PE35400
Document Category: Product Specification
UltraCMOS® Divide-by-4 Prescaler, 3–13.5 GHz
Features
Figure 1 • PE35400 Functional Diagram
• High frequency support up to 13.5 GHz
• Low SSB phase noise of –135 dBc/Hz @
3.025 GHz output frequency
• Low supply current of 16 mA
D
Q
D
Q
• Bare die
Q
Q
Applications
• Wireless communication
• Test and measurement
• Phased array radar
Product Description
The PE35400 is a high-performance UltraCMOS® prescaler with a fixed divide ratio of 4. It supports an operating
frequency range from 3–13.5 GHz. It operates on a single voltage supply with a frequency-selecting bias resistor
and draws a low current of 16 mA. The PE35400 is available in bare die.
The PE35400 is manufactured on Peregrine’s UltraCMOS process, a patented variation of silicon-on-insulator
(SOI) technology on a sapphire substrate, offering the performance of GaAs with the economy and integration of
conventional CMOS.
©2015, Peregrine Semiconductor Corporation. All rights reserved. • Headquarters: 9380 Carroll Park Drive, San Diego, CA, 92121
Product Specification
DOC-64872-2 – (10/2015)
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PE35400
Divide-by-4 Prescaler
Absolute Maximum Ratings
Exceeding absolute maximum ratings listed in Table 1 may cause permanent damage. Operation should be
restricted to the limits in Table 2. Operation between operating range maximum and absolute maximum for
extended periods may reduce reliability.
ESD Precautions
When handling this UltraCMOS device, observe the same precautions as with any other ESD-sensitive devices.
Although this device contains circuitry to protect it from damage due to ESD, precautions should be taken to
avoid exceeding the rating specified in Table 1.
Latch-up Immunity
Unlike conventional CMOS devices, UltraCMOS devices are immune to latch-up.
Table 1 • Absolute Maximum Ratings for PE35400
Parameter/Condition
Min
Max
Unit
Supply voltage, VDD
–0.3
3.3
V
+14
dBm
+150
°C
250
V
Input power, 50Ω
Storage temperature range
–65
ESD voltage HBM, all pins(*)
Note: * Human body model (MIL-STD 883 Method 3015).
Recommended Operating Conditions
Table 2 lists the recommending operating conditions for the PE35400. Devices should not be operated outside
the recommended operating conditions listed below.
Table 2 • Recommended Operating Conditions for PE35400
Parameter
Min
Typ
Max
Unit
Supply voltage, VDD
2.65
2.8
2.95
V
+7
dBm
+85
°C
Input power, 50Ω, based on optimal RBIAS (see Figure 3), PIN
Operating temperature range
–40
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PE35400
Divide-by-4 Prescaler
Electrical Specifications
Table 3 provides the PE35400 key electrical specifications @ +25 °C, VDD = 2.8V (ZS = ZL = 50Ω), unless
otherwise specified.
Table 3 • PE35400 Electrical Specifications(*)
Parameter
Condition
Operating frequency, FIN
Min
Typ
3.0 GHz
Max
Unit
13.5 GHz As shown
FIN = 3–4.5 GHz
–5
> –7
dBm
FIN = >4.5–11.5 GHz
–15
> –20
dBm
FIN = >11.5–13.5 GHz
–1
> –7
dBm
Output power
0.75–3.375 GHz output frequency range
0
5
dBm
Reverse leakage
FIN = 3–13.5 GHz, PIN = 0 dBm
–45
dBm
SSB phase noise
3.025 GHz output frequency @ 100 kHz offset, PIN = 0 dBm
–135
dBc/Hz
Supply current, IDD
FIN = 8 GHz
16
mA
Input power sensitivity
Note: * All values in Min/Max columns are guaranteed by design characterization.
DOC-64872-2 – (10/2015)
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PE35400
Divide-by-4 Prescaler
Device Functional Considerations
The PE35400 divides a 3.0–13.5 GHz input signal by four, producing a 750 MHz to 3.375 GHz output signal. In
order for the prescaler to work properly, several conditions need to be adhered to. It is crucial that VBYPS and VDD
are supplied with bypass capacitors to ground. In addition, the output signal RFOUT needs to be AC coupled via
an external capacitor, as shown in Figure 2. The input frequency range is selected by the value of RBIAS
according to Figure 3. The ground pattern on the board should be made as wide as possible to minimize ground
impedance.
