GLAST LAT Project
GLAST Collaboration Meeting, September 26-30, 2004
GLAST Large Area Telescope:
Gamma-ray Large
Area Space
Telescope
Electronics, Data Acquisition &
Instrument Flight Software
Status Sept 20, 2004
Gunther Haller
Stanford Linear Accelerator Center
Manager, Electronics, DAQ & FSW
LAT Chief Electronics Engineer
haller@slac.stanford.edu
(650) 926-4257
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GLAST LAT Project
GLAST Collaboration Meeting, September 26-30, 2004
Contents
• Overview
• Hardware
– Tower Electronics Module (TEM)
– TEM ASIC’s
– Tower Power Supply (TPS)
– Power Distribution Unit (PDU)
– Global Trigger-ACD-Signal Distribution Unit (GASU)
– Spacecraft Interface Unit (SIU)/Event Processor Unit (EPU)
– Heater Control Boxes/Harness
• Flight Software
• Test-Stands
• Testbed
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GLAST LAT Project
GLAST Collaboration Meeting, September 26-30, 2004
LAT Electronics
ACD
TKR Front-End Electronics (MCM)
ACD Front-End Electronics (FREE)
CAL Front-End Electronics (AFEE)
FSW is an integral part of the
data acquisition (DAQ)
subsystem and is managed,
budgeted, and scheduled as
part of the DAQ subsystem
TKR
16 Tower Electronics Modules & Tower
Power Supplies
CAL
Global-Trigger/ACD-EM/Signal-Distribution Unit*
Spacecraft Interface
Units (SIU)*
– Storage Interface
Board (SIB):
Spacecraft interface,
control & telemetry
– LAT control CPU
– LAT Communication
Board (LCB): LAT
command and data
interface
EPU-1
3 Event-Processor Units (EPU) (2 + 1
spare)
– Event processing CPU
– LAT Communication Board
– SIB
EPU-2
Power Dist. Unit*
empty
empty
GASU*
empty
empty
empty
SIU*
SIU*
EPU-3
Power-Distribution Unit (PDU)*
– Spacecraft interface,
power
– LAT power distribution
– LAT health monitoring
* Primary & Secondary Units shown in one chassis
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GLAST LAT Project
GLAST Collaboration Meeting, September 26-30, 2004
TEM/TPS Mounted to CAL
LAT GRID with 16 CAL/TEM/TPS Modules
TKR not shown
CAL
TEM & TPS
TEM
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TPS
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GLAST LAT Project
GLAST Collaboration Meeting, September 26-30, 2004
Tower Electronics Module
•
Main DAQ module, one on each tower
– Controls and reads out data from TKR MCM and CAL
AFEE front-end electronics
– Zero-suppresses CAL event data
– Buffers events in cable ASIC FIFO’s
– Assembles CAL and TKR event fragments to tower
event
– Transmits data to GASU
– Contains monitoring and low-rate science circuits
– LVDS interface to front-end electronics and GASU
TEM
Assembly
GTCC1 &
GCCC1
ASICs
6 3 4
•
5 3 4 29X
2
5
4 2 3 26X
3 1
2
1
4.1.7 DAQ & FSW
EM Tower Electronics Module (TEM)
before coating/staking
V1
Status
– Close to 60 TEM & TPS assemblies in the field used as
EGSE for CAL, TKR, DAQ, FSW, I&T
– All flight drawings released
– Flight PCB’s fabricated
– All enclosures fabricated
– One flight PCB loaded at SLAC with flight-lot
components for testing over parameter space; passed
tests
– Flight assembly contract in place
– All components kitted and sent to assembler last week
– Expect three assembled (Qual, Tower A, Tower B)
enclosures at SLAC in November
– Balance of flight production 2/05
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GLAST LAT Project
GLAST Collaboration Meeting, September 26-30, 2004
TEM ASIC’s
•
•
•
•
•
•
Two ASICs on the TEM
– GLAST Tracker Cable Controller (GTCC)
ASIC
– GLAST Colorimeter Cable Controller
(GCCC) ASIC
Function
– TEM interface to tracker MCM’s or
Calorimeter AFEE’s
– Configuration and readback data
• Trigger and event data handling
• Data reformatting
• Event buffers
First prototype design of both ASICs was
production version
GTCC1’s
– 398 tested
– 384 good (96% yield)
– 384 burned in, no failures (need 176 for
TEM’s)
192 flight GCCC1’s burned in, tested, no
failures (need 88 for TEM’s)
GCCC1’s
– 203 tested
– 192 good (95% yield)
– 192 burned in, no failures (need 88 for
TEM’s)
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LVDS IO
CORE
FIFO
GTCC1
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GLAST LAT Project
GLAST Collaboration Meeting, September 26-30, 2004
Tower Power Supply
•
Tower Power Supply module, one on each tower
– Input 28V
– Generates low-noise voltages for
• TKR (2.65V analog, 2.65V Digital)
• CAL (3.3V analog, 3.3V digital)
• TEM (3.3V and 2.5V digital)
• TKR Bias (20V-140V programmable)
• CAL (20V to 90V programmable)
– Temperature sensors
EM Tower Power Supply (TPS) before
coating/staking
20X 3 6 8
TPS
Assembly
8 3 2X
•
Status
– Same as TEM since TEM/TPS are produced as modules
7 2
2X 2 3 5 12
5 16
