Lecture 1.0 Computer Basics
What is in a computer?
Computers do some pretty
impressive things!


CFD Modeling
Flow Sheet Simulation
Computer is a simple machine,
in principle!




Add
Subtract
Count
Switching

Pass information for one place to another


CPU to RAM
Bus = Communication with Equipment

Hard Drive / RAM
At the circuit level Computers
use Binary Math;


a switch is either on or off
Instructions in Binary math = Machine
Language
What is Hexadecimal math?
What is inside the Computer?
What are these Components?
Computer Components - I

Mother Board


Memory (RAM) (128 mbyte, 256 mbyte,
512 mbyte, 1024 mbyte)
Serial Communications Bus



CPU with math coprocessor and memory
cache (512 k byte)
Battery
Clock = counting circuit
Computer Components - II

Connections for













Key Board
Mouse
Hard Disk Drive (20-120 Giga byte)
Floppy Drive (2 Mega byte)
Zip Drive (100/250 Mega byte)
CD Rom (650 Mega byte)
DVD (4.7 Giga byte)
Video Card that Drives Monitor (analogue)
Sound Card that Drives Speakers (analogue)
Modem Card (digital)
Ethernet Card(digital)
A-to-D/D-to-A Card = Data Acquisition Card
IEEE bus = external communications
Moore’s Law

please see
http://developer.intel.com/update/archive/issue2/focus.htm
Chip Feature Scaling
What does a ChE need to know
to work in materials processing?


Materials Nomenclature
Materials are High Purity Chemicals




Silicon = 99.9999% pure
Structure is Important
Defects in the Structure are Important
Trace Impurities Play a Critical Role

Where they are in the structure is also
critical
Course Overview

Physics of Solids



Materials Properties
Device Physics
Materials Processing of Silicon Chips




Photolithography
Deposition / Etching
Implantation
Planarization
Course Overview

Materials’ Properties




Structure – Metals,
Oxides, Semi-conductors
Electrical Properties –
Metals, Oxides, Semiconductors
Other Properties – Piezo,
magnetic, ferro-electric





Device Physics





Conductor
Resistor
Capacitor
Diode
Transistor
Chip Devices


Structures
Memory
CPU/Switches
Multi-layer
Interconnects
barrier layers
Limits on Computer
speed
Course Overview -
Chemical
Engineering in Processing of Silicon Chips


Wafer Fabrication
Doping Wafers






Diffusion
Implantation
Patterning



Spin Coating

Photo-resist Development
Photo-resist dissolution
Etching
Deposition



Oxides
Silicon
Metals
Multi-layer
Interconnects


Patterning
Deposition
Chemical Mechanical
Polishing/Planarization
Course Overview - II

What Can Go Wrong?




Understanding the electrical problem in
terms of chip processing.
Understanding what causes the problem
Developing a solution to the problem
Developing a strategy so that the problem
will not occur again.