Figure 2 • Circuit Block Diagram for PE35400(*)
10 pF
GND
0.01 μF
10 pF
VBYPS
VDD
VBYPS
50Ω
RFIN
Transmission
Line
RBIAS
RBIAS
RFOUT
VDD
10 pF
0.01 μF
6.8 pF
50Ω
GND
Die ID
Transmission
Line
Note: * For optimal performance, the following bond wire configuration is recommended. VBYPS: 2 bond wires per pad. RFIN: 1 bond wire. GND: 3
bond wires per pad. RFOUT: 2 bond wires. VDD: 2 bond wires. RBIAS: 1 bond wire.
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PE35400
Divide-by-4 Prescaler
Typical Performance Data
Figure 3 through Figure 11 show the typical performance data @ +25 °C, VDD = 2.8V (ZS = ZL = 50Ω), based on
optimal RBIAS as shown in Figure 3, unless otherwise specified.
Figure 3 • Frequency vs RBIAS
Lower Freq Limit (PIN = 0 dBm)
Optimal Level
Upper Freq Limit (PIN = -7 dBm)
Upper Freq Limit (PIN = 0 dBm)
Lower Freq Limit (PIN = -7 dBm)
Input Frequency (GHz)
16
14
12
10
8
6
4
2
0
5.6
8.2
12
18
27
39
56
RBIAS (kΩ)
DOC-64872-2 – (10/2015)
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PE35400
Divide-by-4 Prescaler
Figure 4 • Input Power Sensitivity
Min PIN
Max PIN
10
Input Power (dBm)
5
0
Recommended input power
operating region
-5
-10
-15
-20
RBIAS = 56 kΩ
RBIAS = 5.6 kΩ
-25
1
2
3
4
5
6
7
8
9
10
Input Frequency (GHz)
4.5 GHz
11
12
13
14
15
14
15
11.5 GHz
Figure 5 • Input Power Sensitivity vs Temperature
Min PIN -40 °C
Min PIN +25 °C
Min PIN +85 °C
Max PIN -40 °C
Max PIN +25 °C
Max PIN +85 °C
10
Input Power (dBm)
5
RBIAS = 56 kΩ
RBIAS = 5.6 kΩ
0
-5
-10
-15
-20
-25
1
2
3
4
5
4.5 GHz
6
7
8
9
10
Input Frequency (GHz)
Page 6
11
12
13
11.5 GHz
DOC-64872-2 – (10/2015)
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PE35400
Divide-by-4 Prescaler
Figure 6 • Output Power vs VDD
Output power @ 2.65V
Output power @ 2.8V
Output power @ 2.95V
10
9
Ouput Power (dBm)
8
7
6
5
4
3
2
1
0
2
3
4
5
6
RBIAS Max
= 56 kΩ
7
8
9
10
11
12
14
13
RBIAS Min
= 5.6 kΩ
Input Frequency (GHz)
Figure 7 • Output Power vs Temperature
Output power @ -40 °C
Output power @ +25 °C
Output power @ +85 °C
Output Power (dBm)
10
9
8
7
6
5
4
3
2
1
0
2
RBIAS Max
= 56 kΩ
3
4
6
7
8
9
10
Input Frequency (GHz)
DOC-64872-2 – (10/2015)
11
12
13
14
RBIAS Min
= 5.6 kΩ
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PE35400
Divide-by-4 Prescaler
Figure 8 • SSB Phase Noise @ 3.025 GHz Output Frequency, PIN = 0 dBm
SSB Phase Noise @ 3.025 GHz Output Frequency
-125
Phase Noise (dBc/Hz)
-130
-135
-140
-145
-150
-155
-160
1.E+05
1.E+06
1.E+07
Offset Frequency (Hz)
Figure 9 • Output Harmonics, PIN = 0 dBm
2nd Harmonic
3rd Harmonic
Feedthru
0
Output Power (dBm)
-5
-10
-15
-20
-25
-30
-35
-40
2
4
6
8
10
12
14
Input Frequency (GHz)
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PE35400
Divide-by-4 Prescaler
Figure 10 • IDD vs RBIAS
Supply Current
20
19
18
IDD (mA)
17
16
15
14
13
12
11
10
5.6
8.2
12
18
27
39
56
RBIAS (kΩ)
Figure 11 • Reverse Leakage, PIN = 0 dBm
Reverse Leakage
-20
Power Level (dBm)
-30
-40
-50
-60
-70
2
3
4
5
6
7
8
9
10
11
12
13
14
Input Frequency (GHz)
DOC-64872-2 – (10/2015)
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PE35400
Divide-by-4 Prescaler
Pad Configuration
This section provides pad information for the
PE35400. Figure 12 shows the pad configuration of
this device. Table 4 provides a description for each
pad.
Table 4 • Pad Descriptions for PE35400
Pad No.
