Smart Things Require
Smart Packaging
Semicon West
David Bolognia
July, 2016
Copyright 2016 Analog Devices, Inc.
IoT and the Semiconductor Solutions Provider
Progress through sensing, amplifying, converting, sharing and processing information with the things in our lives!
Cloud Services
Communications
Sense
Amp
Convert
Process
Convert
Amp
Output
Control & Power
Copyright 2016 Analog Devices, Inc.
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A Typical System Level Solution
Optical
Sensor
Communications
LAN/WAN/BAN
Microprocessor
Motion
Sensor
Electrodes
Etc..
Temp
Sensor
Memory
ECG
Other
Sensors
User Interface
Connectors
Antennas
Passives
Battery
Energy Harvesting
Power Management
Packaging the Solution
System in Package
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Understanding Packaging Trade-Offs
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Value of size, weight
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Miniaturization
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Design Challenges
Market driven
Over design
Time to market risk
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Integration, form factor
High speed/frequency
Heat dissipation
Power consumption (ULP)
Copyright 2016 Analog Devices, Inc.
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Cost of manufacturing
Cumulative yield loss
Wafer probe, KGD
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Two Paths to System Solution Integration
System on Chip
System in Package
- May benefit from Moore’s Law
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Best fab technology for each function
- All or most functions on one die
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Re-use of qualified silicon
- Analog & digital integration challenge
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Customization
- Small ‘tweaks’ require new mask set
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Passive integration
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Lower NRE
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System in Package Technology at ADI
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Primary package-level technology for integration of the signal chain
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Integration of various process & product technologies
 Silicon (many), SiGe, GaAs, GaN
 Amplifier, convertor, micro-controller, sensors, etc.
 Passive integration (discrete and IPD)
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SiP package formats
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Rigid laminate
Flex
Ceramic
Leadframe
Others?
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SiP is the Integration of Enabling Packaging Technologies
 Enabling technologies
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Advanced laminate & flex technologies
Chip & wire
Flip chip (plated & copper pillar)
Die stacking (pyramid, spacer, FOW, flip-stack)
Discrete passives & IPDs
Embedded components
Mechanical integration & shielding
Laminate
Technologies
Mixed Interconnect
Technologies
Copper Pillar BOL
IPD (2.45GHz Matching Circuit)
High
Density
Flex
Film Over Wire
Flip Stack
Optical SiP
Stacked Boards
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System on Flex (SOF)
 Sensor integration in 3D
 Applications
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Medical imaging
Vital signs
Consumer
Industrial
Optical Sensor
on Flex
Single Metal System on Flex
 Advance flex technologies
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Ultra-fine geometries (25um pitch, 20um via)
1, 2, 4+ layers
PI, LCP, Teflon
SMT, W/B, F/C, & TCB interconnect
Embedded features (RLC, antennas)
Mechanical assembly (stiffeners, lids, etc.)
2 Metal High Density Flex
(Stiffeners, Antennas)
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3D Industrial
Sensor Node
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IoT Example: Remote Sensor Node (Smart Factory)
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Core hardware technologies
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Packaging challenges
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Sensors: acceleration, vibration, humidity, temperature
Amplifiers, converters, MCUs
Wireless radios
Energy harvesting and power management
RF + digital integration (isolation & signal integrity)
Ultra-low power design
Sensor location, orientation, exposure to the environment
Antenna performance, boundary conditions
Battery packaging and energy harvesting
Partitioning (SiP Radio Modules)
Breadboard Circuit
Complete Sensor Nodes
Evaluation Cards & PCB Products
Copyright 2016 Analog Devices, Inc.
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IoT Examples: Vital Signs (Smart Wearables)
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Body worn sensor node
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Batteries
A-side
Sensors and AFEs
Radio + antenna
NFC + antenna
PMU
Microcontroller
Batteries
Wrapped flex
LEBT Tx
B-side
w/antenna
Flex & Housing
MCU
►
Sensor
PMU
NFC Antenna
Sensor
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VSM module
 Microcontroller
 Optical HRM + ECG
 LEBT, matching circuit on IPD &
antenna
 XL
 Cap Sense
 Folded flex
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The Flex Interconnect Density Challenge
Power
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Coexistence of plated and printed flex
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Interconnect to ICs require HD flex
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2-4 routing layers (interconnect at SI)
30um line and space
Through & blind metal filled micro-vias
Solder mask w/30um registration
Supports solder attach and wire
Plating technologies
Printed flex supports size and cost
necessary to stretch across body
 Rigid or HD flex interposers
 Larger discretes and electrodes
2.80
0.35
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2.80
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10’s of centimeters
5-20 interconnects
2.60
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10’s of millimeters
5-10 interconnects
Micro (64p)
0.40
2.60
2.80
0.40
AFE (36p)
2.40
RF (42p)
Ground
Copyright 2016 Analog Devices, Inc.
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IoT Packaging – The Tail Wags the Dog!
Fashionable
Small Size
Communication
Low Power/
Re-chargeable
Comfortable
Affordable
Purposeful
Safe
Robustness
Ecosystem
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Thank You!
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