coding for easy scanning
4/2/04_rev5.4
Mounting the Heatsink Fan
AMD Athlon™ 64, 64 FX and AMD Opteron™ processors
The Heatsink Fan is attached to the platform as follows:
– A backplate (supplied with the motherboard) is mounted to
the underside of the motherboard to prevent the
motherboard from flexing beneath the processor
– A retention frame (supplied with the motherboard) is placed
on the top side of the motherboard and then secured
through the motherboard to the backplate
– The processor is positioned in the socket and locked in
place
– Thermal grease is applied to the top of the processor’s
heat spreader. A supply of thermal grease is included with
the PIB
– With the heatsink positioned in the retention frame, the
cam lever on the heatsink is rotated to lock it to the
platform
– The power line for the CPU cooler fan is attached to the
CPU fan power connector on the motherboard
4/2/04_rev5.4