Pad
Name
1
VBYPS
Prescaler supply bypass
2
VBYPS
Prescaler supply bypass
7
3
RFIN
RF input
RBIAS
4
GND
Ground
5
RFOUT
6
VDD
7
RBIAS
Frequency selecting bias resistor
8
GND
Ground
Figure 12 • Pad Configuration (Top View)
1
8
GND
VBYPS
6
2
VDD
VBYPS
Description
RF output
Supply voltage
5
3
RFIN
Die ID
4
GND
RFOUT
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PE35400
Divide-by-4 Prescaler
Die Mechanical Specifications
This section provides the die mechanical specifications for the PE35400.
Table 5 • Mechanical Specifications for PE35400
Die size, singulated (x,y)
Min
Typ
Max
Unit
Condition
866 × 716
886 × 736
916 × 766
µm
Including excess sapphire, max
tolerance = –20/+30 µm
180
200
220
µm
Wafer thickness
Wafer size
150
Table 6 • Pad Coordinates for PE35400(*)
Pad Pad
No. Name
Pad Center (µm)
mm
Figure 13 • Pad Layout for PE35400(1)(2)
Pad Opening
Size (µm)
X
Y
X
Y
1
8
GND
7
RBIAS
VBYPS
1
VBYPS
–303
198
160
180
2
VBPYS
–303
–3
160
180
2
3
RFIN
–303
–208
100
100
VBYPS
4
GND
68
–243
290
130
5
RFOUT
333
–193
100
190
6
VDD
318
40
130
190
7
RBIAS
318
243
130
130
8
GND
14
243
290
130
Note: * All pad locations originate from the die center and refer to the
center of the pad.
6
VDD
736 μm (−20 / +30 μm)
Parameter
5
3
RFIN
Die ID
4
GND
RFOUT
886 μm (−20 / +30 μm)
Notes:
1) Drawings are not drawn to scale.
2) Singulated die size shown, pad side up.
DOC-64872-2 – (10/2015)
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PE35400
Divide-by-4 Prescaler
Waffle Pack Information
Figure 14 provides the waffle pack information for the PE35400.
Figure 14 • 2 × 2 Inch Waffle Pack for PE35400(1)(2)(3)
Notch
Pocket Closeup
Pad 1
Die ID
Notes:
1) Drawings are not drawn to scale.
2) Die in pocket shown pad side up.
3) Die will be oriented in the same direction in and within all waffle packs. Unless otherwise stated, die will be oriented such that the top left corner
of die will be in-line with the "notched" corner of the die plate base and corner. The die base cover label will be affixed on the die base cover
such that the top of the label indicates the top of the die within the waffle pack.
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PE35400
Divide-by-4 Prescaler
Ordering Information
Table 7 lists the available ordering code for the PE35400 as well as available shipping method.
Table 7 • Order Code for PE35400
Order Codes
PE35400A–G
Description
Packaging
Shipping Method
PE35400 die
Die in 2 × 2 inch waffle pack
100 die/waffle pack
Document Categories
Advance Information
Product Brief
The product is in a formative or design stage. The datasheet contains
design target specifications for product development. Specifications
and features may change in any manner without notice.
This document contains a shortened version of the datasheet. For the
full datasheet, contact sales@psemi.com.
Preliminary Specification
Not Recommended for New Designs (NRND)
This product is in production but is not recommended for new designs.
The datasheet contains preliminary data. Additional data may be added
at a later date. Peregrine reserves the right to change specifications at
any time without notice in order to supply the best possible product.
Product Specification
The datasheet contains final data. In the event Peregrine decides to
change the specifications, Peregrine will notify customers of the
intended changes by issuing a CNF (Customer Notification Form).
End of Life (EOL)
This product is currently going through the EOL process. It has a
specific last-time buy date.
Obsolete
This product is discontinued. Orders are no longer accepted for this
product.
Sales Contact
For additional information, contact Sales at sales@psemi.com.
Disclaimers
The information in this document is believed to be reliable. However, Peregrine assumes no liability for the use of this information. Use shall be
entirely at the user’s own risk. No patent rights or licenses to any circuits described in this document are implied or granted to any third party.
Peregrine’s products are not designed or intended for use in devices or systems intended for surgical implant, or in other applications intended to
support or sustain life, or in any application in which the failure of the Peregrine product could create a situation in which personal injury or death
might occur. Peregrine assumes no liability for damages, including consequential or incidental damages, arising out of the use of its products in
such applications.
Patent Statement
Peregrine products are protected under one or more of the following U.S. patents: patents.psemi.com
Copyright and Trademark
©2015, Peregrine Semiconductor Corporation. All rights reserved. The Peregrine name, logo, UTSi and UltraCMOS are registered trademarks and
HaRP, MultiSwitch and DuNE are trademarks of Peregrine Semiconductor Corp.
Product Specification
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DOC-64872-2 – (10/2015)