Stackpole Electronics, Inc.
Recommended Solder Profiles
Resistive Product Solutions
RECOMMENDED SOLDER PROFILES
This document is intended as a reference for solder profiles for SEI resistive components. These profiles
should be compatible with most soldering processes. These are only recommendations. Actual numbers will
depend on board density, geometry, packages used, etc., especially those cells labeled with “*”.
100% Matte Tin/RoHS Compliant Terminations
Soldering iron recommended temperatures: 330ºC to 350ºC with minimum duration.
Wave Soldering
Description
Preheat Time
Temperature Diff.
Solder Temp.
Dwell Time @ Max.
Ramp DN (deg. C/sec)
Maximum
80 sec.
140ºC
260ºC
10 sec.
NA
Recommended
70 sec.
120ºC
250ºC
5 sec.
NA
Minimum
60 sec.
100ºC
240ºC
NA
Temperature Diff. = Difference between final preheat stage and soldering stage.
Convection / IR Reflow Soldering
Description
Ramp Up (deg. C/sec)
Dwell Time > 217ºC
Solder Temp.
Dwell Time @ Max
Ramp DN (deg. C/sec)
Maximum
3ºC/sec.
150 sec.
260ºC
30 sec.
6ºC/sec.
Recommended
2ºC/sec.
90 sec.
245ºC
15 sec.
3ºC/sec.
Minimum
60 sec.
10 sec.
-
Recommended Lead Free Chip Resistor Reflow Profile
TP 260˚C
Max Ramp up Rate = 3˚C/Sec
Max Ramp Down Rate = 6˚C/Sec
tp
Tc -5˚C
30 Sec
TL 217˚C
tL
Preheat Area
60 - 150 Sec
Temperature ˚C
Tsmax 200˚C
Tsmin 150˚C
ts
60 - 180 Sec
25˚C
Time 25˚C to Peak
Max 8 min
Rev Date: 07/11/2012
This specification may be changed at any time without prior notice.
Please confirm technical specifications before you order and/or use.
1
www.seielect.com
marketing@seielect.com
Stackpole Electronics, Inc.
Recommended Solder Profiles
Resistive Product Solutions
Sn-Pb Terminations
Soldering iron recommended temperatures: 330ºC to 350ºC with minimum duration.
Wave Soldering
Description
Preheat Time
Temperature Diff.
Solder Temp.
Dwell Time @ Max.
Ramp DN (deg. C/sec)
Maximum
80 sec.
140ºC
260ºC
4 sec.
NA
Recommended
70 sec.
120ºC
240ºC
3 sec.
4ºC / sec.
Minimum
60 sec.
100ºC
225ºC
NA
Temperature Diff. = Difference between final preheat stage and soldering stage.
Convection / IR Reflow Soldering
Description
Ramp Up (deg. C/sec)
Dwell Time > 180ºC
Solder Temp.
Dwell Time @ Max
Ramp DN (deg. C/sec)
Maximum
3ºC/sec.
150 sec.
260ºC
20 sec.
4ºC/sec.
Description
Ramp Up (deg. C/sec)
Dwell Time > 183ºC
Solder Temp.
Dwell Time @ Max
Ramp DN (deg. C/sec)
Maximum
4ºC/sec.
85 sec.
220ºC
75 sec.
4ºC/sec.
Recommended
2ºC/sec.
90 sec.
225ºC
15 sec.
2ºC/sec.
Minimum
60 sec.
10 sec.
-
Vapor Phase Soldering
Recommended
2ºC/sec.
75 sec.
215ºC
70 sec.
2ºC/sec.
Minimum
-
For further information, please contact Kory Schroeder, Director of Marketing,
at kschroeder@seielect.com or 919-875-2495.
Rev Date: 07/11/2012
This specification may be changed at any time without prior notice.
Please confirm technical specifications before you order and/or use.
2
www.seielect.com
marketing@seielect.com