J1 4
2X 2 13
26X 2 3 4
26X 2 6
2 3
6 4X
5 3 4X
4 J2
1 1
8
2X 3 7
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GLAST LAT Project
GLAST Collaboration Meeting, September 26-30, 2004
Power Distribution Module (PDU)
•
•
•
•
•
•
•
•
Primary and redundant boards in one
enclosure
Function
– Receives 28V from spacecraft
– Power conditioning
– Contains switches to turn-on/off 16
TEM’s and 3 EPU’s
– Monitoring of LAT temperatures
5 PDU assemblies in the field used as
EGSE for DAQ, FSW, I&T
All flight drawings submitted for
review/release
Flight PCB’s requisition and PDU
assembly Statement-of-Work in
progress
All components ordered
Start of assembly planned for
November
Delivery of Flight PDU 3/05
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EM PDU (before harness routing)
PDU Assembly
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GLAST LAT Project
GLAST Collaboration Meeting, September 26-30, 2004
GASU
•
•
•
•
•
•
•
Primary and redundant GASU DAQ and
GASU Power Supply boards in one
enclosure
Function
– Global Trigger
– Event-Builder
– Signal Distribution/Fan-out/In
– ACD Electronic Interface
15 GASU assemblies in the field used
as EGSE for ACD, DAQ, FSW, I&T
Flight PCB’s requisition and GASU
assembly Statement-of-Work in
progress
All components ordered
Start of assembly planned for
December
Delivery of Flight GASU 3/05
EM GASU (before harness routing)
Power Supply
DAQ board
GASU Assembly
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GLAST LAT Project
GLAST Collaboration Meeting, September 26-30, 2004
SIU/EPU
•
•
•
•
•
•
•
•
3 EPU’s (2 Primary/1 Redundant) & 2 SIU’s
(Primary/Redundant)
Difference is
– SIB in SIU has MIL1553 communication
components to spacecraft loaded
– Start-up boot code loaded in CPU is different
from SIU and EPU
5 cPCI SIU/PDU assemblies in the field for DAQ,
FSW, I&T
– Enclosure
– PCI Backplane
– Crate Power Supply Board
– Storage Interface Board (SIB)
– LAT Communication Board (LCB)
– BAE Processor Board
Mechanical flight drawings released
Electrical flight drawings almost ready for
review/release
All components ordered
Start of assembly planned for December
Delivery of Flight SIU/EPU 3/05
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EM SIB
SIU/EPU Crate Assembly
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GLAST LAT Project
GLAST Collaboration Meeting, September 26-30, 2004
Heater Control Box and Harness
• Heater Control Box
– Function
• Turn on/off power to VHCP heaters via SIU supplied
control signals
– Engineering Module used on ISIS and Testbed
– Flight drawings in sign-off
• Harness
– Function
• Interconnects electronics modules in LAT
• Interface to spacecraft
– Drawings in sign-off
– Contract to be placed in 10/04
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GLAST LAT Project
GLAST Collaboration Meeting, September 26-30, 2004
Flight Software (FSW)
•
FSW is an integral part of the data acquisition (DAQ) subsystem
– > 3 million configuration bits to configure system and to take
event data properly
– Majority of software is to configure & setup hardware (boot, TKR,
CAL, ACD, DAQ trigger, event-builder, sub-system setup, etc)
– Rest is filtering, data monitoring, health & safety, telemetry
•
FSW development follows an iterative model
– Functionality is developed and tested against available Hardware
– Incremental builds with more functionality
– Major builds
• EM1: supports single tower, single CPU (e.g. TEM-based teststations)
• EM2: supports multi-tower or GASU/ACD, single CPU (GASUbased test-stations, partial test-bed)
• FU (Flight Unit): supports multi-tower, multi-CPU (full test-bed,
LAT)
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GLAST LAT Project
GLAST Collaboration Meeting, September 26-30, 2004
FSW Releases
• In addition to regular builds, FSW must provide two formal
releases
– ISIS (Instrument Spacecraft Interface Simulator) Build &
Release
– An integrated FSW and hardware package provided to
Spectrum Astro (the Spacecraft manufacturer) to allow
Spectrum to conduct integration work
– The ISIS FSW supports:1553 command delivery,
ancillary/attitude/time tone command processing, boot
process and boot commands for SIU, science data
interface, all telemetry types, and other functionality
– Full LAT Build & Release
• Complete set of 16 towers, GASU, full set of CPU’s
– Used as test-bed for hardware and software development
& test
– To be delivered to I&T for full-LAT testing (Formal Release)
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GLAST LAT Project
GLAST Collaboration Meeting, September 26-30, 2004
FSW Layer Model (Post Boot)
Applications Layer
Charge
Instrument
Injection Diagnostics
Physics
Calibration Framework
(LPA)
(LDF)
(LCI)
Instrument
Manager
(LIM)
Basic Services
Watchdog
(LSW)
Spacecraft
Messages
(LSM)
Housekeeping
(LHK)
Thermal
Control
(LTC)
File/Object
(LFS)
Abstract Communication Layer
Inter-task Communications System (ITC)
Service Layer
Command and Telemetry/1553
Service (CTS)
LCB Service
(LCS)
Driver Layer
1553 Driver (CTDB)
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LCB Driver (LCBD)
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GLAST LAT Project
GLAST Collaboration Meeting, September 26-30, 2004
FSW Status
•
Flight Unit level coding is underway
•
FU peer review was held September 16, 04
http://www.slac.stanford.edu/exp/glast/flight/web/FSW_home.shtml
•
Development, Unit Test, Low-Level Integration During CYQ4
– Builds produced as needed to support I&T
•
SW Test Scripts underway, completion February 2005
•
Dry runs of qualification tests start in January 2005
•
Then, following a TRR, Formal Qualification Testing (FQT) begins April 2005
•
FQT period ends 4/30/05
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GLAST LAT Project
GLAST Collaboration Meeting, September 26-30, 2004
EGSE: TEM-based Test-stands
LCB: LAT
Communication
Board
Power-PC
Processor
Transition-card:
Trigger Module
Flight
Software
TEM DAQ
Assembly
Tower Power
Supply
Assembly
28-V Power Supply
•
•
•
•
•
•
•
(1.5V/2.5V/3.3V/
0-100V/0-150V)
Processor: Motorola Power-PC
Flight Software
PMCIA LAT Communication Board for
– LAT Communication
Transition Board
– Trigger
TEM DAQ Assembly
TEM Power-Supply Assembly
28-V Supply
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GLAST LAT Project
GLAST Collaboration Meeting, September 26-30, 2004
Test-Stand Summary
Client
Calorimeter (conformal)
Calorimeter
Tracker (conformal)
Tracker
ACD
I&T
DAQ/FSW
Electronics Support
Total
•
•
Shipped Assemble/Test
8
2
5
0
2
0
9
0
4
0
5
0
11
0
11
0
55
2
Total
10
5
2
9
4
5
11
11
57
Includes TEM-based and GASU-based test-stands
Outstanding
– 2 TEM/TPS for CAL
– PDU’s for I&T
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GLAST LAT Project
GLAST Collaboration Meeting, September 26-30, 2004
Instrument Spacecraft Interface Simulator
Heater Controls/Loads
PDU
GASU
PDU Load Box
Crate Tester
Power Supply
SIU Crate
•
•
•
(Shown before installation in rack)
ISIS to be delivered to Spectrum Astro as LAT simulator
Delivery in October
– Contains
• SIU
• GASU
• PDU with loadbox
• Heater control box with load box
• Flight Software
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GLAST LAT Project
GLAST Collaboration Meeting, September 26-30, 2004
Testbed
•
•
•
•
The Testbed is a complete “flight-like” Trigger and Dataflow system with simulated frontend inputs.
Purpose of the Testbed
– Validate the Level 3 Filter
– Validate Flight Software
– Validate Trigger and Dataflow System
– Eventually, passed to ISOC
– Can be used to test on orbit scenarios
The testbed is the only place where all parts of the T&DF system are assembled in a test
environment
– The last line of defense for catching system-level problems
Status: assembled, tests are in progress
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GLAST LAT Project
GLAST Collaboration Meeting, September 26-30, 2004
The LAT Testbed (-z)
1 of16 TEMs
EPU
External
Crate
PDU
SIU
Power
Feeds
GASU
RF Shield
1 of 2 Heater
Loads
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1 of 2 Heater
Controls
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GLAST LAT Project
GLAST Collaboration Meeting, September 26-30, 2004
The LAT Testbed (+z)
16 TKR FES
16 CAL FES
8 ACD FES
1 Control FES
16 Tower Loads
11 FES Control PCs
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GLAST Collaboration Meeting, September 26-30, 2004
Issues
• ACTEL FPGA’s (on TEM/GASU/PDU/DIB/LCB)
– Investigations on-going into failures on MEC fabrication
line. Considering using new UMC fabrication line FPGA’s
instead (decision in November)
• EEPROM (on SIB/CPU)
– Investigations on-going into failures in EEPROM
components
– Have software work-around for SIB
– Decision whether to use PROM on BAE RAD750 board
instead of EEPROM by November 1
• ESD Sensitivity
– ASIC’s have higher sensitivity (about 200V HBM) than
desired. Need good ESD-sensitive handling
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GLAST Collaboration Meeting, September 26-30, 2004
Summary
•
•
•
•
TEM and TPS are in flight assembly
Rest of DAQ will be in flight assembly within 12 weeks
Software is working on flight unit release
Instrument Spacecraft Interface Simulator will be deliver to SC
vendor next month
• LAT Testbed assembled and in test
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